Electrode tool and electroplating device

Abstract

The utility model relates to an electrode tool and an electroplating device, the electrode tool comprises a seat body and an electrode piece, the seat body comprises a mounting surface, and the seat body is an insulating piece; the electrode piece is embedded in the mounting surface, the electrode piece comprises a conductive surface facing the same side with the mounting surface, the conductive surface is flush with or basically flush with the mounting surface, and the electrode piece is a conductive piece. When the electrode tool is used as a conductive cathode, the conductive surface and the mounting surface can bear the battery piece together, and the contact surfaces between the battery piece and the conductive surface and between the battery piece and the mounting surface are flat, so that the stability and reliability of the battery piece on the conductive surface and the mounting surface are ensured, and the conductive contact effect between the battery piece and the conductive surface is ensured; the uniformity of a conductive electric field of the electrode piece is ensured, so that the electroplating effect is ensured; when the electrode tool is used as a conductive anode, the electroplating liquid flows smoothly when passing through the conductive surface and the mounting surface, and does not stay on the conductive surface and the mounting surface, so that the flow rate of the electroplating liquid can be prevented from being reduced, and the electroplating effect is ensured.

Description

Technical Field

[0001] This utility model relates to the field of battery cell processing technology, and in particular to an electrode tooling and electroplating device. Background Technology

[0002] During the metallization process of solar cells and other plated components, the positive terminal of the power supply is connected to the conductive anode in the electroplating solution, and the negative terminal is connected to the conductive cathode. A negative pressure device on the base adsorbs and fixes the solar cell onto the conductive cathode, ensuring contact between the conductive cathode and the surface of the solar cell, forming an electroplating circuit. When electricity is applied, metal cations in the electroplating solution can adhere to the surface of the solar cell in contact with the conductive cathode. The conductive cathode, acting as the negative electrode, increases the conductivity of the solar cell and reduces its internal resistance, thereby improving battery performance.

[0003] However, when existing electrode fixtures are used as conductive cathodes, the fixtures are placed on a base, and the electrode plates support the battery cells. A negative pressure device on the base adsorbs and fixes the battery cells onto the electrode plates. Because the electrode plates have a certain thickness, the adsorption effect of the negative pressure device on the battery cells is poor, and the contact surface between the battery cells and the electrode plates is uneven, thus affecting the electroplating effect. Conversely, when the electrode fixture is used as a conductive anode, the electroplating solution may stagnate on the surface of the electrode plates, causing a decrease in the flow rate of the electroplating solution, which also affects the electroplating effect. Utility Model Content

[0004] Therefore, it is necessary to provide an electrode fixture and electroplating apparatus to address the above problems and improve the electroplating effect.

[0005] This utility model first provides an electrode fixture, including: a base, including a mounting surface, the base being an insulating component; and an electrode component, the electrode component being embedded in the mounting surface, the electrode component including a conductive surface facing the same side as the mounting surface, the conductive surface being flush or substantially flush with the mounting surface, the electrode component being a conductive component.

[0006] In the aforementioned electrode fixture, the conductive surface and the mounting surface can form a flat surface or a flat substrate surface. When the electrode fixture is used as a conductive cathode, the conductive surface and the mounting surface can jointly support the battery cell, and the contact surface between the battery cell and the conductive and mounting surfaces is flat to ensure the stability and reliability of the battery cell on the conductive and mounting surfaces, as well as to ensure the conductive contact effect between the battery cell and the conductive surface, and to ensure the uniformity of the conductive electric field of the electrode, thereby ensuring the electroplating effect. When the electrode fixture is used as a conductive anode, the electroplating solution flows smoothly through the conductive and mounting surfaces and will not stagnate on the conductive and mounting surfaces, thereby avoiding a reduction in the flow rate of the electroplating solution and ensuring the electroplating effect.

[0007] In one embodiment, the electrode is integrally formed with the base.

[0008] This design ensures a tight and secure connection between the electrode and the base, with no gaps between them. This improves the flatness of the conductive surface and the mounting surface, enhancing the electroplating effect.

[0009] In one embodiment, the seat is configured as a light-transmitting element.

[0010] This setup, based on the principle of photoinduced deposition, promotes the deposition of coating material ions in the electrolyte onto the electroplating surface of the battery cell to form a coating, thereby improving the processing efficiency of the battery cell.

[0011] In one embodiment, the electrode is configured as a perforated structure, a mesh structure, a grid structure, a hollow structure, or a honeycomb structure.

[0012] With this design, the hollow part allows light to pass through, so that the light emitted by the light source towards the base can shine through the hollow part onto the battery cells.

[0013] This utility model also provides an electroplating apparatus, comprising: a first fixture, including the electrode fixture as described above, wherein the mounting surface and the conductive surface are used to support the battery cell; and a second fixture, wherein the first fixture and the second fixture are movable relative to each other, and the second fixture is configured with the first fixture to form an electroplating cavity for accommodating the battery cell and electrolyte, wherein the mounting surface and the conductive surface face the electroplating cavity.

[0014] With this configuration, the metal cations in the electroplating solution can adhere to the surface of the battery cell away from the mounting and conductive surfaces; the contact surface between the battery cell and the conductive and mounting surfaces is flat to ensure the stability and reliability of the battery cell on the conductive and mounting surfaces, as well as to ensure the conductive contact effect between the battery cell and the conductive surfaces, and to ensure the uniformity of the conductive electric field of the electrode components, thereby ensuring the electroplating effect.

[0015] In one embodiment, the mounting surface is provided with an adsorption hole that communicates with the electroplating chamber. The end of the adsorption hole away from the electroplating chamber is used to communicate with a negative pressure device. There are multiple adsorption holes, which are arranged at intervals.

[0016] With this configuration, multiple adsorption holes can provide uniform adsorption force to all positions of the solar cell, ensuring the adsorption effect of the solar cell and preventing the solar cell from separating from the mounting surface and conductive surface due to weak adsorption force in some positions.

[0017] In one embodiment, the electrode is configured as a porous structure, a mesh structure, a grid structure, a hollow structure, or a honeycomb structure, and the adsorption holes are arranged corresponding to the hollow portion of the electrode.

[0018] With this configuration, the adsorption holes are located in the seat body that fills the hollow part of the electrode, so as to facilitate the processing of the adsorption holes; and the adsorption holes can provide uniform adsorption force to the battery cells at each hollow part, ensuring the adsorption effect of the battery cells.

[0019] This utility model also provides an electroplating apparatus, comprising: a first fixture for carrying a battery cell; and a second fixture, including the electrode fixture as described above, wherein the first fixture and the second fixture are capable of relative movement, and the second fixture is capable of forming an electroplating cavity with the first fixture for accommodating the battery cell and electrolyte, wherein the mounting surface and the conductive surface face the electroplating cavity.

[0020] With this configuration, the metal cations in the electroplating solution can adhere to the surfaces of the battery cells facing the mounting and conductive surfaces; the electroplating solution flows smoothly through the conductive and mounting surfaces without stagnation, thus avoiding a reduction in the flow rate of the electroplating solution and ensuring the electroplating effect.

[0021] In one embodiment, the first tooling has an adsorption hole on its surface for supporting the battery cell that communicates with the electroplating chamber. The end of the adsorption hole away from the electroplating chamber is used to communicate with a negative pressure device. There are multiple adsorption holes, which are arranged at intervals.

[0022] With this configuration, multiple adsorption holes can provide uniform adsorption force to all positions of the solar cell, ensuring the adsorption effect of the solar cell and preventing the solar cell from separating from the mounting surface and conductive surface due to weak adsorption force in some positions.

[0023] In one embodiment, the first tooling is provided with an inlet channel and an outlet channel respectively communicating with both sides of the electroplating chamber. The ends of the inlet channel and the outlet channel away from the electroplating chamber are respectively used to communicate with the outlet and inlet of the fluid drive component.

[0024] This configuration ensures that the electroplating solution within the electroplating chamber is in a circulating state, thereby increasing the flow rate and uniformity of the electroplating solution, enhancing the metal ion exchange rate on the surface of the solar cells, and ultimately improving the processing efficiency of the solar cells. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a three-dimensional cross-sectional schematic diagram of an electroplating apparatus according to one embodiment of the present invention.

[0027] Figure 2 Provided by this utility model Figure 1 A cross-sectional schematic diagram of an electroplating apparatus;

[0028] Figure 3 Provided by this utility model Figure 1 A three-dimensional structural diagram of the first tooling, including the electrode tooling;

[0029] Figure 4 Provided by this utility model Figure 3 A three-dimensional cross-sectional schematic diagram of the first tooling;

[0030] Figure 5 Provided by this utility model Figure 4 Enlarged structural diagram at point A;

[0031] Figure 6 Provided by this utility model Figure 3 An exploded view of the first tooling, where the mounting surface is not shown.

[0032] Reference numerals: 1. Electrode fixture; 11. Base; 111. Mounting surface; 112. Groove; 12. Electrode component; 121. Conductive surface; 122. Hollow part; 2. First fixture; 21. Adsorption hole; 22. Liquid inlet channel; 23. Liquid outlet channel; 3. Second fixture; 4. Sealing component; 5. Battery cell. Detailed Implementation

[0033] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0034] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0037] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0038] In the metallization process of solar cells and other plated components, the positive terminal of the power supply is connected to the conductive anode in the electroplating solution, and the negative terminal is connected to the conductive cathode. A negative pressure device on the first fixture adsorbs and fixes the solar cell onto the conductive cathode, creating contact between the cathode and the cell surface to form an electroplating circuit. When energized, metal cations in the electroplating solution adhere to the cell surface in contact with the conductive cathode. The conductive cathode, acting as the negative electrode, increases the conductivity of the solar cell and reduces its internal resistance, thereby improving battery performance. However, when existing electrode fixtures are used as conductive cathodes, they are placed on the first fixture, with electrode plates supporting the solar cell. The negative pressure device on the first fixture adsorbs and fixes the cell onto the electrode plates. Due to the thickness of the electrode plates, the adsorption effect of the negative pressure device on the cell is poor, and the contact surface between the cell and the electrode plates is uneven, affecting the electroplating effect. Conversely, when the electrode fixture is used as the conductive anode, the electroplating solution may stagnate on the electrode plate surface, reducing the flow rate and also affecting the electroplating effect.

[0039] To solve the above problems, such as Figures 1 to 6 As shown, this utility model provides an electrode fixture and an electroplating device to improve the electroplating effect.

[0040] like Figures 1 to 2 As shown, specifically, the electrode fixture 1 includes a base 11 and an electrode component 12, wherein: the base 11 includes a mounting surface 111 and the base 11 is an insulating component; the electrode component 12 is embedded in the mounting surface 111 and includes a conductive surface 121 facing the same side as the mounting surface 111, the conductive surface 121 is flush or substantially flush with the mounting surface 111, and the electrode component 12 is a conductive component.

[0041] It should be noted that "conductive surface 121 flush with mounting surface 111" means that conductive surface 121 and mounting surface 111 are on the same plane and can form a flat surface. "Conductive surface 121 basically flush with mounting surface 111" means that conductive surface 121 and mounting surface 111 are basically on the same plane. In this case, errors caused by production, assembly, wear and other factors are allowed, but a basically flat surface can still be formed.

[0042] In the electrode fixture 1 provided in this embodiment of the present invention, when the electrode fixture 1 serves as a conductive cathode, the conductive surface 121 and the mounting surface 111 can jointly support the battery cell 5, and the contact surfaces between the battery cell 5 and the conductive surface 121 and the mounting surface 111 are flat, so as to ensure the stability and reliability of the battery cell 5 on the conductive surface 121 and the mounting surface 111, and to ensure the conductive contact effect between the battery cell 5 and the conductive surface 121, and to ensure the uniformity of the conductive electric field of the electrode 12, thereby ensuring the electroplating effect. When the electrode fixture 1 serves as a conductive anode, the electroplating solution flows smoothly through the conductive surface 121 and the mounting surface 111, and will not stagnate on the conductive surface 121 and the mounting surface 111, thereby avoiding a reduction in the flow rate of the electroplating solution and ensuring the electroplating effect.

[0043] like Figures 1 to 2 As shown, the electrode 12 and the base 11 are integrally formed. This ensures that the electrode 12 and the base 11 are tightly and firmly bonded together, with no gaps between them, thereby improving the flatness of the conductive surface 121 and the mounting surface 111 and enhancing the electroplating effect.

[0044] like Figures 1 to 2 As shown, the base 11 is configured as a light-transmitting element. During the electroplating process, a light source (not shown) can be placed on the side of the base 11 away from the battery cell 5. The light source emits light towards the base 11, and the light passes through the base 11 and illuminates the battery cell 5. Based on the principle of photoinduced deposition, a potential difference is formed between the battery cell 5 and the electrode 12, which in turn promotes the deposition of coating material ions in the electrolyte on the electroplating surface of the battery cell 5 to form a coating layer, thereby improving the processing efficiency of the battery cell 5. The base 11 can be made of other light-transmitting materials such as polymethyl methacrylate, polystyrene, polycarbonate, and inorganic glass. This embodiment of the present invention does not impose specific limitations on these materials.

[0045] like Figure 3and Figure 6 As shown, in one embodiment, the electrode 12 is configured with a porous structure, a mesh structure, a grid structure, a hollow structure, or a honeycomb structure. That is, the electrode 12 has a hollow portion 122. When the electrode 12 is embedded in the mounting surface 111, the base 11 fills the hollow portion 122 of the electrode 12, so that the mounting surface 111 is flush with the conductive surface 121. When a light source emits light towards the base 11, the light can pass through the base 11 filled in the hollow portion 122 of the electrode 12 and irradiate the battery cell 5. Furthermore, when the conductive surface 121 and the mounting surface 111 jointly support the battery cell 5, the battery cell 5 can also be fixed to the conductive surface 121 and the mounting surface 111 by adsorption or other methods at the hollow portion 122 of the electrode 12. When the electrode 12 has a regular and orderly structure such as a mesh structure, grid structure, or honeycomb structure, the uniformity of the conductive electric field of the electrode 12 can be improved, thereby enhancing the electroplating effect. Of course, in other embodiments, the electrode 12 can also be a complete structure, that is, without a hollow part 122 on the electrode 12, such as a rectangular structure or a circular structure. The specific shape and size can be adjusted according to the structural size of the battery cell 5. This embodiment of the present invention does not impose specific limitations here.

[0046] like Figure 6 As shown, the mounting surface 111 may be provided with grooves 112, channels, through holes, etc., that are the same shape as the electrode 12, so that the electrode 12 can be embedded in the mounting surface 111. Taking the mounting surface 111 having a groove 112 with the same shape as the electrode 12 as an example, when the electrode 12 has a hollow portion 122, the bottom wall of the groove 112 is provided with multiple protrusions that correspond one-to-one with the hollow portion 122, and the end of the protrusion away from the bottom wall of the groove 112 is the mounting surface 111. Figure 6 The protrusion structure is not displayed.

[0047] like Figures 1 to 2As shown, this embodiment of the present invention also provides an electroplating apparatus, including a first fixture 2 and a second fixture 3. The first fixture 2 includes the aforementioned electrode fixture, and the mounting surface 111 and conductive surface 121 are used to support the battery cell 5. The first fixture 2 and the second fixture 3 are capable of relative movement, and the second fixture 3 can be arranged with the first fixture 2 to form an electroplating cavity for accommodating the battery cell 5 and electrolyte. The mounting surface 111 and conductive surface 121 face the electroplating cavity. When it is necessary to process the battery cell 5, the first fixture 2 and the second fixture 3 are first controlled to move away from each other to open the electroplating cavity. The battery cell 5 is placed in the electroplating cavity and supported on the mounting surface 111 and conductive surface 121. Then, the first fixture 2 and the second fixture 3 are controlled to move closer to each other to close the electroplating cavity. At this time, the electrode 12 of the electrode fixture 1 is connected to the negative terminal of the power supply, and the second fixture 3 is provided with a conductive anode connected to the positive terminal of the power supply. At least part of the conductive anode is located in the electroplating cavity, and there is a gap between the conductive anode and the battery cell 5 for the flow of conductive liquid. Then, electroplating solution is injected into the electroplating chamber, and the electroplating device is energized. The metal cations in the electroplating solution can adhere to the surface of the battery cell 5 that is away from the mounting surface 111 and the conductive surface 121, i.e., the electroplating surface of the battery cell 5. After electroplating is completed, the electroplating solution in the electroplating chamber is discharged, and the first tooling 2 and the second tooling 3 are again controlled to move away from each other to open the electroplating chamber and remove the battery cell 5. Since the conductive surface 121 and the mounting surface 111 can form a flat surface, the contact surface between the battery cell 5 and the conductive surface 121 and the mounting surface 111 is flat, which ensures the stability and reliability of the battery cell 5 supported on the conductive surface 121 and the mounting surface 111, and ensures the conductive contact effect between the battery cell 5 and the conductive surface 121, and ensures the uniformity of the conductive electric field of the electrode 12, thereby ensuring the electroplating effect.

[0048] In this embodiment, when the base 11 is configured as a light-transmitting component, other parts of the first fixture 2 can also be configured as light-transmitting components. The light source can be located at the end of the first fixture 2 away from the second fixture 3 and emit light towards the first fixture 2. The light passes through the base 11 and the first fixture 2 and illuminates the battery cell 5. Alternatively, the second fixture 3 can also be configured as a light-transmitting component. The light source can be located at the end of the second fixture 3 away from the first fixture 2 and emit light towards the second fixture 3. The light passes through the second fixture 3 and illuminates the battery cell 5. In other words, the light from the light source can illuminate the electroplated surface of the battery cell 5 or the non-electroplated surface of the battery cell 5. The specific illumination position of the light source can be determined according to the electroplating process, and this embodiment of the present invention does not impose specific limitations. The first fixture 2 and the second fixture 3 can be made of other light-transmitting materials such as polymethyl methacrylate, polystyrene, polycarbonate, and inorganic glass, and this embodiment of the present invention does not impose specific limitations.

[0049] like Figures 1 to 2As shown, in one embodiment, the first tooling 2 and the second tooling 3 can be arranged vertically. For example, the second tooling 3 is located above the first tooling 2 and can be raised and lowered relative to the first tooling 2. When the second tooling 3 is lowered, it can form an electroplating cavity with the first tooling 2 to accommodate the battery cell 5 and the electrolyte. The mounting surface 111 and the conductive surface 121 both face upwards and are located on the bottom wall of the electroplating cavity. Of course, in other embodiments, the first tooling 2 and the second tooling 3 can also be arranged horizontally or obliquely, as long as the first tooling 2 and the second tooling 3 can form an electroplating cavity when they are close to each other. This embodiment of the present invention does not impose specific limitations here.

[0050] like Figures 4 to 5 As shown, in one embodiment, the mounting surface 111 is provided with adsorption holes 21 communicating with the electroplating chamber. One end of the adsorption hole 21 away from the electroplating chamber is used to communicate with a negative pressure device (not shown). There are multiple adsorption holes 21 arranged at intervals. After the battery cell 5 is placed on the mounting surface 111 and the conductive surface 121, the negative pressure device is controlled to operate, providing negative pressure to the adsorption holes 21 to adsorb and fix the battery cell 5 onto the mounting surface 111 and the conductive surface 121. The multiple adsorption holes 21 can provide uniform adsorption force to various positions of the battery cell 5, ensuring the adsorption effect and preventing the battery cell 5 from separating from the mounting surface 111 and the conductive surface 121 due to weak adsorption force at some positions. The negative pressure device can be a vacuum pump, vacuum generator, air compressor, or other devices that can generate negative pressure within the adsorption holes 21. Furthermore, the number and distribution structure of the adsorption holes 21 can be adjusted according to the structural dimensions of the battery cell 5; this embodiment of the invention does not impose specific limitations on these devices. Of course, in other embodiments, fasteners or other methods can be used to secure the battery cell 5 to the mounting surface 111.

[0051] like Figures 5 to 6 As shown, the adsorption holes 21 are arranged correspondingly to the hollow portion 122 of the electrode 12. The adsorption holes 21 are located within the seat 11 that fills the hollow portion 122 of the electrode 12, facilitating the processing of the adsorption holes 21 and preventing interference between the electrode 12 and the adsorption holes 21. Furthermore, the adsorption holes 21 provide a uniform adsorption force to the battery cell 5 at the hollow portion 122 of the electrode 12, ensuring effective adsorption of the battery cell 5.

[0052] like Figures 1 to 2As shown, this embodiment of the present invention also provides an electroplating apparatus, including a first fixture 2 and a second fixture 3. The first fixture 2 is used to support a battery cell 5; the second fixture 3 includes the aforementioned electrode fixture. The first fixture 2 and the second fixture 3 are capable of relative movement, and the second fixture 3 and the first fixture 2 can surround an electroplating cavity for accommodating the battery cell 5 and electrolyte. The mounting surface 111 and the conductive surface 121 face the electroplating cavity. When it is necessary to process the battery cell 5, the first fixture 2 and the second fixture 3 are first controlled to move away from each other to open the electroplating cavity. The battery cell 5 is placed in the electroplating cavity and supported on the first fixture 2. Then, the first fixture 2 and the second fixture 3 are controlled to move closer to each other to close the electroplating cavity. At this time, the electrode 12 of the electrode fixture 1 is connected to the positive terminal of the power supply, and the first fixture 2 is provided with a conductive cathode connected to the negative terminal of the power supply. At least part of the conductive cathode is located in the electroplating cavity and in contact with the battery cell 5. The mounting surface 111 and the conductive surface 121 have a gap between themselves and the battery cell 5 for the flow of conductive liquid. Then, electroplating solution is injected into the electroplating chamber, and the electroplating device is energized. The metal cations in the electroplating solution can adhere to the surface of the battery cell 5 facing the mounting surface 111 and the conductive surface 121, i.e., the electroplating surface of the battery cell 5. After electroplating is completed, the electroplating solution in the electroplating chamber is discharged, and the first tooling 2 and the second tooling 3 are again controlled to move away from each other to open the electroplating chamber and remove the battery cell 5. Since the conductive surface 121 and the mounting surface 111 can form a flat surface, the electroplating solution flows smoothly through the conductive surface 121 and the mounting surface 111 without stagnation, thereby avoiding a reduction in the flow rate of the electroplating solution and ensuring the electroplating effect.

[0053] In this embodiment, when the base 11 is configured as a light-transmitting component, other parts of the second fixture 3 can also be configured as light-transmitting components. The light source can be located at the end of the second fixture 3 away from the first fixture 2 and emit light towards the second fixture 3. The light passes through the base 11 and the second fixture 3 and illuminates the battery cell 5. Alternatively, the first fixture 2 can also be configured as a light-transmitting component. The light source can be located at the end of the first fixture 2 away from the second fixture 3 and emit light towards the first fixture 2. The light passes through the first fixture 2 and illuminates the battery cell 5. In other words, the light from the light source can illuminate the electroplated surface of the battery cell 5 or the non-electroplated surface of the battery cell 5. The specific illumination position of the light source can be determined according to the electroplating process, and this embodiment of the present invention does not impose specific limitations. The first fixture 2 and the second fixture 3 can be made of other light-transmitting materials such as polymethyl methacrylate, polystyrene, polycarbonate, and inorganic glass, and this embodiment of the present invention does not impose specific limitations.

[0054] like Figures 1 to 2As shown, in one embodiment, the first tooling 2 and the second tooling 3 can be arranged vertically. For example, the second tooling 3 is located above the first tooling 2 and can be raised and lowered relative to the first tooling 2. When the second tooling 3 is lowered, it can form an electroplating cavity with the first tooling 2 to accommodate the battery cell 5 and the electrolyte. The mounting surface 111 and the conductive surface 121 both face upwards and are located on the bottom wall of the electroplating cavity. Of course, in other embodiments, the first tooling 2 and the second tooling 3 can also be arranged horizontally or obliquely, as long as the first tooling 2 and the second tooling 3 can form an electroplating cavity when they are close to each other. This embodiment of the present invention does not impose specific limitations here.

[0055] like Figures 4 to 5 As shown, in one embodiment, the first tooling 2, which supports the battery cell 5, has adsorption holes 21 communicating with the electroplating chamber. One end of the adsorption hole 21, away from the electroplating chamber, is connected to a negative pressure device (not shown). Multiple adsorption holes 21 are arranged at intervals. After the battery cell 5 is placed on the bottom wall of the electroplating chamber, the negative pressure device is activated, providing negative pressure to the adsorption holes 21 to adsorb and fix the battery cell 5 onto the bottom wall of the electroplating chamber. The multiple adsorption holes 21 provide uniform adsorption force to various positions of the battery cell 5, ensuring effective adsorption and preventing the battery cell 5 from separating from the mounting surface 111 and the conductive surface 121 due to insufficient adsorption force at some positions. The negative pressure device can be a vacuum pump, vacuum generator, air compressor, or other device capable of generating negative pressure within the adsorption holes 21. Furthermore, the number and distribution of the adsorption holes 21 can be adjusted according to the structural dimensions of the battery cell 5; this embodiment does not impose specific limitations on these devices. Of course, in other embodiments, fasteners or other methods can be used to secure the battery cell 5 to the first fixture 2.

[0056] like Figures 1 to 2 As shown, in the above-mentioned electroplating apparatus, the first tooling 2 is provided with an inlet channel 22 and an outlet channel 23 respectively connected to both sides of the electroplating chamber. The ends of the inlet channel 22 and the outlet channel 23 away from the electroplating chamber are respectively used to connect to the outlet and inlet of a fluid drive (not shown). When the fluid drive is working, it can provide power for the flow of the electroplating solution. The fluid drive drives the electroplating solution in the electroplating chamber to flow out from the outlet channel 23, and after passing through the inlet and outlet of the fluid drive, it flows back into the electroplating chamber through the inlet channel 22. In this way, the electroplating solution in the electroplating chamber is in a state of circulation, so as to improve the flow rate and uniformity of the electroplating solution, improve the metal ion exchange rate on the surface of the battery cell 5, and thus improve the processing efficiency of the battery cell 5. The fluid drive can be a drive pump or other device that can provide power for the flow of the electroplating solution. This embodiment of the present invention does not impose specific limitations.

[0057] like Figures 1 to 2As shown, the electroplating apparatus also includes a sealing element 4, which is disposed between the first tooling 2 and the second tooling 3, and located on the outer periphery of the electroplating chamber. When the first tooling 2 and the second tooling 3 approach each other, they press the sealing element 4 together, thus sealing the gap between the first tooling 2 and the second tooling 3 and preventing the electroplating solution in the electroplating chamber from overflowing from the gap between the first tooling 2 and the second tooling 3, ensuring that the electroplating apparatus can operate normally. Specifically, a sealing groove located on the outer periphery of the electroplating chamber can be formed on the side of the second tooling 3 facing the first tooling 2 or on the side of the first tooling 2 facing the second tooling 3, and part of the sealing element 4 can be embedded in the sealing groove to fix the sealing element 4 to the second tooling 3 or the first tooling 2. The sealing element 4 can be a silicone part, a rubber part, or other elastic components, and this embodiment of the present invention does not impose specific limitations.

[0058] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. An electrode tooling, characterized in that, include: The base (11) includes a mounting surface (111), and the base (11) is an insulating component; as well as, Electrode (12) is embedded in the mounting surface (111). The electrode (12) includes a conductive surface (121) facing the same side as the mounting surface (111). The conductive surface (121) is flush or substantially flush with the mounting surface (111). The electrode (12) is a conductive component.

2. The electrode fixture according to claim 1, characterized in that, The electrode (12) is integrally formed with the base (11).

3. The electrode fixture according to claim 1, characterized in that, The base (11) is configured as a light-transmitting element.

4. The electrode fixture according to claim 1, characterized in that, The electrode (12) is configured as a hole structure, mesh structure, grid structure, hollow structure or honeycomb structure.

5. An electroplating apparatus, characterized in that, include: The first tooling (2) includes the electrode tooling as described in any one of claims 1-4, wherein the mounting surface (111) and the conductive surface (121) are used to support the battery cell (5); and, The second tooling (3) is capable of relative movement with the first tooling (2) and the second tooling (3), and the second tooling (3) is capable of forming an electroplating cavity with the first tooling (2) for accommodating the battery cell (5) and electrolyte, with the mounting surface (111) and the conductive surface (121) facing the electroplating cavity.

6. The electroplating apparatus according to claim 5, characterized in that, The mounting surface (111) is provided with an adsorption hole (21) that communicates with the electroplating chamber. The end of the adsorption hole (21) away from the electroplating chamber is used to communicate with the negative pressure device. There are multiple adsorption holes (21), and the multiple adsorption holes (21) are arranged at intervals.

7. The electroplating apparatus according to claim 6, characterized in that, The electrode (12) is configured as a porous structure, a mesh structure, a grid structure, a hollow structure or a honeycomb structure, and the adsorption holes (21) are arranged corresponding to the hollow part (122) of the electrode (12).

8. An electroplating apparatus, characterized in that, include: The first tooling (2) is used to carry the battery cell (5); as well as, The second tooling (3) includes the electrode tooling as described in any one of claims 1-4, wherein the first tooling (2) and the second tooling (3) are movable relative to each other, and the second tooling (3) is able to form an electroplating cavity with the first tooling (2) for accommodating the battery cell (5) and the electrolyte, wherein the mounting surface (111) and the conductive surface (121) face the electroplating cavity.

9. The electroplating apparatus according to claim 8, characterized in that, The first tooling (2) has an adsorption hole (21) on the surface of the battery cell (5) that is connected to the electroplating chamber. The end of the adsorption hole (21) away from the electroplating chamber is connected to the negative pressure device. There are multiple adsorption holes (21), and the multiple adsorption holes (21) are arranged at intervals.

10. The electroplating apparatus according to any one of claims 5-9, characterized in that, The first tooling (2) is provided with an inlet channel (22) and an outlet channel (23) that are respectively connected to both sides of the electroplating chamber. The ends of the inlet channel (22) and the outlet channel (23) away from the electroplating chamber are respectively used to connect to the outlet and inlet of the fluid drive component.

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