PCB and probe card

Abstract

The utility model provides a PCB and a probe card, comprising a substrate, a golden finger arranged on the substrate, a test connection point and a first isolation groove arranged on the golden finger, and a small card arranged on the substrate. The small card is provided with a plurality of probe connection points and a plurality of probes, the small card is provided with a plurality of first device connection areas used for welding components, and the first device connection areas and the test connection points are arranged in a one-to-one correspondence manner and are electrically conducted; in the process of testing and machine testing, various parameters can be tested and verified only by replacing the small card on the premise that the PCB (specifically a substrate) is not replaced, the frequency of replacing the PCB is reduced, unstable factors caused in the card dismounting process are reduced, the efficiency of testing and verification is improved, and the cost can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor design and manufacturing, and particularly relates to a PCB and a probe card. BACKGROUND

[0002] In the semiconductor integrated circuit industry, a probe card is usually used to assist in testing when performing electrical property testing on a wafer level on a testing machine. The existing probe card fixes one end of a probe on a PCB (circuit board), and then connects the PCB with the testing machine, and the other end of the probe contacts a test point on each test unit (DUT: device under test) on the wafer, thereby forming a complete testing system. The function of the probe card is to pierce the solder pad, thereby enabling the testing machine and the tested structure to be connected.

[0003] Meanwhile, the PCB of the probe card can also be used as a verification board. In order to verify the testing accuracy and testing accuracy of the wafer electrical property testing equipment, a series of verification work is usually performed before the testing equipment is shipped. The way of verifying the testing equipment and the instrument used are different, and one of the important verification methods is to use the newly built testing equipment to measure different components, compare the measured value with the actual component value to see the difference between them, and the closer the measured value is to the actual value, the higher the accuracy of the testing equipment.

[0004] Currently, the verification work of the electrical property testing equipment is to directly weld the components to the PCB of the probe card for measurement, which has the following disadvantages: first, if the PCB of the probe card is used as a verification board, the PCB cannot be used as a probe card; second, since the verification parameters are various, the PCB of the probe card currently only supports the welding of a single component, and if multiple parameters are to be verified, different components need to be welded on multiple PCBs of the probe card, which consumes many PCBs, reduces the utilization rate of the PCBs, and is not conducive to cost control; third, since the cards need to be replaced frequently during the verification process, this is not conducive to improving the verification efficiency.

[0005] Therefore, it is necessary to provide a multifunctional main card PCB and an embedded small card, which can be quickly switched to a probe card and a verification board for verification in the testing and verification process without replacing the main card, thereby improving the testing and verification efficiency and more accurately completing the wafer electrical property testing and equipment verification. CONTENT OF THE INVENTION

[0006] The utility model discloses to solve all or part problems of the prior art. The utility model provides a kind of PCB board, the multifunctionality of PCB board can be realized, when welding component is used as verification purpose, it will not cause the problem that PCB board cannot be used secondly, greatly improve utilization rate.

[0007] The utility model further provides a kind of probe card, because the above-mentioned PCB board is used, the multifunctionality of probe card and efficient use are realized.

[0008] Other purposes and advantages of the utility model can be further understood from the technical features disclosed by the utility model.

[0009] To achieve one or part or all of the above purposes or other purposes, the PCB board provided by the technical scheme of the utility model includes a substrate, a gold finger disposed on the substrate, a test connection point and a first isolation groove disposed on the gold finger, and a small card mounted on the substrate.

[0010] A plurality of first component connection areas for welding components are provided on the small card, and the first component connection areas are one-to-one correspondingly arranged with the test connection points and electrically conductive therebetween.

[0011] In an embodiment, the substrate and the small card are correspondingly provided with a first connection area and a second connection area for electrical conduction on the contact surface, and the first connection area and the second connection area are one-to-one correspondingly arranged with the test connection points and the first component connection areas respectively, and are electrically connected with the respective corresponding test connection points and first component connection areas.

[0012] In an embodiment, the gold finger is provided with a second isolation groove and a second component connection area located in the second isolation groove, and the second component connection area is electrically connected with the test connection point.

[0013] In an embodiment, the second component connection area is provided with at least two first connection points, the first connection points are electrically conductive, and at least one of the first connection points is electrically connected with the test connection point.

[0014] In an embodiment, a plurality of test connection points are provided on each of the gold fingers, each of the test connection points is separately provided with a corresponding first isolation groove, and is disconnected with the gold finger through the corresponding first isolation groove, and at least one of the first connection points is electrically connected with the plurality of test connection points.

[0015] In an embodiment, the first connection point, the test connection point, and the gold finger in the external area of the first isolation groove and the second isolation groove are all provided with through holes.

[0016] In an embodiment, the substrate and the upper surface and the lower surface of the small card are made of ceramic material, and the intermediate layer between the upper surface and the lower surface is made of FR4 material.

[0017] In an embodiment, the substrate is provided with positioning holes and / or portable device mounting holes; the positioning holes are used for positioning and mounting the PCB board, and the portable device mounting holes are used for mounting a portable device.

[0018] The utility model also provides a probe card, including above-mentioned PCB board, still be provided with a plurality of probe connecting points and a plurality of probes on the small card of PCB board, a plurality of probe connecting points are arranged around the periphery of a plurality of probes, a plurality of probes are electrically connected with a plurality of probe connecting points respectively, a plurality of probe connecting points are electrically connected with a plurality of first device connecting areas respectively.

[0019] In an embodiment, the plurality of probe connecting points are located between the plurality of first device connecting areas and the plurality of probes.

[0020] The utility model has the following advantages: based on the design of the embedded small card, a multifunctional PCB board and probe card are provided, and in the process of testing and verifying, various parameter tests and verifications can be performed by only replacing the small card without replacing the PCB board substrate, and the small card only needs to be mounted on the large card, which reduces the frequency of replacing the large card and the unstable factors caused by the card removal process, improves the efficiency of testing and verification, and reduces the cost. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the following will briefly introduce the drawings needed to be used in the embodiment or related art description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0022] Figure 1 It is a schematic diagram of the substrate of the PCB board in an embodiment;

[0023] Figure 2 It is a schematic diagram of the small card in an embodiment; DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of the present application.

[0025] A PCB, referring to Figure 1 and Figure 2 , comprises a substrate 1, a gold finger 2 arranged on the substrate 1, a test connection point 21 and a first isolation groove 24 arranged on the gold finger 2, and a small card 5 mounted on the substrate 1.

[0026] The small card 5 is provided with a plurality of first device connection areas 53 for welding components, and the first device connection areas 53 are arranged one by one corresponding to the test connection points 21 and are electrically connected.

[0027] Specifically, the previous PCB is provided with a device connection area on the gold finger or other positions, and the present application divides the PCB into a main substrate 1 and a replaceable small card 5, retains the gold finger 2 and the test connection point 21 on the substrate 1, and arranges the device connection area (i.e. the first device connection area 53) on the small card 5, so that the components can be directly welded on the small card 5, and when it is necessary to replace the components for testing, only the small card 5 needs to be replaced, and the substrate 1 can also be used as a PCB or a probe card.

[0028] Further, the substrate 1 and the small card 5 are provided with first and second connection areas for electrical conduction on the contact surface, the first and second connection areas are arranged one by one corresponding to the test connection points 21 and the first device connection areas 53, respectively, and are electrically connected to the respective corresponding test connection points 21 and first device connection areas 53. The electrical connection is achieved by the internal circuit of the substrate 1 and the small card 5.

[0029] In the present embodiment, the connection mode of the substrate 1 and the small card 5 adopts detachable connection, including two connection forms, which are as follows:

[0030] Connection form 1: the small card 5 covers the upper surface position 4 of the substrate 1, and the small card 5 can be directly fixed on the upper surface of the substrate 1 by screws or the like. Of course, the small card 5 can also be fixed on the position 4 of the surface of the main card substrate 1 in a rotating manner by the small card connector 3, and the first and second connection areas are arranged on the upper surface of the substrate 1 and the lower surface of the small card 5, respectively. Of course, the first device connection 53 and the test connection point 21 can also be connected by a flying wire and a pressure connection.

[0031] The connection form 2 is that the small card 5 is embedded into the substrate 1, that is, a mounting groove adapted to the small card 5 is formed in the middle position of the substrate 1, the small card 5 can be partially or entirely located in the mounting groove, and then is connected through some fixing modes such as clamping, and the first connection area and the second connection area are respectively arranged on the inner side surface of the substrate 1 and the outer side surface of the small card 5.

[0032] In the embodiment, at least two gold fingers 2 are arranged on the upper surface of the substrate 1 and surround the center of the substrate 1, and in the embodiment, the circular substrate and 48 gold fingers 2 are taken as an example for description, and in other embodiments, the substrate 1 can also have other shapes, and the number of the gold fingers 2 can also be adjusted according to actual needs.

[0033] Specifically, in the embodiment, the test connection point 21, the second device connection area 22, the first isolation groove 23 and the second isolation groove 24 are arranged on each gold finger 2; the second device connection area 22 is located in the second isolation groove 23 and is disconnected from the gold finger 2 through the second isolation groove 23, the test connection point 21 is located in the first isolation groove 24 and is disconnected from the gold finger 2 through the first isolation groove 24; the second device connection area 22 is provided with at least two first connection points, and in the embodiment, two first connection points are taken as an example for description, and the two first connection points are respectively denoted as 221 and 222, the two first connection points 221 and 222 are electrically connected through the metal on the second device connection area 22, and at least one of the first connection points is electrically connected with the test connection point 21, and the electrical connection mode can be connected through the circuit in the substrate 1, can also be connected through the flying wire, and can also be connected through the conductive path arranged on the lower surface of the substrate 1, for example, the conductive path arranged on the lower surface of the substrate 1 can be a gold finger (not shown in the figure) arranged on the lower surface of the substrate 1, the number and arrangement mode of the gold finger on the lower surface correspond to those of the gold finger on the upper surface, and the conductive path is arranged on the gold finger on the lower surface, and the electrical connection of the connection points on the gold finger 2 on the upper surface can be realized by electrically connecting the gold fingers on the upper surface and the lower surface during testing, and the utility model does not make specific limitation on this.

[0034] It is worth noting that the second device connection area 22 can be arranged to realize the verification function by using the substrate 1 without the small card 5 or without using the small card 5, and of course, the components can be respectively connected with one of the first device connection area 53 and the second device connection area 22.

[0035] In order to measure different electrical parameters at the same time, the test connection points 21 on each gold finger 2 can also be provided with multiple, two in this embodiment, and the two test connection points are respectively denoted as 21 and 21'. Each test connection point 21, 21' is separately configured with a corresponding first isolation groove 24, 24', and is disconnected from the gold finger 2 through the corresponding first isolation groove 24, 24', and at least one of the two first connection points 221 and 222 is electrically connected with the test connection points 21, 21', respectively.

[0036] In order to facilitate the pin welding of components and the electrical connection between the first connection points and the test connection points, in this embodiment, through holes are provided on the first connection points 221, 222, the test connection points 21, 21' on the gold finger 2. When the signal conduction of each connection point on the upper surface of the substrate 1 is realized through the gold finger 2 on the lower surface of the substrate 1, a through hole is also provided on the gold finger 2 located in the external region of the second isolation groove 23 and the first isolation groove 24, 24'. The through hole can realize the electrical connection between the gold fingers 2 on the upper and lower surfaces of the substrate 1, so as to realize the simultaneous grounding of the gold fingers 2 on the upper and lower surfaces. Among them, the first connection points 221, 222 can be used as the connection points of the components during verification, and the through holes on the first connection points 221, 222 and the test connection points 21, 21' can realize the electrical connection between the probe connection points, the first connection points and the test connection points during testing.

[0037] In order to realize the grounding protection, in this embodiment, the substrate 1 is provided with a grounding point 6. During testing, the grounding protection of the substrate 1 can be realized by connecting the grounding pressure point of the test head, or the grounding protection of the substrate 1 can be realized by directly connecting the test machine.

[0038] In order to reduce the cost, the substrate 1 and the small card 5 in this embodiment are both made of FR4 material in the middle layer, and the upper surface and the lower surface are made of ceramic. The line part of the PCB and the probe card is covered by the ceramic. Since the ceramic material is relatively expensive, but has little effect on the leakage of the probe card, and the FR4 material is very cheap, but will cause large leakage, therefore, such design not only ensures that the leakage of the product is not affected, but also greatly saves the manufacturing cost.

[0039] It should be noted that in other embodiments, some structures for facilitating positioning, installation, picking and placing, or calibrating direction can also be added to the substrate 1. For example, in some embodiments, positioning holes 7 can be provided on the substrate 1 for positioning the probe card to fix and install the probe card on the probe station; at the same time, the positioning holes 7 can also be used as mounting holes of the fixing structure, and the fixing structure such as bolts is fixed on the probe station, so that the installation of the probe card is more firm, and the pressure point of the test head is more accurate.

[0040] In some other embodiments, the substrate 1 can be provided with a holding device mounting hole 8 for mounting a holding device, the holding device mounting hole 8 can be symmetrically or asymmetrically provided on the substrate 1, and the probe card further comprises a holding device mounted in the holding device mounting hole 8. The holding device can be a single device mounted and fixed through a single holding device mounting hole 8, or when the single device is large, the holding device can be mounted and fixed through multiple holding device mounting holes 8, or the holding device can be a combination of multiple devices, and when the multiple devices are combined, the multiple devices are respectively mounted in the corresponding different holding device mounting holes 8. In addition, in order to adapt to the operation habits of users or to the use environment of the probe card and other factors, the holding device can be annular, profiled, circular, arcuate or other irregular shapes to adapt to and cooperate with the test environment. The holding device can be conveniently held and placed by the user, avoid pollution and damage to the surface of the probe card, cause the problem of excessive leakage of the probe card, and at the same time, the holding device can protect the parts on the probe card.

[0041] In some other embodiments, the substrate 1 can be further provided with a direction indicating mark 9, such as an arrow printed on the substrate, which can make it more convenient for the user to determine the direction of the probe and can quickly position and install the probe.

[0042] In some other embodiments, a probe card is provided according to the PCB described above, and the small card 5 of the PCB is further provided with a plurality of probe connection points 52 and a plurality of probes 51. The plurality of probe connection points 52 are located between the plurality of first device connection areas 53 and the plurality of probes 51, and the plurality of probe connection points 52 are arranged around the periphery of the plurality of probes 51. The plurality of probes 51 are respectively electrically connected to the plurality of probe connection points 52, and the plurality of probe connection points 52 are respectively electrically connected to the plurality of first device connection areas 53. The electrical connection mode can be, for example, that the probe 51 is welded on the probe connection point 52.

[0043] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A PCB board comprising a substrate, a gold finger disposed on the substrate, and a test connection point and a first isolation slot disposed on the gold finger, wherein, The small card is installed on the substrate; The small card is provided with a plurality of first device connection areas for welding components, which are arranged one by one corresponding to the test connection points and are electrically connected.

2. The PCB board of claim 1, wherein, The substrate and the small card are provided with first connection areas and second connection areas for electrical conduction on the contact surface, which are arranged one by one corresponding to the test connection points and the first device connection areas, respectively, and are electrically connected to the respective corresponding test connection points and first device connection areas.

3. The PCB board of claim 1, wherein, The gold finger is provided with a second isolation groove and a second device connection area located in the second isolation groove, and the second device connection area is electrically connected to the test connection point.

4. The PCB board of claim 3, wherein, The second device connection area is provided with at least two first connection points, which are electrically connected, and at least one of the first connection points is electrically connected to the test connection point.

5. The PCB board of claim 4, wherein, Each of the gold fingers is provided with a plurality of test connection points, each of which is individually provided with a corresponding first isolation groove and is disconnected from the gold finger through the corresponding first isolation groove, and at least one of the first connection points is electrically connected to the plurality of test connection points.

6. The PCB board of claim 5, wherein, The first connection points, the test connection points, and the gold finger in the external area of the first isolation groove and the second isolation groove are all provided with through holes.

7. The PCB board of claim 1, wherein, The upper surface and the lower surface of the substrate and the small card are both paved with ceramic material, and the intermediate layer between the upper surface and the lower surface is made of FR4 material.

8. The PCB board of claim 1, wherein, The substrate is provided with a positioning hole and / or a convenient holding device mounting hole; the positioning hole is used for positioning and mounting the PCB board, and the convenient holding device mounting hole is used for mounting the convenient holding device.

9. A probe card, characterized by, The PCB board includes a small card provided with a plurality of probe connection points and a plurality of probes, the plurality of probe connection points are arranged around the periphery of the plurality of probes, the plurality of probes are electrically connected to the plurality of probe connection points, respectively, and the plurality of probe connection points are electrically connected to a plurality of first device connection areas, respectively.

10. The probe card of claim 9, wherein, The plurality of probe connection points are located between the plurality of first device connection areas and the plurality of probes.

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