LED support plate

Abstract

The utility model provides an LED support plate which comprises a substrate, a plurality of first cutting lines are arranged on one side of the substrate and used for dividing the substrate into a plurality of substrate units, second cutting lines and third cutting lines are arranged on the substrate units, and the second cutting lines and the third cutting lines are consistent in shape and correspond in position. The substrate is provided with a plurality of first blind holes, a plurality of second blind holes and a plurality of third blind holes. The plurality of first blind holes, the plurality of second blind holes and the plurality of third blind holes are formed, the substrate is subjected to cutting pretreatment, the LED bracket does not need to be put into a positioning jig for batch processing, the processing error caused by deflection of the bracket in the positioning jig is avoided, the process of putting the LED bracket into the jig is omitted, the efficiency is greatly improved, step-by-step separation is realized, and the production cost is reduced. And the internal stress on the LED product is small.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to an LED bracket plate. Background Technology

[0002] LEDs are light-emitting devices that convert electrical energy into light energy, offering advantages such as low energy consumption, high light quality, and good luminous efficacy. Current LED manufacturing processes include substrate fabrication, electroplating, and bracket cutting.

[0003] After the electroplating layer is made on the substrate, it is cut according to the divided bracket area to be cut, usually by laser cutting, to form several individual brackets. The individual brackets are then placed into a positioning fixture for subsequent processing.

[0004] However, for circular brackets, the positioning holes in the positioning fixture are also circular. Since the bracket needs to be placed into the hole, and the diameter of the hole is slightly larger than the bracket, the circular bracket is prone to rotation within it, resulting in angular displacement that is uncontrollable and thus affecting subsequent processing. Furthermore, placing the bracket into the fixture is inefficient. Additionally, laser cutting easily produces burrs on the edges of the bracket, which can negatively impact the quality of the LED chips. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide an LED bracket plate, which aims to solve the problems of low quality in cutting and separating the bracket from the substrate, inconvenience in subsequent jig processing, and difficulty in ensuring the quality of the final product in the prior art.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0007] An LED support board includes a substrate. One side of the substrate is provided with a plurality of first dicing lines, which divide the substrate into a plurality of substrate units. One side of each substrate unit is provided with a second dicing line, and the side of each substrate unit facing away from the second dicing line is provided with a third dicing line. The second dicing line is circular, and the second dicing line and the third dicing line have the same shape and are corresponding in position. A plurality of first blind holes, a plurality of second blind holes, and a plurality of third blind holes are formed on the substrate. The plurality of first blind holes are distributed along the first dicing lines, the plurality of second blind holes are distributed along the second dicing lines, and the plurality of third blind holes are distributed along the third dicing lines.

[0008] Compared with the prior art, the beneficial effects of this utility model are as follows: By setting a plurality of first blind holes, a plurality of second blind holes, and a plurality of third blind holes distributed along the cutting line, the substrate is pre-processed for cutting. In subsequent processing, there is no need to place the LED brackets separated from the substrate into a positioning fixture for batch processing. The LED bracket plate can be directly used for processing, avoiding processing errors caused by the brackets deflecting in the positioning fixture, and avoiding the problem of the LED brackets shaking or even falling off in the fixture. The processed products have good quality and the process of placing the LED brackets into the fixture is eliminated, greatly improving efficiency. After subsequent processing, the LED products can be separated by equipment or manually. First, a plurality of substrate units are separated according to the plurality of first blind holes, and then the LED products are separated from the substrate units according to the plurality of second blind holes and the plurality of third blind holes. Cutting in the holes avoids burrs on the surface of the LED products, resulting in high separation quality. Furthermore, the step-by-step separation reduces the internal stress on the LED products.

[0009] Furthermore, several first blind holes are evenly spaced, with the distance between adjacent first blind holes being 0.08 mm to 0.12 mm.

[0010] Furthermore, the depth of the first blind hole is 42% to 48% of the substrate thickness.

[0011] Furthermore, a number of second blind holes are evenly spaced apart, with the distance between adjacent second blind holes being 0.08mm to 0.12mm; and a number of third blind holes are evenly spaced apart, with the distance between adjacent third blind holes being 0.08mm to 0.12mm.

[0012] Furthermore, the depths of both the second and third blind vias are 27% to 33% of the substrate thickness.

[0013] Furthermore, the diameters of the first blind hole, the second blind hole, and the third blind hole are all 0.03mm to 0.07mm.

[0014] Furthermore, the second cutting line encloses and forms an LED bracket area, within which a first pad and a second pad are provided, both of which are semi-circular.

[0015] Furthermore, a dam is provided within the LED bracket area. The dam is circular, and the tops of the first pad and the second pad are both connected to the dam. The dam encloses and forms a receiving cavity, which is used to accommodate the LED chip and phosphor colloid. Attached Figure Description

[0016] Figure 1This is a first-view structural diagram of the LED bracket plate in an embodiment of this utility model;

[0017] Figure 2 This is a second-view structural diagram of the LED bracket plate in an embodiment of the present invention;

[0018] Figure 3 This is a schematic diagram of the structure of the first blind hole, the second blind hole, and the third blind hole in the LED bracket plate in this embodiment of the present invention;

[0019] Figure 4 This is a side view of the LED bracket area in the LED bracket plate in an embodiment of the present invention;

[0020] Figure 5 This is a schematic diagram of the positioning fixture and LED bracket in an embodiment of the present utility model;

[0021] Explanation of key component symbols:

[0022] substrate 100 substrate unit 110 First cutting line 210 First blind hole 211 Second cutting line 220 Second blind hole 221 Third cutting line 230 Third blind hole 231 First pad 310 Second pad 320 Enclosure 330 LED chips 340 Fluorescent colloids 350 Positioning fixture 400 positioning holes 410 LED bracket 420

[0023] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0024] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0025] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0027] Please see Figures 1 to 4The LED support plate in this embodiment of the present invention includes a substrate 100. One side of the substrate 100 is provided with a plurality of first cutting lines 210, which divide the substrate 100 into a plurality of substrate units 110. One side of each substrate unit 110 is provided with a second cutting line 220, and the side of each substrate unit 110 facing away from the second cutting line 220 is provided with a third cutting line 230. The second cutting line 220 is circular, and the second cutting line 220 and the third cutting line 230 have the same shape and are corresponding in position. Preferably, one side of the substrate 100 is divided into a plurality of rectangles, and a plurality of substrate units 110 can be obtained by cutting according to the plurality of rectangles. The second cutting line 220 divides a circular area within the rectangle, and an LED support plate can be obtained by cutting according to the circular area.

[0028] The substrate 100 has a plurality of first blind holes 211, a plurality of second blind holes 221, and a plurality of third blind holes 231. The first blind holes 211 are distributed along the first cutting line 210, the second blind holes 221 are distributed along the second cutting line 220, and the third blind holes 231 are distributed along the third cutting line 230. The first blind holes 211 are evenly spaced, with a distance of 0.08 mm to 0.12 mm between adjacent first blind holes 211. The depth of each first blind hole 211 is 4 times the thickness of the substrate 100. The depth of the second blind holes 221 is 2% to 48% of the thickness of the substrate 100. The second blind holes 221 are evenly spaced, and the distance between adjacent second blind holes 221 is 0.08 mm to 0.12 mm. The third blind holes 231 are evenly spaced, and the distance between adjacent third blind holes 231 is 0.08 mm to 0.12 mm. The depth of the second blind holes 221 and the third blind holes 231 is 27% to 33% of the thickness of the substrate 100. The diameter of the first blind hole 211, the second blind hole 221 and the third blind hole 231 is 0.03 mm to 0.07 mm. Preferably, the distance between adjacent first blind holes 211 is 0.1 mm, the depth of the first blind hole 211 is 45% of the thickness of the substrate 100, the distance between adjacent second blind holes 221 is 0.1 mm, the distance between adjacent third blind holes 231 is 0.1 mm, and the depth of both the second blind hole 221 and the third blind hole 231 is 30% of the thickness of the substrate 100. After the blind holes are opened, the LED bracket board can be directly used for subsequent processing without the need for a fixture to fix the position of the LED bracket. After the LED product is processed, it is first separated along the first cutting line 210 to obtain several substrate units 110. The substrate units 110 are fixed according to the rectangular positioning, and then separated a second time along the second cutting line 220 and the third cutting line 230 to obtain a circular LED bracket. Understandably, the first blind hole 211, the second blind hole 221, and the third blind hole 231 pass through a portion of the board. Single-sided cutting is performed based on the first blind hole 211, and double-sided cutting is performed based on the second blind hole 221 and the third blind hole 231. The separation and cutting process is relatively easy, and compared to cutting directly on the surface of the substrate 100, fewer burrs are generated. The burr phenomenon on the surface of the separated LED product is greatly improved. Furthermore, due to the multiple cutting and separation on both sides of the LED bracket board, the internal stress on the product during the separation process is gradually reduced, ensuring the quality of the separated product.

[0029] The second cutting line 220 encloses and forms an LED support area. A first pad 310 and a second pad 320 are disposed within the LED support area. Both the first pad 310 and the second pad 320 are semi-circular. A dam 330, which is circular, is disposed within the LED support area. The tops of the first pad 310 and the second pad 320 are connected to the dam 330. The dam 330 encloses and forms a receiving cavity for accommodating the LED chip 340 and the phosphor colloid 350. Preferably, the dam 330 provides protection and sealing for the first pad 310 and the second pad 320, and also helps to stabilize the leads connecting the LED chip 340 to the pads. The dam 330 is obtained by baking and curing with a dam adhesive.

[0030] Please see Figure 5 The positioning fixture 400 has several positioning holes 410. Several circular LED brackets 420 are separated from the traditional LED bracket plate. The positioning holes 410 and the LED brackets 420 are roughly matched in shape. However, since the LED brackets 420 need to be smoothly placed into the positioning holes 410, there is still a gap between the positioning fixture 400 and the LED brackets 420. Therefore, the LED brackets 420 are prone to uncontrollable deflection in the positioning fixture 400, and are prone to shaking or even falling off during subsequent processing, which has a serious negative impact on the final product. In this embodiment, the LED bracket plate does not require the positioning fixture 400 and is easy to separate after processing. If the traditional LED bracket plate is processed directly as a whole, drilling or laser cutting during product separation will generate greater internal stress, which will have a certain destructive force on the small structure of the product that has already been made, and may easily lead to product quality problems. The LED bracket plate with pre-drilling treatment eliminates the process of placing the LED bracket 420 into the positioning fixture 400, and the positioning of the whole plate processing is more accurate, and the processing quality and efficiency are greatly improved.

[0031] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0032] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An LED support plate, characterized by, The substrate is provided with a plurality of first cutting lines on one side thereof, the first cutting lines are used for dividing the substrate into a plurality of substrate units, the substrate units are provided with second cutting lines on one side thereof, the substrate units are provided with third cutting lines on the side opposite to the second cutting lines, the second cutting lines are in the shape of a circle, the second cutting lines are consistent with the third cutting lines in shape and correspond in position, a plurality of first blind holes, a plurality of second blind holes and a plurality of third blind holes are formed in the substrate, the plurality of first blind holes are distributed along the first cutting lines, the plurality of second blind holes are distributed along the second cutting lines, and the plurality of third blind holes are distributed along the third cutting lines.

2. The LED support plate of claim 1, wherein, The plurality of first blind holes are uniformly and spacedly distributed, and the distance between adjacent first blind holes is 0.08-0.12 mm.

3. The LED support plate of claim 1, wherein, The depth of the first blind hole is 42-48% of the thickness of the substrate.

4. The LED support plate of claim 1, wherein, The plurality of second blind holes are uniformly and spacedly distributed, and the distance between adjacent second blind holes is 0.08-0.12 mm, and the plurality of third blind holes are uniformly and spacedly distributed, and the distance between adjacent third blind holes is 0.08-0.12 mm.

5. The LED support plate of claim 1, wherein, The depth of the second blind hole and the third blind hole is 27-33% of the thickness of the substrate.

6. The LED support plate of claim 1, wherein, The diameter of the first blind hole, the second blind hole and the third blind hole is 0.03-0.07 mm.

7. The LED support plate of claim 1, wherein, The second cutting line encloses an LED support area, the LED support area is provided with a first solder pad and a second solder pad, and the first solder pad and the second solder pad are both in the shape of a semicircular ring.

8. The LED support plate of claim 7, wherein, The LED support area is provided with a dam, the dam is in the shape of a circular ring, the top of the first solder pad and the top of the second solder pad are connected to the dam, the dam encloses a containing cavity, and the containing cavity is used for containing an LED chip and a fluorescent colloid.

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