Battery and electric equipment
By setting a first mold and a second mold in the battery, the sealing and curing problems in battery manufacturing are solved by injecting the colloid in stages, which achieves full solidification and sealing effect of the colloid and improves the connection stability of the battery.
Patent Information
- Application Number
- CN202423318559.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2034-12-31
AI Technical Summary
In the existing technology, during the battery manufacturing process, the glue near the center of the filling space cannot fully solidify, resulting in poor sealing and fixation. Furthermore, injecting a large amount of glue at one time can easily generate air bubbles, affecting the sealing performance.
A first and second mold are set around the sampling socket to form first and second accommodating spaces. The colloid is poured in stages to ensure that the colloid in each accommodating space is fully cured and to avoid the generation of air bubbles.
Ensure that the colloid in each containment space can fully cure, improve sealing and structural strength, avoid the influence of air bubbles, and enhance the connection stability between the circuit board and the sampling socket.
Smart Images

Figure CN223785168U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to new energy technology field, specifically, relate to a kind of battery and electric equipment. BACKGROUND
[0002] In the battery manufacturing process, often need to inject colloid to multiple parts of battery, to achieve insulation, sealing or fixing effect.
[0003] For example, at the position where circuit board is connected with sampling socket, in order to improve the stability between sampling socket and circuit board and prevent water vapor from entering the connection position, etc., it is necessary to inject sealant around the sampling socket. But in the prior art, the volume of the glue injection space at this position is large, a large amount of glue needs to be injected at one time, which causes the glue in the glue injection space near the center position to be unable to fully solidify, which is not conducive to the sealing and fixing between the circuit board and the sampling socket, and a large amount of glue injected at one time will cause bubbles in the glue, affecting the final sealing performance. SUMMARY
[0004] To solve the above problems, the purpose of the utility model is to provide a kind of battery and electric equipment.
[0005] On the one hand, the utility model provides a kind of battery, the battery includes:
[0006] Battery cell group;
[0007] Circuit board located above the battery cell group, the surface of the circuit board away from the battery cell group is provided with a sampling socket, and the sampling socket is electrically connected with the circuit board;
[0008] First mold cover, surrounding the outer side of the sampling socket, and forming a first accommodation space around the sampling socket;
[0009] Cover, covering the circuit board, the side of the cover away from the circuit board is provided with a second mold cover, the cover is provided with a through hole at the position corresponding to the second mold cover, the first mold cover and the sampling socket extend to the side of the cover away from the circuit board through the through hole, the second mold cover surrounds the outer side of the first mold cover, and the first mold cover and the second mold cover form a second accommodation space;
[0010] The first accommodation space and the second accommodation space are filled with glue.
[0011] As an optional implementation, one end of the first mold cover close to the circuit board is bonded to the circuit board, and the end of the first mold cover away from the circuit board extends towards the direction away from the circuit board and beyond the sampling socket.
[0012] As an optional implementation, the gap between the inner side wall of the first mold sleeve and the outer side wall of the sampling socket gradually decreases from bottom to top along the height direction of the first mold sleeve.
[0013] As an optional implementation, the length of the first mold sleeve is a, the width of the first mold sleeve is b, and the height of the first mold sleeve is c, and the first mold sleeve satisfies:
[0014] 71mm≤a≤76mm, and / or
[0015] 25mm≤b≤30mm, and / or
[0016] 15mm≤c≤20mm.
[0017] As an optional implementation, the side of the first mold sleeve facing the sampling socket is provided with a plurality of limiting structures, and the plurality of limiting structures are uniformly arranged around the sampling socket.
[0018] As an optional implementation, the plurality of limiting structures are plate bodies extending towards the direction close to the sampling socket, one end of the plate body is fixedly connected with the first mold sleeve, and the other end opposite to the one end abuts against the sampling socket.
[0019] As an optional implementation, at least one corner of the first mold sleeve is provided with a chamfer; and / or, at least one corner of the second mold sleeve is provided with a chamfer.
[0020] As an optional implementation, the second mold sleeve is integrally formed with the cover body, and the end of the second mold sleeve away from the cover body exceeds the end of the first mold sleeve away from the circuit board.
[0021] As an optional implementation, a plurality of reinforcing ribs are arranged between the outer side wall of the second mold sleeve and the cover body, and the plurality of reinforcing ribs are arranged around the second mold sleeve.
[0022] In another aspect, the utility model also provides a kind of electric equipment, including battery as described above.
[0023] The utility model has the beneficial effects that: by being provided with first mold sleeve and second mold sleeve around sampling socket, first accommodating space is formed between first mold sleeve and sampling socket, and second accommodating space is formed between first mold sleeve and second mold sleeve, can be sealed by filling glue to first accommodating space and second accommodating space in turns, so that it can be ensured that colloid in each accommodating space can be fully solidified, avoid the problem that a large amount of liquid glue is filled at one time, so that its internal portion cannot be fully solidified.In addition, it can also avoid that bubble is generated in colloid, influence final sealing and structural strength of colloid after solidification. BRIEF DESCRIPTION OF DRAWINGS
[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.
[0025] Figure 1 It is a structural schematic view of an exemplary cover assembly.
[0026] Figure 2 It is Figure 1 It is an exploded view of the cover assembly shown.
[0027] Figure 3 It is Figure 1 It is a top view of the cover assembly.
[0028] Figure 4 It is Figure 3 It is an enlarged view of A in the cover assembly.
[0029] In the drawings,
[0030] 10, cover; 11, second mold sleeve; 12, reinforcing rib; 20, first mold sleeve; 21, limiting structure; 30, sampling socket; 40, circuit board; 50, first accommodating space; 60, second accommodating space; 70, battery cell group. DETAILED DESCRIPTION
[0031] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0032] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications will also change accordingly.
[0033] Furthermore, the terminology used in the description of this utility model is for illustrative purposes only and is not intended to limit the scope of this utility model. The terms "comprising" and / or "including" are used to specify the presence of the said elements, steps, operations, and / or components, but do not exclude the presence or addition of one or more other elements, steps, operations, and / or components. The terms "first," "second," etc., may be used to describe various elements, do not represent an order, and do not limit these elements. In addition, in the description of this utility model, unless otherwise stated, "a plurality of" means two or more. These terms are used only to distinguish one element from another. These and / or other aspects become apparent in conjunction with the following drawings, and those skilled in the art will more readily understand the description of the embodiments of this utility model. The drawings are used for illustrative purposes only to depict the embodiments of this utility model. Those skilled in the art will readily recognize from the following description that alternative embodiments of the structures and methods shown in this utility model can be employed without departing from the principles of this utility model.
[0034] For ease of understanding, in the accompanying drawings of this application, the X-axis is the length direction of the battery, that is, the width direction of the first mold and the second mold; the Y-axis is the thickness direction of the battery, that is, the length direction of the first mold and the second mold; and the Z-axis is the width direction of the battery, that is, the height direction of the first mold and the second mold.
[0035] The present invention discloses a battery comprising a cover 10, a first mold 20, a sampling socket 30, a circuit board 40, and a battery cell assembly 70.
[0036] by Figures 1 to 4 Let's take an example to illustrate:
[0037] like Figure 1 As shown, along the width direction of the battery, the cover 10, circuit board 40, and cell assembly 70 are arranged sequentially from top to bottom. The sampling socket 30 is located on the circuit board 40, and the first mold sleeve 20 surrounds the outside of the sampling socket 30. The individual components will be described separately below:
[0038] like Figure 1 and Figure 2 As shown, a second mold 11 is provided on the surface of the cover 10 facing away from the circuit board 40. For example, the second mold 11 is located on the upper surface of the cover 10. The second mold 11 is, for example, an "annular" shape with openings at both ends, so that the first mold 20 and the sampling socket 30 can pass through the interior of the second mold 11. The second mold 11 and the cover 10 can be integrally injection molded. The end of the second mold 11 away from the cover 10 extends upward along the width direction of the battery by a certain distance, so that the second mold 11 has a certain height, which facilitates the formation of a potting and accommodating space within the interior space enclosed by the second mold 11, thereby providing a sealing and protective function for the sampling socket 30.
[0039] It can be understood that the position of the cover 10 corresponding to the area surrounded by the second die sleeve 11 is provided as a through hole, on the one hand, the first die sleeve 20 and the sampling socket 30 can extend through the cover 10 into the first die sleeve 11; on the other hand, the area surrounded by the second die sleeve 11 can be in communication with the internal space of the cover 10, and the gel can be poured into the cover 10 from the upper end of the second die sleeve 11, so as to seal or fix the circuit board 40 and the like.
[0040] Continuing to refer to Figure 1 and Figure 2 , the first die sleeve 20 can also be injection molded, and the size and shape thereof can be determined according to the size and shape of the sampling socket 30. The first die sleeve 20 is also provided as a "ring" with two open ends, so that the sampling socket 30 can pass through the opening at the lower end thereof to extend into the space surrounded thereby. Specifically, one end of the first die sleeve 20 close to the circuit board 40 is fixed on the circuit board 40, and the other end of the first die sleeve 20 passes through the cover 10 to extend into the space formed by the second die sleeve 11. For example, the lower end of the first die sleeve 20 is fixed on the upper surface of the circuit board 40, and the upper end of the first die sleeve 20 extends into the space formed by the second die sleeve 11.
[0041] Thus, as shown in Figure 4 , the space surrounded by the first die sleeve 20 around the sampling socket 30 forms a first accommodating space 50, and the first accommodating space 50 is a space sealed at the lower end and open at the upper end, so as to pour the gel into the space surrounded by the first die sleeve 20 from the opening, and seal the connection position between the sampling socket 30 and the circuit board 40. At the same time, the space between the outer side of the first die sleeve 20 and the second die sleeve 11 forms a second accommodating space 60, and the first accommodating space 60 is in communication with the space in the cover 10 through the lower end thereof, and the gel can be poured into the first accommodating space 60 and the space in the cover 10 through the upper end of the first accommodating space 60, so as to seal, fix or protect the sampling socket 30 and the circuit board 40.
[0042] It can be understood that the larger glue filling space formed by the second mold sleeve 11 is divided into two parts, i.e., the first accommodating space 50 and the second accommodating space 60, by extending the first mold sleeve 20 into the space enclosed by the second mold sleeve 11. Not only the volume of each accommodating space is small, but also the glue can be filled in two times. In this way, the amount of glue filled in each accommodating space is small, so that the glue in each accommodating space can be fully solidified, and the solidification speed is also improved. Moreover, the first accommodating space 50 and the second accommodating space 60 can be filled with glue in two times according to the needs. For example, the glue can be filled in the second accommodating space 60 after the glue in the first accommodating space 50 is fully solidified, or vice versa. In addition, the amount of glue filled each time is small, which can avoid the generation of a large number of bubbles in the glue to affect the sealing performance.
[0043] Again to Figure 2 , the sampling socket 30 is arranged on the side of the circuit board 40 away from the battery cell group 70, for example, the sampling socket 30 is located on the upper surface of the circuit board 40. The sampling socket 30 can be welded with the circuit board 40 through the pins at the lower end of the sampling socket 30, so as to be fixedly connected and electrically connected with the circuit board 40. The sampling socket 30 extends upward along the width direction of the battery for a certain distance, so that the sampling socket 30 can be located in the first accommodating space 50, and the glue in the first accommodating space 50 can seal or protect the sampling socket 30.
[0044] Continuing to refer to Figure 2 As described above, the circuit board 40 is located between the cover 10 and the battery cell group 70. On the one hand, it can facilitate the signal connection between the circuit board 40 and the battery cell group 70, so as to collect the information such as current, voltage or temperature of the battery cell group 70. On the other hand, it can facilitate the connection of the sampling socket 30 located on the upper surface of the circuit board 40 with the external circuit. It can be understood that the battery cell group 70 includes a plurality of battery cells stacked along the length direction of the battery, and the circuit board 40 can be connected with the tabs of the battery cells respectively, so as to collect the information such as current, voltage or temperature of the corresponding battery cell through the tabs.
[0045] In an optional embodiment, the end of the first mold sleeve close to the circuit board is bonded with the circuit board, and the end of the first mold sleeve away from the circuit board extends toward the direction away from the circuit board and beyond the sampling socket.
[0046] The end of the first mold sleeve 20 close to the circuit board 40 is, for example, the lower end of the first mold sleeve 20 in the width direction of the battery, and the end of the first mold sleeve 20 away from the circuit board 40 is, for example, the upper end of the first mold sleeve 20 in the width direction of the battery. That is, the lower end of the first mold sleeve 20 is fixed on the upper surface of the circuit board 40 by bonding, for example, the lower end of the first mold sleeve 20 can be bonded and fixed with the circuit board 40 by double-sided adhesive. In use, the fixation between the first mold sleeve 20 and the circuit board 40 can also be achieved by other bonding methods, which are not limited in the present application.
[0047] The upper end of the first sleeve 20 is directed away from the circuit board 40 and beyond the sampling socket 30. It can be understood that, along the width direction of the battery, the height of the first sleeve 20 is higher than the height of the sampling socket 30, so that a sufficient amount of glue can be injected into the first accommodating space 50, and the part of the glue can completely seal the sampling socket 30, and play a better sealing, insulation and protection effect on the sampling socket 30.
[0048] Further, along the height direction of the first sleeve, the gap between the inner side wall of the first sleeve and the outer side wall of the sampling socket gradually decreases from bottom to top.
[0049] It can be understood that, as shown in Figure 2 The side wall of the first sleeve 20 is inclined towards the direction close to the sampling socket 30. That is, along the width direction of the battery or the height direction of the first sleeve 20, the cross-sectional area of the first accommodating space 50 gradually decreases from bottom to top. Therefore, the side wall of the first sleeve 20 can exert a downward component force on the glue in the first accommodating space 50, that is, a certain pressure is exerted on the part of the glue, so that the part of the glue is more stable after solidification, so as to improve the sealing effect on the sampling socket 30.
[0050] Preferably, the inclination angle of the side wall of the first sleeve 20 is, for example, 2° to 3°. On the basis of the above-mentioned effect, it can also ensure that the first accommodating space 50 can accommodate a sufficient amount of glue, and ensure the sealing effect on the sampling socket 30.
[0051] In an alternative embodiment, the length of the first sleeve is a, the width of the first sleeve is b, and the height of the first sleeve is c, and the first sleeve satisfies: 71mm≤a≤76mm, and / or 25mm≤b≤30mm, and / or 15mm≤c≤20mm.
[0052] Referring to Figure 2 and Figure 4 , the distance of the first sleeve 20 parallel to the X axis is the width b of the first sleeve 20; the distance of the second sleeve 20 parallel to the Y axis is the length a of the second sleeve 20; and the distance of the first sleeve 20 parallel to the Z axis is the height c of the first sleeve 20. The first sleeve 20 satisfying the above range can ensure that a sufficient amount of glue is injected into the first accommodating space 50, so as to ensure the sealing effect on the sampling socket 30; at the same time, the amount of glue in the first accommodating space 50 is not too large, which affects the solidification effect of the glue.
[0053] Optionally, the length of the first mold sleeve 20 is for example 72mm, 73mm, 74mm or 75mm, etc.; the width of the second mold sleeve 20 is for example 26mm, 27mm, 28mm or 29mm, etc.; and the height of the second mold sleeve 20 is for example 16mm, 17mm, 18mm or 19mm, etc. In use, the length, width or height of the first mold sleeve 20 can be adjusted only from adaptability according to the size of the sampling socket 30, and is not limited to the above-mentioned range or size, and the size of the first mold sleeve 20 is not specifically limited in the present application.
[0054] In an optional embodiment, the side of the first mold sleeve facing the sampling socket is provided with a plurality of limiting structures, and the plurality of limiting structures are uniformly arranged around the sampling socket.
[0055] Referring to Figure 3 and Figure 4 , the side of the first mold sleeve 20 facing the sampling socket 30 can be understood as the inner side of the first mold sleeve 20. That is, a plurality of limiting structures 21 are arranged on the inner side of the first mold sleeve 20, and the plurality of limiting structures 21 are uniformly arranged on the inner side of the first mold sleeve 20 around the sampling socket 30. In this way, during the process of bonding the first mold sleeve 20 to the circuit board 40, the placement position of the first mold sleeve 20 can be easily determined through the uniformly arranged plurality of limiting structures 21, and the gap between the first mold sleeve 20 and the sampling socket 30 at each position is equal or close. Further, when pouring the gel into the first accommodating space 50, it can also be ensured that the gel can be uniformly distributed at each position of the sampling socket 30, and each position of the sampling socket 30 can be sealed by the gel.
[0056] Further, the limiting structure 21 is for example a rectangular plate, for example, the first mold sleeve 20 can be limited by the two opposite sides. It can be understood that the rectangular plate is fixedly connected to the inner wall of the first mold sleeve 20 through one of the two opposite sides, and abuts against the outer side wall of the sampling socket 30 through the other side. In this way, the distance between the two opposite sides of the rectangular plate is the installation distance defined by the first mold sleeve 20 and the sampling socket 30, which further determines the placement position of the first mold sleeve 20 on the circuit board 40, and improves the assembly efficiency.
[0057] It should be noted that the limiting structure 21 can also be selected as other structures, for example, a triangular plate, a trapezoidal plate, a wedge-shaped plate or a column, etc. The structure of the limiting structure 21 is not specifically limited in the present application.
[0058] In an optional embodiment, at least one corner of the first mold sleeve is chamfered; and / or, at least one corner of the second mold sleeve is chamfered.
[0059] Continuing to refer to Figure 3And Figure 4 The first sleeve 20 is for example provided in a shape of an approximate rectangle "ring" to surround the outside of the sampling socket 30. Thus, the first accommodating space 50 is an approximate rectangular accommodating space with four corner positions. At least one of the four corner positions of the first sleeve 20 is provided with an arc-shaped chamfer, which can improve the flow rate of the glue at the corner position of the first accommodating space 50, so that the glue can fill the corner position, avoiding the formation of a hole at the corner position of the first accommodating space 50, affecting the sealing effect. Preferably, the four corner positions of the first sleeve 20 are all provided with arc-shaped chamfers.
[0060] It should be noted that when the sampling socket 30 is provided with multiple sampling sockets 30, and the lengths of the multiple sampling sockets 30 are not equal, the first sleeve 20 will also form a corner position at the position between the two sampling sockets 30 with unequal lengths. The corner position at this position is also provided with an arc-shaped chamfer, which can also make the glue fill the corner position, so as to avoid the formation of a hole at this position, so that all the sampling sockets 30 can be fully sealed.
[0061] Based on the same principle, the second sleeve 11 has the same or similar shape as the first sleeve 20. The arc-shaped chamfer is also provided at the corresponding corner position of the second sleeve 11 to avoid the formation of a hole at the corner position of the second sleeve 11. For details, please refer to the related description of the first sleeve 20, which will not be repeated here.
[0062] In an optional embodiment, the second sleeve is integrally formed with the cover body, and the end of the second sleeve away from the cover body exceeds the end of the first sleeve away from the circuit board.
[0063] As shown in Figure 1 , the end of the second sleeve 11 away from the cover body 10 is for example the upper end of the second sleeve 11 in the height direction, that is, the upper end of the second sleeve 11 extends upward by a certain height, so that the height of the second sleeve 11 is greater than the height of the first sleeve 20. In this way, the height of the glue in the second accommodating space 60 is greater than the height in the first accommodating space 50, which not only can improve the strength and sealing effect of the glue in the first accommodating space 50, but also can avoid the glue in the first accommodating space 50 overflowing from the upper end of the first accommodating space 50 when the glue is first poured into the second accommodating space 60 and then poured into the first accommodating space 50.
[0064] In an optional embodiment, a plurality of reinforcing ribs are arranged between the outer side wall of the second sleeve and the cover body, and the plurality of reinforcing ribs surround the second sleeve.
[0065] As shown in Figure 1As shown in the drawings, a plurality of reinforcing ribs 12 are arranged between the outer side surface of the second bushing 11 and the upper surface of the cover body 10, and the plurality of reinforcing ribs 12 are arranged around the outer periphery of the second bushing 11. Thus, deformation of the second bushing 11 due to temperature reduction during injection molding of the second bushing 11 and the cover body 10 is avoided.
[0066] Still taking the second bushing 11 as a rectangular "ring" as an example, the plurality of reinforcing ribs 12 can be arranged along the long edges of the second bushing 11. In this way, even if the long edges of the second bushing 11 are large, shrinkage and deformation after injection molding will not occur.
[0067] Optionally, the reinforcing ribs 12 are in the shape of a triangle, a wedge, or a right-angled trapezoid, etc. In use, the shape of the reinforcing ribs 12 can be adaptively selected according to the processing technology, which is not limited in the present application.
[0068] The present embodiment also provides a power consumption device including the battery as described above, and the power consumption device is provided with electric energy by the battery. The power consumption device is, for example, a drone, a remote control handle, or a new energy vehicle, etc.
[0069] In the specification provided herein, a large number of specific details are described. However, it can be understood that the embodiments of the present application can be practiced without these specific details. In some examples, well-known methods, structures, and techniques are not described in detail in order not to obscure the understanding of the present specification.
[0070] In addition, those skilled in the art can understand that although some embodiments described herein include certain features included in other embodiments but not others, the combination of features of different embodiments means that it is within the scope of the present application and forms different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.
[0071] Those skilled in the art will understand that although the present application has been described with reference to exemplary embodiments, various changes and substitutions can be made without departing from the scope of the present application, and elements thereof can be replaced with equivalents. In addition, many modifications can be made to adapt a particular situation or material to the teachings of the present application without departing from the essential scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed, but the present application will include all embodiments falling within the scope of the appended claims.
Claims
1. A battery, characterized in that, include: Battery cell assembly; A circuit board is located above the battery cell assembly. A sampling socket is provided on the surface of the circuit board facing away from the battery cell assembly, and the sampling socket is electrically connected to the circuit board. A first mold sleeve surrounds the outside of the sampling socket and forms a first accommodating space around the sampling socket; A cover body covers the circuit board. A second mold sleeve is provided on the side of the cover body facing away from the circuit board. A through hole is provided on the cover body corresponding to the position of the second mold sleeve. The first mold sleeve and the sampling socket extend to the side of the cover body facing away from the circuit board through the through hole. The second mold sleeve surrounds the outside of the first mold sleeve. A second accommodating space is formed between the first mold sleeve and the second mold sleeve. The first accommodating space and the second accommodating space are filled with colloid.
2. The battery as described in claim 1, characterized in that, The first mold sleeve is bonded to the circuit board at one end near the circuit board, and the first mold sleeve extends beyond the circuit board at the other end away from the circuit board and beyond the sampling socket.
3. The battery as described in claim 1, characterized in that, Along the height direction of the first mold sleeve, the gap between the inner wall of the first mold sleeve and the outer wall of the sampling socket gradually decreases from bottom to top.
4. The battery as described in claim 1, characterized in that, The length of the first mold sleeve is 'a', the width of the first mold sleeve is 'b', and the height of the first mold sleeve is 'c'. The first mold sleeve satisfies the following: 71mm≤a≤76mm, and / or 25mm≤b≤30mm, and / or 15mm≤c≤20mm.
5. The battery as described in claim 1, characterized in that, The first mold sleeve has multiple limiting structures on the side facing the sampling socket, and the multiple limiting structures are evenly arranged around the sampling socket.
6. The battery as described in claim 5, characterized in that, The plurality of limiting structures are plates extending toward the sampling socket. One end of the plate is fixedly connected to the first mold sleeve, and the other end, which is opposite to the first end, abuts against the sampling socket.
7. The battery as claimed in claim 1, characterized in that, At least one corner of the first mold sleeve is chamfered; and / or, At least one corner of the second mold is chamfered.
8. The battery as described in claim 2, characterized in that, The second mold is integrally formed with the cover, and the end of the second mold away from the cover extends beyond the end of the first mold away from the circuit board.
9. The battery as claimed in claim 8, characterized in that, A plurality of reinforcing ribs are provided between the outer wall of the second mold and the cover, and the plurality of reinforcing ribs are arranged around the second mold.
10. An electrical appliance, characterized in that, Includes the battery as described in any one of claims 1-9.