Intelligent harmonic suppression type integrated power capacitance compensation device

Abstract

The utility model discloses an intelligent harmonic suppression type integrated power capacitance compensation device, which comprises a casing, a display screen fixedly arranged at the upper end of the front end face of the casing, a bottom plate arranged at the bottom of the casing, a storage cavity arranged in the casing and the bottom plate, and a mainboard and a circuit breaker arranged at the top of the storage cavity. A capacitor and a reactor are arranged at the lower end of the storage cavity, a dustproof cavity is formed among the machine shell, the left side plate and the right side plate, and the main board, the circuit breaker, the first connecting wire, the second connecting wire, the third connecting wire, the fourth connecting wire, the fifth connecting wire and the sixth connecting wire are all located in the dustproof cavity. The capacitor and the reactor are combined to form a filtering device, and harmonic current in a power grid is filtered or suppressed through the filtering device, so that the electric energy quality is improved. According to the technical scheme, the structural design is reasonable, modular assembly is achieved, the assembly efficiency can be improved, space is saved, the manufacturing cost is reduced, maintenance is easy, and practicability is good.

Description

Technical Field

[0001] This utility model relates to the technical field of capacitor compensation devices, specifically to an intelligent harmonic suppression integrated power capacitor compensation device. Background Technology

[0002] Existing intelligent combined anti-harmonic low-voltage power capacitor compensation devices generally include a chassis, a front panel, a terminal block, and a base. The front panel is located at the front of the chassis and has a display module embedded in it. A top plate is located on the top of the chassis, and a switch is installed on the top plate. The base is located at the bottom of the chassis. A terminal block with multiple connectors is located on the back of the chassis. A fixing device is installed on the terminal block, and the terminal block is fixed to the chassis through the fixing device. Multiple ventilation holes are provided on both sides of the chassis. A support plate with a filter membrane is provided on the inner side wall of the chassis, and the filter membrane covers the ventilation holes. A base plate is located inside the chassis, and buffers are provided around the base plate. A PCB board is mounted on the base plate. In this prior art, the chassis installation in various environments does not affect the normal operation of the PCB board, and it also has good shock absorption performance.

[0003] However, in the aforementioned existing technologies, after prolonged use, a lot of dust accumulates on the ventilation holes of the chassis. Since the ventilation holes and the chassis are integrally molded, it is not convenient to clean the dust on the ventilation holes, which in turn affects the heat dissipation effect. Each component needs to be manufactured separately and then assembled, which requires a large installation space, resulting in a large chassis size, high manufacturing cost, low space utilization, and low assembly efficiency during the assembly of each component. The components are also prone to loosening during assembly or use, making maintenance troublesome and practical. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide an intelligent harmonic suppression integrated power capacitor compensation device with reasonable structural design, modular assembly, improved assembly efficiency, space saving, reduced manufacturing cost, easy maintenance and good practicality.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an intelligent harmonic suppression integrated power capacitor compensation device, comprising a housing, a display screen fixedly mounted on the upper end of the front face of the housing, a base plate mounted on the bottom of the housing, a storage cavity within the housing and base plate, a main board and a circuit breaker mounted on the top of the storage cavity, a capacitor and a reactor mounted on the lower end of the storage cavity, a first connecting wire between the main board and the display screen, a second connecting wire between the main board and the circuit breaker, and a connection between the main board and the capacitor. A third connecting wire is provided; a fourth connecting wire is provided between the motherboard and the reactor; a network interface component is fixedly provided on one side of the chassis; a fifth connecting wire is provided between the inner end of the network interface component and the motherboard; a sixth connecting wire is provided between the capacitor and the reactor; a left side plate is provided on the left side of the chassis, which is detachably connected to the left side of the chassis, and the left side plate is provided with multiple first heat dissipation holes; a right side plate is provided on the right side of the chassis, which is detachably connected to the right side of the chassis, and the right side plate is provided with multiple second heat dissipation holes.

[0006] The casing, left side panel, and right side panel form a dustproof cavity, and the main board, circuit breaker, first connecting wire, second connecting wire, third connecting wire, fourth connecting wire, fifth connecting wire, and sixth connecting wire are all located inside the dustproof cavity.

[0007] The present invention is further configured such that the capacitor and the reactor are combined to form a filter device, which filters out or suppresses harmonic currents in the power grid, thereby improving power quality.

[0008] This utility model is further configured as follows: a display screen mounting through hole is provided at the upper end of the front face of the housing, the display screen is installed in the display screen mounting through hole, and the display screen is fixed to the housing by screws or by a snap-fit ​​structure; a first circuit breaker through hole is provided at the rear end of the upper face of the housing, and a second circuit breaker through hole is provided at the upper end of the rear end face of the housing, the first circuit breaker through hole and the second circuit breaker through hole together form a circuit breaker mounting through hole, the circuit breaker is installed in the circuit breaker mounting through hole, and the circuit breaker is fixed to the housing by bolts or by screws; a network interface is provided on the rear end face of the housing, the network interface component is installed in the network interface, and the network interface component is fixed to the rear end face of the housing by screws; the motherboard is fixed to the upper inner wall of the housing by nuts or by bolts.

[0009] The present invention is further configured such that: a left handle is fixedly provided on the left side plate, and the left side plate is fixedly connected to the left side of the housing by screws; a right handle is fixedly provided on the right side plate, and the right side plate is fixedly connected to the right side of the housing by screws.

[0010] The present invention is further configured such that: the front end of the base plate is fixed to the lower end of the front face of the housing by bolts or screws; the rear end of the base plate is fixed to the lower end of the rear face of the housing by bolts or screws; the lower end of the capacitor is fixed to the upper face of the base plate by bolts or screws; and the lower end of the reactor is fixed to the upper face of the base plate by bolts or screws.

[0011] The present invention is further configured such that: the number of the first heat dissipation through holes is three or more, and all the first heat dissipation through holes are vertically arranged and are all oblong holes; the number of the second heat dissipation through holes is three or more, and all the second heat dissipation through holes are vertically arranged and are all oblong holes.

[0012] The beneficial effects of this utility model are as follows: Compared with the prior art, this utility model has a reasonable structural design, with the motherboard, circuit breaker, first connecting wire, second connecting wire, third connecting wire, fourth connecting wire, fifth connecting wire, and sixth connecting wire all located inside the dustproof cavity. The reasonable structural design allows the motherboard to be assembled into the dustproof cavity of the casing, and the modular assembly technology integrates electronic components onto the motherboard, ensuring reliable connections between components, preventing loosening, improving assembly efficiency, and facilitating maintenance.

[0013] By adopting a compact layout, the casing is miniaturized. This invention can save space and gain greater advantages in terms of size, cost and transportation, thereby reducing manufacturing costs.

[0014] Optimized dust protection: This utility model carefully places the motherboard circuit board at the top of the dustproof cavity inside the casing and ensures a safe distance. This layout effectively prevents the intrusion of external dust and ensures that the equipment will not be affected by dust accumulation. In addition, the left side panel is detachable from the left side of the casing, and the right side panel is detachable from the right side of the casing, making it easy to clean the dust on the heat dissipation holes and improving its practicality.

[0015] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0017] Figure 2 This is an exploded view of an embodiment of the present invention;

[0018] Figure 3 This is a partial structural diagram of the present invention. Figure 1 ;

[0019] Figure 4 This is a partial structural diagram of the present invention. Figure 2 . Detailed Implementation

[0020] In the description of this embodiment, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] See Figures 1 to 4 This utility model discloses an intelligent harmonic suppression integrated power capacitor compensation device, comprising a housing 1, a display screen 2 fixedly mounted on the upper end of the front face of the housing 1, a base plate 3 mounted on the bottom of the housing 1, a storage cavity 11 disposed within the housing 1 and the base plate 3, a main board 4 and a circuit breaker 5 disposed on the top of the storage cavity 11, a capacitor 6 and a reactor 7 disposed at the lower end of the storage cavity 11, a first connecting wire 8 disposed between the main board 4 and the display screen 2, a second connecting wire 9 disposed between the main board 4 and the circuit breaker 5, and a third connecting wire 10 disposed between the main board 4 and the capacitor 6. A fourth connecting wire 12 is provided between the capacitor 6 and the reactor 7. A network interface assembly 13 is fixedly provided on one side of the housing 1. A fifth connecting wire 14 is provided between the inner end of the network interface assembly 13 and the motherboard 4. A sixth connecting wire 15 is provided between the capacitor 6 and the reactor 7. A left side plate 16 is provided on the left side of the housing 1. The left side plate 16 is detachably provided with the left side of the housing 1, and a plurality of first heat dissipation holes 161 are provided on the left side of the housing 1. A right side plate 17 is provided on the right side of the housing 1. The right side plate 17 is detachably provided with the right side of the housing 1, and a plurality of second heat dissipation holes 171 are provided on the right side of the housing 1.

[0022] The casing 1, the left side plate 16 and the right side plate 17 form a dustproof cavity 111. The main board 4, the circuit breaker 5, the first connecting wire 8, the second connecting wire 9, the third connecting wire 10, the fourth connecting wire 12, the fifth connecting wire 13 and the sixth connecting wire 14 are all located inside the dustproof cavity 111.

[0023] As a preferred option, modular assembly technology is used to integrate electronic components onto the motherboard 4. The connections between the components are reliable and not easily loosened, which improves assembly efficiency and makes maintenance easy.

[0024] The capacitor 6 and the reactor 7 are combined to form a filter device, which filters out or suppresses harmonic currents in the power grid, thereby improving power quality.

[0025] To make the structural design of this utility model more reasonable, as a preferred embodiment, the front end face of the housing 1 is provided with a display screen mounting through hole 18, the display screen 2 is installed in the display screen mounting through hole 18, and the display screen 2 is fixed to the housing 1 by screws or by a snap-fit ​​structure; the rear end face of the upper end face of the housing 1 is provided with a first circuit breaker through hole 19, and the upper end face of the rear end face of the housing 1 is provided with a second circuit breaker through hole 110. The first circuit breaker through hole 19 and the second circuit breaker through hole 110 together form a circuit breaker mounting through hole, the circuit breaker 5 is installed in the circuit breaker mounting through hole, and the circuit breaker 5 is fixed to the housing 1 by bolts or screws; the rear end face of the housing 1 is provided with a network interface 112, the network interface assembly 13 is installed in the network interface 112, and the network interface assembly 13 is fixed to the rear end face of the housing 1 by screws; the motherboard 4 is fixed to the upper inner wall of the housing 1 by nuts or bolts.

[0026] A left handle 20 is fixedly provided on the left side plate 16, and the left side plate 16 is connected and fixed to the left side of the housing 1 by screws. A right handle 21 is fixedly provided on the right side plate 17, and the right side plate 17 is connected and fixed to the right side of the housing 1 by screws.

[0027] The front end of the base plate 3 is fixed to the lower end of the front face of the housing 1 by bolts or screws, and the rear end of the base plate 3 is fixed to the lower end of the rear face of the housing 1 by bolts or screws; the lower end of the capacitor 6 is fixed to the upper face of the base plate 3 by bolts or screws; and the lower end of the reactor 7 is fixed to the upper face of the base plate 3 by bolts or screws.

[0028] The number of the first heat dissipation through holes 161 is set to 3 or more, and all the first heat dissipation through holes 161 are vertically arranged and are all oblong holes; the number of the second heat dissipation through holes 171 is set to 3 or more, and all the second heat dissipation through holes 171 are vertically arranged and are all oblong holes.

[0029] In practical applications, the motherboard 4, circuit breaker 5, first connecting wire 8, second connecting wire 9, third connecting wire 10, fourth connecting wire 12, fifth connecting wire 13, and sixth connecting wire 14 are all located inside the dustproof cavity. The structural design is reasonable, assembling the motherboard 4 into the dustproof cavity of the casing 1. Modular assembly technology integrates electronic components onto the motherboard, ensuring reliable connections between components, preventing loosening, improving assembly efficiency, and facilitating maintenance.

[0030] By adopting a compact layout, the casing is miniaturized. This invention can save space and gain greater advantages in terms of size, cost and transportation, thereby reducing manufacturing costs.

[0031] Optimized dust protection: This utility model carefully arranges the motherboard circuit board at the top of the dustproof cavity inside the casing 1 and ensures a safe distance. This layout effectively prevents the intrusion of external dust and ensures that the equipment will not be affected by dust accumulation. In addition, the left side panel is detachable from the left side of the casing and the right side panel is detachable from the right side of the casing, making it easy to clean the dust on the heat dissipation holes and improving its practicality.

[0032] The above description of the specific embodiments of this utility model is only used to further illustrate this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-essential improvements and adjustments made to this utility model by technical engineers in the art based on the above description of the utility model shall fall within the scope of protection of this utility model.

Claims

1. A smart harmonic suppression integrated power capacitor compensation device, comprising a housing (1), wherein a display screen (2) is fixedly disposed on the upper end of the front end face of the housing (1), a base plate (3) is disposed on the bottom of the housing (1), and a storage cavity (11) is disposed within the housing (1) and the base plate (3), characterized in that: The top of the storage cavity (11) is provided with a mainboard (4) and a circuit breaker (5), the lower end of the storage cavity (11) is provided with a capacitor (6) and a reactor (7), the mainboard (4) and the display screen (2) are provided with a first connecting wire (8), the mainboard (4) and the circuit breaker (5) are provided with a second connecting wire (9), the mainboard (4) and the capacitor (6) are provided with a third connecting wire (10), the mainboard (4) and the reactor (7) are provided with a fourth connecting wire (12), one side of the shell (1) is fixedly provided with a network interface assembly (13), the inner end of the network interface assembly (13) and the mainboard (4) are provided with a fifth connecting wire (14), the capacitor (6) and the reactor (7) are provided with a sixth connecting wire (15); The left side of the shell (1) is provided with a left side plate (16), the left side plate (16) is detachably arranged on the left side of the shell (1), and a plurality of first heat dissipation through holes (161) are arranged on the left side plate (16); The right side of the shell (1) is provided with a right side plate (17), the right side plate (17) is detachably arranged on the right side of the shell (1), and a plurality of second heat dissipation through holes (171) are arranged on the right side plate (17). The shell (1), the left side plate (16) and the right side plate (17) form a dustproof cavity (111), and the mainboard (4), the circuit breaker (5), the first connecting wire (8), the second connecting wire (9), the third connecting wire (10), the fourth connecting wire (12), the fifth connecting wire (13) and the sixth connecting wire (14) are located in the dustproof cavity (111).

2. The integrated power capacitor compensation device of claim 1, wherein: The capacitor (6) and the reactor (7) are combined into a filter device, which filters or suppresses the harmonic current in the power grid, thereby improving the power quality.

3. The integrated power capacitor compensation device of claim 1 or 2, wherein: The front end surface of the shell (1) is provided with a display screen mounting through hole (18), the display screen (2) is mounted in the display screen mounting through hole (18), and the display screen (2) and the shell (1) are fixedly connected by screws or fixedly connected by a buckle structure; The rear end of the upper end surface of the shell (1) is provided with a first circuit breaker through hole (19), the upper end of the rear end surface of the shell (1) is provided with a second circuit breaker through hole (110), the first circuit breaker through hole (19) and the second circuit breaker through hole (110) together form a circuit breaker mounting through hole, the circuit breaker (5) is mounted in the circuit breaker mounting through hole, and the circuit breaker (5) and the shell (1) are fixedly connected by bolts or fixedly connected by screws; The rear end surface of the shell (1) is provided with a network interface (112), the network interface assembly (13) is mounted in the network interface (112), and the network interface assembly (13) and the rear end surface of the shell (1) are fixedly connected by screws; The mainboard (4) and the inner wall surface of the shell (1) are fixedly connected by a nut column or fixedly connected by a bolt.

4. The intelligent harmonic suppression integrated power capacitor compensation device according to claim 3, characterized in that: The left side plate (16) is fixedly provided with a left handle (20), and the left side plate (16) is fixedly connected with the left side of the shell (1) through screws; the right side plate (17) is fixedly provided with a right handle (21), and the right side plate (17) is fixedly connected with the right side of the shell (1) through screws.

5. The intelligent harmonic suppression integrated power capacitor compensation device according to claim 4, characterized in that: The front end of the bottom plate (3) is fixedly connected with the lower end of the front end face of the shell (1) through bolts or screws, and the rear end of the bottom plate (3) is fixedly connected with the lower end of the rear end face of the shell (1) through bolts or screws; the lower end of the capacitor (6) is fixedly connected with the upper end face of the bottom plate (3) through bolts or screws; and the lower end of the electric reactor (7) is fixedly connected with the upper end face of the bottom plate (3) through bolts or screws.

6. The intelligent harmonic suppression integrated power capacitor compensation device according to claim 1 or 2, characterized in that: The number of the first heat dissipation through holes (161) is more than three, and the first heat dissipation through holes (161) are all vertically arranged and are all waist-shaped holes; the number of the second heat dissipation through holes (171) is more than three, and the second heat dissipation through holes (171) are all vertically arranged and are all waist-shaped holes.

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