Sensor, robot tail end structure and robot
By introducing support ribs and a surface layer into the contact force sensor, the problem of misidentification of the contact force sensor in non-planar positions is solved, and accurate sensing of contact force in complex shapes is achieved.
Patent Information
- Application Number
- CN202520053506.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-09
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2035-01-09
AI Technical Summary
Existing contact force sensors are prone to misidentification of contact force when in non-planar positions.
A contact force sensor was designed, comprising an electrode array film, a semiconductive film, and supporting ribs. The supporting ribs are distributed at the non-edge positions of the electrode array film. The surface layer is used to conduct contact force and is tightly fitted with the semiconductive film through integral injection molding to avoid accidental contact.
It enables accurate sensing of contact force in non-planar positions, avoids false identification of contact force, and improves the accuracy of the sensor.
Smart Images
Figure CN223777184U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of robotics technology, specifically to a sensor, a robot end effector, and a robot. Background Technology
[0002] In recent years, robotics technology has been continuously developing, becoming increasingly intelligent and automated, with improvements in the richness, stability, and flexibility of its movements. When robots move and perform tasks, they need to be equipped with contact force sensing capabilities at their end caps, such as the distal joints of fingers, to determine whether contact has occurred, the contact location, and the contact force when the robot comes into contact with the work object or environmental obstacle. For example, contact force sensors can be installed on the robot's end cap structure to enable it to sense contact force.
[0003] However, in related technologies, the accuracy of contact force sensors is low, and misidentification of contact force often occurs. Summary of the Invention
[0004] To overcome the problems existing in the related technologies, this disclosure provides a sensor, a robot end effector structure, and a robot to address the deficiencies in the related technologies.
[0005] According to a first aspect of the present disclosure, a sensor is provided, which may include a contact force sensor, the sensor including an electrode array film and a semiconductive film connected to each other, wherein a support rib is provided between the electrode array film and the semiconductive film, the support rib being distributed at least at non-edge positions of the electrode array film; a surface layer, the surface layer being at least partially located on the side of the semiconductive film away from the electrode array film, the surface layer being used to transmit contact force to the semiconductive film.
[0006] In one possible embodiment of this disclosure, the support ribs are distributed at the edge of the electrode array film, or the support ribs are distributed at the edge of the semiconductive film.
[0007] In one possible embodiment of this disclosure, the thickness of the support rib at the edge location is greater than the thickness of the support rib at the non-edge location.
[0008] In one possible embodiment of this disclosure, the electrode array film has a plurality of electrode regions on the surface facing the semiconductive film, and support ribs distributed at non-edge positions of the electrode array film are distributed between adjacent electrode regions.
[0009] In one possible embodiment of this disclosure, the support rib comprises at least one of the following materials: adhesive, ink, paint, and coating.
[0010] In one possible embodiment of this disclosure, the support ribs distributed at the edge positions of the electrode array film are made of adhesive; and / or,
[0011] The supporting ribs distributed at the non-edge positions of the electrode array film are made of at least one of the following materials: ink, paint, and coating.
[0012] In one possible embodiment of this disclosure, the support ribs made of ink are attached to the surface of the electrode array film using a screen printing process.
[0013] According to a second aspect of the present disclosure, a robot end effector structure is provided, the structure comprising:
[0014] Main structural element;
[0015] A circuit board, which is embedded within the main body of the structure;
[0016] As described in any embodiment of the first aspect, the contact force sensor has an electrode array film attached to part or all of the surface of the main structure, and the electrode array film of the contact force sensor is electrically connected to the circuit board.
[0017] In one possible embodiment of this disclosure, the support ribs are at least distributed at positions corresponding to the non-planar portions of the main structure.
[0018] In one possible embodiment of this disclosure, the surface layer of the contact force sensor is integrally injection molded onto the surface of the semiconductive film of the contact force sensor, provided that the other structures of the contact force sensor are assembled into the main body of the structure.
[0019] In one possible embodiment of this disclosure, when the surface layer of the contact force sensor covers the circuit board, and the surface layer of the contact force sensor is integrally injection molded onto the surface of the semiconductive film and the surface of the cover plate, provided that other structures of the contact force sensor are assembled into the main body of the structure and a cover plate is assembled onto the surface of the circuit board.
[0020] In one possible embodiment of this disclosure, the surface layer has a textured surface.
[0021] In one possible embodiment of this disclosure, the structure is fabricated as follows:
[0022] The circuit board and the electrode array film of the contact force sensor are respectively connected to the main structure, and support ribs are prepared on the surface of the electrode array film to form a rigid part;
[0023] The surface layer of the contact force sensor is integrally formed on the outer surface of the semiconductive film of the contact force sensor and the shaped frame to form a flexible part;
[0024] The rigid part and the flexible part are assembled into a whole.
[0025] In one possible embodiment of this disclosure, the structure is the distal joint of a robotic finger.
[0026] According to a third aspect of the present disclosure, a robotic arm is provided, comprising a contact force sensor as described in any embodiment of the first aspect or a robot end effector as described in any embodiment of the second aspect.
[0027] According to a fourth aspect of the present disclosure, a robotic arm is provided, including the robotic hand described in any embodiment of the third aspect.
[0028] According to a fifth aspect of the present disclosure, a robot is provided, the robot including a contact force sensor as described in any embodiment of the first aspect, a robot end effector as described in any embodiment of the second aspect, a manipulator as described in any embodiment of the third aspect, or a manipulator arm as described in any embodiment of the fourth aspect.
[0029] According to a sixth aspect of the present disclosure, a method for manufacturing a robot end effector structure is provided, the method comprising:
[0030] The circuit board is embedded within the main structure;
[0031] The electrode array film of the contact force sensor as described in any embodiment of the first aspect is attached to part or all of the surface of the main body of the structure, and the electrode array film is connected to the circuit board.
[0032] Support ribs are prepared on the surface of the electrode array film, and the semiconductive film of the contact force sensor is attached to the surface of the electrode array film.
[0033] The surface layer of the contact force sensor is prepared by integral injection molding on the surface of the semiconductive film.
[0034] In one possible embodiment of this disclosure, when the electrode array film of the contact force sensor covers the circuit board, the step of integrally injection molding the surface layer of the contact force sensor onto the surface of the semiconductive film includes:
[0035] A cover plate is assembled on the surface of the circuit board, and the surface layer of the contact force sensor is prepared by integral injection molding on the surface of the semiconductive film and the surface of the cover plate.
[0036] According to a seventh aspect of the present disclosure, a method for manufacturing a robot end effector structure is provided, the method comprising:
[0037] The circuit board and the electrode array film of the contact force sensor as described in any embodiment of the first aspect are respectively connected to the main body of the structure, and support ribs are prepared on the surface of the electrode array film to form a rigid part;
[0038] The surface layer of the contact force sensor is integrally formed on the outer surface of the semiconductive film of the contact force sensor and the shaped frame to form a flexible part;
[0039] The rigid part and the flexible part are assembled into a whole.
[0040] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:
[0041] The contact force sensor provided in this embodiment includes an electrode array film, a semiconductive film, and a surface layer connected in sequence. The surface layer is used to contact the contact object, receive the contact force applied by the contact object, and transmit the contact force to the semiconductive film so that the force-bearing position of the semiconductive film contacts the electrode array film. This causes the contact position between the electrode array film and the semiconductive film to generate an electrical signal characterizing the contact force, thereby realizing the sensing of contact force. Moreover, a support rib is provided between the electrode array film and the semiconductive film. In particular, the support rib is distributed at least at the non-edge position of the electrode array film. Therefore, even when the sensor is arranged in an irregular position such as a non-planar surface, the electrode array film and the semiconductive film can maintain a gap and will not make false contact when no external force is applied. Therefore, the sensor will not misidentify the contact force. Attached Figure Description
[0042] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.
[0043] Figure 1 and Figure 2 This is an exploded view of a contact force sensor at different angles, as illustrated in an exemplary embodiment of this disclosure;
[0044] Figure 3 This is a schematic diagram of the structure of the electrode array membrane of the contact force sensor shown in an exemplary embodiment of the present disclosure;
[0045] Figure 4 and Figure 5 This is an exploded view of the distal joint of the index finger of a robot at different angles, as shown in an exemplary embodiment of this disclosure;
[0046] Figure 6 This is a schematic diagram of the distal joint of the index finger of a robot, illustrating an exemplary embodiment of this disclosure;
[0047] Figure 7 This is an exploded view of the distal joint of the thumb of a robot shown in an exemplary embodiment of this disclosure;
[0048] Figure 8 This is a schematic diagram of the distal joint of a robot's thumb, illustrating an exemplary embodiment of this disclosure;
[0049] Figure 9 This is an exploded view of the flexible portion of a robot end effector structure illustrated in an exemplary embodiment of this disclosure;
[0050] Figure 10 This is a schematic diagram of the structure of the flexible portion of the robot end effector, as shown in an exemplary embodiment of this disclosure;
[0051] Figure 11 This is a flowchart illustrating a method for manufacturing a robot end effector structure according to an exemplary embodiment of this disclosure;
[0052] Figure 12 This is a flowchart illustrating a method for manufacturing a robot end effector structure according to an exemplary embodiment of this disclosure. Detailed Implementation
[0053] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.
[0054] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.
[0055] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are used only to distinguish information of the same type from one another. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."
[0056] In related technologies, contact force sensors often suffer from low accuracy and frequently exhibit false contact force identification. For example, a contact force sensor creates a gap between the edge of the electrode array film and the edge of the semiconductive film by using double-sided adhesive tape to connect them. This gap prevents the sensor from generating an electrical signal characterizing the contact force when no external force is applied. However, when the sensor is placed in an irregular position, such as a non-planar surface, the electrode array film and the semiconductive film are easily squeezed by external structures, leading to false contact and thus false contact force identification.
[0057] Based on this, in a first aspect, at least one embodiment of this disclosure provides a sensor, exemplarily a contact force sensor. This contact force sensor can be applied to the end effector structure of a robot, such as the distal joint of a robot's finger, to accurately sense the contact force between the robot's end effector and a contacting object when they come into contact; moreover, this contact force sensor can avoid the problem of misidentification of contact force that is common in contact force sensors of related technologies.
[0058] Appendix Figure 1 To be continued Figure 3 Taking a contact force sensor applied to the distal joint of a robot's finger as an example, the structure of this contact force sensor is shown. The following section, in conjunction with the appendix... Figure 1 To be continued Figure 3 This contact force sensor will be described in detail.
[0059] The contact force sensor includes an electrode array film 101 and a semiconductive film 102 connected to each other. A support rib 104 is provided between the electrode array film 101 and the semiconductive film 102. The support rib 104 is distributed at least at the non-edge positions of the electrode array film 101.
[0060] The sensor further includes a surface layer 103, which is at least partially located on the side of the semiconductive film away from the electrode array film. The surface layer is used to transmit contact forces to the semiconductive film. This contact force can be the contact force between the object being contacted and the surface layer.
[0061] For example, Figure 1As shown, the area enclosed by the dashed frame 1010 in the electrode array film 101 is the edge position (or edge region) in this application. The area enclosed by the dashed frame 1012 in the electrode array film 101 is the non-edge position in this application. The edge position, relative to the non-edge position, can be understood as any position on the electrode array film 101 other than the edge position being an edge position. In this application, the non-edge position (or non-edge region) of the electrode array film 101 indicates one or more regions occupying a predetermined area on the electrode array film, and the edge of each region has a predetermined distance relative to the edge of the electrode array film 101, which is set according to the size of the electrode array film 101.
[0062] For example, Figure 1 The supporting ribs at the non-edge position are at least 10mm away from the edge of the electrode array film 101.
[0063] In this embodiment of the application, the distribution of support ribs in non-edge positions means that the position of the support rib is a non-edge position, and does not mean that support ribs are distributed in all non-edge positions.
[0064] The support ribs 104 distributed at the non-edge positions of the electrode array film 101 can ensure a stable gap between the electrode array film 101 and the semiconductive film 102, preventing accidental contact, when the contact force sensor does not receive external force. For example, the support ribs 104 distributed at the non-edge positions of the electrode array film 101 can be uniformly arranged within the non-edge areas of the electrode array film 101, or the support ribs 104 distributed at the non-edge positions of the electrode array film 101 can be specifically arranged at locations on the electrode array film 101 where accidental contact is likely to occur, such as within the non-planar areas of the electrode array film 101.
[0065] With attachment Figure 1 To be continued Figure 2 Taking the contact force sensor shown as an example, the support ribs 104 distributed at the non-edge positions of the electrode array film 101 can be set in the area of the electrode array film 101 corresponding to the curved area of the finger, that is, in the area where the back of the finger transitions to the side of the finger, and in the area where the back of the finger transitions to the fingertip.
[0066] Optionally, the support ribs 104 are also distributed at the edge of the electrode array film 101, or at the edge of the semiconductive film 102. The support ribs 104 distributed at the edge of the electrode array film 101 or the semiconductive film 102 can create a stable gap between the electrode array film 101 and the semiconductive film 102. Furthermore, the support ribs 104 distributed at the edge of the electrode array film 101 can also be used to connect the electrode array film 101 and the semiconductive film 102. For example, if the support ribs are double-sided adhesive, then when the support ribs 104 distributed at the edge of the electrode array film 101 are double-sided adhesive, the electrode array film 101 and the semiconductive film 102 can be glued together.
[0067] Preferably, if the support ribs 104 are distributed both at the non-edge positions and at the edges of the electrode array film 101, then preferably, the thickness of the support ribs 104 distributed at the edges of the electrode array film 101 (i.e., their height in the axial direction relative to the electrode array film 101) is greater than the thickness of the support ribs 104 distributed at the non-edge positions of the electrode array film 101 (i.e., their height in the axial direction relative to the electrode array film 101). In this case, the support ribs 104 distributed at the edges can form a gap between the electrode array film 101 and the semiconductive film 102, while the support ribs 104 distributed at the non-edge positions can prevent accidental contact between the electrode array film 101 and the semiconductive film 102 when the sensor does not receive external force. Furthermore, by making the thickness of the support ribs 104 distributed at the non-edge positions of the electrode array film 101 smaller, it is possible to ensure that the semiconductive film 102 is in contact with the electrode region 10111 when it is subjected to external force, and to trigger the electrode array film 101 to generate an accurate electrical signal for characterizing the contact force.
[0068] The electrode array film 101 has multiple electrode regions 10111 on its surface facing the semiconductive film 102. For example, the electrode array film includes a sensing area 1011 and a connection terminal 1012. The sensing area 1011 is used to arrange the multiple electrode regions 10111, while the connection terminal 1012 is a portion independent of the sensing area 1011 and is electrically connected to each electrode region 10111 within the sensing area 1011. The multiple electrode regions 10111 are arranged in a multi-row, multi-column configuration within the sensing area 1011 of the electrode array film 101. If the semiconductive film 102 contacts the electrode array film 101, it triggers a change in resistance between adjacent electrode regions 10111. This change can be used to characterize and measure the magnitude of the contact force. The drive circuit within the connection terminal 1012 can output a sensor signal, such as a resistance value, for each electrode region 10111.
[0069] Preferably, the electrode array film 101 is a flexible printed circuit (FPC). Flexible printed circuit boards facilitate the arrangement of contact force sensors on structures of different shapes, thereby improving the applicability of contact force sensors and expanding their application environment.
[0070] Preferably, the support ribs 104 distributed at non-edge positions of the electrode array film 101 are distributed between adjacent electrode regions 10111. The support ribs 104, located between adjacent electrode regions 10111, can ensure contact with the electrode regions 10111 when the semiconductive film 102 is subjected to external force, and trigger the electrode array film 101 to generate an accurate electrical signal for characterizing the contact force.
[0071] The support rib 104 may be made of at least one of the following materials: adhesive, ink, paint, and coating. For example, the support rib 104 made of ink may be attached to the surface of the electrode array film 101 using a screen printing process. For example, the adhesive may be double-sided tape or glue.
[0072] Preferably, if the support ribs 104 are distributed both at the non-edge positions and at the edges of the electrode array film 101, then preferably: the support ribs 104 distributed at the edges of the electrode array film 101 are made of adhesive; and / or, the support ribs 104 distributed at the non-edge positions of the electrode array film 101 are made of at least one of the following: ink, paint, and coating. This allows the support ribs 104 distributed at the edges of the electrode array film 101 to bond the electrode array film 101 and the semiconductive film 102, while the support ribs 104 distributed at the non-edge positions of the electrode array film 101 ensure that there is no false contact between them when the sensor does not receive contact force, and the support ribs 104 distributed at the non-edge positions of the electrode array film 101 do not affect the dimensional consistency of the gap between them. In other words, the gap size between the electrode array film 101 and the semiconductive film 102 is only affected by the support ribs 104 distributed at the edges of the electrode array film 101, thus ensuring consistency across different positions.
[0073] The surface layer 103 can be made of injection-moldable materials such as ordinary silicone, rubber, silicone rubber, and PDMS, used for appearance design and transmission of contact force, while also providing protection for the inner layer. When the surface layer 103 serves as the outer surface of the robot's end effector structure, it can exhibit a texture similar to real human skin.
[0074] Secondly, at least one embodiment of this disclosure also provides a robot end effector structure applied to a robot for accurately sensing the contact force between a contacting object and the object. For example, the end effector structure could be the distal joint of a robot finger or the palm of a robot's dexterous hand.
[0075] Please refer to the appendix. Figure 4 To be continued Figure 8 It uses the distal joint of a robot's finger as an example to illustrate the structure of this distal structure, wherein, attached Figure 4 To be continued Figure 6 For the distal joint of the robot's index finger, attached Figure 7 To be continued Figure 8 This refers to the distal joint of a robot's thumb. The distal structure includes a structural body 200, a circuit board 300, and a contact force sensor as described in any embodiment of the first aspect. The circuit board 300 is embedded within the structural body 200; the electrode array film 101 of the contact force sensor is attached to part or all of the surface of the structural body 200, and the electrode array film 101 of the contact force sensor is electrically connected to the circuit board 300.
[0076] For example, the circuit board 300 is exposed to the outside through the opening of the main body 200, the collection area 1011 of the electrode array film 101 is attached to part or all of the surface of the main body 200, and the connection terminal 1012 of the electrode array film 101 enters its interior through the opening of the main body 200 and is electrically connected to the circuit board 300.
[0077] Taking the distal joint of a robot's finger as an example, the electrode array film 101 can cover the back of the finger, the side of the finger, and the fingertip of the distal joint.
[0078] Preferably, the support ribs 104 are at least distributed at positions corresponding to the non-planar portions of the main structure 200. The electrode array film 101 and the semi-conductive film 102 covering the non-planar portions of the main structure 200 are prone to accidental contact when the sensor does not receive external force. Therefore, support ribs 104 can be specifically arranged in this portion to prevent accidental contact between the electrode array film 101 and the semi-conductive film 102 when the sensor does not receive external force. Taking the distal joint of a robot's finger as an example, the support ribs 104 are at least distributed in the region of the electrode array film 101 corresponding to the curved area of the finger, i.e., the region where the back of the finger transitions to the side of the finger, and the region where the back of the finger transitions to the fingertip.
[0079] Wherein, the surface layer 103 of the contact force sensor is integrally injection molded onto the surface of the semiconductive film 102 of the contact force sensor when the other structures of the contact force sensor are assembled into the main body 200. In the related technology, the surface layer 103 is a pre-formed surface layer 103, which cannot achieve a tight fit with the semi-conductive film 102. It is easy for the semi-conductive film 102 to be squeezed inward due to dimensional errors after assembly, thereby causing false contact between the semi-conductive film 102 and the electrode array film 101. However, in this end structure, the surface layer 103 is integrally formed on the surface of the semi-conductive film 102 after being assembled with other structures of the sensor, such as the electrode array film 101, support rib 104, and semi-conductive film 102, and the circuit board 300 is assembled with the structural body 200 and electrically connected to the electrode array film 101. This achieves a tight fit between the surface layer 103 and the semi-conductive film 102, that is, a near or 100% "seamless" structural fit, so as to avoid the surface layer 103 squeezing the semi-conductive film 102 and causing false identification of contact force, and to increase the range of contact force that the end structure can sense.
[0080] Preferably, when the surface layer 103 of the contact force sensor covers the circuit board 300, and when other structures of the contact force sensor are assembled to the main body 200 and a cover plate 400 is assembled to the surface of the circuit board 300, the surface layer 103 of the contact force sensor is integrally injection molded onto the surface of the semiconductive film 102 and the surface of the cover plate 400. Figure 4 and attached Figure 6 For example, the surface layer 103 of the index finger, after molding, will not cover the circuit board 300, but will instead... Figure 7 To be continued Figure 8 The surface layer 103 of the thumb shown will cover the circuit board 300 after molding. By adding a cover plate 400, liquid adhesive can be prevented from entering the circuit board 300 and the area around the connecting terminal 1012 during the one-piece molding process, thus affecting the performance of the circuit board 300.
[0081] Preferably, the surface layer 103 has a textured surface. This increases the frictional force when the end structure comes into contact with the contact object.
[0082] For example, the structure can be made in the following manner:
[0083] First, the circuit board 300 and the electrode array film 101 of the contact force sensor are respectively connected to the main body 200, and a support rib 104 is prepared on the surface of the electrode array film 101 to form a rigid part.
[0084] Next, the surface layer 103 of the contact force sensor is integrally formed on the outer surface of the shaping frame 500 and the semiconductive film 102 of the contact force sensor to form a flexible portion. For example, see attached... Figure 9 To be continued Figure 10 The flexible portion shown.
[0085] The fixed frame 500 can be a structure that cooperates with the rigid part, and this structure is located at the edge of the flexible part, for example, attached. Figure 10 The opening edge of the flexible section shown.
[0086] Finally, the rigid part and the flexible part are assembled into a whole.
[0087] This example demonstrates that the surface layer 103 is integrally formed only with the semiconductive film 102, rather than with all other structures in the end structure. This increases the modularity of the surface layer 103, improves the consistency of its appearance, reduces assembly difficulty, and allows for replacement of only the flexible portion when the surface layer 103 is damaged, thereby increasing the utilization rate of the rigid portion. This avoids the waste of discarding the entire end structure when the surface layer 103 is integrally formed with all other structures in the end structure. Furthermore, when the surface layer 103 is integrally formed with the semiconductive film 102, a shaping frame 500 is provided to ensure the structural stability after molding and the tightness with the rigid portion. The shaping frame 500 also facilitates the connection between the flexible and rigid portions, such as connecting to the inductive portion via the shaping frame 500.
[0088] According to a third aspect of the present disclosure, a robotic arm is provided, comprising a contact force sensor as described in any embodiment of the first aspect or a robot end effector as described in any embodiment of the second aspect.
[0089] According to a fourth aspect of the present disclosure, a robotic arm is provided, including the robotic hand described in any embodiment of the third aspect.
[0090] According to a fifth aspect of the present disclosure, a robot is provided, the robot including a contact force sensor as described in any embodiment of the first aspect, a robot end effector as described in any embodiment of the second aspect, a manipulator as described in any embodiment of the third aspect, or a manipulator arm as described in any embodiment of the fourth aspect.
[0091] The robot can be a humanoid robot, a quadruped robot, etc.
[0092] Sixthly, at least one embodiment of this disclosure also provides a method for manufacturing a robot end effector structure, please refer to the appendix. Figure 11 The example illustrates the flow of the method, including steps S1101 to S1104.
[0093] In step S1101, the circuit board is embedded in the main body of the structure.
[0094] In step S1102, the electrode array film of the contact force sensor as described in any embodiment of the first aspect is attached to part or all of the surface of the main body of the structure, and the electrode array film is connected to the circuit board.
[0095] In step S1103, support ribs are prepared on the surface of the electrode array film, and the semiconductive film of the contact force sensor is attached to the surface of the electrode array film.
[0096] In step S1104, the surface layer of the contact force sensor is prepared on the surface of the semiconductive film by integral injection molding.
[0097] For example, when the electrode array film of the contact force sensor covers the circuit board, the step of preparing the surface layer of the contact force sensor by integral injection molding on the surface of the semiconductive film may include: mounting a cover plate on the surface of the circuit board and preparing the surface layer of the contact force sensor by integral injection molding on the surface of the semiconductive film and the surface of the cover plate.
[0098] More details about the above steps have been described in detail in the second part about the robot's end effector structure, and will not be repeated here.
[0099] Seventhly, at least one embodiment of this disclosure also provides a method for manufacturing a robot end effector structure, please refer to the appendix. Figure 12 The example illustrates the flow of the method, including steps S1201 to S1203.
[0100] In step S1201, the circuit board and the electrode array film of the contact force sensor as described in any embodiment of the first aspect are respectively connected to the main body of the structure, and support ribs are prepared on the surface of the electrode array film to form a rigid part.
[0101] In step S1202, the surface layer of the contact force sensor is integrally formed on the outer surface of the semiconductive film of the shaped frame and the contact force sensor to form a flexible part.
[0102] In step S1203, the rigid part and the flexible part are assembled into a whole.
[0103] More details about the above steps have been described in detail in the second part about the robot's end effector structure, and will not be repeated here.
[0104] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.
[0105] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.
Claims
1. A sensor, characterized in that, include: An interconnected electrode array film and a semiconductive film, wherein a supporting rib is provided between the electrode array film and the semiconductive film, and the supporting rib is distributed at least at the non-edge position of the electrode array film; A surface layer, at least partially located on the side of the semiconductive film away from the electrode array film, is used to transmit contact forces to the semiconductive film.
2. The sensor according to claim 1, characterized in that, The supporting ribs are distributed at the edge of the electrode array film, or the supporting ribs are distributed at the edge of the semiconductive film.
3. The sensor according to claim 2, characterized in that, The thickness of the support rib at the edge position is greater than the thickness of the support rib at the non-edge position.
4. The sensor according to claim 2, characterized in that, The electrode array film has multiple electrode regions on its surface facing the semiconductive film, and support ribs distributed at non-edge positions of the electrode array film are distributed between adjacent electrode regions.
5. The sensor according to claim 2, characterized in that, The supporting ribs include at least one of the following materials: adhesive, ink, paint, and coating.
6. The sensor according to claim 5, characterized in that, The supporting ribs distributed at the edges of the electrode array film are made of adhesive; and / or, The supporting ribs distributed at the non-edge positions of the electrode array film are made of at least one of the following materials: ink, paint, and coating.
7. The sensor according to claim 6, characterized in that, The support ribs, made of ink, are attached to the surface of the electrode array film using a screen printing process.
8. A robot end effector structure, characterized in that, The structure includes: Main structural element; A circuit board, which is embedded within the main body of the structure; The sensor according to any one of claims 1 to 7, wherein the electrode array film of the sensor is attached to part or all of the surface of the main body of the structure, and the electrode array film of the sensor is electrically connected to the circuit board.
9. The robot end effector structure according to claim 8, characterized in that, The supporting ribs are distributed at least at positions corresponding to the non-planar portions of the main structure.
10. The robot end effector structure according to claim 8, characterized in that, The surface layer of the sensor is integrally injection molded onto the surface of the semiconductive film of the sensor, provided that the other structures of the sensor are assembled into the main body of the structure.
11. The robot end effector structure according to claim 10, characterized in that, When the surface layer of the sensor covers the circuit board, and when the other structures of the sensor are assembled to the main body of the structure and a cover plate is assembled to the surface of the circuit board, the surface layer of the sensor is integrally injection molded onto the surface of the semiconductive film and the surface of the cover plate.
12. The robot end effector structure according to claim 10, characterized in that, The surface layer has a textured surface.
13. The robot end effector structure according to claim 10, characterized in that, The structure is fabricated in the following manner: The circuit board and the electrode array film of the sensor are respectively connected to the main structure, and support ribs are prepared on the surface of the electrode array film to form a rigid part; The surface layer of the sensor is integrally formed on the outer surface of the semiconductive film of the sensor and the shaped frame to form a flexible part; The rigid part and the flexible part are assembled into a whole.
14. The robot end effector structure according to any one of claims 8 to 13, characterized in that, The structure is the distal joint of a robot finger.
15. A robotic hand comprising the sensor according to any one of claims 1 to 7 or the robot end effector according to any one of claims 8 to 14.
16. A robotic arm comprising the robotic hand of claim 15.
17. A robot, characterized in that, The robot includes the sensor as described in any one of claims 1 to 7, the robot end effector as described in any one of claims 8 to 14, the manipulator as described in claim 15, or the robotic arm as described in claim 16.