LED device

Abstract

The utility model is applicable to the technical field of LED packaging, and provides an LED device, the LED device comprises a substrate, an LED chip, a box dam, a light window and a sealing member, the box dam is provided with a first end and a second end which are opposite to each other and side walls extending at the first end and the second end, the side walls define a cavity, and the light window is arranged in the cavity. The box dam is installed on the substrate through the first end, the LED chip is arranged in the cavity and packaged on the substrate, the light window is connected to the second end so as to cover the cavity in a sealing mode, the sealing piece is arranged between the light window and the second end, and the LED chip is arranged in the cavity. The light window is fixedly connected with the box dam through a buckle structure located in the cavity. According to the LED device provided by the utility model, the defects of semi-inorganic and full-inorganic packaging technologies in the market are overcome, the air tightness of products can be ensured, and the packaging efficiency and the service life of the LED device are greatly improved.

Description

Technical Field

[0001] This utility model belongs to the field of LED packaging technology, and in particular relates to an LED device. Background Technology

[0002] Light-emitting diodes (LEDs) are semiconductor light sources characterized by high luminous efficiency and long lifespan. To expand the application range of LEDs, ultraviolet light-emitting diode (UV-LED) lamps have emerged. Today, UV-LED lamps are already being used in fields such as biomedicine, anti-counterfeiting, and purification. The technology of UV-LED lamps is still under continuous development.

[0003] UV-LED packaging typically consists of a chip, a ceramic substrate, and a glass lens. The tightness of the bond between the glass lens and the ceramic substrate is crucial for ensuring the product's airtightness. Airtightness is a major factor affecting product lifespan; poor airtightness allows moisture from the environment to enter the product during use, reducing LED lifespan and potentially causing LED failure. Currently, the mainstream technologies for bonding glass lenses and ceramic substrates are: 1) using organic adhesives to bond the glass lens to the ceramic substrate, commonly known as a semi-inorganic packaging process; and 2) embedding metal around the glass lens or metallizing the bottom of the glass lens and then soldering the metal to the ceramic substrate, commonly known as a fully inorganic packaging process.

[0004] Currently available semi-inorganic and fully inorganic packaging technologies all have the following drawbacks:

[0005] 1. The defects of semi-inorganic packaging on the market are:

[0006] ① During product use, ultraviolet light will irradiate the adhesive. Organic adhesive will age and fail under UV irradiation for a long time, which will cause the glass lens to fall off.

[0007] ② The bonding of glass requires first applying glue, and after covering with glass, the glue needs to be baked and cured at high temperature. Not only is the process complicated, but the high temperature will also cause secondary damage to the chip (the primary damage is that the chip needs to go through high temperature during die bonding to weld the chip to the substrate).

[0008] 2. The drawbacks of fully inorganic packaging on the market are:

[0009] ① There are generally two types of all-inorganic packaging. One type is to metallize the bottom of the glass lens and then use reflow soldering to solder the glass lens onto the ceramic substrate. The disadvantage of this type of all-inorganic packaging is that the entire product is heated during reflow soldering, and the high temperature will also cause secondary damage to the chip.

[0010] ② Another method uses a TO-type metal casing with a light window, which is laser-welded onto the ceramic substrate. This is currently the mainstream all-inorganic packaging method on the market. Although this all-inorganic packaging method involves localized heating, preventing secondary damage to the chip, its disadvantages include: slower laser welding efficiency, more complex procedures, and higher costs. Utility Model Content

[0011] This utility model aims to solve at least one of the above-mentioned technical problems and provides an LED device that overcomes the defects of semi-inorganic and fully inorganic packaging processes on the market, and can ensure the airtightness of the product, greatly improving the packaging efficiency and lifespan of the LED device.

[0012] The technical solution of this utility model is: an LED device, including a substrate, an LED chip, a dam, a light window, and a sealing element. The dam has a first end and a second end opposite to each other, and sidewalls extending from the first end and the second end. The sidewalls define a cavity. The dam is mounted on the substrate through the first end. The LED chip is disposed in the cavity and encapsulated on the substrate. The light window is connected to the second end to cover the cavity. The sealing element is disposed between the light window and the second end, and the light window is connected and fixed to the dam through a snap-fit ​​structure located in the cavity.

[0013] Optionally, the buckle structure includes at least one set of buckle components arranged opposite to each other. Each buckle component includes a buckle part and a slot part. The light window is provided with the buckle part, and the dam is provided with the slot part.

[0014] Optionally, the slot portion is located on the side wall and is recessed relative to the inner surface of the side wall toward the outer surface of the side wall.

[0015] Optionally, the latching part includes an extension section, a connecting section, and a barb. The extension section extends along a first direction and connects to the light window. The first direction is parallel to the light window. The connecting section extends along a second direction, which is the direction from the second end to the first end. One end of the connecting section is connected to the extension section, and the other end is connected to the barb. The barb can be latched into the slot.

[0016] Optionally, the sidewall is provided with a guide groove extending along the second direction, the guide groove passing through the second end and communicating with the slot portion, wherein the connecting section passes through the guide groove so that the barb is engaged with the slot portion.

[0017] Optionally, the inner side of the second end is recessed to form a stepped structure, the light window is installed on the stepped structure, and the slot is located below the stepped structure.

[0018] Optionally, the step structure has a step surface that is lower than the end face of the second end, and the side wall is provided with a guide groove extending along the second direction. The guide groove passes through the step surface and communicates with the slot portion, wherein the connecting section passes through the guide groove so that the barb engages with the slot portion.

[0019] Optionally, the number of barbs is two, the two barbs are arranged opposite to each other about the connecting segment, and the barbs undergo elastic deformation under pressure.

[0020] Optionally, the sealing element is a flexible element, and the sealing element has a minimum thickness H1 after being deformed by pressure. The minimum thickness H1 is defined as: H1≤H2-H3-H4, where H2 is the length of the connecting segment, H3 is the length of the barb, and H4 is the distance from the slot to the step surface of the stepped structure.

[0021] Optionally, the dam also has an installation space, which is defined as: an area extending horizontally from the inner and outer edges of the second end of the dam to both sides, and enclosed within an angle α formed by the line connecting the inner and outer edges of the first end of the dam, which does not exceed 70°. When the light window is connected and fixed to the dam, the snap-fit ​​structure is located within the installation space.

[0022] This invention provides an LED device that utilizes a snap-fit ​​structure to mechanically connect and fix the light window and the enclosure. A sealing element located between the second end of the light window and the enclosure ensures the airtightness of the LED device encapsulation. Furthermore, since the snap-fit ​​structure 6 is located within a cavity 34, the cavity 34 conceals the snap-fit ​​structure 6, ensuring a clean and uncluttered appearance for the LED device. Compared to existing semi-inorganic and fully inorganic encapsulation methods, this invention eliminates the need for bonding or welding, simplifying the encapsulation process and making it more concise and efficient. Moreover, because the LED device of this invention does not suffer secondary high-temperature damage to the LED chip during the encapsulation process, it significantly extends the lifespan of the LED device. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a cross-sectional view of the LED device provided in this embodiment of the utility model;

[0025] Figure 2 yes Figure 1 Sectional view omitting the light window and snap-fit ​​structure;

[0026] Figure 3 This is a partial structural diagram showing the positional relationship between the latching part and the slot part in the LED device provided in this embodiment of the utility model;

[0027] Figure 4 This is a partial structural diagram showing the positional relationship between the latching part and the slot part in an LED device with a guide groove on the side wall, provided in an embodiment of this utility model.

[0028] Figure 5 This is a schematic diagram of the snap-fit ​​part in the LED device provided in this embodiment of the utility model;

[0029] Figure 6 This is another structural schematic diagram of the snap-fit ​​part in the LED device provided in this embodiment of the utility model;

[0030] Figure 7 This is another structural schematic diagram of the slot portion in the LED device provided in this embodiment of the utility model;

[0031] Figure 8 This is another structural schematic diagram of the slot portion in the LED device provided in this embodiment of the utility model.

[0032] Figure 9 This is a schematic diagram of the LED device light window encapsulated in the dam according to an embodiment of the present invention;

[0033] Figure 10 This is a cross-sectional view of the LED device provided in this embodiment of the present invention when the sidewall has a guide groove;

[0034] Figure 11 yes Figure 10 Sectional view omitting the light window and snap-fit ​​structure.

[0035] Figure 12 This is another cross-sectional view of the LED device provided in this embodiment of the present invention when the sidewall is provided with a guide groove;

[0036] Figure 13 This is another cross-sectional view of the LED device provided in this embodiment of the present invention when the side wall is provided with a guide groove;

[0037] Figure 14 This is a schematic diagram of the mounting space in the LED device provided in this embodiment of the utility model.

[0038] 1-Substrate, 2-LED chip, 3-Dam, 31-First end, 32-Second end, 33-Side wall, 34-Cavity, 4-Light window, 5-Sealing component, 6-Snap-fit ​​assembly, 61-Snap-fit ​​part, 611-Extension section, 612-Connecting section, 613-Barb, 62-Slot part, 7-Step structure, 71-Step surface, 72-Chamfer, 8-Solder, 9-Auxiliary component, 10-Guide groove, 11-First circuit, 12-Second circuit, 13-Conductive hole, 14-Mounting space. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0040] It should be noted that the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to direct setup, installation, or connection, or indirect setup or connection through centered components or centered structures.

[0041] Furthermore, in embodiments of this utility model, the orientations or positional relationships indicated by terms such as "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are based on the orientations or positional relationships shown in the accompanying drawings or the conventional placement or usage state. These are merely for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the structure, feature, device, or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In the description of this utility model, unless otherwise stated, "multiple" means two or more.

[0042] The various specific technical features and embodiments described in the detailed embodiments can be combined in any suitable manner without contradiction. For example, different implementation methods can be formed by combining different specific technical features / embodiments. In order to avoid unnecessary repetition, the various possible combinations of the various specific technical features / embodiments in this utility model will not be described separately.

[0043] like Figure 1As shown, the LED device of this utility model includes a substrate 1, an LED chip 2, a dam 3, a light window 4, and a sealing member 5. The light window 4 is defined to allow light emitted by the LED chip 2 to pass through. The dam 3 has a first end 31 and a second end 32, and sidewalls 33 extending from the first end 31 and the second end 32. The sidewalls 33 define a cavity 34. Specifically, the sidewalls 33 enclose a cavity 34. The dam 3 is mounted on the substrate 1 through the first end 31. The LED chip 2 is disposed in the cavity 34 and encapsulated on the substrate 1. The light window 4 is sealed to the second end 32. The substrate 1 and the light window 4 enclose the cavity 34 into a sealed cavity. The sealing member 5 is disposed between the light window 4 and the second end 32, and the light window 4 is connected and fixed to the dam 3 through a snap-fit ​​structure 6 located in the cavity 34.

[0044] The LED device provided by this invention utilizes a snap-fit ​​structure to mechanically connect and fix the light window 4 and the enclosure 3, eliminating the need for bonding or welding processes required in existing technologies. This makes the packaging simpler and more efficient, effectively improving packaging efficiency. Furthermore, the sealing element 5 located between the light window 4 and the second end 32 of the enclosure 3 ensures the airtightness of the LED device packaging. Simultaneously, since the snap-fit ​​structure 6 is located within the cavity 34, the cavity 34 conceals the snap-fit ​​structure 6, ensuring a clean and uncluttered appearance for the LED device. The LED device provided by this invention features simple and efficient packaging and reliable product quality.

[0045] Specifically, such as Figure 1 , Figure 2 , Figure 10 , Figures 11 to 13 As shown, the substrate 1 of this invention is a ceramic substrate. A first line 11 is provided on the front side of the ceramic substrate for connection to the LED chip 2. Preferably, a second line 12 is provided on the back side of the substrate 1 for electrical connection to the PCB board. The substrate 1 has conductive holes 13 penetrating both the front and back sides. The first line 11 and the second line 12 can be electrically connected through the conductive holes 13, thereby realizing the connection between the LED chip 2 and the first line 11 and the second line 12. In specific applications, the first line 11 and the second line 12 on the ceramic substrate can be implemented using DPC (Direct Plating Copper) technology.

[0046] In some embodiments, when the dam 3 is viewed along a direction perpendicular to the light window 4, the cross-section of the chamber 34 defined by the sidewall 33 of the dam 3 can be square, rectangular, or circular. In this embodiment, the cross-section of the chamber 34 defined by the sidewall 33 of the dam 3 is rectangular, and the dam 3 is a metal component. Specifically, the dam 3 is made of copper, i.e., a copper dam, and the first end 31 of the copper dam is welded to the substrate 1 to achieve connection and fixation between the dam 3 and the substrate 1. Alternatively, the copper dam and the substrate 1 can be integrally formed using a DPC process. Specifically, the sealing element 5 is annular, and the shape of the sealing element 5 is the same as the cross-sectional shape of the dam 3.

[0047] In some embodiments, the snap-fit ​​structure 6 may include at least one set of oppositely arranged snap-fit ​​components 6, with at least two snap-fit ​​components 6 ensuring the stability of the connection between the light window 4 and the dam 3. The snap-fit ​​components 6 can be arranged in two, three, four, or other groups as needed. In each group, two snap-fit ​​components 6 are spaced apart relative to each other along a direction parallel to the plane of the light window 4. The line connecting two snap-fit ​​components 6 in each group is defined as a first line segment, and the relationship between adjacent first line segments is either parallel or intersecting. In this invention, when the number of snap-fit ​​components 6 exceeds two groups, the arrangement of the multiple first line segments is not limited, as long as the connection strength between the light window 4 and the dam 3 is ensured.

[0048] In some embodiments, such as Figure 1 , Figure 3 , Figure 4 , Figures 9 to 13 As shown, the snap-fit ​​assembly 6 may include a snap-fit ​​part 61 and a slot part 62. The light window 4 may be provided with the snap-fit ​​part 61, and the dam 3 may be provided with the slot part 62. The light window 4 is connected and fixed to the dam 3 by the snap-fit ​​part 61 and the slot part 62.

[0049] Optionally, such as Figure 3 As shown in Figure b, the slot portion 62 is located on the inner side of the side wall 33, while the latch portion 61 is coupled to the light window 4. When the light window 4 covers the second end 32 of the enclosure 3, the latch portion 61 extends into the cavity 34 and engages with the slot portion 62. Thus, the latch portion 61 and the slot portion 62 are located within the cavity, and the cavity 34 conceals the latch structure, ensuring a clean and uncluttered appearance for the LED device. Specifically, the slot portion 62 is located on the side wall 33 and is recessed relative to the inner surface of the side wall 33 towards its outer surface. The depth of the recess is less than the distance between the inner and outer surfaces of the side wall 33. By recessing the slot portion 62 onto the surface of the side wall 33, processing becomes easier.

[0050] In practical applications, such as Figure 3As shown in diagram a, the slot portion 62 can also be located on the outer side of the side wall 33, while the latch portion 61 is coupled to the light window 4. When the light window 4 covers the second end 32 of the dam 3, the latch portion 61 is located outside the chamber 34 and is latched and connected to the slot portion 62. In this structure, the latch portion 61 is connected to the light window 4, and the slot portion 62 is located on the side wall 33, wherein the slot portion 62 is recessed relative to the surface of the side wall 33. The slot portion 62 is located on the side wall 33 and is recessed relative to the outer surface of the side wall 33 towards the inner surface of the side wall 33.

[0051] In some embodiments, such as Figure 5 As shown, the latching part 61 includes an extension section 611, a connecting section 612, and a barb 613. The extension section 611 extends along a first direction and is connected and fixed to the light window 4. The first direction is parallel to the light window 4. One end of the connecting section 612 is connected to the extension section 611 and extends along a second direction, which is the direction from the second end 32 to the first end 31. The other end of the connecting section 612 is connected to the barb 613, which faces the latching slot 62, so that the barb 613 can be latched into the latching slot 62. By providing the extension section 611 extending along the first direction, the contact area between the latching part 61 and the light window 4 is increased, thereby ensuring the connection strength between the latching part 61 and the light window 4.

[0052] Specifically, such as Figure 5 As shown, the connecting segment 612 can be connected to the end of the extension segment 611. At this time, the shape of the extension segment 611 and the connecting segment 612 after being connected is L-shaped.

[0053] Optionally, the extension section 611 can be connected and fixed to the light window 4 by means of bonding, welding, locking connection, etc.

[0054] Optionally, the light window 4 is made of glass, and the latching part 61 is made of metal. The latching part 61 is manufactured by a stamping process. For example, the latching part 61 is preferably made of Kova alloy. A solder 8 is provided between the latching part 61 and the light window 4. See [link to relevant documentation]. Figure 1 The latching part 61 is brazed to the light window 4, with the extension 611 located above the stepped surface 71, serving as the welding area for the latching part 61 and the light window 4. Kova alloy can achieve a tight mechanical connection between the two materials within a certain temperature range, thus ensuring a good bond to the light window 4. In this invention, the specific material of the light window 4 is not limited, as long as it allows light transmission.

[0055] Optionally, such as Figure 5As shown, the included angle β between the extension segment 611 and the connecting segment 612 is less than 90°, meaning that the end of the connecting segment 612 away from the extension segment 611 is inclined towards the sidewall 33. This prevents the barb 613 from easily dislodging from the slot 62 after it is engaged, further ensuring the reliability of the LED device package. In practical applications, the included angle β between the extension segment 611 and the connecting segment 612 can also be 90°.

[0056] Optionally, such as Figure 2 and Figure 9 As shown, the inner edge of the step surface 71 can be provided with a chamfer 72. Since the included angle β between the extension section 611 and the connecting section 612 is less than 90°, by providing the chamfer 72, the chamfer 72 can guide the barb 613 during the process of the external force F pushing the light window 4 closer to the second end 32, so that the barb 613 can smoothly enter the cavity 34.

[0057] In some embodiments, such as Figure 2 and Figure 11 As shown, the inner side of the second end 32 (i.e., the side near the chamber 34) can be recessed to form a stepped structure 7. The stepped structure 7 has a stepped surface 71, which is lower than the end face of the second end 32, creating a height difference between the stepped surface 71 and the end face of the second end 32. The light window 4 can be installed onto the stepped structure 7 by embedding, and the slot 61 is located below the stepped structure 7. By setting the stepped structure 7, it can serve two purposes: firstly, it can play a positioning role, allowing the light window 4 to be precisely encapsulated onto the dam 3; secondly, after the light window 4 is embedded into the stepped structure 7, the stepped structure 7 can effectively protect the light window 4, preventing the edges of the light window 4 from being accidentally damaged or chipped.

[0058] When the light window 4 is embedded in the stepped structure 7, both the latching part 61 and the slot part 62 are located within the cavity 34. This prevents the connection between the latching part 61 and the slot part 62 from being affected by the external environment, ensuring the reliability of the LED device packaging. Furthermore, hiding the latching part 61 and the slot part 62 within the cavity 34 also ensures a clean and uncluttered appearance for the LED device. The structure of the slot part 62 located on the inner side of the side wall 33 can be as follows: Figure 2 , Figure 7 and Figure 8 As shown. In this utility model, the specific structure of the slot 62 is not limited, as long as the barb 613 can be engaged with the slot 62.

[0059] Preferably, such as Figure 1 , Figure 10 , Figure 12 and Figure 13As shown, the height difference between the step surface 71 and the end face of the second end 32 is limited to the following: when the light window 4 is installed on the step structure 7, the upper surface of the light window 4 is flush with the end face of the second end 32, thereby ensuring the consistency of the LED device's appearance. In practical applications, when the light window 4 is installed on the step structure 7, the upper surface of the light window 4 may be lower than the end face of the second end 32, or the upper surface of the light window 4 may be higher than the end face of the second end 32. In this invention, as long as the light window 4 can be installed on the step structure 7, the height difference between the step surface 71 and the end face of the second end 32 is not limited.

[0060] Optionally, such as Figure 1 , Figure 10 , Figure 12 and Figure 13 As shown, the seal 5 can be located between the stepped surface 71 and the extension 611. The seal 5 is made of an elastic material, such as silicone resin, epoxy resin, Teflon, etc., so that the seal 5 has resilience after molding. See also Figure 7 After the light window 4 is sealed to the second end 32, an external force F is applied to the light window 4 from the second end 32 toward the first end 31. During this process, the sealing element 5 undergoes elastic deformation under pressure until the light window 4 is fixed to the dam 3 through the snap-fit ​​structure (i.e., the barb 613 is engaged with the slot 62). After the external force F is removed, the sealing element 5 tends to return to its initial state. The light window 4 moves away from the step surface 71 under the action of the sealing element 5, and the snap-fit ​​part 61 also moves with the light window 4, so that the barb 613 is tightly engaged with the slot 62, further ensuring the stability of the connection between the light window 4 and the dam 3. At the same time, the sealing element 5 tends to return to its original state and will fully fill the space between the light window 4 and the step surface 71 to ensure the airtightness of the LED device and prevent moisture from the environment from entering the LED device during use.

[0061] Optionally, the seal 5, after being deformed under pressure, has a minimum thickness H1, which is defined as: H1 ≤ H2 - H3 - H4, where H2 is the length of the connecting section 612, H3 is the length of the barb 613, and H4 is the distance from the slot 62 to the stepped surface 71 (see [link to documentation]). Figure 2 and Figure 5 The length of the barb 613 is specifically defined as the length between the position of the barb 613 closest to the first end 31 and the position of the barb 613 closest to the second end 32. By defining the relationship between H1, H2, H3, and H4, it is ensured that when the seal 5 is deformed under pressure to the minimum thickness H1, the barb 613 can be engaged with the groove portion 62.

[0062] In some embodiments, such as Figure 4As shown, a guide groove 10 extending in a second direction can be provided on the side wall 33. The guide groove 10 passes through the second end 32 and communicates with the slot portion 62. The connecting section 612 passes through the guide groove 10 so that the barb 613 is engaged with the slot portion 62. During encapsulation, the snap-fit ​​portion 61 needs to be aligned with the guide groove 10. After the light window 4 covers the second end 32, the connecting section 612 of the snap-fit ​​portion 61 can pass through the guide groove 10, and at the same time, the barb 613 is engaged with the slot portion 62. By providing the guide groove 10, the extension section 612 of the snap-fit ​​portion 61 and the barb 613 are hidden within the enclosure 3, resulting in good overall appearance consistency of the encapsulated LED device.

[0063] Specifically, the position of the guide groove 10 is determined by the position of the slot portion 62, for example, as Figure 4 As shown in Figure c, the slot portion 62 is located on the side wall 33 and is recessed relative to the outer surface of the side wall 33 towards the inner surface of the side wall 33. At this time, the guide groove 10 is located on the side of the side wall 33 closer to the outer surface; as Figure 4 As shown in d, the slot 62 is located on the side wall 33 and is recessed relative to the inner surface of the side wall 33 toward the outer surface of the side wall 33. At this time, the guide groove 10 is located on the side of the side wall 33 near the inner surface.

[0064] Specifically, when a guide groove 10 is provided on the side wall 33, a clearance hole (not shown in the figure) is provided on the sealing member 5 at a position corresponding to the guide groove 10, so that the connecting section 612 of the snap-fit ​​part 61 passes through the clearance hole first and then enters the guide groove 10. With this arrangement, the snap-fit ​​part 61 can be used to limit the sealing member 5, ensuring that the sealing member 5 always remains in the correct position during the sealing process.

[0065] In some embodiments, such as when a stepped structure 7 is formed by a recess on the inner side of the second end 32 (i.e., the side near the chamber 34), as... Figures 10 to 13 As shown, the sidewall 33 can also be provided with a guide groove 10 extending in the second direction. In this case, the guide groove 10 penetrates the stepped surface 71 and communicates with the slot portion 62. During encapsulation, the snap-fit ​​portion 61 needs to be aligned with the guide groove 10. When the light window 4 is installed on the stepped structure 7, the connecting section 612 of the snap-fit ​​portion 61 just passes through the guide groove 10, and the barb 613 is engaged with the slot portion 62. By setting the guide groove 10, the extension section 612 of the snap-fit ​​portion 61 and the barb 613 are hidden inside the enclosure 3, so that the overall appearance of the LED device after encapsulation is consistent. For the case where the stepped structure 7 is formed by a recess on the inner side of the second end 32 (i.e., the side near the chamber 34), the sealing member 5 can also be provided with a clearance hole at the position corresponding to the guide groove 10.

[0066] In some embodiments, such as Figure 4 e, Figure 6 Figure 12 and Figure 13As shown, when the guide groove 10 is provided on the side wall 33, whether the guide groove 10 passes through the second end 32 and is connected to the slot 62, or the guide groove 10 passes through the step surface 71 and is connected to the slot 62, the number of barbs 613 can be set to two. The two barbs 613 are arranged opposite to each other about the connecting section 612, and the barbs 613 will produce elastic deformation after being pressed. Understandably, in order to ensure the stability of the engagement between the barb 613 and the slot 62, the maximum distance between the two barbs 613 must be greater than the width of the guide groove 10 when no elastic deformation occurs. Since the barb 613 will undergo elastic deformation after being pressed, during the process of inserting the buckle 61 into the guide groove 10, the two barbs 613 are squeezed and elastically deformed by the groove wall of the guide groove 10, and the maximum distance between the two barbs 613 becomes smaller, so that the two barbs can smoothly enter the guide groove 10, and after exiting the guide groove 10, the two barbs 613 return to their original shape. At this time, the two barbs 613 are just engaged with the slot 62.

[0067] Specifically, such as Figure 4 e, Figure 6 Figure 12 and Figure 13 As shown, when there are two barbs 613, the connecting segment 613 can be connected to the middle of the extension segment 611. In this case, the shape of the extension segment 611 and the connecting segment 612 after connection is T-shaped. Understandably, the number of barbs 613 can also be three, four, five, etc. When there are more than three barbs 613, multiple barbs 613 are connected to the end of the connecting segment 612 and are distributed at intervals along the circumference of the connecting segment 612.

[0068] In practical applications, such as Figure 13 As shown, by reducing the size of the extension 611 of the latching part 61, the extension 611 located below the light window is less noticeable when viewing the LED device from above, further improving the overall appearance consistency of the LED device. At the same time, the number of latching components is increased to ensure the connection strength between the latching part 61 and the light window 4.

[0069] In some embodiments, the LED chip 2 is packaged on the substrate 1 in at least one of the following ways: flip-chip, upright, or vertical packaging. That is, when the LED chip 2 is a flip chip, it can be packaged on the substrate 1 by a eutectic bonding process; or, when the LED chip 2 is an upright or vertical chip, it can be packaged on the substrate 1 by a wire bonding process. The type of LED chip 2 can be selected according to actual needs and is not specifically limited here.

[0070] In some embodiments, such as Figure 14As shown, the dam 3 also has an installation space 14, which is defined as the area enclosed by extending horizontally from the inner and outer edges of the second end 32 of the dam 3 to both sides, and within an angle α formed by the line connecting the inner and outer edges of the first end 31 of the dam 3, which does not exceed 70°. The light window 4 is connected and fixed to the dam 3 by a snap-fit ​​structure. When the light window 4 is connected and fixed to the dam 3, the snap-fit ​​structure is located within the installation space 14.

[0071] After the light window 4 is connected and fixed to the dam 3, the buckle structure 6 is positioned exactly within the installation space 14. This design reduces the impact of the buckle part 61 on the light-emitting path of the LED chip 2, ensuring the light-emitting effect of the LED device.

[0072] Specifically, please see Figure 14 The inner edge of the first end 31 refers to endpoint A where the first end 31 intersects with the inner surface of the sidewall 33, and the outer edge of the first end 31 refers to endpoint B where the first end 31 intersects with the outer surface of the sidewall 33. The inner edge of the second end 32 refers to endpoint C where the second end 32 intersects with the inner surface of the sidewall 33, and the outer edge of the second end 32 refers to endpoint D where the second end 32 intersects with the outer surface of the sidewall 33. Extending a horizontal distance S inward from endpoint C yields endpoint C'. Connecting endpoint C' with endpoint A yields line segment L1. Extending a horizontal distance S outward from endpoint D yields endpoint D'. Connecting endpoint D' with endpoint B yields line segment L2, and the included angle α between line segments L1 and L2 is ≤ 70°. In this case, the installation space 14 refers to the area enclosed by endpoints A, B, D', and C'. After the light window 4 is connected and fixed to the dam 3, the buckle part 61 and the slot part 62 are both located in the area enclosed by the endpoints A, B, D' and C'.

[0073] In some embodiments, the installation space 14 is defined as the area enclosed by extending horizontally from the inner and outer edges of the second end 32 of the dam 3 to both sides, and within the range where the included angle α formed by the line connecting the inner and outer edges of the first end 31 of the dam 3 does not exceed 40°, i.e., the included angle α between line segment L1 and line segment L2 is ≤ 40°.

[0074] This utility model also provides an LED packaging method for packaging the above-mentioned LED device, comprising the following steps:

[0075] Prepare substrate 1;

[0076] LED chip 2 is packaged on substrate 1;

[0077] A dam 3 is prepared, the dam 3 having a sidewall 33 extending between a first end 31 and a second end 32 and between the first end 31 and the second end 32, the sidewall 33 defining a chamber 34, the dam 3 being mounted on a substrate 1 via the first end 31, such that an LED chip 2 is disposed within the chamber 34;

[0078] A sealing element 5 is provided on the second end 32, the light window 4 is placed on the sealing element 5, and a force is applied to the light window 4 from the second end 32 toward the first end 31. The light window 4 is connected and fixed to the dam 3 through the snap-fit ​​structure 6 located in the chamber 34.

[0079] This packaging method utilizes a snap-fit ​​structure to mechanically connect and fix the light window 4 and the enclosure 3, eliminating the need for bonding or welding processes in existing technologies. This makes the packaging simpler and more efficient, effectively improving packaging efficiency. Furthermore, a sealing element 5 is provided between the light window 4 and the second end 32 of the enclosure 3 to ensure the airtightness of the LED device packaging and guarantee product reliability.

[0080] In some embodiments, the preparation of substrate 1 includes:

[0081] A ceramic substrate is provided, on which a first line 11 and a second line 12 for connecting to an LED chip 2 can be respectively provided on the front and back sides. The first line 11 and the second line 12 can be fabricated using a DPC (Direct Plating Copper) process. Furthermore, the substrate 1 has a through-hole conductive via 13, through which the first line 11 and the second line 12 are connected, thereby enabling conductive communication between the LED chip 2 and the first line 11 and the second line 12, facilitating electrical connection to the LED chip 2. A nickel layer and a gold layer are sequentially plated onto the first line 11 and the second line 12 respectively to obtain the substrate 1. The purpose of the nickel and gold plating is to improve conductivity and oxidation resistance. Further, the thickness of the nickel layer is >3µm, and the thickness of the gold layer is >0.05µm to ensure conductivity and oxidation resistance.

[0082] Optionally, an LED chip 2 is packaged on the substrate 1, including:

[0083] LED chip 2 is a flip chip, which is soldered onto the surface of substrate 1 using a eutectic furnace.

[0084] In the soldering process, at least one temperature zone of the eutectic furnace is maintained between 280°C and 340°C. Since the pads of the flip chip are made of gold-tin alloy, and the melting point of gold-tin alloy is 280°C, maintaining at least one temperature zone of the eutectic furnace between 280°C and 340°C ensures a strong bond between the flip chip and substrate 1.

[0085] Optionally, flux may also be applied to the surfaces of the flip chip and substrate 1, serving as a medium for eutectic bonding and improving the adhesion between the flip chip and substrate 1 during eutectic soldering. Specifically, rosin and its metal mixture may be used as the flux.

[0086] Optionally, flux can be applied to the substrate surface by dotting, and then the LED chip 2 can be placed on the flux. It is understood that the flux can be dotted onto the surface of the substrate 110 by manual or mechanical means, such as using a smart robot to evenly apply a fixed amount of flux, thereby further improving the welding effect.

[0087] Optionally, during the welding process, the eutectic furnace is kept under vacuum, or an inert gas is introduced into the eutectic furnace. Vacuum or inert gas protection reduces the welding void ratio of the LED chip 2 and prevents high-temperature oxidation of the LED chip 2's electrodes. Specifically, nitrogen gas can be used as the inert gas.

[0088] In some embodiments, the preparation of substrate 1 includes:

[0089] A ceramic substrate is provided, on which a first line 11 and a second line 12 for connecting to an LED chip 2 can be respectively provided on the front and back sides. The first line 11 and the second line 12 can be fabricated using a DPC (Direct Plating Copper) process. Furthermore, the substrate 1 has a through-hole conductive via 13, through which the first line 11 and the second line 12 are connected, thereby enabling conductive communication between the LED chip 2 and the first line 11 and the second line 12, facilitating electrical connection to the LED chip 2. A nickel layer, a palladium layer, and a gold layer are sequentially plated onto the first line 11 and the second line 12 respectively to obtain the substrate 1. The purpose of plating the nickel, palladium, and gold layers is to ensure solderability, conductivity, and oxidation resistance. Further, the thickness of the nickel layer is >3 μm, the thickness of the palladium layer is >0.05 μm, and the thickness of the gold layer is >0.05 μm.

[0090] Optionally, an LED chip 2 is packaged on the substrate 1, including:

[0091] LED chip 2 is either a standard or vertical chip. Die-attach adhesive is applied to the corresponding positions on the surface of substrate 1. The standard or vertical chip is then placed on the adhesive and baked at high temperature to cure the adhesive, thus bonding the standard or vertical chip to substrate 1. Wire bonding is then performed between the electrodes of the standard or vertical chip and the circuitry of substrate 1 using soldering equipment. The die-attach adhesive ensures a stronger bond between the standard or vertical chip and substrate 1. The die-attach adhesive can be insulating glue, silver paste, or solder paste.

[0092] This invention provides an LED device that utilizes a snap-fit ​​structure to mechanically connect and fix the light window and the enclosure. A sealing element located between the second end of the light window and the enclosure ensures the airtightness of the LED device encapsulation. Furthermore, since the snap-fit ​​structure 6 is located within a cavity 34, the cavity 34 conceals the snap-fit ​​structure 6, ensuring a clean and uncluttered appearance for the LED device. Compared to existing semi-inorganic and fully inorganic encapsulation methods, this invention eliminates the need for bonding or welding, simplifying the encapsulation process and making it more concise and efficient. Moreover, because the LED device of this invention does not suffer secondary high-temperature damage to the LED chip during the encapsulation process, its lifespan is significantly extended.

[0093] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An LED device, characterized by, The application relates to a light-emitting diode (LED) encapsulation structure, which comprises a substrate, an LED chip, a dam, a light window and a sealing member, wherein the dam has opposite first and second ends and a sidewall extending from the first end to the second end, the sidewall defines a cavity, the dam is mounted on the substrate through the first end, the LED chip is arranged in the cavity and encapsulated on the substrate, the light window is connected to the second end to cover the cavity, the sealing member is arranged between the light window and the second end, and the light window is connected and fixed to the dam through a buckle structure in the cavity.

2. The LED device of claim 1, wherein, The buckle structure comprises at least one set of oppositely arranged buckle assemblies, each buckle assembly comprises a buckle part and a buckle groove part, the light window is provided with the buckle part, and the dam is provided with the buckle groove part.

3. The LED device of claim 2, wherein, The buckle groove part is arranged on the sidewall and recessed towards the outer surface of the sidewall relative to the inner surface of the sidewall.

4. The LED device of claim 2, wherein, The buckle part comprises an extension section, a connecting section and a barb, the extension section extends along a first direction and is connected to the light window, the first direction is parallel to the light window, the connecting section extends along a second direction, the second direction is a direction from the second end to the first end, one end of the connecting section is connected to the extension section, and the other end is connected to the barb, and the barb can be buckled in the buckle groove part.

5. The LED device of claim 4, wherein the first and second LED dies are mounted on the same side of the substrate. The sidewall is provided with a guide groove extending along the second direction, the guide groove penetrates through the second end and is communicated with the buckle groove part, and the connecting section penetrates through the guide groove so that the barb is buckled in the buckle groove part.

6. The LED device of claim 4, wherein, The inner side of the second end is recessed to form a step structure, the light window is mounted on the step structure, and the buckle groove part is arranged below the step structure.

7. The LED device of claim 6, wherein, The step structure has a step surface which is lower than the end surface of the second end, the sidewall is provided with a guide groove extending along the second direction, the guide groove penetrates through the step surface and is communicated with the buckle groove part, and the connecting section penetrates through the guide groove so that the barb is buckled in the buckle groove part.

8. The LED device of claim 5 or 7, wherein, The number of the barbs is two, the two barbs are oppositely arranged relative to the connecting section, and the barbs are elastically deformed under pressure.

9. The LED device of claim 6, wherein, The sealing member is a flexible member, the minimum thickness H1 of the sealing member after being deformed under pressure is limited as follows: H1<=H2-H3-H4, wherein H2 is the length of the connecting section, H3 is the length of the barb, and H4 is the distance from the buckle groove part to the step surface of the step structure.

10. The LED device of claim 1, wherein, The dam further has a mounting space, the mounting space is defined as a region surrounded by extending horizontally from the inner and outer edges of the second end of the dam to both sides and within a range in which the included angle alpha formed by the inner and outer edges of the first end of the dam is not more than 70 degrees, and the buckle structure is arranged in the mounting space after the light window is connected and fixed to the dam.

Images