COF Internet of Things smart screen

Abstract

The utility model is applicable to the technical field of smart screens, and provides a COF Internet of Things smart screen, which comprises a smart screen main body, a debugging interface, a universal expansion interface, a smart screen interface, a USB interface, an RS458 interface, a screen backlight module, a flexible substrate, an FPC antenna, a wireless SOC chip and a cooling fin, compact design of the intelligent screen is achieved, the space utilization rate is improved, the wireless SOC chip is attached to the conductive circuit of the flexible substrate, use of connectors and wires is reduced, the risks of faults and contact problems are reduced, signal interference and data transmission errors caused by the connection problems are reduced, the cooling fins are additionally arranged at the bottom of the wireless SOC chip, and the cooling effect is improved. The cooling fin reinforces the wireless SOC chip and directly transmits heat generated by the wireless SOC chip into the screen backlight module, so that rapid heat dissipation of the wireless SOC chip is realized, the working temperature of the wireless SOC chip is reduced, and the performance of the wireless SOC chip is improved.

Description

Technical Field

[0001] This utility model belongs to the field of smart screen technology, and in particular relates to a COF Internet of Things smart screen. Background Technology

[0002] A smart screen is an intelligent display device that integrates a variety of advanced technologies and functions. It not only has the audio-visual playback functions of a traditional TV, but also integrates emerging technologies such as AI and IoT, becoming an important terminal for smart home interaction.

[0003] Traditional LCD screen driving technology typically uses COB (Chip-on-Board) technology, which mounts the IoT SOC onto the PCB. However, this mounting process has some limitations, and traditional smart screens and traditional COF smart screens usually require additional circuit boards and connectors to connect to the wireless SOC chip, which increases the overall size and weight of the smart screen.

[0004] Therefore, in view of the above situation, there is an urgent need to develop a COF IoT smart screen to overcome the shortcomings in current practical applications. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model embodiment is to provide a COF IoT smart screen to solve the problems in the background technology mentioned above.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A COF IoT smart screen includes a smart screen body. The back side of the smart screen body is sequentially provided with a debugging interface, a general expansion interface, a smart screen interface, a USB interface, an RS458 interface, and a screen backlight module. It also includes:

[0008] A flexible substrate is installed on the back side of the main body of the smart screen. An FPC antenna is connected to one side of the flexible substrate. The flexible substrate and the FPC antenna are connected as a whole in a vertical stacking manner. A conductor layer is provided on the flexible substrate. Conductive lines electrically connected to the debugging interface, the general expansion interface, the smart screen interface, the USB interface, the RS458 interface and the screen backlight module are provided in the conductor layer.

[0009] A wireless SOC chip is mounted on the conductive lines of a flexible substrate. A heat sink is installed on the bottom of the wireless SOC chip. The heat sink is in contact with the screen backlight module. The heat sink is used to reinforce the wireless SOC chip and directly transfer the heat generated by the wireless SOC chip to the screen backlight module.

[0010] As a further technical solution of this utility model, the heat sink is a heat dissipation steel sheet, which is used to reinforce the heat generated by the wireless SOC chip and conduct it to the screen backlight module.

[0011] As a further technical solution of this utility model, the flexible substrate and the FPC antenna are integrally formed, the connection between the FPC antenna and the flexible substrate is bent, and black foam adhesive is installed at the bent part of the FPC antenna and the flexible substrate. The black foam adhesive is used to fix the FPC antenna and other components and increase the distance between the wireless SOC chip and the FPC antenna.

[0012] As a further technical solution of this utility model, the flexible substrate is a flexible substrate with low electromagnetic radiation and sensitivity, and the conductive layer on the flexible substrate adopts thin film technology.

[0013] As a further technical solution of this utility model, the debugging interface is used for users to read the logs of the smart screen, modify configuration parameters and update firmware. The debugging interface is directly connected to the wireless SOC chip and processor.

[0014] The general expansion interface is used to connect the smart screen to external devices;

[0015] The smart screen interface is used to enable the smart screen to communicate with other smart devices and systems and supports multiple communication protocols and standards;

[0016] The USB interface is used to connect storage devices and USB devices;

[0017] The RS458 interface is used to connect remote control devices or sensors and enable reliable data transmission.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] The flexible substrate and FPC antenna are connected as a whole in a vertical stacking manner, which enables the compact design of the smart screen and improves the space utilization. The wireless SOC chip is mounted on the conductive lines of the flexible substrate, which reduces the use of connectors and wires, thereby reducing the risk of failure and contact problems, improving the reliability of the smart screen, reducing signal interference and data transmission errors caused by connection problems, and achieving a compact design of the smart screen. In contrast, traditional smart screens and traditional COF smart screens usually require additional circuit boards and connectors to connect to the wireless SOC chip, which only increases the overall size and weight of the smart screen.

[0020] A heat sink is installed on the bottom of the wireless SOC chip. The heat sink is in contact with the screen backlight module. The heat sink is used to reinforce the wireless SOC chip and can directly transfer the heat generated by the wireless SOC chip to the screen backlight module, thereby achieving rapid heat dissipation of the wireless SOC chip, reducing the operating temperature of the wireless SOC chip, improving the performance of the wireless SOC chip, enhancing the overall shock resistance and heat dissipation performance of the smart screen, and reducing manufacturing and maintenance costs.

[0021] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0022] Figure 1 The front view of the COF IoT smart screen provided in this embodiment of the utility model.

[0023] Figure 2 The rear view of the internal structure of the COF IoT smart screen provided in this embodiment of the utility model.

[0024] Figure 3 for Figure 2 A schematic diagram of the structure of a flexible substrate.

[0025] Figure 4 for Figure 3 A top-view front view of a flexible substrate structure.

[0026] Attached label: 100-Smart screen main body, 200-Debugging interface, 300-General expansion interface, 400-Smart screen interface, 500-USB interface, 600-RS458 interface, 700-Screen backlight module, 800-Flexible substrate, 810-FPC antenna, 820-Black foam adhesive, 900-Wireless SOC chip. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0028] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.

[0029] like Figures 1 to 4As shown, a COF IoT smart screen provided as an embodiment of this utility model includes a smart screen body 100. The back side of the smart screen body 100 is sequentially provided with a debugging interface 200, a general expansion interface 300, a smart screen interface 400, a USB interface 500, an RS458 interface 600, and a screen backlight module 700. It also includes:

[0030] A flexible substrate 800 is mounted on the back side of the smart screen body 100. An FPC antenna 810 is connected to one side of the flexible substrate 800. The flexible substrate 800 and the FPC antenna 810 are connected as a whole in a vertical stacking manner, which can realize the compact design of the smart screen and improve the space utilization. A conductor layer is provided on the flexible substrate 800. The conductor layer is provided with conductive lines that are electrically connected to the debugging interface 200, the general expansion interface 300, the smart screen interface 400, the USB interface 500, the RS458 interface 600 and the screen backlight module 700.

[0031] The wireless SOC chip 900 is mounted on the conductive lines of the flexible substrate 800. This reduces the use of connectors and wires, thereby lowering the risk of malfunctions and contact problems, improving the reliability of the smart screen, reducing signal interference and data transmission errors caused by connection issues, and enabling a compact design for the smart screen. In contrast, traditional smart screens and traditional COF smart screens typically require additional circuit boards and connectors to connect to the wireless SOC chip 900, which only increases the overall size and weight of the smart screen. A heat sink is added to the bottom of the wireless SOC chip 900, which is in contact with the screen backlight module 700. The heat sink reinforces the wireless SOC chip 900 and can directly transfer the heat generated by the wireless SOC chip 900 to the screen backlight module 700, achieving rapid heat dissipation of the wireless SOC chip 900, reducing its operating temperature, improving its performance, enhancing the overall shock resistance and heat dissipation performance of the smart screen, and reducing manufacturing and maintenance costs.

[0032] like Figures 2 to 4 As shown in the preferred embodiment of this utility model, the heat sink is preferably a heat-dissipating steel sheet. The steel sheet can reinforce the heat generated by the wireless SOC chip 900 and conduct it to the screen backlight module 700. The backlight module has a relatively large heat dissipation area, which can reduce the temperature of the wireless SOC chip 900 to a lower operating temperature. At a lower operating temperature, the wireless SOC chip 900 will have better radio frequency performance, that is, the quasi-frequency drift of the wireless SOC chip 900 can be reduced.

[0033] like Figures 2 to 4As shown, in a preferred embodiment of this utility model, the flexible substrate 800 and the FPC antenna 810 are integrally formed, and the connection between the FPC antenna 810 and the flexible substrate 800 is bent and formed, with black foam adhesive 820 installed at the bent part, realizing a vertically stacked structural design. The black foam adhesive 820 is used to fix the FPC antenna 810 and other components, ensuring the stability of the overall structure. At the same time, the black foam adhesive 820 can also increase the distance between the wireless SOC chip 900 and the FPC antenna 810, preventing interference between the wireless SOC chip 900 and the FPC antenna 810, ensuring that the wireless SOC chip 900 and the FPC antenna 810 can work effectively and efficiently, thereby ensuring the stability of the overall performance of the smart screen.

[0034] like Figure 2 and 4 As shown in the preferred embodiment of this utility model, the conductive layer on the flexible substrate 800 can be made using thin-film technology, which has lower transmission loss and better high-frequency characteristics. This enables the flexible substrate 800 to provide better signal transmission performance in radio frequency applications, including lower signal attenuation and higher signal quality. Furthermore, the flexible substrate 800 has lower electromagnetic radiation and sensitivity, which can provide better electromagnetic interference suppression capabilities. Radio frequency circuits usually need to consider signal integrity and anti-interference performance, while the low electromagnetic radiation characteristics of the flexible substrate 800 help reduce signal crosstalk and external interference, providing more reliable radio frequency performance, thereby further improving the overall stability of the smart screen performance.

[0035] like Figure 1 and Figure 2 As shown, in a preferred embodiment of this utility model, the debugging interface 200 is used for users to read the smart screen's logs, modify configuration parameters, and update firmware, etc., to ensure the stability and performance of the product. The debugging interface 200 is usually directly connected to the wireless SOC chip 900 or the processor for efficient data transmission and control.

[0036] The general expansion interface 300 is used to connect the smart screen to external devices, enhancing the smart screen's external connectivity. The general expansion interface 300 may be connected to multiple external device interfaces to form an expansion network to meet different connection needs.

[0037] The smart screen interface 400 is used for the smart screen to communicate with other smart devices or systems, supports multiple communication protocols and standards, and ensures that the smart screen can be seamlessly integrated into the smart home ecosystem. The smart screen interface 400 may be connected to a wireless communication module (such as Wi-Fi or Bluetooth) to enable wireless communication with other smart devices.

[0038] The USB interface 500 is used to connect storage devices such as USB flash drives or external hard drives, making it convenient for users to transfer data. It also supports connecting other USB devices, such as keyboards and mice, to enhance the user's interactive experience.

[0039] The RS458 interface 600 is used to connect remote control devices or sensors to achieve reliable data transmission.

[0040] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A COF IoT smart screen, comprising a smart screen body, wherein a debugging interface, a general expansion interface, a smart screen interface, a USB interface, an RS458 interface, and a screen backlight module are sequentially arranged on the back side of the smart screen body, characterized in that, Also includes: A flexible substrate is installed on the back side of the main body of the smart screen. An FPC antenna is connected to one side of the flexible substrate. The flexible substrate and the FPC antenna are connected as a whole in a vertical stacking manner. A conductor layer is provided on the flexible substrate. Conductive lines electrically connected to the debugging interface, the general expansion interface, the smart screen interface, the USB interface, the RS458 interface and the screen backlight module are provided in the conductor layer. A wireless SOC chip is mounted on the conductive lines of a flexible substrate. A heat sink is installed on the bottom of the wireless SOC chip. The heat sink is in contact with the screen backlight module. The heat sink is used to reinforce the wireless SOC chip and directly transfer the heat generated by the wireless SOC chip to the screen backlight module.

2. The COF IoT smart screen according to claim 1, characterized in that, The heat sink is made of a heat-dissipating steel sheet, which is used to reinforce the heat generated by the wireless SOC chip and conduct it to the screen backlight module.

3. The COF IoT smart screen according to claim 1, characterized in that, The flexible substrate and the FPC antenna are integrally formed. The connection between the FPC antenna and the flexible substrate is bent and formed. Black foam adhesive is installed at the bent part of the FPC antenna and the flexible substrate. The black foam adhesive is used to fix the FPC antenna and other components and increase the distance between the wireless SOC chip and the FPC antenna.

4. The COF IoT smart screen according to claim 3, characterized in that, The flexible substrate is a flexible substrate with low electromagnetic radiation and sensitivity, and the conductive layer on the flexible substrate adopts thin film technology.

5. The COF IoT smart screen according to claim 1, characterized in that, The debugging interface is used for users to read the smart screen's logs, modify configuration parameters, and update firmware. The debugging interface is directly connected to the wireless SOC chip and processor. The general expansion interface is used to connect the smart screen to external devices; The smart screen interface is used to enable the smart screen to communicate with other smart devices and systems and supports multiple communication protocols and standards; The USB interface is used to connect storage devices and USB devices; The RS458 interface is used to connect remote control devices or sensors and enable reliable data transmission.

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