Optical device

Abstract

The utility model provides an optical device. The optical device comprises a shell, an optical chip, a light collecting assembly and a monitoring assembly. The monitoring assembly comprises a reflecting part and a monitoring part, the reflecting part is arranged between the plurality of optical chips and the light collecting assembly, and the monitoring part is arranged on the shell; part of light beams emitted by the optical chips are in a divergent light state, the reflecting part is used for reflecting the light beams emitted by the optical chips in the divergent light state to the monitoring part, and the monitoring part is used for receiving the light beams from the reflecting part and obtaining light beam information of the light beams. According to the optical device provided by the invention, the reflecting part is arranged between the optical chip and the light collecting assembly, and the monitoring part is arranged on the shell, so that the divergent light emitted by the optical chip can be arranged in the monitoring part through the reflecting part, and the monitoring part can obtain the light beam information of the light beam, so that the power and quality detection of the optical signal is realized, and the reliability of the optical device is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of optical communication, and particularly relates to an optical device. BACKGROUND

[0002] In the field of optical communication, in order to monitor the power and quality of an optical signal and provide feedback information to ensure the stability and performance of a system, a monitoring component is often arranged between the optical path of an optical chip and a light collecting assembly to improve the signal quality.

[0003] In the related art, in order to improve the speed of optical transmission, a parallel light system with a very short distance between the optical chip and the light collecting assembly is adopted. However, due to the small distance between the optical chip and the light collecting assembly, it is impossible to arrange a monitoring component between the optical path of the optical chip and the light collecting assembly, and the arrangement of the monitoring component is often omitted in the related art, so that the power and quality of the optical signal in the optical device cannot be detected, and the reliability of the optical device is reduced. CONTENT OF THE UTILITY MODEL

[0004] In view of this, the application provides an optical device, which comprises:

[0005] A shell having a receiving space, the shell further having an input port and an output port communicating with the receiving space;

[0006] A plurality of optical chips arranged in the receiving space, each of the optical chips being used for emitting an optical beam of different wavelength, and the plurality of optical chips being connected to the input port;

[0007] A light collecting assembly arranged in the receiving space and between the plurality of optical chips and the output port, the light collecting assembly being used for receiving a plurality of optical beams emitted by the plurality of optical chips, making the plurality of optical beams in a parallel light state, and then making the plurality of optical beams in a parallel light state to be combined to form an emission light, the emission light being emitted from the output port; and

[0008] A monitoring assembly arranged in the receiving space, the monitoring assembly comprising a reflecting element and a monitoring component, the reflecting element being arranged between the plurality of optical chips and the light collecting assembly, and the monitoring component being arranged in the shell, part of the optical beams emitted from the optical chips being in a divergent light state, the reflecting element being used for reflecting the optical beams emitted from the optical chips in the divergent light state to the monitoring component, and the monitoring component being used for receiving the optical beams from the reflecting element and acquiring the beam information of the optical beams.

[0009] The light collecting assembly comprises a coupling lens arranged on one side of the plurality of optical chips, the coupling lens comprising a plurality of sub-translucent parts arranged side by side and at intervals, one of the sub-translucent parts corresponding to one of the optical chips, and the sub-translucent part being used for receiving the optical beams emitted by the optical chip and making the optical beams in a parallel light state.

[0010] The number of the reflecting elements is the same as the number of the optical chips, and the number of the monitoring elements is the same as the number of the optical chips. One of the reflecting elements is arranged between one of the optical chips and one of the sub-light-transmitting parts. A plurality of the reflecting elements are arranged in parallel and at intervals. One of the monitoring elements corresponds to one of the reflecting elements. A plurality of the monitoring elements are arranged in parallel and at intervals.

[0011] The monitoring assembly further comprises a blocking element arranged between two adjacent reflecting elements. The blocking element is used to block the light beams emitted by the optical chips from being incident on the reflecting elements.

[0012] The monitoring assembly further comprises a controller and a temperature sensor electrically connected. The blocking element is used to absorb light. The temperature sensor is used to obtain temperature information of the blocking element. The controller is used to receive the temperature information of the blocking element and control the plurality of optical chips.

[0013] The reflecting element comprises a reflecting surface for reflecting the light beams. The monitoring element comprises a receiving surface for receiving the light beams. The included angle between the reflecting surface and the receiving surface is greater than or equal to 30° and less than 45°.

[0014] The distance between the optical chip and the reflecting element is a first distance. The first distance is 250 μm-350 μm.

[0015] The distance between the optical chip and the reflecting element is a first distance. The distance between the reflecting element and the monitoring element is a second distance. The ratio between the first distance and the second distance is 1:(2-6).

[0016] The light collecting assembly further comprises a beam combining group arranged on the side of the coupling lens away from the plurality of optical chips. The beam combining group comprises a first light inlet part, a first reflecting part, and a second light inlet part. The first light inlet part is arranged between one of the sub-light-transmitting parts and the first reflecting part. The second light inlet part is arranged corresponding to another of the sub-light-transmitting parts.

[0017] The plurality of optical chips respectively emit first light beams and second light beams with different wavelengths. The first light beams pass through one of the sub-light-transmitting parts and are incident on the first light inlet part. The first light inlet part is used to receive the first light beams and make the first light beams incident on the first reflecting part. The first reflecting part is used to reflect the first light beams to the second light inlet part. The second light beams pass through another of the sub-light-transmitting parts and are incident on the second light inlet part. The second light inlet part is used to receive the second light beams and make the second light beams and the first light beams incident on the output port, so as to combine the first light beams and the second light beams to form the emission light.

[0018] The beam combination set further comprises a fixing member, the fixing member comprises oppositely arranged first and second inner side walls, the first inner side wall is closer to the coupling lens than the second inner side wall, the first and second inner side walls are both arranged obliquely, the first light inlet portion and the second light inlet portion are fixed to the first inner side wall, and the first reflecting portion is fixed to the second inner side wall.

[0019] The first inner side wall has a first included angle with a vertical direction, the second inner side wall has a second included angle with the vertical direction, and the first and second included angles are both 3°-20°.

[0020] The optical device further comprises a base arranged in the accommodation space, and the plurality of optical chips are fixed to the base and arranged side by side and at intervals.

[0021] The optical device further comprises an optical fiber and a receiving member arranged on one side of the shell, the optical fiber is used for receiving the emitted light emitted by the output port, the optical fiber is also used for emitting incident light, and the receiving member is used for receiving the incident light.

[0022] The receiving member is arranged between the output port and the optical fiber, and a plurality of receiving members are arranged side by side and at intervals along the arrangement direction from the output port to the optical fiber.

[0023] The optical device further comprises a light collecting member arranged between the output port and the optical fiber, the light collecting member is used for receiving and collecting the emitted light, and the collected emitted light is emitted to the optical fiber.

[0024] The optical device further comprises an isolation member arranged between the output port and the optical fiber, the isolation member is used for blocking the light beam reflected to the plurality of optical chips by the light collecting assembly.

[0025] The optical device provided by the application can realize power and quality detection of optical signals by arranging a reflecting member between the optical chip and the light collecting assembly and arranging a monitoring member on the shell, so that the divergent light emitted by the optical chip can be arranged in the monitoring member through the reflecting member, the monitoring member can obtain the light beam information of the light beam, and the reliability of the optical device is improved.

[0026] In addition, the optical device provided by the application integrates the plurality of optical chips, the light collecting assembly, and the monitoring assembly in one shell, optimizes the structure of the optical device, reduces the number of parts that need to be assembled, facilitates user assembly, reduces the assembly difficulty, reduces the overall size of the optical device, and can provide more available space for other parts.

[0027] In addition, the application sets the light collecting assembly to combine multiple light beams to form the emitted light, omits at least one filter and lens in the related art, reduces the preparation cost, reduces the power loss of the light beam, and improves the transmission performance of the optical device. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed to be used in the embodiments of the application will be described below.

[0029] Figure 1 The structure schematic diagram of the optical device provided by an embodiment of the application.

[0030] Figure 2 The structure schematic diagram of the optical device provided by the related art.

[0031] Figure 3 The structure schematic diagram of the optical device provided by another embodiment of the application.

[0032] Figure 4 The structure schematic diagram of the optical chip and the coupling lens provided by an embodiment of the application.

[0033] Figure 5 The structure schematic diagram of the optical chip, the monitoring assembly, and the coupling lens provided by an embodiment of the application.

[0034] Figure 6 The structure schematic diagram of the optical device provided by still another embodiment of the application.

[0035] Figure 7 The change curve diagram of the light loss rate received by the monitoring device and the second interval provided by an embodiment of the application.

[0036] Figure 8 The structure schematic diagram of the beam combining group provided by an embodiment of the application.

[0037] Figure 9 The structure schematic diagram of the beam combining group provided by another embodiment of the application.

[0038] Figure 10 The structure schematic diagram of the beam combining group provided by still another embodiment of the application.

[0039] Figure 11 The light path schematic diagram of the emitted light in the optical device provided by an embodiment of the application.

[0040] Figure 12 The light path schematic diagram of the incident light in the optical device provided by an embodiment of the application.

[0041] Label explanation: optical device 1, housing 10, accommodation space 11, input port 12, output port 13, optical chip 20, light collecting assembly 30, coupling lens 31, sub-translucent part 311, beam combining group 32, first light inlet part 321, first reflection part 322, second light inlet part 323, second reflection part 324, third light inlet part 325, third reflection part 326, fourth light inlet part 327, fixing member 328, first inner side wall 3281, second inner side wall 3282, monitoring assembly 40, reflecting member 41, monitoring element 42, blocking member 43, temperature sensor 44, base 51, optical fiber 52, receiving member 53, condensing member 54, isolation member 55. DETAILED DESCRIPTION

[0042] The following is the preferred embodiment of the present application, it should be noted that for those skilled in the art, without departing from the principles of the present application, can make several improvements and refinements, these improvements and refinements are also considered to be within the scope of the present application.

[0043] In view of this, in order to solve the above problems, please refer to Figures 1-3 The present embodiment provides an optical device 1, the optical device 1 includes a housing 10, an optical chip 20, a light collecting assembly 30, and a monitoring assembly 40. The housing 10 has an accommodation space 11, the housing 10 also has an input port 12 and an output port 13 communicating with the accommodation space 11. A plurality of optical chips 20 is arranged in the accommodation space 11, each of the optical chips 20 is used to emit light beams of different wavelengths, and the plurality of optical chips 20 is connected to the input port 12.

[0044] The light collecting assembly 30 is arranged in the accommodation space 11 and between the plurality of optical chips 20 and the output port 13; the light collecting assembly 30 is used to receive a plurality of light beams emitted by the plurality of optical chips 20, and make the plurality of light beams in parallel light state, and then make the plurality of light beams beam combining to form an emission light, the emission light is emitted from the output port 13.

[0045] The monitoring assembly 40 is arranged in the accommodation space 11. The monitoring assembly 40 includes a reflecting member 41 and a monitoring element 42, the reflecting member 41 is arranged between the plurality of optical chips 20 and the light collecting assembly, and the monitoring element 42 is arranged in the housing 10; part of the light beams emitted from the optical chips 20 are in divergent light state, the reflecting member 41 is used to reflect the light beams in divergent light state emitted from the optical chips 20 to the monitoring element 42, and the monitoring element 42 is used to receive the light beams from the reflecting member 41 and obtain the light beam information of the light beams.

[0046] The optical device 1 provided by the present embodiment can be used in optical communication systems including optical network terminals, or optical network units, or optical distribution networks, etc.

[0047] The shell 10 is used to fix and protect the components of the optical device 1. The shell 10 has a receiving space 11, and the optical chip 20 and the light collecting assembly 30 are arranged in the receiving space 11. The shell 10 also has an input port 12 and an output port 13. The input port 12 is used to connect the optical chip 20 with other components, and the output port 13 is used to output the emitted light. Optionally, the input port 12, the optical chip 20, the light collecting assembly 30, and the output port 13 are arranged along the axial direction of the shell 10. The connection mode between the optical chip 20 and the shell 10 can be adhesive connection, buckle connection, threaded connection, etc., which is not limited in the embodiment. The connection mode between the light collecting assembly 30 and the shell 10 can be adhesive connection, buckle connection, threaded connection, etc., which is not limited in the embodiment.

[0048] The optical chip 20 is used to emit light beams. The number of the optical chip 20 can be at least two, for example, the number of the optical chip 20 can be 2, or 3, or 4, or 5, or 6, etc. Optionally, the optical chip 20 is a laser emitter, and further optionally, the optical chip 20 can be an infrared emitter, or an ultraviolet emitter, etc. Each optical chip 20 can emit light beams of different wavelengths, for example, the wavelength of the light beams emitted by the optical chip 20 can be 1342 nm, or 1490 nm, or 1577 nm, etc.

[0049] The light collecting assembly 30 is used to receive and reflect, and / or receive and transmit, and / or receive and filter the light beams emitted by the optical chip 20, so as to change the propagation direction of the light beams, and to combine the multiple light beams to form the emitted light, and then to make the emitted light exit from the output port 13. The light path from the optical chip 20 to the light collecting assembly 30 is shown as L3 in FIG. 1. Figure 3 The emitted light can also be emitted to components that receive light source signals, such as optical fibers 52, passive networks, active networks, etc. Optionally, the light collecting assembly 30 includes multiple glass sheets, which can reflect and / or transmit light. The number of the glass sheets is 2-10. The specific structure of the light collecting assembly 30 will be described in detail below.

[0050] Optionally, the distance between the multiple optical chips 20 and the light collecting assembly is 250-750 μm. For example, the distance between the optical chip 20 and the light collecting assembly can be 250 μm, or 300 μm, or 350 μm, or 400 μm, or 450 μm, or 500 μm, or 550 μm, or 600 μm, or 650 μm, or 700 μm, or 750 μm, etc.

[0051] The monitoring component 40 is configured to detect the light beam information of the light beam emitted by the optical chip 20, and the light beam information includes the wavelength, power, energy, etc. of the light beam. The monitoring component 40 includes a reflecting component 41 and a monitoring component 42. The reflecting component 41 is configured to reflect the light beam, and the monitoring component 42 is configured to receive the light beam and obtain the light beam information of the light beam. For example, the monitoring component 42 can be a photodiode, which works based on the photoelectric effect. When the incident light signal irradiates on the monitoring component 42, an electric current will be generated. The electric current is proportional to the power of the incident light signal, and the power value of the incident light signal can be obtained by measuring the size of the electric current. The monitoring component 42 is arranged on the inner cavity wall of the receiving space 11 of the shell 10, and the connection mode between the monitoring component 42 and the shell 10 can be adhesive connection, threaded connection, clamping, etc., which is not limited in the embodiment.

[0052] Specifically, the light beam emitted by the optical chip 20 in the divergent light state is incident on the reflecting component 41, and the reflecting component 41 reflects the light beam to the monitoring component 42. In other words, the monitoring component 42 receives the light beam emitted by the optical chip 20 and obtains the light beam information of the light beam, so as to realize the monitoring of the optical chip 20 by the monitoring component 42. The light path of the optical chip 20 to the reflecting component 41 and the monitoring component 42 is shown in FIG. 1. Figure 1

[0053] Optionally, the reflecting component 41 is a concave mirror, and the reflecting component is further configured to converge the light beam emitted by the optical chip 20 in the divergent light state. The reflecting component 41 not only has the function of reflecting the light beam, but also has the function of converging the light beam, which can make more divergent light emitted by the optical chip 20 reflect to the monitoring component 42, thereby improving the monitoring accuracy of the monitoring component 42.

[0054] In summary, the optical device 1 provided by the embodiment can realize the power and quality detection of the optical signal by arranging the reflecting component 41 between the optical chip 20 and the light collecting component and arranging the monitoring component 42 on the shell 10, so that the divergent light emitted by the optical chip 20 can be arranged in the monitoring component 42 through the reflecting component 41, and the monitoring component 42 can obtain the light beam information of the light beam, thereby improving the reliability of the optical device 1.

[0055] 50G PON is the next generation PON standard after 10G PON, supporting uplink and downlink 50Gbps with single wavelength, and the bandwidth is 5 times of 10GPON. It can coexist with 10G PON and is compatible with the existing network infrastructure. It should be noted that 50G PON is a kind of optical fiber 52 communication technology, and the "50G" in its name represents its excellent data transmission speed, reaching 50Gbps (Gigabits per second) per second, as a representative of the next generation PON (Passive Optical Network) technology.

[0056] Please refer to​Figure 2 In the related art, a 50G COMBO PON OLT optical device is usually composed of three transmitters and three receivers 53, and shares one optical fiber 52 for transmitting and receiving optical signals. The transmitter can also be understood as an optical chip 20. As shown in the figure, three transmitters (optical chips 20), three receivers 53, and one optical fiber 52 need to be assembled on an integrated piece respectively, and then the propagation paths of different wavelength beams are changed by using the filter and lens on the integrated piece. The light path transmitted from the transmitter (optical chip 20) to the optical fiber 52 is shown as L1 in the figure, and the light path transmitted from the optical fiber 52 to the receiver 53 is shown as L2 in the figure. Figure 2 Figure 2 Figure 2

[0057] However, using the optical device 1 in the related art described above, different optical transmitters need to be assembled on an integrated piece, and then at least one filter in the integrated piece is used to combine multiple wavelength beams into one transmitted light, which results in high assembly difficulty, large power loss of the light beam, the need to use multiple components, and high manufacturing cost.

[0058] In summary, the optical device 1 provided by the embodiment optimizes the structure of the optical device 1 by integrating multiple optical chips 20, light collecting assemblies 30, and monitoring assemblies 40 in one housing 10, reduces the number of components that need to be assembled, facilitates user assembly, reduces assembly difficulty, reduces the overall size of the optical device 1, and provides more available space for other components.

[0059] In addition, the embodiment further combines multiple light beams into a transmitted light by providing the light collecting assembly 30, omits at least one filter and lens in the related art, reduces the manufacturing cost, further reduces the power loss of the light beam, and improves the transmission performance of the optical device 1.

[0060] Please refer to Figure 4 In one embodiment, the light collecting assembly 30 includes a coupling lens 31 arranged on one side of the multiple optical chips 20. The coupling lens 31 includes multiple sub-light-transmitting parts 311 arranged side by side and spaced apart. One sub-light-transmitting part 311 is arranged corresponding to one optical chip 20. The sub-light-transmitting part 311 is used to receive the light beam emitted by the optical chip 20 and make the light beam into a parallel light state.

[0061] ​​​The coupling lens 31 is arranged facing the plurality of light chips 20. The plurality of light chips 20 are arranged in parallel and at intervals, and the arrangement direction of the plurality of light chips 20 is parallel to the arrangement direction of the plurality of sub-transmissive parts 311 in the coupling lens 31. The plurality of sub-transmissive parts 311 are coupled individually by using a coupling machine, so as to obtain the coupling lens 31, in other words, the plurality of sub-transmissive parts 311 are an integral structure. The sub-transmissive part 311 can also be called a collimator, which is used to make the light beams emitted by the light chip 20 into parallel light state.

[0062] In summary, the embodiment optimizes the structure by arranging the coupling lens 31, omits at least one filter and lens sheet in the related art, reduces the preparation cost, and also makes the plurality of light beams into parallel light state, thereby reducing the difficulty of subsequent beam combination to form the emission light.

[0063] For reference Figures 1-5 In an embodiment, the number of the reflecting elements 41 is the same as the number of the light chips 20, the number of the monitoring elements 42 is the same as the number of the light chips 20, one reflecting element 41 is arranged between one light chip 20 and one sub-transmissive part 311, and the plurality of reflecting elements 41 are arranged in parallel and at intervals. One monitoring element 42 corresponds to one reflecting element 41, and the plurality of monitoring elements 42 are arranged in parallel and at intervals.

[0064] One monitoring element 42 receives the light beam reflected by one reflecting element 41, and obtains the light beam information of the light beam emitted by one light chip 20. Optionally, the arrangement direction of the plurality of light chips 20 is parallel to the arrangement direction of the plurality of reflecting elements 41. Optionally, the interval between the two adjacent light chips 20 is equal to the interval between the two adjacent reflecting elements 41. Optionally, the arrangement direction of the plurality of light chips 20 is parallel to the arrangement direction of the plurality of monitoring elements 42. Optionally, the interval between the two adjacent light chips 20 is equal to the interval between the two adjacent monitoring elements 42.

[0065] In summary, the embodiment defines that one reflecting element 41 corresponds to one light chip 20, and one monitoring element 42 is used to monitor the light beam of one light chip 20, thereby avoiding the mutual interference of the light beam information of the plurality of light chips 20, and improving the monitoring accuracy of the monitoring assembly 40.

[0066] For reference Figures 1-5 In an embodiment, the monitoring assembly 40 further comprises a blocking element 43, the blocking element 43 is arranged between the two adjacent reflecting elements 41, and the blocking element 43 is used to block the light beam emitted by the non-corresponding light chip 20 from being incident on the reflecting element 41.

[0067] Specifically, the blocking member 43 is capable of absorbing, or reflecting, or filtering the light beams, so that the light beams emitted by the non-corresponding light chip 20 are blocked from reaching the reflector 41. In other words, the material of the blocking member 43 includes but is not limited to the material capable of absorbing, or reflecting, or filtering the light beams of the preset wavelength. The light beams emitted by the non-corresponding light chip 20 refer to the light beams emitted by the light chip 20 which is not in direct correspondence with the reflector 41.

[0068] For example, the plurality of light chips 20 includes a first light chip 20 for emitting a first light beam, and a second light chip 20 for emitting a second light beam. The plurality of sub-light-transmitting portions 311 includes a first sub-light-transmitting portion 311 corresponding to the first light chip, and a second sub-light-transmitting portion 311 corresponding to the second light chip. The plurality of reflectors 41 includes a first reflector 41 for receiving and reflecting the first light beam, and a second reflector 41 for receiving and reflecting the second light beam. The plurality of monitoring devices 42 includes a first monitoring device 42 for receiving the first light beam and obtaining the light beam information of the first light beam, and a second monitoring device 42 for receiving the second light beam and obtaining the light beam information of the second light beam. The first reflector 41 is located between the first light chip 20 and the first sub-light-transmitting portion 311, and the second reflector 41 is located between the second light chip 20 and the second sub-light-transmitting portion 311. One blocking member 43 is located between the first reflector 41 and the second reflector 41, and the blocking member 43 is used for blocking the first light beam of the first light chip 20 from reaching the second reflector 41, and is also used for blocking the second light beam of the second light chip 20 from reaching the first reflector 41.

[0069] In summary, the embodiment sets the blocking member 43 between the adjacent reflectors 41 to avoid the light beams of the non-corresponding light chip 20 from reaching the reflector 41, thereby further avoiding the light beam information of the plurality of light chips 20 from interfering with each other, and further improving the monitoring accuracy of the monitoring assembly 40.

[0070] For reference Figures 1-5 In an embodiment, the monitoring assembly 40 further includes an electrically connected controller and a temperature sensor 44, the blocking member 43 is used for absorbing light, the temperature sensor 44 is used for obtaining the temperature information of the blocking member 43, and the controller is used for receiving the temperature information of the blocking member 43 and controlling the plurality of light chips 20.

[0071] The blocking member 43 will be heated after absorbing the light beams, the temperature of the blocking member 43 can indirectly reflect the temperature of the light chip 20, and the temperatures of the plurality of blocking members 43 can indirectly reflect the ambient temperature of the receiving space 11 in the shell 10.

[0072] Optionally, the temperature information of the plurality of barriers 43 is acquired, and if the difference between the maximum temperature and the minimum temperature of the plurality of barriers 43 is greater than or equal to a first preset value, the controller controls the two optical chips 20 adjacent to the barrier 43 with the maximum temperature to stop working. This setting can determine the optical chip 20 with a too high working temperature, and timely stop the optical chip 20 from working, thereby reducing the probability of damage to the optical chip 20 and improving the reliability of the optical device 1.

[0073] Optionally, the temperature information of the plurality of barriers 43 is acquired, and if the average temperature of all barriers 43 is greater than or equal to a second preset value, the controller controls all optical chips 20 to stop working. This setting can determine whether the optical chip 20 is working normally by judging whether the ambient temperature in the shell 10 is too high, thereby timely reducing the probability of damage to the optical chip 20 and improving the reliability of the optical device 1.

[0074] In summary, the present embodiment detects the temperature information of the barrier 43 through the temperature sensor 44, and cooperates with the controller to work, thereby timely processing various emergencies that may occur to the optical chip 20, reducing the probability of damage to the optical chip 20, and improving the reliability of the optical device 1.

[0075] Please refer to Figure 1 In an embodiment, the reflecting member 41 comprises a reflecting surface for reflecting the light beam, and the monitoring member 42 comprises a receiving surface for receiving the light beam, and the angle between the reflecting surface and the receiving surface is equal to 45°.

[0076] At this time, the light beam reflected by the reflecting surface to the receiving surface is perpendicular to the receiving surface. This mode is simple and convenient, and the light beam path is short, i.e., the light beam of the optical chip 20 can be transmitted to the receiving surface.

[0077] However, since the light beam is perpendicular to the receiving surface, there is a certain probability that the light beam is reflected from the receiving surface to the reflecting member 41, or even reflected to the optical chip 20 again, thereby damaging the optical chip 20.

[0078] Please refer to Figure 6 Preferably, the reflecting member 41 comprises a reflecting surface for reflecting the light beam, and the monitoring member 42 comprises a receiving surface for receiving the light beam, and the angle between the reflecting surface and the receiving surface is greater than or equal to 30° and less than 45°.

[0079] The angle between the reflecting surface and the receiving surface can be, for example, 30°, or 32.5°, or 35°, or 37.5°, or 40°, 42.5°, or 44.5°, etc.

[0080] In summary, this embodiment limits the angle between the reflecting surface and the receiving surface to greater than or equal to 30° and less than 45° to prevent the light beam from hitting the receiving surface perpendicularly, so that the light beam enters the receiving surface at an angle to prevent the light beam from being reflected back onto the reflector 41 and the optical chip 20. This not only reduces the probability of damage to the optical chip 20 and improves the reliability of the optical device 1, but also allows more light to be received by the receiving surface, thereby improving the monitoring accuracy of the monitoring component 40.

[0081] Please refer to this as well. Figures 1-5 In one embodiment, the distance between the optical chip 20 and the reflector 41 is a first distance, which is 250μm-350μm. The first distance is as follows: Figure 1 As shown in H1.

[0082] The first spacing can be specifically 250μm, 275μm, 300μm, 325μm, or 350μm, etc. This embodiment limits the first spacing to 250μm-350μm so that the reflector 41 can reflect enough light beam to the monitoring component 42, thereby ensuring that the monitoring component 42 can receive enough light beam and improving the monitoring accuracy of the monitoring component 40.

[0083] Optionally, the distance between the reflector 41 and the sub-transmitting portion 311 is a third distance, which is 50μm-150μm. The third distance is as follows: Figure 1 As shown in H3. The third spacing can be specifically 50μm, 75μm, 100μm, 125μm, or 150μm, etc. This embodiment limits the third spacing to 50μm-150μm to avoid interference between the reflector 41 and the sub-transmitter 311, while minimizing the spacing between components, thereby reducing the overall size of the optical device 1 and facilitating miniaturization of the optical device 1.

[0084] Please refer to this as well. Figures 1-5 In one embodiment, the distance between the optical chip 20 and the reflector 41 is a first distance, and the distance between the reflector 41 and the monitoring element 42 is a second distance, with the ratio of the first distance to the second distance being 1:(2-6). The first distance is as follows: Figure 1 As shown in H1, the second spacing is as follows Figure 1 As shown in H2.

[0085] The ratio between the first distance and the second distance can be, for example, 1:2, or 1:2.5, or 1:3, or 1:3.5, or 1:4, or 1:4.5, or 1:5, or 1:5.5, or 1:6, etc. Alternatively, the third distance is 600-1900 μm, and the third distance can be, for example, 600 μm, or 700 μm, or 800 μm, or 900 μm, or 1000 μm, or 1100 μm, or 1200 μm, or 1300 μm, or 1400 μm, or 1500 μm, or 1600 μm, or 1700 μm, or 1800 μm, or 1900 μm, etc.

[0086] If the second distance is too large, the distance between the monitoring component 42 and the reflecting component 41 is too far, the light loss received by the monitoring component 42 is too large, the monitoring component 42 cannot receive sufficient light beams, and thus the accuracy of the light beam information is reduced, and the monitoring accuracy of the monitoring assembly 40 is reduced. If the second distance is too small, the distance between the monitoring component 42 and the reflecting component 41 is too close, the monitoring component 42 is too close to the light collecting assembly and the light chip 20, the components are easily interfered with each other, and the optical device 1 is easily damaged.

[0087] Please refer to Figure 7 The Y axis of the change curve is the light loss rate received by the monitoring component 42, and the X axis is the change amount of the distance between the monitoring component 42 and the reflecting component 41. The X axis changes based on the distance between the monitoring component 42 and the reflecting component 41 being 1500 μm. For example, when the change amount of the distance between the monitoring component 42 and the reflecting component 41 in the X axis is 0.4 mm, the distance between the monitoring component 42 and the reflecting component 41 is 1500 μm+400 μm=1900 μm, and at this time, the light loss rate received by the monitoring component 42 in the Y axis is 40%. Therefore, from the change curve, it can be known that as the distance between the monitoring component 42 and the reflecting component 41 gradually increases, the light loss rate received by the monitoring component 42 gradually increases. The present embodiment limits the second distance to be less than or equal to 1900 μm, so as to ensure that the monitoring component 42 can receive sufficient light beams, and the monitoring accuracy of the monitoring assembly 40 is improved.

[0088] In summary, the present embodiment limits the ratio between the first distance and the second distance to be 1:(2-6), so as to reduce the light loss received by the monitoring component 42, ensure that the monitoring component 42 can receive sufficient light beams, improve the monitoring accuracy of the monitoring assembly 40, reduce the probability of interference between the components of the optical device 1, and improve the reliability of the optical device 1.

[0089] Please refer to Figures 1-8In an embodiment, the light collection assembly 30 further comprises a beam combining group 32 disposed on the side of the coupling lens 31 away from the plurality of light chips 20, the beam combining group 32 comprising a first light receiving portion 321, a first reflecting portion 322, and a second light receiving portion 323, the first light receiving portion 321 being disposed between one of the sub-transmissive portions 311 and the first reflecting portion 322, the second light receiving portion 323 being disposed corresponding to the other of the sub-transmissive portions 311.

[0090] The plurality of light chips 20 respectively emit first light beams and second light beams having different wavelengths; wherein the first light beams pass through one of the sub-transmissive portions 311 and are incident toward the first light receiving portion 321, the first light receiving portion 321 being configured to receive the first light beams and to cause the first light beams to be incident on the first reflecting portion 322, the first reflecting portion 322 being configured to reflect the first light beams to the second light receiving portion 323; the second light beams pass through the other of the sub-transmissive portions 311 and are incident toward the second light receiving portion 323, the second light receiving portion 323 being configured to receive the second light beams and to cause the second light beams and the first light beams to be incident on the output port 13, thereby combining the first light beams and the second light beams to form the emission light.

[0091] After passing through the coupling lens 31, the first light beams and the second light beams are in a parallel light state, and then the first light beams and the second light beams in the parallel light state are incident in the beam combining group 32. Optionally, the input port 12, the light chip 20, the coupling lens 31, the beam combining group 32, and the output port 13 are arranged along the axial direction of the housing 10.

[0092] The first light receiving portion 321 is configured to receive and transmit the first light beams, and to cause the first light beams to be incident on the first reflecting portion 322. The first reflecting portion 322 is configured to reflect the first light beams to the second light receiving portion 323. The second light receiving portion 323 is configured to receive and transmit the second light beams, and to receive and reflect the first light beams, and to cause the first light beams and the second light beams to be combined to form the emission light and to be incident on the output port 13. As shown in Figure 8 , the first light beams are as shown in B1 of Figure 8 . The second light beams are as shown in B2 of Figure 8 . The emission light is as shown in B5 of Figure 8 .

[0093] Optionally, the first light-in part 321 is arranged in parallel with the first reflecting part 322, and the second light-in part 323 is arranged in parallel with the first reflecting part 322. Optionally, the plurality of light chips 20 includes a first light chip 20 for emitting a first light beam, and a second light chip 20 for emitting a second light beam. The plurality of sub-light-transmitting parts 311 includes a first sub-light-transmitting part 311 corresponding to the first light chip 20, and a second sub-light-transmitting part 311 corresponding to the second light chip 20. The first sub-light-transmitting part 311 is located between the first light chip 20 and the first light-in part 321, and the first reflecting part 322 is located on a side of the first light-in part 321 away from the first sub-light-transmitting part 311. The second sub-light-transmitting part 311 is located between the second light chip 20 and the second light-in part 323.

[0094] In summary, in the present embodiment, the first light beam and the second light beam are combined into one emission light by the beam-combining group 32 cooperating with the coupling lens 31, the structure is optimized, the overall size of the optical device 1 is reduced, the optical path is simplified, the power loss of the light beam is reduced, and the transmission performance of the optical device 1 is improved.

[0095] For reference, Figures 1-7 , and Figure 9 , in another embodiment, the process of combining three light beams with different wavelengths into an optical path of an emission light is introduced. The beam-combining group 32 further includes a second reflecting part 324 and a third light-in part 325. The second reflecting part 324 is arranged on a side of the second light-in part 323 away from another sub-light-transmitting part 311, and the third light-in part 325 is arranged corresponding to the another sub-light-transmitting part 311. The plurality of light chips 20 further emits a third light beam with a different wavelength. When the first light beam and the second light beam are incident on the second light-in part 323, the second light-in part 323 is used to combine the first light beam and the second light beam and emit them to the second reflecting part 324, and the second reflecting part 324 reflects the first light beam and the second light beam to the third light-in part 325. Then, the third light-in part 325 receives the third light beam passing through the another sub-light-transmitting part 311, and the third light-in part 325 combines the first light beam, the second light beam, and the third light beam to form an emission light and emit it to the output port 13. As shown in Figure 9 , the first light beam is shown as B1 in Figure 9 , the second light beam is shown as B2 in Figure 9 , the third light beam is shown as B3 in Figure 9 , and the emission light is shown as B5 in Figure 9 .

[0096] Optionally, the second light-in part 323 is arranged in parallel with the second reflecting part 324, and the third light-in part 325 is arranged in parallel with the second reflecting part 324. Optionally, the plurality of light chips 20 includes a first light chip 20 for emitting a first light beam, a second light chip 20 for emitting a second light beam, and a third light chip 20 for emitting a third light beam. The plurality of sub-light-transmitting parts 311 includes a first sub-light-transmitting part 311 corresponding to the first light chip, a second sub-light-transmitting part 311 corresponding to the second light chip, and a third sub-light-transmitting part 311 corresponding to the third light chip. The first sub-light-transmitting part 311 is located between the first light chip 20 and the first light-in part 321, and the first reflecting part 322 is located on a side of the first light-in part 321 away from the first sub-light-transmitting part 311. The second sub-light-transmitting part 311 is located between the second light chip 20 and the second light-in part 323, and the second reflecting part 324 is located on a side of the second light-in part 323 away from the second sub-light-transmitting part 311. The third sub-light-transmitting part 311 is located between the third light chip 20 and the third light-in part 325.

[0097] By analogy, please refer to Figures 1-7 , and Figure 10 In yet another embodiment, a process of combining four light beams with different wavelengths to form a light path of an emitted light is introduced. The combining group 32 further includes a third reflecting part 326 and a fourth light-in part 327. The third reflecting part 326 is arranged on a side of the third light-in part 325 away from yet another sub-light-transmitting part 311, and the fourth light-in part 327 is arranged corresponding to yet another sub-light-transmitting part 311. The plurality of light chips 20 further emits a fourth light beam with a different wavelength. When the first light beam, the second light beam, and the third light beam are incident on the third light-in part 325, the third light-in part 325 is used to combine the first light beam, the second light beam, and the third light beam and emit them to the third reflecting part 326, and the third reflecting part 326 reflects the first light beam, the second light beam, and the third light beam to the fourth light-in part 327. Then, the fourth light-in part 327 receives the fourth light beam passing through yet another sub-light-transmitting part 311, and the fourth light-in part 327 combines the first light beam, the second light beam, the third light beam, and the fourth light beam to form an emitted light and emit it to the output port 13. As shown in Figure 10 , the first light beam is shown as B1 in Figure 10 . The second light beam is shown as B2 in Figure 10 . The third light beam is shown as B3 in Figure 10 . The fourth light beam is shown as B4 in Figure 10 . The emitted light is shown as B5 in Figure 10 .

[0098] Optionally, the third light inlet portion 325 is arranged in parallel with the third reflecting portion 326, and the fourth light inlet portion 327 is arranged in parallel with the third reflecting portion 326. Optionally, the plurality of light chips 20 includes a first light chip 20 for emitting a first light beam, a second light chip 20 for emitting a second light beam, a third light chip 20 for emitting a third light beam, and a fourth light chip 20 for emitting a fourth light beam. The plurality of sub-light-transmitting portions 311 includes a first sub-light-transmitting portion 311 corresponding to the first chip, a second sub-light-transmitting portion 311 corresponding to the second chip, a third sub-light-transmitting portion 311 corresponding to the third chip, and a fourth sub-light-transmitting portion 311 corresponding to the fourth chip. The first sub-light-transmitting portion 311 is located between the first light chip 20 and the first light inlet portion 321, and the first reflecting portion 322 is located on a side of the first light inlet portion 321 away from the first sub-light-transmitting portion 311. The second sub-light-transmitting portion 311 is located between the second light chip 20 and the second light inlet portion 323, and the second reflecting portion 324 is located on a side of the second light inlet portion 323 away from the second sub-light-transmitting portion 311. The third sub-light-transmitting portion 311 is located between the third light chip 20 and the third light inlet portion 325, and the third reflecting portion 326 is located on a side of the third light inlet portion 325 away from the third sub-light-transmitting portion 311. The fourth sub-light-transmitting portion 311 is located between the fourth light chip 20 and the fourth light inlet portion 327.

[0099] By analogy, the number and position of the light inlet portions, the number and position of the light emitting portions, the included angle between the light inlet portions and the horizontal plane, and the included angle between the light emitting portions and the horizontal plane can be adjusted according to the number of light beams of the emitted light and product requirements, so as to obtain one emitted light of the beam combination.

[0100] For reference Figures 8-10 In an embodiment, the beam combination group 32 further includes a fixing member 328, the fixing member 328 includes oppositely arranged first and second inner side walls 3281 and 3282, the first inner side wall 3281 is closer to the coupling lens 31 than the second inner side wall 3282, and the first and second inner side walls are both arranged obliquely, the first light inlet portion 321 and the second light inlet portion 323 are fixed to the first inner side wall 3281, and the first reflecting portion 322 is fixed to the second inner side wall 3282.

[0101] The fixing member 328 has a receiving space, the first light inlet portion 321, the first reflecting portion 322, and the second light inlet portion 323 are arranged on the cavity wall of the receiving space, and the cavity wall of the receiving space includes a first inner side wall 3281 and a second inner side wall 3282. Optionally, the first light inlet portion 321, the second light inlet portion 323, the third light inlet portion 325, and the fourth light inlet portion 327 are arranged on the first inner side wall 3281 in sequence and at intervals. The first reflecting portion 322, the second reflecting portion 324, and the third reflecting portion 326 are arranged on the second inner side wall 3282 in sequence and at intervals. The connection mode of the first light inlet portion 321, the first reflecting portion 322, and the second light inlet portion 323 with the fixing member 328 can be adhesive connection, buckle connection, threaded connection, etc., which is not limited in the embodiment. The connection mode of the fixing member 328 with the shell 10 can be adhesive connection, buckle connection, threaded connection, etc., which is not limited in the embodiment.

[0102] The first inner side wall 3281 is provided with a light inlet, the first light inlet portion 321 is arranged corresponding to the light inlet, and the second light inlet portion 323 is arranged corresponding to the light inlet. The light beam passing through the coupling lens 31 can be emitted to the first light inlet portion 321 from the light inlet, and the light beam passing through the coupling lens 31 can also be emitted to the second light inlet portion 323 from the light inlet. For example, the light inlet can be a through hole penetrating through the first inner side wall 3281, or a perspective window allowing the light beam to pass through. The second inner side wall 3282 is provided with a light outlet, the light outlet is arranged corresponding to the output port 13, and the light outlet is arranged corresponding to the second light inlet portion 323. The first light beam and the second light beam are combined to form the emission light emitted to the output port 13 from the light outlet. For example, the light outlet can be a through hole penetrating through the second inner side wall 3282, or a perspective window allowing the light beam to pass through. It should be noted that the light inlet and the light outlet are not shown in the Figure 8 .

[0103] The first inner side wall 3281 and the second inner side wall 3282 are arranged obliquely, in other words, the first inner side wall 3281 has a first included angle between the extension direction and the vertical direction, and the second inner side wall 3282 has a second included angle between the extension direction and the vertical direction. The shape of the fixing member 328 can also be approximately understood as a parallelogram or a near parallelogram. Optionally, the first included angle is equal to the second included angle, in other words, the oblique direction of the first inner side wall 3281 is the same as the oblique direction of the second inner side wall 3282. The vertical direction is the direction perpendicular to the horizontal plane.

[0104] In conclusion, in the embodiment, the plurality of light-in parts and the plurality of reflecting parts are arranged in the fixing part 328, which not only optimizes the structure, improves the integration performance of the optical device 1, reduces the number of parts to be assembled, and reduces the assembly difficulty of the optical device 1, but also reduces the overall size of the optical device 1, and provides more available space for other parts. In addition, by arranging the light-in part on the first inner side wall 3281 and the reflecting part on the second inner side wall 3282, the beam combination group 32 is obtained, which reduces the assembly difficulty of the beam combination group 32 and improves the yield of the optical device 1.

[0105] For reference Figures 8-10 In an embodiment, the first inner side wall 3281 has a first included angle between the extension direction and the vertical direction, and the second inner side wall 3282 has a second included angle between the extension direction and the vertical direction. The first included angle and the second included angle are both 3°-20°.

[0106] The vertical direction is a direction perpendicular to the horizontal plane. The first included angle and the second included angle are as shown by α in Figure 8 In an embodiment, the first included angle is equal to the second included angle. Alternatively, the first included angle is not equal to the second included angle. For example, the first included angle can be 3°, 5°, 8°, 10°, 12°, 15°, 18°, or 20°. The second included angle can be 3°, 5°, 8°, 10°, 12°, 15°, 18°, or 20°.

[0107] In conclusion, in the embodiment, the first included angle and the second included angle are limited, thereby limiting the inclination of the first inner side wall 3281 and the second inner side wall 3282, and limiting the inclination of the first light-in part 321, the first reflecting part 322, and the second reflecting part 324, so that the plurality of light beams in parallel light state are combined by the beam combination group 32 to form the emitted light.

[0108] For reference Figure 1 With Figure 3 In an embodiment, the optical device 1 further comprises a base 51 arranged in the accommodation space 11, and the plurality of optical chips 20 are fixed to the base 51. The plurality of optical chips 20 are arranged side by side and spaced apart.

[0109] The base 51 is fixed to the shell 10. The connection between the base 51 and the shell 10 can be adhesive connection, buckle connection, threaded connection, etc., which is not limited in the embodiment.

[0110] In summary, the embodiment fixes the light chip 20 by the base 51, thereby improving the connection performance between the light chip 20 and the shell 10, firmly fixing the light chip 20 in the shell 10, and improving the reliability of the optical device 1. Moreover, the embodiment also limits the arrangement of the light chip 20, which can make the propagation directions of the multiple light beams in parallel light state the same, reduce the difficulty of beam combination of the multiple light beams to form the emitted light, and reduce the probability of mutual interference between the multiple light beams, thereby further improving the reliability of the optical device 1.

[0111] For reference Figures 1-12 In an embodiment, the optical device 1 further comprises an optical fiber 52 and a receiving member 53 arranged on one side of the shell 10. The optical fiber 52 is used to receive the emitted light emitted by the output port 13, and the optical fiber 52 is also used to emit incident light. The receiving member 53 is used to receive the incident light.

[0112] The receiving member 53 can also be called a receiving chip. The receiving member 53 can receive light and convert the light into an electric current. For example, each receiving member 53 can receive a light beam of a certain wavelength. For another example, the receiving member 53 can receive multiple light beams of different wavelengths. For example, the wavelength of the light beam received by the receiving member 53 can be 1270 nm, or 1286 nm, or 1310 nm, etc. The optical path diagram of the emitted light B5 emitted by the output port 13 is shown in FIG. 5. Figure 11 The emitted light B6 emitted by the light ray is received by the receiving member 53. Figure 12 The optical path diagram of the incident light is shown in FIG. 6.

[0113] The number of receiving members 53 can be one or more. Optionally, the receiving member 53 can be a photoelectric chip, a photoelectric conversion structure, etc. Optionally, the optical fiber 52 is connected to the shell 10, for example, the optical fiber 52 is directly arranged on the shell 10, and for another example, the optical fiber 52 is connected to the shell 10 through other components. When the shell 10 is coupled to the optical fiber 52, the optical source signal transmission can be realized with other devices to achieve photoelectric conversion. Optionally, the receiving member 53 is closer to the shell 10 than the optical fiber 52. Optionally, the receiving member 53 and the optical fiber 52 are arranged on the same side of the shell 10. Optionally, the receiving member 53 and the optical fiber 52 are arranged in parallel and spaced apart.

[0114] In conclusion, the present embodiment achieves the receiving of the emitted light signal and the transmission of the incident light signal by arranging the optical fiber 52 and the receiving member 53, thereby simplifying the process of optical communication and greatly reducing the assembly cost and material cost.

[0115] For reference Figures 1-12 In an embodiment, the number of the receiving members 53 is multiple, and the multiple receiving members 53 are arranged between the output port 13 and the optical fiber 52 and are arranged in parallel and at intervals along the arrangement direction from the output port 13 to the optical fiber 52.

[0116] The multiple receiving members 53 are arranged in parallel and at intervals, and each receiving member 53 is used for receiving light beams of different wavelengths. For example, the number of the receiving members 53 is 2, or 3, or 4, or 5, or 6, etc. Alternatively, the number of the receiving members 53 is equal to the number of the optical chips 20.

[0117] In conclusion, the present embodiment optimizes the optical path by limiting the position and arrangement of the receiving member 53, thereby reducing the probability of mutual interference between the receiving members 53, reducing the power loss of the light beams, and improving the transmission performance of the optical device 1.

[0118] In addition, the optical fiber 52 can shoot the incident light to the multiple receiving members 53 in the manner of parallel light, thereby reducing the divergence phenomenon of the optical path, further reducing the power loss of the light beams, and further improving the transmission performance of the optical device 1.

[0119] For reference Figures 1-12 In an embodiment, the optical device 1 further comprises a light collecting member 54 arranged between the output port 13 and the optical fiber 52, the light collecting member 54 is used for receiving and collecting the emitted light, and the collected emitted light is shot to the optical fiber 52.

[0120] The light collecting member 54 is used for collecting the dispersed light. For example, the light collecting member 54 is a convex lens, a concave lens, etc. Alternatively, the output port 13, the light collecting member 54, and the optical fiber 52 are arranged in parallel and at intervals. Alternatively, the central axes of the output port 13, the light collecting member 54, and the optical fiber 52 coincide. Alternatively, the light collecting member 54 is arranged between the receiving member 53 and the optical fiber 52. For example, the receiving member 53, the light collecting member 54, and the optical fiber 52 are arranged in parallel and at intervals.

[0121] In conclusion, the present embodiment collects the emitted light by arranging the light collecting member 54, thereby improving the intensity of the light source signal, reducing the power loss of the light beams, and improving the transmission performance of the optical device 1.

[0122] For reference Figures 1-12In one embodiment, the optical device 1 further comprises an isolator 55 disposed between the output port 13 and the optical fiber 52, the isolator 55 is configured to block the light beams reflected by the light collection assembly 30 back to the plurality of optical chips 20.

[0123] The isolator 55 is configured to block the reflected light, thereby blocking the light beams reflected by the light collection assembly 30 back to the optical chips 20. The isolator 55 is also configured to transmit the emitted light, the emitted light emitted from the output port 13 passes through the isolator 55 and is emitted to the optical fiber 52. Optionally, the isolator 55 is disposed between the output port 13 and the receiving member 53. Optionally, the output port 13, the isolator 55, the receiving member 53, the light collection member 54, and the optical fiber 52 are arranged in parallel and are spaced apart. Optionally, the central axes of the output port 13, the isolator 55, the receiving member 53, the light collection member 54, and the optical fiber 52 are coincident.

[0124] In summary, by disposing the isolator 55, the present embodiment avoids the reflected light being reflected back to the optical chips 20, avoids the reflected light interfering with the optical chips 20, and protects the optical chips 20, thereby improving the reliability and accuracy of the optical device 1.

[0125] Unless otherwise defined or indicated, the terms or phrases used in the present application have the following meanings:

[0126] In the present application, “first”, “second”, and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as “first” and “second” can explicitly or implicitly include at least one of the features.

[0127] In the present application, “one or more” refers to any one, any two, or any two or more of the listed items. Among them, “several” refers to any two or more.

[0128] In the present application, it should be understood that the orientations or positional relationships indicated by the terms “center”, “longitudinal”, “transverse”, “length”, “width”, “thickness”, “upper”, “lower”, “front”, “rear”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, “clockwise”, “counterclockwise”, and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0129] In this application, unless otherwise clearly indicated and limited, the terms "mounting", "connection", "connecting", "fixed", and the like, should be interpreted broadly, for example, can be connected, can also be detachable connection, or integrated. Can be mechanical connection, can also be electrical connection. Can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship of two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0130] In this application, the phrase "embodiment" or "embodiments" means that the specific features, structures or characteristics described in connection with the embodiment can be included in at least one embodiment of the application. The appearance of the phrase in various places in the specification does not necessarily mean the same embodiment, nor is it an independent or alternative embodiment that is not mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in the embodiments of the present application can be combined with each other without contradiction, to form another embodiment without departing from the spirit and scope of the present application.

[0131] The above is part of the embodiments of the present application. It should be pointed out that for those skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, which are also considered within the scope of protection of the present application.

Claims

1. An optical device, characterized by The optical device comprises: a housing having a receiving space, the housing further having an input port and an output port communicating with the receiving space; a plurality of optical chips arranged in the receiving space, each of the optical chips being configured to emit light beams of different wavelengths, and each of the optical chips being connected to the input port; a light collecting assembly arranged in the receiving space and between the plurality of optical chips and the output port, the light collecting assembly being configured to receive the light beams emitted by the plurality of optical chips, make the light beams parallel, and then combine the light beams to form an emission light, the emission light being emitted from the output port; and a monitoring assembly arranged in the receiving space, the monitoring assembly comprising a reflecting element and a monitoring unit, the reflecting element being arranged between the plurality of optical chips and the light collecting assembly, and the monitoring unit being arranged in the housing, the reflecting element being configured to reflect the light beams emitted from the optical chips in a divergent state to the monitoring unit, and the monitoring unit being configured to receive the light beams from the reflecting element and obtain beam information of the light beams.

2. The optical device of claim 1, wherein, The light collecting assembly comprises a coupling lens arranged on one side of the plurality of optical chips, the coupling lens comprising a plurality of sub-translucent parts arranged side by side and spaced apart, one of the sub-translucent parts corresponding to one of the optical chips, and the sub-translucent part being configured to receive the light beams emitted by the optical chip and make the light beams parallel.

3. The optical device of claim 2, wherein, The number of the reflecting elements is the same as the number of the optical chips, and the number of the monitoring units is the same as the number of the optical chips, one of the reflecting elements being arranged between one of the optical chips and one of the sub-translucent parts, a plurality of the reflecting elements being arranged side by side and spaced apart, one of the monitoring units corresponding to one of the reflecting elements, and a plurality of the monitoring units being arranged side by side and spaced apart.

4. The optical device of claim 3, wherein, The monitoring assembly further comprises a blocking element arranged between two adjacent reflecting elements, the blocking element being configured to block the light beams emitted by the optical chips from being incident on the reflecting elements.

5. The optical device of claim 4, wherein, The monitoring assembly further comprises a controller and a temperature sensor electrically connected, the blocking element being configured to absorb light, the temperature sensor being configured to obtain temperature information of the blocking element, and the controller being configured to receive the temperature information of the blocking element and control the plurality of optical chips.

6. The optical device of claim 2, wherein, The reflecting element comprises a reflecting surface for reflecting the light beams, and the monitoring unit comprises a receiving surface for receiving the light beams, an included angle between the reflecting surface and the receiving surface being greater than or equal to 30° and less than 45°.

7. The optical device of claim 2, wherein, A distance between the optical chip and the reflecting element is a first distance, and the first distance is 250 μm-350 μm.

8. The optical device of claim 2, wherein, A distance between the optical chip and the reflecting element is a first distance, a distance between the reflecting element and the monitoring unit is a second distance, and a ratio between the first distance and the second distance is 1:(2-6).

9. The optical device of claim 2, wherein, The light collection assembly further comprises a beam combination group arranged on a side of the coupling lens away from the plurality of light chips, the beam combination group comprising a first light inlet portion, a first reflecting portion, and a second light inlet portion, the first light inlet portion being arranged between one of the sub-transmissive portions and the first reflecting portion, and the second light inlet portion being arranged corresponding to the other sub-transmissive portion; The plurality of light chips respectively emit first light beams and second light beams with different wavelengths, wherein the first light beams pass through one of the sub-transmissive portions and are incident towards the first light inlet portion, the first light inlet portion is configured to receive the first light beams and make the first light beams incident to the first reflecting portion, the first reflecting portion is configured to reflect the first light beams to the second light inlet portion; the second light beams pass through the other sub-transmissive portion and are incident towards the second light inlet portion, the second light inlet portion is configured to receive the second light beams and make the second light beams and the first light beams incident to the output port, so as to combine the first light beams and the second light beams to form the emission light.

10. The optical device of claim 9, wherein, The beam combination group further comprises a fixing member, the fixing member comprising a first inner side wall and a second inner side wall arranged oppositely, the first inner side wall being closer to the coupling lens than the second inner side wall, the first inner side wall and the second inner side wall being arranged obliquely, the first light inlet portion and the second light inlet portion being fixed to the first inner side wall, and the first reflecting portion being fixed to the second inner side wall.

11. The optical device of claim 10, wherein, The first inner side wall has a first included angle between an extension direction and a vertical direction, and the second inner side wall has a second included angle between an extension direction and a vertical direction, the first included angle and the second included angle being 3°-20°.

12. The optical device of claim 1, wherein, The optical device further comprises a base arranged in the accommodation space, the plurality of light chips being fixed to the base, and the plurality of light chips being arranged side by side and spaced apart.

13. The optical device of claim 1, wherein, The optical device further comprises an optical fiber and a receiving member arranged on a side of the shell, the optical fiber being configured to receive the emission light emitted by the output port, and the optical fiber being further configured to emit incident light, and the receiving member being configured to receive the incident light.

14. The optical device of claim 13, wherein the first and second waveguides are formed in the same layer of the substrate. The receiving member is in a plurality, the plurality of receiving members being arranged between the output port and the optical fiber, and the plurality of receiving members being arranged side by side and spaced apart along an arrangement direction from the output port to the optical fiber.

15. The optical device of claim 13, wherein the first and second waveguides are formed by a single etching step. The optical device further comprises a light collecting member arranged between the output port and the optical fiber, the light collecting member being configured to receive and collect the emission light, and further configured to make the collected emission light incident to the optical fiber.

16. The optical device of claim 13, wherein, The optical device further comprises an isolation member arranged between the output port and the optical fiber, the isolation member being configured to block light beams reflected to the plurality of light chips through the light collection assembly.

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