Heat dissipation iron core

Abstract

The utility model belongs to the technical field of motors, and particularly relates to a heat dissipation iron core which comprises a plurality of chip frame bodies which are stacked to form an iron core structure. And the heat dissipation assembly is arranged among the plurality of chip rack bodies and extends to the outer sides of the chip rack bodies.

Description

Technical Field

[0001] This utility model belongs to the field of motor technology, and in particular relates to a heat dissipation iron core. Background Technology

[0002] The stator is the stationary part of an electric motor or generator. It consists of three parts: the stator core, the stator windings, and the frame. The stator is used to generate a rotating magnetic field.

[0003] Existing stators are generally made of multiple stator cores stacked and fixed together, which makes them prone to overheating during long-term use, thus affecting the normal use of the stator. Therefore, we have specially designed a heat-dissipating core. Utility Model Content

[0004] The purpose of this invention is to address the aforementioned technical problems by providing a heat-dissipating iron core that achieves good heat dissipation.

[0005] In view of this, the present invention provides a heat dissipation core, comprising:

[0006] Chip frame, multiple chip frames are stacked and arranged to form an iron core structure;

[0007] The heat dissipation assembly is located between multiple chip frames and extends to the outside of the chip frames.

[0008] In the above technical solution, the chip frame further includes:

[0009] The first through slot is located in the center of the chip frame;

[0010] The assembly slots are arranged in a circumferential array on the chip holder with the first through slot as the center.

[0011] The slot is set on the chip holder and corresponds to the mounting slot.

[0012] Among them, the iron core structure formed by multiple chip frames has an opening on the side at the slot position, and the heat dissipation component slot opening is connected to the assembly slot and cooperates with the slot.

[0013] In the above technical solution, the heat dissipation component further includes:

[0014] The rod body has a first through hole inside and is set in the assembly groove.

[0015] Heat dissipation fins, multiple heat dissipation fins are set on the rod body, and the heat dissipation fins are connected to the slots between adjacent chip frames.

[0016] Furthermore, the above technical solution also includes:

[0017] A fixed frame is installed at both ends of the iron core structure and connected to the first through hole on the rod.

[0018] In the above technical solution, the fixing frame further includes:

[0019] The guard plate has a second through groove corresponding to the first through groove;

[0020] A fixing rod is provided on one side of the guard plate and corresponds to the mounting groove.

[0021] The fixing rod is tightly fitted into the first through hole and fixed to the rod body.

[0022] Furthermore, the above technical solution also includes:

[0023] The second through hole is set on the fixing rod and extends through to the end face of the guard plate.

[0024] Furthermore, the above technical solution also includes:

[0025] The gasket is placed on the mating surface between the protective plate and the chip carrier;

[0026] The gasket is provided with a third through groove corresponding to the first through groove, and a third through hole corresponding to the first through hole;

[0027] The liner has protrusions corresponding to the groove.

[0028] Furthermore, in the above technical solution, both the rod body and the heat dissipation fins are made of aluminum.

[0029] The beneficial effects of this utility model are as follows: the heat dissipation component can absorb the heat inside the chip holder and release the heat through a section extending to the outside of the chip holder, thereby achieving the purpose of heat dissipation. Attached Figure Description

[0030] Figure 1 This is a perspective view of the present invention;

[0031] Figure 2 This is an exploded view of the structure of this utility model;

[0032] Figure 3 This is a schematic diagram of the heat dissipation component of this utility model;

[0033] The markings in the diagram are as follows: 1. Chip frame; 11. First through slot; 12. Assembly slot; 13. Insert slot; 2. Heat dissipation assembly; 21. Rod; 211. First through hole; 22. Heat dissipation fins; 3. Fixing frame; 31. Protective plate; 311. Second through slot; 32. Fixing rod; 321. Second through hole; 4. Pad; 41. Third through slot; 42. Third through hole; 44. Protrusion. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0035] Example 1:

[0036] This embodiment provides a heat dissipation core, including:

[0037] Chip frame 1, multiple chip frames 1 are stacked and arranged to form an iron core structure;

[0038] Heat dissipation component 2 is disposed between multiple chip holders 1 and extends to the outside of the chip holders 1.

[0039] As can be seen from this embodiment, a heat dissipation core includes a chip frame 1 and a heat dissipation component 2;

[0040] Chip frames 1 are stacked to form an iron core structure, and heat dissipation components 2 are installed between multiple chip frames 1 and extend to the outside of the chip frames 1;

[0041] The heat dissipation component 2 can absorb the heat inside the chip holder 1 and release the heat through a section extending to the outside of the chip holder 1, thereby achieving the purpose of heat dissipation.

[0042] Example 2:

[0043] This embodiment provides a heat dissipation core, which, in addition to the technical solutions of the above embodiments, also has the following technical features.

[0044] Chip frame 1 includes:

[0045] The first through slot 11 is located in the center of the chip frame 1;

[0046] Assembly slots 12 are arranged in a circumferential array on the chip holder 1 with the first through slot 11 as the center.

[0047] The slot 13 is provided on the chip holder 1 and corresponds to the mounting slot 12.

[0048] Among them, the iron core structure formed by multiple chip holders 1 has an opening on the side of the slot 13, and the heat dissipation component 2 is connected to the assembly slot 12 at the opening of the slot 13 and cooperates with the slot 13.

[0049] As can be seen from this embodiment, the chip frame 1 is formed with a first through groove 11, an assembly groove 12 and an insert groove 13;

[0050] The first through slot 11 is formed in the center of the chip frame 1. Multiple assembly slots 12 are arrayed on the chip frame 1 and multiple cut structures are formed on the chip frame 1. The slots 13 are formed on both sides of the chip frame 1 and correspond to the assembly slots 12. The slots 13 form openings on the side wall of the iron core structure to facilitate the assembly of the heat dissipation component 2.

[0051] In use, the heat dissipation component 2 is connected to the assembly slot 12 and fixed to the chip holder 1 through the opening formed on the side wall of the iron core structure by the slot 13;

[0052] The groove 13 is attached to the outside of the heat dissipation component 2, which helps to improve heat transfer efficiency and thus enhance the heat dissipation effect.

[0053] Example 3:

[0054] This embodiment provides a heat dissipation core, which, in addition to the technical solutions of the above embodiments, also has the following technical features.

[0055] Heat dissipation component 2 includes:

[0056] The rod body 21 has a first through hole 211 inside it and is disposed in the assembly groove 12.

[0057] Heat dissipation fins 22, multiple heat dissipation fins 22 are disposed on the rod body 21, and the heat dissipation fins 22 are connected to the slots 13 between adjacent chip frames 1.

[0058] As can be seen from this embodiment, the heat dissipation assembly 2 includes a rod 21 and heat dissipation fins 22;

[0059] The rod body 21 has a first through hole 211 formed inside, and heat dissipation fins 22 are formed at equal intervals on the outer wall surface of the rod body 21.

[0060] The rod 21 is connected to the assembly slot 12, while the heat dissipation fins 22 are connected to the multiple chip frames 1 through the openings on the iron core structure wall.

[0061] The part where the heat dissipation fins 22 and the groove 13 meet is the heat absorption area. The groove 13 is in close contact with the surface of the heat dissipation fins 22, which helps to improve the heat transfer effect. The heat dissipation fins 22 are exposed from the assembly groove 12, thereby enhancing the heat dissipation effect. At the same time, the first through hole 211 formed on the rod body 21 can dissipate heat through the opening of the first through hole 211 at both ends of the iron core structure.

[0062] Example 4:

[0063] This embodiment provides a heat dissipation core, which, in addition to the technical solutions of the above embodiments, also has the following technical features.

[0064] The fixed frame 3 is set at both ends of the iron core structure and connected to the first through hole 211 on the rod 21.

[0065] As can be seen from this embodiment, by setting a fixed frame 3 at both ends of the iron core structure and connecting it with the through holes on the rod 21, the heat dissipation component 2 is fixedly connected to the iron core structure.

[0066] The fixed frame 3 and the heat dissipation component 2 work together to fix the iron core structure.

[0067] Example 5:

[0068] This embodiment provides a heat dissipation core, which, in addition to the technical solutions of the above embodiments, also has the following technical features.

[0069] The fixed frame 3 includes:

[0070] The guard plate 31 has a second through groove 311 corresponding to the first through groove 11;

[0071] A fixing rod 32 is provided on one side of the guard plate 31 and corresponds to the assembly groove 12.

[0072] The fixing rod 32 is tightly fitted into the first through hole 211 and fixed to the rod body 21.

[0073] As can be seen from this embodiment, the fixed frame 3 includes a protective plate 31 and a connecting rod;

[0074] The guard plate 31 has a second through groove 311 corresponding to the first through groove 11, and a fixing rod 32 is formed on one side wall of the guard plate 31. The fixing rod 32 corresponds to the assembly groove 12 and is tightly fitted and fixed with the first through hole 211 on the rod body 21 connected to the assembly groove 12 during use.

[0075] The protective plate 31 is injection molded from polymer material. During use, it can protect both ends of the iron core structure. At the same time, the fixing rod 32 will be connected to the heat dissipation component 2 assembled on the iron core structure and cooperate to fix the chip frame 1.

[0076] Example 6:

[0077] This embodiment provides a heat dissipation core, which, in addition to the technical solutions of the above embodiments, also has the following technical features.

[0078] The second through hole 321 is provided on the fixing rod 32 and extends through to the end face of the guard plate 31.

[0079] As can be seen from this embodiment, the second through hole 321 is formed on the fixing rod 32 and extends through to the end face of the guard plate 31. Then, after the fixing frame 3 and the heat dissipation component 2 are assembled, the first through hole 211 is opened, thereby enhancing the heat dissipation effect.

[0080] Example 7:

[0081] This embodiment provides a heat dissipation core, which, in addition to the technical solutions of the above embodiments, also has the following technical features.

[0082] Gasket 4 is disposed on the mating surface between the protective plate 31 and the chip holder 1;

[0083] Among them, the gasket 4 is provided with a third through groove 41 corresponding to the first through groove 11, and a third through hole 42 is provided with the first through hole 211.

[0084] Among them, the pad 4 is provided with a protrusion 44 corresponding to the groove 13.

[0085] As can be seen from this embodiment, a third through groove 41 is provided on the gasket 4 corresponding to the first through groove 11, and a third through hole 42 is provided on the gasket 4 corresponding to the first through groove 11.

[0086] By setting a gasket 4 between the protective plate 31 and the chip carrier 1, the mating surface between the chip carrier 1 and the protective plate 31 is protected. Furthermore, a protrusion 44 is formed on one side of the chip carrier 1 that the gasket 4 mates with, corresponding to the groove 13, thereby filling the gap and enhancing the structural strength.

[0087] Example 8:

[0088] This embodiment provides a heat dissipation core, which, in addition to the technical solutions of the above embodiments, also has the following technical features.

[0089] Both the rod body 21 and the heat dissipation fins 22 are made of aluminum.

[0090] As can be seen from this embodiment, both the rod 21 and the heat dissipation fins 22 are made of aluminum. Aluminum has good heat dissipation effect, which helps to dissipate heat from the iron core structure.

[0091] The embodiments of this application have been described above with reference to the accompanying drawings. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. This application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A heat dissipation iron core, characterized in that, include: Chip frame (1), multiple chip frames (1) are stacked and arranged to form a core structure; Heat dissipation assembly (2) is disposed between multiple chip frames (1) and extends to the outside of the chip frames (1).

2. A heat dissipation core according to claim 1, characterized in that, The chip frame (1) includes: The first through slot (11) is located in the center of the chip frame (1); Assembly slot (12), wherein the assembly slot (12) is arranged in a circumferential array on the chip frame (1) with the first through slot (11) as the center; The slot (13) is provided on the chip holder (1) and corresponds to the assembly slot (12); Among them, the iron core structure formed by the multiple chip frames (1) has an opening on the side of the slot (13), and the heat dissipation component (2) is connected to the assembly slot (12) at the slot (13) opening and cooperates with the slot (13).

3. A heat dissipation core according to claim 2, characterized in that, The heat dissipation component (2) includes: The rod (21) has a first through hole (211) and is disposed in the assembly groove (12). Heat dissipation fins (22), a plurality of such heat dissipation fins (22) are disposed on the rod body (21), and the heat dissipation fins (22) are connected to the slots (13) between adjacent chip frames (1).

4. A heat dissipation core according to claim 3, characterized in that, it also... include: The fixed frame (3) is set at both ends of the iron core structure and connected to the first through hole (211) on the rod (21).

5. A heat dissipation core according to claim 4, characterized in that, The fixed frame (3) includes: The protective plate (31) has a second through groove (311) corresponding to the first through groove (11); A fixing rod (32) is provided on one side of the guard plate (31) and corresponds to the mounting groove (12); The fixing rod (32) is tightly fitted into the first through hole (211) and fixed to the rod body (21).

6. A heat dissipation core according to claim 5, characterized in that, it further... include: The second through hole (321) is provided on the fixing rod (32) and extends through to the end face of the guard plate (31).

7. A heat dissipation core according to claim 6, characterized in that, it further... include: The pad (4) is provided on the mating surface between the protective plate (31) and the chip frame (1); The gasket (4) is provided with a third through groove (41) corresponding to the first through groove (11) and a third through hole (42) corresponding to the first through hole (211); The pad (4) is provided with a protrusion (44) corresponding to the groove (13).

8. A heat dissipation core according to claim 7, characterized in that, The rod (21) and heat dissipation fins (22) are both made of aluminum.

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