Integrated circuit mainboard with high stability

Abstract

The utility model belongs to the technical field of integrated circuit boards, and particularly relates to a high-stability integrated circuit mainboard which comprises an outer shell, a top cover is installed at the top end of the outer shell through screws, and the problem that an existing integrated circuit mainboard is not provided with a rapid cooling structure is solved. The temperature sensor transmits a signal to the controller to cut off power of the electromagnetic block, at the moment, the cooling pipe is jacked upwards through the compression spring and makes contact with the bottom of the circuit mainboard, then the micro suction pump is started, cooling liquid is conveyed into the cooling pipe to flow circularly to rapidly cool the top cover, and when the temperature is reduced to the optimal operation range of the circuit mainboard, the micro suction pump is closed. And then the electromagnetic block is powered, so that the electromagnetic block is attracted to the storage sleeve, the cooling pipe on the supporting plate is lowered to the initial position and is separated from the circuit mainboard, and the effect of automatically starting the rapid cooling mechanism to cool the circuit mainboard according to the temperature change of the environment where the circuit mainboard is located is achieved.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit board technology, specifically to a highly stable integrated circuit motherboard. Background Technology

[0002] An integrated circuit board is a miniature electronic device or component. Using specific processes, transistors, resistors, capacitors, inductors, and other components required for a circuit, along with interconnected wiring, are fabricated on one or several small pieces of semiconductor wafers or dielectric substrates. These are then packaged in a housing to form a miniature structure with the required circuit function. All components are structurally integrated, representing a significant step forward in the miniaturization, low power consumption, intelligence, and high reliability of electronic components.

[0003] The existing technology, patent number CN218735621U, entitled "A High-Stability Integrated Circuit Board," includes an integrated circuit motherboard and a housing for mounting the motherboard. The housing includes a bottom shell and a cover plate. The motherboard is a rectangular plate structure. An elastic support platform is provided along the circumference of the inner side of the bottom shell. A first annular groove for supporting and engaging the motherboard is formed on the side of the elastic support platform away from the inner side of the bottom shell. A second annular groove is formed on the side of the elastic support platform closer to the inner side of the bottom shell. An elastic fixing frame is installed in the second annular groove. The elastic fixing frame includes a snap-fit ​​part that engages with the second annular groove and a clamping part for pressing the motherboard firmly into the first annular groove. The motherboard and the first annular groove, as well as the snap-fit ​​part and the second annular groove, are all interference-fitted. This patent application solves the problem of existing integrated circuit boards lacking a buffer protection structure, leading to reduced stability and lifespan.

[0004] The aforementioned device protects the integrated circuit motherboard through a buffer protection structure, extending its service life. Existing integrated circuits have high power, and the current integrated circuit motherboard packaging structure is not easy to dissipate heat, causing heat to accumulate and not be able to dissipate quickly, reducing its service life or even causing it to burn out directly. Existing integrated circuit motherboards do not have a structure for rapid cooling, so it is necessary to design an integrated circuit motherboard with high stability to improve it. Utility Model Content

[0005] The technical problem solved by this utility model is that existing integrated circuits have high power and the current integrated circuit motherboard packaging structure is not easy to dissipate heat, resulting in heat accumulation that cannot be dissipated quickly, which reduces their service life or even causes them to burn out directly. Existing integrated circuit motherboards do not have a structure for rapid cooling. This utility model provides an integrated circuit motherboard with high stability.

[0006] To solve the above-mentioned technical problems, this utility model provides a highly stable integrated circuit motherboard, including a housing, a top cover mounted on the top of the housing by screws, a circuit motherboard mounted inside the housing, and a cooling component mounted below the circuit motherboard inside the housing.

[0007] The cooling component includes a mounting bracket connected to the inner wall of the outer casing via a connecting block, and a main circuit board mounted on the mounting bracket. A base plate is fixedly connected to the bottom of the outer casing, and multiple electromagnetic blocks are equidistantly embedded in the top of the base plate. A compression spring is fixedly connected to the top of the electromagnetic blocks, and a storage sleeve is fixedly connected to the top of the compression spring. A support plate located below the mounting bracket is fixedly connected to the top of the storage sleeve, and a cooling pipe is laid on the support plate. Symmetrical perforations corresponding to the cooling pipes are opened on the side wall of the outer casing, and the cooling pipes extend to the outside of the outer casing through the perforations. A water tank filled with coolant is detachably connected to the outer wall of the outer casing, and a micro pump is installed in the water tank. The output and input ends of the micro pump are respectively threaded to the two ends of the cooling pipes via delivery pipes. A controller for controlling the electromagnetic blocks and the micro pump is fixedly connected inside the main circuit board, and a temperature sensor is fixedly connected to the inner wall of the main circuit board, and the temperature sensor is electrically connected to the controller.

[0008] Preferably, a heat dissipation assembly is installed on the side wall of the housing. The heat dissipation assembly includes vents symmetrically opened on the side wall of the housing, and the vents are located above the mounting bracket.

[0009] Preferably, a baffle is rotatably connected to the side wall of the vent via a hinge, and multiple heat dissipation holes are equally spaced on the vent.

[0010] Preferably, multiple connecting plates are fixedly connected at equal intervals on the inner wall of the outer shell at the top of the vent. A nickel-titanium-based memory alloy spring is fixedly connected between the connecting plate and the baffle, and the temperature value of the nickel-titanium-based memory alloy spring is set to ℃.

[0011] Preferably, the height of the storage sleeve is equal to the height of the compression spring when it is fully contracted, and the storage sleeve is made of magnetic material.

[0012] Preferably, the cooling pipe is in contact with the bottom of the circuit board when it is lifted upward by a compression spring.

[0013] Preferably, mounting blocks are symmetrically fixedly connected to both ends of the water tank, and the mounting blocks are fixed to the side wall of the outer shell by screws.

[0014] Compared with related technologies, this utility model has the following beneficial effects:

[0015] 1. This utility model, by setting up a cooling component, when the temperature sensor detects that the temperature inside the circuit board is too high, sends a signal to the controller to cut off the power to the electromagnetic block. At this time, the cooling pipe on the tray is lifted upward by the elastic force of the compression spring and contacts the bottom of the circuit board. Then, the controller starts the micro suction pump, which delivers coolant from the output end to the cooling pipe through the delivery pipe, and then returns it to the water tank from the input end, continuously circulating the coolant to quickly cool the top cover. When the temperature drops to the optimal operating range of the circuit board, the micro suction pump is turned off, and the electromagnetic block is powered on again, causing the electromagnetic block to attract the storage sleeve, which drives the compression spring to retract into the storage sleeve, lowering the cooling pipe on the tray to the initial position and separating it from the circuit board. This effectively achieves the effect of automatically activating the rapid cooling mechanism to cool the circuit board according to the change of the ambient temperature.

[0016] 2. This utility model, by setting up a heat dissipation component, in a high-temperature environment where the temperature exceeds 40°C, the nickel-titanium-based memory alloy spring will extend due to the temperature change, thereby rotating and flipping the baffle through the hinge, opening the vent, so that the control can directly enter the outer shell through the vent to dissipate heat from the circuit board. Combined with the cooling component, the heat dissipation effect can be accelerated. When the temperature drops to about 20°C, the nickel-titanium-based memory alloy spring will automatically retract, driving the baffle to close and reset.

[0017] To make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is an isometric view of the integrated circuit motherboard mounting according to this utility model;

[0020] Figure 2 An exploded view of the integrated circuit motherboard installation according to this utility model;

[0021] Figure 3 For the present utility model Figure 2 Enlarged view of point A in the middle;

[0022] Figure 4 This is a schematic diagram of the compression spring mounting structure of this utility model;

[0023] Figure 5 This is a schematic diagram of the heat dissipation component structure of this utility model.

[0024] Numbering on the map:

[0025] 1. Outer casing; 2. Circuit board; 3. Top cover; 4. Heat dissipation assembly; 401. Baffle; 402. Heat dissipation hole; 403. Hinge; 404. Vent; 405. Nickel-titanium-based memory alloy spring; 406. Connecting plate; 5. Cooling assembly; 501. Water tank; 502. Delivery pipe; 503. Perforation; 504. Mounting bracket; 505. Base plate; 506. Support plate; 507. Cooling pipe; 508. Compression spring; 509. Electromagnetic block; 510. Storage sleeve; 511. Connecting block. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figure 1-4 A highly stable integrated circuit motherboard includes a housing 1, a top cover 3 mounted on the top of the housing 1 by screws, a circuit motherboard 2 installed inside the housing 1, and a cooling component 5 installed inside the housing 1 below the circuit motherboard 2.

[0028] The cooling component 5 includes a mounting bracket 504 that is threadedly connected to the inner wall of the outer casing 1 via a connecting block 511, and a circuit board 2 is mounted on the mounting bracket 504. A base plate 505 is fixedly connected to the bottom of the outer casing 1. Multiple electromagnetic blocks 509 are equidistantly embedded in the top of the base plate 505. A compression spring 508 is fixedly connected to the top of the electromagnetic block 509. A storage sleeve 510 is fixedly connected to the top of the compression spring 508. A support plate 506 located below the mounting bracket 504 is fixedly connected to the top of the storage sleeve 510. Cooling pipes 507 are laid on the support plate 506. The outer casing 1 is located on the side of the mounting bracket 504. Symmetrical openings 503 are provided on the wall corresponding to the cooling pipe 507, and the cooling pipe 507 extends to the outside of the outer shell 1 through the through holes 503. A water tank 501 filled with coolant is detachably connected to the outer wall of the outer shell 1. A micro pump is installed in the water tank 501. The output end and input end of the micro pump are respectively threaded to the two ends of the cooling pipe 507 through the delivery pipe 502. A controller for controlling the electromagnetic block 509 and the micro pump is fixedly connected in the circuit main board 2. A temperature sensor is fixedly connected to the inner wall of the circuit main board 2, and the temperature sensor is electrically connected to the controller.

[0029] Please see Figure 1 and Figure 4 The height of the storage sleeve 510 is equal to the height of the compression spring 508 when it is fully contracted. The storage sleeve 510 is made of magnetic material. The cooling pipe 507 is in contact with the bottom of the circuit board 2 when it is pushed upward by the compression spring 508. The water tank 501 is symmetrically fixed with mounting blocks at both ends, and the mounting blocks are fixed to the side wall of the outer shell 1 by screws.

[0030] By setting the cooling component 5, when the temperature sensor detects that the temperature inside the main circuit board 2 is too high, it sends a signal to the controller to cut off the power to the electromagnetic block 509. At this time, the cooling pipe 507 on the tray 506 is pushed upward by the elastic force of the compression spring 508 and contacts the bottom of the main circuit board 2. At this time, the controller starts the micro suction pump, which delivers coolant from the output end to the cooling pipe 507 through the delivery pipe 502, and then returns it to the water tank 501 from the input end, continuously circulating so that the coolant circulation can quickly cool the top cover 3. When the temperature drops to the optimal operating range of the main circuit board 2, the micro suction pump is turned off, and the electromagnetic block 509 is powered on again, so that the electromagnetic block 509 attracts the storage sleeve 510, which drives the compression spring 508 to retract into the storage sleeve 510, lowering the cooling pipe 507 on the tray 506 to the initial position and separating it from the main circuit board 2. This effectively achieves the effect of automatically starting the rapid cooling mechanism to cool the main circuit board 2 according to the change of the ambient temperature of the main circuit board 2.

[0031] Please see Figure 1 and Figure 5 A heat dissipation assembly 4 is installed on the side wall of the outer casing 1. The heat dissipation assembly 4 includes vents 404 symmetrically opened on the side wall of the outer casing 1, and the vents 404 are located above the mounting bracket 504. A baffle 401 is rotatably connected to the side wall of the vent 404 via a hinge 403. Multiple heat dissipation holes 402 are equally spaced on the vent 404. Multiple connecting plates 406 are fixedly connected at equal intervals on the inner wall of the outer casing 1 at the top of the vent 404. A nickel-titanium-based memory alloy spring 405 is fixedly connected between the connecting plate 406 and the baffle 401, and the temperature value of the nickel-titanium-based memory alloy spring 405 is set to 40°C.

[0032] By setting up the heat dissipation component 4, in a high-temperature environment where the temperature exceeds 40°C, the nickel-titanium-based memory alloy spring 405 will extend due to the temperature change, thereby rotating and flipping the baffle 401 via the hinge 403, opening the vent 404, so that the control can directly enter the outer casing 1 through the vent 404 to dissipate heat to the circuit board 2. In conjunction with the cooling component 5, the heat dissipation effect can be accelerated. When the temperature drops to about 20°C, the nickel-titanium-based memory alloy spring 405 will automatically retract, driving the baffle 401 to close and reset.

[0033] The specific implementation process of this utility model is as follows: First, when the temperature sensor detects that the temperature inside the main circuit board 2 is too high, it sends a signal to the controller to cut off the power to the electromagnetic block 509. At this time, the cooling pipe 507 on the support plate 506 is lifted upward by the elastic force of the compression spring 508 and contacts the bottom of the main circuit board 2. At this time, the controller turns on the micro suction pump to deliver coolant from the output end to the cooling pipe 507 through the delivery pipe 502, and then returns it from the input end to the water tank 501, continuously circulating so that the coolant circulates to quickly cool the top cover 3. When the temperature drops to the optimal operating range of the main circuit board 2, the micro suction pump is turned off, and the electromagnetic block 509 is powered on again, so that the electromagnetic block 509 contacts the bottom of the main circuit board 2. The sleeve 510 attracts the compression spring 508, causing it to retract into the sleeve 510. This lowers the cooling pipe 507 on the support plate 506 to its initial position, separating it from the main circuit board 2. Next, in high-temperature environments exceeding 40°C, the nickel-titanium-based memory alloy spring 405 will extend due to the temperature change, causing the baffle 401 to rotate and flip via the hinge 403, opening the vent 404. This allows the control to directly enter the outer casing 1 through the vent 404 to dissipate heat from the main circuit board 2. Combined with the cooling component 5, this accelerates the heat dissipation effect. When the temperature drops to around 20°C, the nickel-titanium-based memory alloy spring 405 will automatically retract, causing the baffle 401 to close and reset.

[0034] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. An integrated circuit main board having high stability, comprising an outer housing (1), characterized in that: The top end of the outer shell (1) is provided with a top cover (3) through screw mounting, the outer shell (1) is internally provided with a circuit mainboard (2), and a cooling assembly (5) is mounted below the circuit mainboard (2) in the outer shell (1); The cooling assembly (5) comprises a mounting frame (504) which is threadedly connected to the inner wall of the outer shell (1) through a connecting block (511), and the circuit mainboard (2) is mounted on the mounting frame (504); a bottom plate (505) is fixedly connected to the bottom of the outer shell (1); a plurality of electromagnetic blocks (509) are inlaid at equal intervals on the top end of the bottom plate (505); a compression spring (508) is fixedly connected to the top end of the electromagnetic block (509); a receiving sleeve (510) is fixedly connected to the top end of the compression spring (508); a supporting plate (506) is fixedly connected below the mounting frame (504) on the top end of the receiving sleeve (510); the supporting plate (506) is provided with a cooling pipe (507); a plurality of through holes (503) corresponding to the cooling pipe (507) are symmetrically formed in the side wall of the outer shell (1), and the cooling pipe (507) extends out of the outer shell (1) through the through holes (503); a water tank (501) filled with cooling liquid is detachably connected to the outer wall of the outer shell (1); a micro suction pump is mounted in the water tank (501); the output end and the input end of the micro suction pump are respectively threadedly connected to the two ends of the cooling pipe (507) through a conveying pipe (502); a controller for controlling the electromagnetic blocks (509) and the micro suction pump is fixedly connected to the circuit mainboard (2); a temperature sensor is fixedly connected to the inner wall of the circuit mainboard (2), and the temperature sensor is electrically connected to the controller.

2. The integrated circuit main board according to claim 1, wherein: The side wall of the outer shell (1) is provided with a heat dissipation assembly (4), and the heat dissipation assembly (4) comprises air vents (404) symmetrically formed in the side wall of the outer shell (1), and the air vents (404) are located above the mounting frame (504).

3. The integrated circuit main board according to claim 2, wherein: The side wall of the air vent (404) is rotatably connected with a baffle (401) through a hinge (403), and a plurality of heat dissipation holes (402) are symmetrically formed in the air vent (404).

4. The integrated circuit main board according to claim 2, wherein: A plurality of connecting plates (406) are fixedly connected at equal intervals to the inner wall of the outer shell (1) at the top of the air vent (404), a nickel-titanium-based memory alloy spring (405) is fixedly connected between the connecting plate (406) and the baffle (401), and the temperature value of the nickel-titanium-based memory alloy spring (405) is set to 40 DEG C.

5. The integrated circuit main board according to claim 1, wherein: The height of the receiving sleeve (510) is equal to the height of the compression spring (508) in the fully contracted state, and the receiving sleeve (510) is made of magnetic material.

6. The integrated circuit main board of claim 1, wherein: The cooling pipe (507) is in contact with the bottom of the circuit mainboard (2) in the upwardly lifted state of the compression spring (508).

7. A highly stable integrated circuit motherboard according to claim 1, characterized in that: The water tank (501) is symmetrically fixedly connected with mounting blocks at the two ends, and the mounting blocks are threadedly fixed to the side wall of the outer shell (1) through screws.

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