Chip transfer device for electrical test

Abstract

The utility model relates to the technical field of chip automatic production equipment, in particular to a chip transfer device for an electrical test, which comprises a horizontally arranged mounting plate, an upper moving seat arranged at the top of the mounting plate, a lower moving seat arranged at the bottom of the mounting plate, a guide rod arranged between the upper moving seat and the lower moving seat and vertically arranged, and a guide rod arranged between the upper moving seat and the lower moving seat. The guide rod is sleeved with a limiting plate capable of moving in the axial direction of the guide rod. The device further comprises a connecting plate capable of moving in the horizontal direction, the connecting plate is slidably connected with the mounting plate, a limiting structure is arranged between the side, away from the mounting plate, of the connecting plate and the limiting plate, and the limiting structure comprises an obliquely-formed limiting hole and a limiting column capable of moving in the limiting hole. The bottom of the connecting plate and the bottom of the lower moving base are both connected with adsorption heads used for adsorbing chips. By adopting the scheme, the chips can be moved in batches, and the distance between the adjacent chips can be changed.

Description

Technical Field

[0001] This utility model relates to the technical field of automated chip manufacturing equipment, specifically a chip transfer device for electrical testing. Background Technology

[0002] In chip manufacturing, electrical testing is necessary to ensure chip performance. This can be achieved using dedicated electrical test sockets. Existing electrical test sockets employ a quick-release structure, allowing chips to be inserted for testing. To improve production efficiency, automated processing is used, employing a suction device to pick up chips from the previous process and move them to the electrical test socket for testing. However, this method of individual chip suction is inefficient. To further improve efficiency, existing technologies have improved the suction device by incorporating multiple parallel suction heads, enabling simultaneous suction and movement of multiple chips. During electrical testing, electrical test sockets are required, but each socket can only test one chip. Therefore, during batch chip transfer, chips must maintain a certain distance to ensure each chip is properly inserted into the electrical test socket. However, in existing technologies, chips are sequentially arranged after processing, waiting to enter the next process. At this point, adjacent chips are in contact with each other, preventing the suction device from directly inserting chips from the previous process into the electrical test socket. Therefore, there is an urgent need for a chip transfer device that can move chips in batches and change the distance between adjacent chips. Utility Model Content

[0003] The present invention aims to provide a chip transfer device for electrical testing, which can move chips in batches and change the distance between adjacent chips.

[0004] This utility model provides the following basic solution:

[0005] A chip transfer device for electrical testing includes a horizontally arranged mounting plate, an upper movable seat at the top of the mounting plate, a lower movable seat at the bottom of the mounting plate, a guide rod between the upper and lower movable seats, the guide rod being vertically arranged, and a limiting plate that can move along the axial direction of the guide rod being sleeved on the guide rod.

[0006] It also includes a connecting plate that can move horizontally. The connecting plate is slidably connected to the mounting plate. A limiting structure is provided between the side of the connecting plate away from the mounting plate and the limiting plate. The limiting structure includes a limiting hole that is inclined and a limiting post that can move within the limiting hole. The bottom of the connecting plate and the lower moving seat are both connected to an adsorption head for adsorbing the chip.

[0007] Furthermore, there are two connecting plates, which are located on both sides of the guide rod, and the two connecting plates slide in opposite directions on the mounting plate.

[0008] Furthermore, the limiting hole is opened on the limiting plate, and the limiting post is set on the connecting plate, with the end of the limiting post away from the connecting plate located inside the limiting hole.

[0009] Furthermore, there are two limiting holes, which are located on both sides of the guide rod. The limiting holes are inclined towards the guide rod from high to low along the direction away from the guide rod.

[0010] Furthermore, a rolling element is provided at the end of the limiting post away from the connecting plate, and the side wall of the rolling element contacts the wall of the limiting hole.

[0011] Furthermore, a guide rail and a slider are provided between the connecting plate and the mounting plate. The guide rail is horizontally set and fixedly connected to the mounting plate. The slider is slidably connected to the guide rail and fixedly connected to the connecting plate.

[0012] Furthermore, both the bottom of the connecting plate and the lower movable seat are provided with L-shaped plates, and the L-shaped plates have mounting holes for installing the adsorption head.

[0013] The working principle and beneficial effects of the basic solution:

[0014] During chip manufacturing, chips need to be transported across different equipment or devices. For example, chips arranged sequentially on a conveyor channel are placed into independent test sockets for power-on testing. Initially, the limiting plate is positioned above, with the limiting posts below the limiting holes. The suction heads are close together, initially used to pick up the sequentially arranged chips. After picking up the chips, the limiting plate moves downward along the axial direction of the guide rod. The limiting posts are restricted by the limiting holes, and the connecting plate is restricted by the guide rail. The two connecting plates move closer to each other along the length of the guide rail until the limiting posts are above the limiting holes, at which point the suction heads separate. By controlling the position of the mounting plate, the position of the suction heads after picking up the chips is changed, thus moving the chips above the test sockets. The test sockets are arranged side by side. Controlling the mounting plate to move downward so that the chips are inside the test sockets, the suction heads release the chips. This process moves chips in batches while simultaneously increasing the distance between adjacent chips, separating chips that are close together.

[0015] In this solution, the adsorption head is used to adsorb and move chips, enabling batch transfer of chips in different processes and improving production efficiency. The mounting plate provides the mounting position and, by controlling its position, changes the chip's location. The upper and lower moving seats provide mounting positions for the guide rods, which in turn limit the movement of the limiting plate. The limiting structure, through the limiting plate, limits the movement of the connecting plate, and, with the guide rail, further limits the connecting plate's movement, thereby changing the relative position of the connecting plate and the guide rods, thus bringing the adsorption heads closer together. The rolling element facilitates the movement of the limiting post within the limiting hole. The L-shaped plate provides the adsorption head's mounting position while preventing interference between the adsorption head and the limiting plate. Using this solution, the movement of the limiting plate changes the relative position of the connecting plate and the guide rods, thereby changing the relative position of the adsorption head on the lower moving seat and the connecting plate, and thus changing the relative position of the chips adsorbed by the adsorption head. This allows for batch chip movement while simultaneously changing the distance between adjacent chips. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the chip transfer device for electrical testing according to an embodiment of the present invention when chips are adjacent.

[0017] Figure 2 This is a schematic diagram of the chip transfer device for electrical testing according to this utility model without the limiting plate.

[0018] Figure 3 This is a schematic diagram of the chip separation process in an embodiment of the chip transfer device for electrical testing according to this utility model. Detailed Implementation

[0019] The following detailed description illustrates the specific implementation method:

[0020] The reference numerals in the accompanying drawings include: mounting plate 1, upper movable seat 2, lower movable seat 3, guide rod 4, limiting plate 5, connecting plate 6, limiting hole 7, limiting post 8, suction head 9, guide rail 10, and L-shaped plate 11.

[0021] Example

[0022] Chip transfer device for electrical testing, as shown in the attached document. Figure 1As shown, the device includes a horizontally arranged mounting plate 1, an upper movable seat 2 at the top of the mounting plate 1, a lower movable seat 3 at the bottom of the mounting plate 1, a guide rod 4 between the upper movable seat 2 and the lower movable seat 3, the guide rod 4 being vertically arranged, and a limiting plate 5 that can move along the axial direction of the guide rod 4 being sleeved on the guide rod 4; it also includes a connecting plate 6 that can move in the horizontal direction, the connecting plate 6 being slidably connected to the mounting plate 1, and a limiting structure between the side of the connecting plate 6 away from the mounting plate 1 and the limiting plate 5, the limiting structure including an inclined limiting hole 7 and a limiting post 8 that can move within the limiting hole 7, and an adsorption head 9 for adsorbing chips connected to the bottom of both the connecting plate 6 and the lower movable seat 3.

[0023] Specific details are attached. Figure 2 As shown, a guide rail 10 and a slider are provided between the connecting plate 6 and the mounting plate 1. The guide rail 10 is horizontally positioned and fixedly connected to the mounting plate 1. The slider is slidably connected to the guide rail 10 and fixedly connected to the connecting plate 6. The slider has a groove that mates with the guide rail 10, allowing it to slide on the guide rail 10. In this embodiment, the guide rail 10 is fixed to the mounting plate 1 with screws, and the slider is fixed to the connecting plate 6 with screws. There are two sliders, corresponding to two connecting plates 6.

[0024] Two connecting plates 6 are located on either side of the guide rod 4. The two connecting plates 6 slide in opposite directions on the mounting plate 1, and limiting posts 8 are provided on the connecting plates 6. Specifically, the limiting posts 8 are located on the side of the connecting plate 6 away from the mounting plate 1, and each connecting plate 6 is provided with a limiting post 8. A rolling element is provided at the end of the limiting post 8 away from the connecting plate 6. In this embodiment, the limiting post 8 is integrally formed with the connecting plate 6, and the rolling element adopts an existing bearing.

[0025] Two limiting holes 7 are formed on the limiting plate 5. The two limiting holes 7 are located on both sides of the guide rod 4, and the limiting holes 7 are inclined towards the guide rod 4 from high to low in the direction away from the guide rod 4. The end of the limiting post 8 away from the connecting plate 6 is located in the limiting hole 7. The side wall of the rolling element is in contact with the hole wall of the limiting hole 7, that is, the outer wall of the bearing is in contact with the hole wall of the limiting hole 7.

[0026] The upper end of the guide rod 4 is fixedly connected to the upper movable seat 2, and the lower end of the guide rod 4 is fixedly connected to the lower movable seat 3. The guide rod 4 passes through the limiting plate 5, and the limiting plate 5 can move along the axial direction of the guide rod 4, that is, the limiting plate 5 can move vertically. In this embodiment, both ends of the guide rod 4 are fixedly connected to the upper movable seat 2 and the lower movable seat 3 respectively by screws.

[0027] Both the connecting plate 6 and the lower movable seat 3 have L-shaped plates 11 at their bottoms. There are two connecting plates 6, and three corresponding L-shaped plates 11. The L-shaped plates 11 have mounting holes for installing the suction head 9. Each L-shaped plate 11 includes a vertical section and a horizontal section. The upper end of the vertical section is fixedly connected to the bottom of the connecting plate 6 and the lower movable seat 3, and the lower end of the vertical section is connected to the horizontal section. The horizontal section faces away from the mounting plate 1 and has mounting holes through which the suction head 9 passes. In this embodiment, the vertical section and the horizontal section are integrally formed. The L-shaped plates 11 are connected to the bottom of the connecting plate 6 and the lower movable seat 3 respectively by screws, and the suction head 9 is installed on the L-shaped plates 11 by nuts.

[0028] During chip manufacturing, chips need to be transported on different equipment or devices. For example, chips arranged sequentially on a transport channel are placed into independent test sockets for power-on testing. Initially, the limiting plate 5 is positioned above, and the limiting post 8 is below the limiting hole 7. The adsorption heads 9 are close to each other, and are used to adsorb the sequentially arranged chips. After adsorbing the chips, the limiting plate 5 moves downward along the axial direction of the guide rod 4. The limiting post 8 is restricted by the limiting hole 7, and the connecting plate 6 is restricted by the guide rail 10. The two connecting plates 6 move closer to each other along the length of the guide rail 10 until the limiting post 8 is above the limiting hole 7. At this point, the adsorption heads 9 separate, as shown in the attached diagram. Figure 3 As shown. By controlling the position of the mounting plate 1, the position of the adsorption head 9 after adsorbing the chip is changed, thereby moving the chip above the test socket. The test sockets are arranged side by side. The mounting plate 1 is controlled to move downward so that the chip is located inside the test socket, and the adsorption head 9 releases the chip. In this way, while moving chips in batches, the distance between adjacent chips is increased, separating chips that are close to each other.

[0029] The movement of the limiting plate 5 can be controlled by a driving component, such as a cylinder or electromagnetic control. Taking cylinder control as an example, the cylinder is mounted on the upper moving seat 2. The cylinder includes a cylinder body and a piston rod. The piston rod faces the limiting plate 5 and is fixedly connected to the limiting plate 5. For example, the free end of the piston rod has a thread, and the limiting plate 5 has a matching threaded hole, thereby realizing the connection between the piston rod and the limiting plate 5. By extending and retracting the piston rod, the position of the limiting plate 5 is changed, thereby controlling the position of the connecting plate 6.

[0030] By using this solution, the relative positions of the connecting plate 6 and the guide rod 4 are changed by moving the limiting plate 5, thereby changing the relative positions of the lower moving seat 3 and the adsorption head 9 on the connecting plate 6, thus changing the relative positions of the chips adsorbed by the adsorption head 9, and changing the distance between adjacent chips while moving chips in batches.

[0031] The above descriptions are merely embodiments of this utility model. Commonly known structures and characteristics are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are knowledgeable of all existing technologies in that field, and possess the ability to apply conventional experimental methods prior to that date. Therefore, those skilled in the art can, based on the guidance provided in this application, improve and implement this solution in conjunction with their own capabilities. Typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A chip transfer device for electrical testing, characterized by: The mounting plate is horizontally arranged, the top of the mounting plate is provided with an upper moving seat, the bottom of the mounting plate is provided with a lower moving seat, a guide rod is arranged between the upper moving seat and the lower moving seat, the guide rod is vertically arranged, a limiting plate is sleeved on the guide rod and can move in the axial direction of the guide rod; The connecting plate is slidably connected with the mounting plate, a limiting structure is arranged between the side of the connecting plate away from the mounting plate and the limiting plate, the limiting structure comprises an obliquely arranged limiting hole and a limiting column which can move in the limiting hole, and the bottom of the connecting plate and the lower moving seat are both connected with a suction head for adsorbing a chip.

2. The chip transfer device for electrical testing according to claim 1, wherein: The number of the connecting plates is two, the two connecting plates are respectively arranged on the two sides of the guide rod, and the sliding directions of the two connecting plates on the mounting plate are opposite.

3. The chip transfer device for electrical testing according to claim 2, wherein: The limiting hole is arranged on the limiting plate, and the limiting column is arranged on the connecting plate, one end of the limiting column away from the connecting plate is located in the limiting hole.

4. The chip transfer device for electrical testing according to claim 3, wherein: The number of the limiting holes is two, the two limiting holes are respectively arranged on the two sides of the guide rod, and the limiting holes are inclined from high to low to the guide rod in the direction away from the guide rod.

5. The chip transfer device for electrical testing according to claim 3, wherein: One end of the limiting column away from the connecting plate is provided with a rolling element, and the side wall of the rolling element is in contact with the hole wall of the limiting hole.

6. The chip transfer device for electrical testing according to claim 4 or 5, wherein: A guide rail and a sliding block are arranged between the connecting plate and the mounting plate, the guide rail is horizontally arranged, the guide rail is fixedly connected with the mounting plate, the sliding block is slidably connected with the guide rail, and the sliding block is fixedly connected with the connecting plate.

7. The chip transfer device for electrical testing according to claim 6, wherein: The bottom of the connecting plate and the lower moving seat are both provided with an L-shaped plate, and the L-shaped plate is provided with a mounting hole for mounting the suction head.

Images