Radio frequency chip anti-interference structure

By designing a closed structure of metal plates and heat pipes on the radio frequency chip, a Faraday cage effect is formed, which solves the problem of electromagnetic interference to the radio frequency chip, achieves effective electromagnetic shielding and uniform heat dissipation, and improves the chip's working efficiency and lifespan.

CN223786053UActive Publication Date: 2026-01-09XIAN YUANCHI IOT TECH CO LTD
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Patent Information

Application Number
CN202520027259.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-06
Publication Date
2026-01-09
Estimated Expiration
2035-01-06

AI Technical Summary

Technical Problem

The lack of effective shielding for radio frequency chips in wireless communication devices leads to external electromagnetic interference affecting the chip's operating efficiency.

Method used

The anti-interference structure adopts a closed structure, including a metal plate and heat pipe design, to form a Faraday cage effect. Combined with a uniform through-hole design and opening mechanism, it can effectively shield electromagnetic interference and dissipate heat evenly.

Benefits of technology

Significantly reduces external electromagnetic interference, improves chip operating efficiency, ensures rapid fault detection and uniform heat dissipation, and extends chip lifespan.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an anti-interference structure of a radio frequency chip, which relates to the technical field of chips, and comprises two first metal plates and two second metal plates which are oppositely arranged in parallel, and a chip body is positioned in a square frame body formed by connecting the two first metal plates and the two second metal plates; a plurality of first square through holes are formed in the side walls of the first metal plate and the second metal plate at equal intervals; second square through holes are formed in the side walls of the first metal plates; the two opening mechanisms are arranged on the inner wall of one second metal plate, and one ends of the two opening mechanisms are slidably connected into the two second square through holes correspondingly. Third strip-shaped through holes are symmetrically formed in one end of the metal top plate, the other ends of the two opening mechanisms are slidably connected into the two third strip-shaped through holes correspondingly, and the other end of the metal top plate is hinged to the second metal plate; the bottom of the metal top plate is connected with the heat conduction pad, the plurality of heat pipes are connected to the heat conduction pad, and through the arrangement of the anti-interference structure, the working efficiency of the chip is improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to chip technical field, concretely is a radio frequency chip anti -interference structure. BACKGROUND

[0002] Radio frequency chip is the integrated circuit specially designed for handling radio signal, these chips play a vital role in wireless communication equipment, including mobile phone, wi -Fi router, bluetooth device, satellite communication system etc. UTILITY MODEL CONTENT

[0003] The utility model discloses a radio frequency chip anti -interference structure to solve the problem in the background art.

[0004] To achieve the above object, the technical scheme adopted by the utility model embodiment is as follows:

[0005] A radio frequency chip anti -interference structure, including: chip body, two first metal plates are opposite and parallel, two second metal plates are opposite and parallel, the chip body is located in the square frame that two first metal plates, two second metal plates are connected into.

[0006] The first metal plate, the second metal plate's lateral wall all equidistance are set up with multiple first square through -hole;

[0007] The lateral wall of first metal plate all is set up with second square through -hole, and the second square through -hole is symmetrically set up.

[0008] Two opening mechanisms, two opening mechanisms are set up on the inner wall of one second metal plate, and two opening mechanisms are symmetrically set up, and one end of two opening mechanisms is slidably connected in two second square through -hole respectively.

[0009] Metal top plate, the metal top plate one end symmetrically set up with third strip through -hole, two opening mechanisms's other end is slidably connected in two third strip through -hole respectively, and the other end of metal top plate is hinged with second metal plate.

[0010] Thermal pad, the metal top plate bottom is connected with thermal pad, and multiple heat pipes are connected on the thermal pad.

[0011] Further, in the utility model, two opening mechanisms all include: first fixed part, second fixed part, connect on the inner wall of one second metal plate, and the second fixed part is located between the first fixed part and the second square through -hole.

[0012] The fourth square through holes are opposite to the second square through hole;

[0013] Connecting shafts, the connecting shafts pass through the fourth square through holes on the first fixing member and the fourth square through holes on the second fixing member and the second square through hole in sequence;

[0014] The connecting shafts are in sliding connection with the fourth square through holes and the second square through hole;

[0015] A third connecting member is in sliding connection on the connecting shaft, and the third connecting member is located between the first fixing member and the second fixing member, one end of a fourth connecting shaft is connected to the top of the third connecting member, and the other end is connected with a fifth connecting plate, and one end of the fourth connecting shaft connected with the fifth connecting plate is in sliding connection in the third square through hole;

[0016] Springs are sleeved on the connecting shafts, and the springs are located between the third connecting member and the first fixing member.

[0017] Further, in the utility model, the heat pipe is a copper heat pipe, an aluminum heat pipe or a stainless steel heat pipe.

[0018] Further, in the utility model, the heat conduction pad is a silica gel base material heat conduction pad.

[0019] Beneficial effects, the technical scheme of the application has the following technical effects:

[0020] The utility model discloses a chip body is located on the circuit board, two first metal sheets, two second metal sheets, metal top plate and circuit board form a closed structure, i. e. faraday cage effect, when metal sheet is completely closed, forms a faraday cage, can effectively shield the interior space from the influence of external electromagnetic interference, a plurality of first square through holes equidistance setting can guarantee the heat convection generated in the inside when the chip body works, realizes uniform heat dissipation, when the chip body appears the failure, the setting of opening mechanism can open metal top plate and check its internal failure conveniently and quickly, a plurality of heat pipes distribute at the bottom of metal top plate, also be for realizing the quick uniform heat dissipation when the chip body works, through the setting of this radio frequency chip anti -interference structure, the external electromagnetic interference has been reduced greatly, thereby improved the work efficiency of chip.

[0021] It should be understood that all combinations of the aforementioned concepts and additional concepts described in greater detail below can be seen as part of the utility model subject matter of the present disclosure, as long as such concepts are not mutually contradictory.

[0022] The foregoing and other aspects, embodiments and features of the present teachings can be more fully understood from the following description taken in conjunction with the accompanying drawings. Other aspects, embodiments and features of the present teachings will be apparent from the description that follows, and from the claims. BRIEF DESCRIPTION OF DRAWINGS

[0023] The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical, or nearly identical, component that is illustrated in various figures is represented with a like numeral. For purposes of clarity, not every component is called out in every drawing. Embodiments of various aspects of the present teachings will now be described, by way of example, with reference to the drawings, in which:

[0024] Figure 1 A perspective view of a radio frequency chip anti-interference structure according to an embodiment of the present teachings;

[0025] Figure 2 An internal structure view of a radio frequency chip anti-interference structure according to an embodiment of the present teachings;

[0026] Figure 3 A partial structure view of a radio frequency chip anti-interference structure according to an embodiment of the present teachings;

[0027] Figure 4 A partial structure view of a radio frequency chip anti-interference structure according to an embodiment of the present teachings;

[0028] Figure 5 A partial enlarged view of an opening mechanism of a radio frequency chip anti-interference structure according to an embodiment of the present teachings;

[0029] In the drawings, the meanings of the reference numerals are as follows: 1 - chip body; 2 - first metal plate; 3 - second metal plate; 4 - first square through hole; 5 - second square through hole; 6 - metal top plate; 7 - third bar-shaped through hole; 8 - heat pipe; 91 - first fixing member; 92 - second fixing member; 93 - fourth square through hole; 94 - connecting shaft; 95 - third connecting member; 96 - fourth connecting shaft; 97 - fifth connecting plate; 98 - spring. DETAILED DESCRIPTION

[0030] For a better understanding of the technical content of the present application, specific embodiments are described below with the accompanying drawings. In the present disclosure, the aspects of the present application are described with reference to the accompanying drawings, which show many embodiments of the description. The embodiments of the present disclosure are not necessarily defined in all aspects including the present application. It should be understood that the various concepts and embodiments introduced above, as well as those described in more detail below, can be implemented in any of a number of ways, as the concepts and embodiments disclosed in the present application are not limited to any implementation. In addition, some aspects of the present application can be used alone or in any appropriate combination with other aspects of the present application.

[0031] As shown in Figures 1-5 A radio frequency chip anti-interference structure, comprising: a chip body 1; two first metal plates 2 are opposite and parallel, two second metal plates 3 are opposite and parallel, the chip body 1 is located in the square frame connected by two first metal plates 2, two second metal plates 3; a plurality of first square through holes 4 are equally spaced on the side wall of the first metal plate 2 and the second metal plate 3; a second square through hole 5 is formed on the side wall of the first metal plate 2, and the second square through hole 5 is symmetrically arranged; two opening mechanisms, two opening mechanisms are arranged on the inner wall of one of the second metal plates 3, and two opening mechanisms are symmetrically arranged, one end of the two opening mechanisms is respectively connected in the two second square through holes 5; a metal top plate 6, the metal top plate 6 is symmetrically provided with a third strip hole 7 at one end, the other end of the two opening mechanisms is respectively connected in the two third strip holes 7, and the other end of the metal top plate 6 is hinged with the second metal plate 3; a heat-conducting pad, the metal top plate 6 is connected with a heat-conducting pad at the bottom, and a plurality of heat pipes 8 are connected on the heat-conducting pad.

[0032] In the application, the chip body 1 is located on the circuit board, the two first metal plates 2, the two second metal plates 3, and the metal top plate 6 form a closed structure, that is, a Faraday cage effect; when the metal plate is completely closed to form a Faraday cage, the internal space can be effectively shielded from external electromagnetic interference; the two first metal plates 2, the two second metal plates 3, and the circuit board can be welded, bonded, or fixed by screws; the plurality of first square through holes 4 are arranged at equal intervals, which can ensure the convection of heat generated inside the chip body 1 during operation to achieve uniform heat dissipation. The aperture size of the first square through hole is 0.3-1mm. The first square through hole 4 in the size range can not only ensure effective heat dissipation but also effectively shield external electromagnetic interference; when the chip body 1 fails, the opening mechanism can be easily and quickly opened to check the internal failure; the plurality of heat pipes are distributed at the bottom of the metal top plate 6, which is also for the purpose of quickly and uniformly dissipating heat during the operation of the chip body 1; through the arrangement of the anti-interference structure of the radio frequency chip, the external electromagnetic interference is greatly reduced, thereby improving the working efficiency of the chip.

[0033] Further, the two opening mechanisms each include: a first fixing member 91 and a second fixing member 92 connected to the inner wall of one of the second metal plates 3, and the second fixing member 92 is located between the first fixing member 91 and the second square through hole 5; the first fixing member 91 and the second fixing member 92 each have a fourth square through hole 93 formed therein, and the fourth square through hole 93 is opposite to the second square through hole 5; a connecting shaft 94, the connecting shaft 94 passes through the fourth square through hole 93 of the first fixing member 91, the fourth square through hole 93 of the second fixing member 92, and the second square through hole 5 in sequence; the connecting shaft 94 is in sliding connection with the fourth square through hole 93 and the second square through hole 5; a third connecting member 95, the third connecting member 95 is in sliding connection with the connecting shaft 94, and the third connecting member 95 is located between the first fixing member 91 and the second fixing member 92; a fourth connecting shaft 96, one end of the fourth connecting shaft 96 is connected to the top of the third connecting member 95; the other end is connected with a fifth connecting plate 97, and the end of the fourth connecting shaft 96 connected with the fifth connecting plate 97 is in sliding connection with the third square through hole 7; a spring 98, the spring 98 is sleeved on the connecting shaft 94, and the spring 98 is located between the third connecting member 95 and the first fixing member 91.

[0034] In the embodiment, when the metal top plate 6 is in the closed state, the spring 98 is in the natural elongation state, the connecting shaft 94 is in sliding connection with the second square through hole 5, and the two fifth connecting plates 97 are respectively located at the farthest ends of the oppositely arranged third square through holes 7; when the metal top plate 6 needs to be opened, only need to pinch the two fifth connecting plates 97, so that the two fifth connecting plates 97 slide to the nearest ends of the oppositely arranged third square through holes 7, and the spring 98 is in the completely compressed state, at this time, the metal top plate 6 can be completely opened.

[0035] Further, the heat pipe 8 is a copper heat pipe, an aluminum heat pipe or a stainless steel heat pipe.

[0036] In the embodiment, the heat pipe 8 can uniformly distribute heat on the surfaces of the first metal plate 2, the second metal plate 3 and the metal top plate 6, thereby helping the chip body 1 in the structure to uniformly dissipate heat and prolonging the service life of the chip body 1; the heat dissipation principle of the heat pipe 8 is based on phase change heat transfer, that is, efficiently transferring heat through the evaporation and condensation process of the working liquid inside the heat pipe 8.

[0037] Further, the heat-conducting pad is a silica gel base heat-conducting pad.

[0038] In the embodiment, the gap between the heat pipe 8 and the metal top plate 6 is filled with the heat-conducting pad, so as to improve the heat conduction efficiency between the heat pipe 8 and the metal top plate 6 and thereby improve the heat dissipation efficiency of the heat pipe 8; the silica gel base heat-conducting pad has good flexibility and compressibility and can adapt to uneven surfaces, and the heat conductivity coefficient is usually between 1.0 W / m·K and 5.0 W / m·K.

[0039] The standard parts used in the present application file can be purchased from the market, and can be ordered according to the description and the drawings, and the specific connection mode of each part adopts the conventional means such as bolt, rivet and welding in the prior art, the mechanical, parts and equipment adopt the conventional type in the prior art, the control mode is automatically controlled through the controller, the control circuit of the controller can be realized by simple programming of the person skilled in the art, which belongs to the common knowledge in the art, and the present application is mainly used to protect the mechanical device, so the control mode and the circuit metal are not explained in detail.

[0040] Although the present application has been disclosed with the above preferred embodiments, it is not intended to limit the present application. Those skilled in the art can make various modifications and decorations without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application shall be subject to the definition of the claims.

Claims

1. A radio frequency chip anti-interference structure, characterized in that, The chip body (1) comprises: Two first metal plates (2) are arranged opposite and parallel, two second metal plates (3) are arranged opposite and parallel, and the chip body (1) is located in a square frame formed by the two first metal plates (2) and the two second metal plates (3); A plurality of first square through holes (4) are equidistantly arranged on the side walls of the first metal plates (2) and the second metal plates (3); Second square through holes (5) are arranged on the side walls of the first metal plates (2), and the second square through holes (5) are symmetrically arranged; Two opening mechanisms are arranged on the inner walls of one of the second metal plates (3), and the two opening mechanisms are symmetrically arranged, one end of each of the two opening mechanisms is slidably connected in the two second square through holes (5), respectively; A metal top plate (6) is provided, one end of the metal top plate (6) is symmetrically provided with a third strip-shaped through hole (7), the other end of each of the two opening mechanisms is slidably connected in the two third strip-shaped through holes (7), respectively, and the other end of the metal top plate (6) is hingedly connected with the second metal plate (3); A heat-conducting pad is connected to the bottom of the metal top plate (6), and a plurality of heat pipes (8) are connected to the heat-conducting pad. Each of the two opening mechanisms comprises:

2. The radio frequency chip anti-interference structure according to claim 1, characterized in that, A first fixing member (91) and a second fixing member (92) are connected to the inner walls of one of the second metal plates (3), and the second fixing member (92) is located between the first fixing member (91) and the second square through hole (5); Fourth square through holes (93) are arranged on the first fixing member (91) and the second fixing member (92), and the fourth square through holes (93) are opposite to the second square through hole (5); A connecting shaft (94) sequentially passes through the fourth square through hole (93) on the first fixing member (91), the fourth square through hole (93) on the second fixing member (92), and the second square through hole (5); The connecting shaft (94) is slidably connected with the fourth square through hole (93) and the second square through hole (5); A third connecting member (95) is slidably connected to the connecting shaft (94), and the third connecting member (95) is located between the first fixing member (91) and the second fixing member (92), one end of a fourth connecting shaft (96) is connected to the top of the third connecting member (95), the other end of the fourth connecting shaft (96) is connected with a fifth connecting plate (97), and one end of the fourth connecting shaft (96) connected with the fifth connecting plate (97) is slidably connected in the third strip-shaped through hole (7); A spring (98) is sleeved on the connecting shaft (94), and the spring (98) is located between the third connecting member (95) and the first fixing member (91). The heat pipes (8) are copper heat pipes, aluminum heat pipes, or stainless steel heat pipes.

3. The radio frequency chip anti-interference structure according to claim 1, characterized in that, The heat-conducting pad is a silica gel base material heat-conducting pad.

4. The radio frequency chip anti-interference structure according to claim 1, characterized in that, ​