Combined conduction structure of ultra-long FPC (Flexible Printed Circuit)

Abstract

The utility model discloses a combined conduction structure of a super-long FPC, which comprises a single-sided board and more than one hollow-out board fixed on the single-sided board, the single-sided board is provided with a plurality of lower conduction hole grooves, each hollow-out board is provided with an upper conduction hole groove, each upper conduction hole groove is arranged right above the corresponding lower conduction hole groove, and the lower conduction hole groove is arranged right above the corresponding hollow-out board. And solder paste is filled in the hollow-out plate and the single-sided plate so as to conduct the hollow-out plate and the single-sided plate. According to the utility model, a double-sided board structure of a conventional FPC is replaced by a structure in which one single-sided board is matched with a plurality of hollowed-out boards, the hollowed-out boards and the single-sided board are provided with communicated hole grooves, and the hole grooves are filled with solder paste capable of conducting a circuit. The manufacturing of the FPC can be completed and the conduction of the circuit can be ensured only by arranging the hollowed-out plate at the place where the double-layer circuit needs to be used on the single-sided board and filling the hollowed-out plate with the solder paste, the size of the hollowed-out plate can be designed according to actual needs, the length of the hollowed-out plate does not need to be the same as that of the single-sided board at the lower end, the use amount of raw materials on the ultra-long FPC can be reduced, the film pasting difficulty of the ultra-long FPC is reduced, and the production cost is reduced. The production cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of FPC production technology, and in particular to a combined conductive structure for an ultra-long FPC. Background Technology

[0002] FPCs typically employ a double-sided PCB structure with vias connecting the upper and lower layers of circuitry. The manufacturing process includes applying protective films to both sides of the copper foil substrate on each single-sided PCB, fixing the two single-sided boards, drilling, plasma plating, and copper plating. During production, to prevent copper foil oxidation and ensure the FPC's functionality and lifespan, the protective films on both single-sided PCBs must completely cover the entire copper foil substrate. Both films must be of equal length, resulting in significant raw material consumption. When the FPC is excessively long, not only is the lamination process difficult and the defect rate significantly increased, but the consumption of both the copper foil substrate and the protective film is also very high, leading to higher manufacturing costs for ultra-long FPCs. Summary of the Invention

[0003] To address the problems existing in the prior art, this utility model provides a combined conductive structure for an ultra-long FPC. It replaces the conventional double-sided FPC structure with a single-sided board and several perforated boards. Connecting slots are provided on the perforated boards and the single-sided board, and solder paste capable of conducting circuits is filled into these slots. FPC fabrication is completed simply by placing perforated boards and filling them with solder paste where double-layer circuitry is required on the single-sided board, ensuring circuit continuity. The size of the perforated boards can be designed according to actual needs, and their length does not need to be the same as the lower single-sided board. This reduces the amount of raw materials used in ultra-long FPCs, lowers the difficulty of applying film to ultra-long FPCs, and reduces production costs.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0005] A combined conductive structure for an ultra-long FPC includes a single-sided panel and one or more perforated plates fixed thereon. Each single-sided panel and each of the perforated plates has one or more solder pads. A protective film is provided on the upper and / or lower surfaces of several of the solder pads, wherein:

[0006] The single-sided panel includes, from bottom to top, a plurality of first pads and a first protective film, wherein a plurality of lower through-hole slots are formed on the first protective film, each corresponding to one of the first pads.

[0007] Each of the cutout boards includes, from bottom to top, a second protective film, several second pads, and a third protective film. Each of the third protective film, each second pad, and the second protective film has a communicating upper via slot. Each upper via slot is matched and positioned directly above a lower via slot. Each upper and lower via slot is filled with solder paste to connect the second pad and the first pad.

[0008] As a further explanation of the above technical solution:

[0009] In the above technical solution, an adhesive curing layer is provided between the lower end face of each second protective film and the first protective film. A plurality of connecting holes are formed on the adhesive curing layer, and each connecting hole is matched between an upper connecting hole and a lower connecting hole.

[0010] In the above technical solution, each of the lower through-hole grooves is coaxial with an upper through-hole groove and a connecting hole groove.

[0011] In the above technical solution, each of the upper through-hole slots includes a first slot, a second slot and a third slot arranged coaxially from bottom to top and connected to each other. The first slot is disposed on the second protective film, the second slot is disposed on the second pad, and the third slot is disposed on the third protective film.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: by replacing the conventional double-sided FPC structure with a structure consisting of a single-sided board and several perforated boards, and by providing connecting slots on the perforated boards and the single-sided board, and filling the slots with solder paste that can conduct circuits, the FPC can be manufactured simply by setting the perforated board and filling it with solder paste where double-layer circuitry is required on the single-sided board, and the circuitry can be ensured to be conductive. The size of the perforated board can be designed according to actual needs, and its length does not need to be the same as the single-sided board at the bottom, which can reduce the amount of raw materials used in ultra-long FPCs, reduce the difficulty of film application in ultra-long FPCs, and reduce production costs. Attached Figure Description

[0013] Figure 1 This is a structural schematic diagram of this embodiment;

[0014] Figure 2 This is an exploded structural diagram of this embodiment.

[0015] In the diagram: 10, single-sided board; 11, first pad; 12, first protective film; 20, cutout board; 21, second protective film; 22, second pad; 23, third protective film; 30, solder paste; 40, adhesive curing layer; 1, lower via slot; 2, upper via slot; 201, first slot; 202, second slot; 203, third slot; 3, connecting via slot. Detailed Implementation

[0016] The present invention will now be described in further detail with reference to the accompanying drawings.

[0017] The embodiments described with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "several" or "more than" means two or more, unless otherwise explicitly specified. In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. In this application, unless otherwise expressly specified and limited, "above" or "below" a second feature can include direct contact between the first and second features, or it can include contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of a second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" of a second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0018] like Figure 1 As shown, a combined conductive structure of an ultra-long FPC includes a single-sided panel 10 and one or more perforated plates 20 fixed thereon. Each single-sided panel 10 and each perforated plate 20 has one or more pads. A protective film is provided on the upper and / or lower surfaces of several pads, wherein:

[0019] like Figure 2As shown, the single-sided board 10 includes, from bottom to top, a plurality of first pads 11 and a first protective film 12. The first protective film 12 has a plurality of lower via slots 1 that are adapted to the first pads 11 one by one. Each cutout board 20 includes, from bottom to top, a second protective film 21, a plurality of second pads 22 and a third protective film 23. The third protective film 23, each second pad 22 and the second protective film 21 have interconnected upper via slots 2. Each upper via slot 2 is matched and located directly above a lower via slot 1. Each upper via slot 2 and lower via slot 1 is filled with solder paste 30 to conduct the second pads 22 and the first pads 11.

[0020] This invention replaces the conventional double-sided FPC structure with a structure consisting of a single-sided panel 10 and several perforated panels 20. Connecting slots are provided on the perforated panels 20 and the single-sided panel 10, and solder paste 30, capable of conducting circuits, is filled into these slots. FPC fabrication can be completed simply by placing the perforated panels 20 and filling them with solder paste 30 where double-layer circuitry is required on the single-sided panel 10, ensuring circuit continuity. The size of the perforated panels 20 can be designed according to actual needs, and their length does not need to be the same as the lower single-sided panel 10. This reduces the amount of raw materials used in ultra-long FPCs, lowers the difficulty of applying film to ultra-long FPCs, and reduces production costs.

[0021] Furthermore, such as Figure 2 As shown, each of the second protective films 21 has an adhesive curing layer 40 between its lower end face and the first protective film 12. The adhesive curing layer 40 has a plurality of connecting holes 3 formed thereon. Each connecting hole 3 is matched between an upper connecting hole 2 and a lower connecting hole 1. Each lower connecting hole 1 is coaxial with an upper connecting hole 2 and a connecting hole 3.

[0022] Furthermore, such as Figure 2 As shown, each upper through-hole groove 2 includes a first groove 201, a second groove 202 and a third groove 203 arranged coaxially from bottom to top and connected to each other. The first groove 201 is provided on the second protective film 21, the second groove 202 is provided on the second pad 22 and the third groove 203 is provided on the third protective film 23.

[0023] In the application, adhesive is applied to the outside of the pre-reserved slots on the second protective film 21 and the third protective film 23 to match and fix the cutout board 20 to the single-sided board 10. Solder paste 30 is then applied into the third slot 203 on the cutout board 20. The solder paste 30 penetrates through the second slot 202 and the first slot 201 into the single-sided board 10, thereby connecting the two pads and realizing circuit conduction.

[0024] The above does not limit the technical scope of this utility model. Any modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this utility model shall still fall within the scope of the technical solution of this utility model.

Claims

1. A combined routing structure for an ultra-long FPC, characterized by, The single panel and the one or more hollowed panels are fixed on the single panel, the single panel and each of the hollowed panels are provided with one or more pads, the upper end surface and / or the lower end surface of some of the pads are provided with a protective film, wherein: The single panel comprises from bottom to top a plurality of first pads and a first protective film, the first protective film is formed with a plurality of lower through-hole slots matched with the first pads one by one; Each of the hollowed panels comprises from bottom to top a second protective film, a plurality of second pads and a third protective film, the third protective film, each of the second pads and the second protective film are formed with a continuous upper through-hole slot, each of the upper through-hole slots is matched with a lower through-hole slot directly above, and each of the upper through-hole slots and the lower through-hole slots are filled with solder paste to connect the second pads and the first pads.

2. The combined routing structure of an ultra-long FPC according to claim 1, wherein, The lower end surface of each of the second protective films and the first protective film are provided with an adhesive curing layer, the adhesive curing layer is formed with a plurality of continuous hole slots, each of the continuous hole slots is matched with a upper through-hole slot and a lower through-hole slot.

3. The combined routing structure of an ultra-long FPC according to claim 2, wherein, Each of the lower through-hole slots is coaxial with one of the upper through-hole slots and one of the continuous hole slots.

4. The combined routing structure of an ultra-long FPC according to any one of claims 1-3, characterized in that, Each of the upper through-hole slots comprises from bottom to top a first hole slot, a second hole slot and a third hole slot which are coaxially arranged and communicated with each other, the first hole slot is arranged on the second protective film, the second hole slot is arranged on the second pad, and the third hole slot is arranged on the third protective film.

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