Integrated phase change liquid cooling head

Abstract

The utility model discloses an integrated phase change liquid cooling head, which comprises an upper-layer shell, a middle-layer shell and a lower-layer shell, the upper-layer shell is an independent closed shell, and a phase change material is packaged in the upper-layer shell; the middle-layer shell is of a concave structure which is opened upwards, an opening of the middle-layer shell is sealed by a bottom plate of the upper-layer shell, an independent closed cavity used for containing refrigerants is formed by the middle-layer shell and the bottom plate of the upper-layer shell, and a flow channel used for flowing and evaporating of the refrigerants is formed in the middle-layer shell; the lower-layer shell is of a concave structure which is opened upwards, the opening of the lower-layer shell is sealed by the bottom plate of the middle-layer shell, and an independent closed cavity for containing cooling water is formed by the lower-layer shell and the middle-layer shell together. The integrated phase change liquid cooling head is high in structural integration level and low in thermal resistance, and achieves the effects of improving the heat exchange efficiency and improving the safety coefficient.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, specifically to an integrated phase change liquid cooling head. Background Technology

[0002] Currently, chip cooling methods mainly include air cooling, liquid cooling, and semiconductor cooling. Air cooling has limited heat dissipation capacity and cannot meet the heat dissipation requirements of chips with high heat flux density. Traditional liquid cooling systems, such as chillers, usually adopt a multi-stage indirect heat exchange mode of "evaporator-water tank-liquid cooling head", which has the problems of system complexity, slow thermal response speed, and low overall energy efficiency. Semiconductor coolers have the disadvantages of high power consumption and large heat generation. Utility Model Content

[0003] To address the problems of complex, slow-response, and high-energy-consumption chiller systems for cooling chips in existing technologies, this invention provides an integrated phase-change liquid cooling head.

[0004] The present invention adopts the following technical solution:

[0005] An integrated phase change liquid cooling head includes: an upper shell, a middle shell, and a lower shell; the upper shell is an independent sealed shell encapsulating a phase change material; the middle shell is an upwardly open concave structure, its opening sealed by the bottom plate of the upper shell, together forming an independent sealed cavity for containing refrigerant, and the middle shell has flow channels for refrigerant flow and evaporation; the lower shell is an upwardly open concave structure, its opening sealed by the bottom plate of the middle shell, together forming an independent sealed cavity for containing cooling water; the upper shell, middle shell, and lower shell are fixedly connected as a single unit to achieve thermal coupling between the three; the liquid cooling head is provided with a refrigerant inlet and a refrigerant outlet communicating with the flow channels.

[0006] Preferably, the upper shell is composed of an upwardly opening concave structure and a cover plate for sealing connection.

[0007] Preferably, the lower shell has a first heat-conducting column inside to increase the heat exchange area, and the first heat-conducting column is integrally formed with the lower shell.

[0008] Preferably, a second heat-conducting column is provided inside the upper shell to increase the heat exchange area, and the second heat-conducting column is integrally formed with the upper shell.

[0009] Preferably, the flow channel is a meandering flow channel.

[0010] Preferably, the internal cavity of the lower shell is connected to the outside through the first water inlet.

[0011] Preferably, the internal cavity of the upper shell is connected to the outside through a second water inlet.

[0012] Preferably, the lower shell and the middle shell are joined by a concave mutual sealing method.

[0013] Preferably, at least two shells in the liquid cooling head are joined by a concave mutual sealing method.

[0014] Preferably, the first heat-conducting column is an array of columns.

[0015] Preferably, the second heat-conducting column is an array of columns.

[0016] The beneficial effects of this utility model are:

[0017] 1. High structural integration and low thermal resistance: The "concave mutual sealing" combination reduces the contact thermal resistance in the traditional cold head heat conduction process and optimizes the utilization rate of cold energy in the cold head.

[0018] 2. Improved heat exchange efficiency and optimized system energy efficiency: The traditional multi-stage indirect heat exchange mode of "evaporator-water tank-liquid cooling head" is improved into an integrated direct heat exchange mode of "liquid cooling head middle shell-liquid cooling head lower shell", which fundamentally reduces the temperature difference loss in the intermediate heat exchange links, thereby improving the overall energy efficiency and reducing the system power consumption.

[0019] 3. Dynamic and coordinated heat dissipation for enhanced safety: The upper phase change material layer, the middle active cooling layer, and the lower liquid cooling layer are tightly coupled, enabling them to respond collaboratively to changes in chip temperature. The phase change material can quickly absorb instantaneous thermal shocks, effectively mitigating chip temperature fluctuations and protecting electronic components. Attached Figure Description

[0020] Figure 1 This is a perspective view of an integrated phase change liquid cooling head according to the present invention;

[0021] Figure 2 This is an exploded view of an integrated phase change liquid cooling head according to the present invention.

[0022] Figure 3 This is a cross-sectional view of an integrated phase change liquid cooling head according to the present invention;

[0023] Figure 4 This is a structural diagram of the upper shell of an integrated phase change liquid cooling head according to this utility model;

[0024] Figure label:

[0025] 1. Lower shell; 11. First heat-conducting column; 2. Middle shell; 21. Flow channel; 22. First water inlet; 3. Upper shell; 31. Second heat-conducting column; 32. Refrigerant inlet; 33. Refrigerant outlet; 4. Cover plate; 41. Second water inlet. Detailed Implementation

[0026] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention.

[0027] like Figure 1-4 As shown, the integrated phase change liquid cooling head of this embodiment is mainly composed of a lower shell 1, a middle shell 2, and an upper shell 3. The bottom plates of the lower shell 1 and the middle shell 2 together form a lower cavity for containing cooling water. The bottom plates of the middle shell 2 and the upper shell 3 together form a middle cavity for containing refrigerant. The hollow internal structure of the upper shell 3 is an upper cavity for containing phase change material.

[0028] The lower housing 1 is an upwardly open concave structure made of a high thermal conductivity metal such as copper or aluminum. It contains multiple integrally formed first heat-conducting pillars 11, forming an array to increase the contact area with the cooling water in the lower cavity. The bottom surface of the lower housing 1 is a flat surface that contacts heat sources such as the chip for cooling. The cooling water contained in the lower housing 1 serves as the basic heat dissipation medium, storing heat through its sensible heat and exchanging heat with the chip through the bottom plate of the lower housing 1. Compared to directly cooling the chip using the refrigerant in the middle housing 2, the cooling water in the lower housing 1 acts as a thermal buffer.

[0029] The internal cavity of the lower housing 1 is connected to the outside through the first water inlet 22 to achieve the filling and maintenance of cooling water. In this embodiment, as... Figure 2 As shown, the first water inlet 22 is located in the middle shell 2 and penetrates the solid structure of the middle shell 2 to communicate with the lower cavity. It can be understood that the first water inlet 22 is used to connect the lower cavity with the outside, and its specific location is not limited to... Figure 2 The upper part of the side wall of the middle shell 2 shown can also be located at any other position of the middle shell 2. In an alternative embodiment, the first water inlet 22 can be directly located in the lower shell 1, as long as it can achieve communication between the lower cavity and the outside. In another alternative embodiment, the first water inlet 22 can also be located in the upper shell 3. It is sufficient to have the first water inlet 22 pass through the solid structure of the upper shell 3 and the solid structure of the middle shell 2 in sequence to communicate with the lower cavity, which can also achieve communication between the lower cavity and the outside.

[0030] The middle shell 2 is also an upward-opening concave structure, with its outer dimensions slightly smaller than the groove of the lower shell 1, allowing it to be nested inside the lower shell 1. It is made of a high thermal conductivity metal such as copper or aluminum. The bottom plate of the middle shell 2 seals the opening of the lower shell 1, and together with the lower shell 1, they form a lower cavity for containing cooling water.

[0031] The liquid cooling head is provided with a refrigerant inlet 32 ​​and a refrigerant outlet 33 that communicate with the flow channel 21 of the middle shell 2. For example... Figures 1 to 3 As shown, in this embodiment, the refrigerant inlet 32 ​​and refrigerant outlet 33 are located in the upper shell 3 and penetrate the solid structure of the upper shell 3 to connect the flow channel 21 in the middle cavity with the outside. It is understood that the function of the refrigerant inlet 32 ​​and refrigerant outlet 33 is to enable communication between the flow channel 21 and the outside, and their location is not limited to the upper shell 3. In other alternative embodiments, the refrigerant inlet 32 ​​and refrigerant outlet 33 can also be directly located in the middle shell 2, as long as communication between the flow channel 21 and the outside is achieved.

[0032] The middle cavity within the middle shell 2 is equipped with a flow channel 21 for refrigerant flow. Refrigerant from the external refrigeration system flows through the refrigerant inlet 32 ​​into the flow channel 21, where it exchanges heat with the cooling water in the lower shell 1 via the bottom plate of the middle shell 2. The refrigerant further evaporates into a gaseous state and returns to the external refrigeration system through the refrigerant outlet 33 to continue the refrigeration cycle. The specific pattern of the flow channel 21 is not limited; any flow channel structure that can extend the refrigerant flow path and increase its contact time with the channel wall, thereby enhancing evaporation and heat exchange, falls within the protection scope. For example... Figure 2 As shown, in a preferred embodiment of this invention, the flow channel 21 is a parallel serpentine flow channel with periodic peaks and troughs, which can extend the flow path and ensure uniform refrigerant distribution. It is understood that the implementation of the flow channel 21 is not limited to this. The term "winding flow channel" should be interpreted broadly, encompassing all non-linear flow channel layouts, including but not limited to: serpentine flow channels, sawtooth flow channels, spiral flow channels, interwoven or braided flow channels, and any other irregularly curved flow channels that improve heat transfer efficiency by increasing flow channel density and length. The common core of these flow channel structures is that, through their winding and densely arranged geometric design, they maximize the heat transfer area and refrigerant residence time within a limited planar space, thereby achieving the purpose of enhanced heat transfer of this invention.

[0033] The upper shell 3 is made of a high thermal conductivity metal such as copper and aluminum. It can be a one-piece sealed structure or a concave structure that opens upwards and is composed of a cover plate 4. The bottom plate of the upper shell 3 seals the opening of the middle shell 2 and together with the middle shell 2, forms a middle cavity for containing refrigerant.

[0034] The upper shell 3 itself forms a sealed structure filled with a phase change material. This phase change material can be water, paraffin compounds, salt hydrates, or other materials capable of absorbing or releasing large amounts of energy during the process. Taking paraffin compounds as an example, this involves using paraffin as a base material and incorporating highly thermally conductive fillers, including mixtures of paraffin, graphite, and activated carbon. The paraffin mixture contains graphite and activated carbon, and as a mixture of alkanes, it lacks a fixed melting point; the desired melting point can be obtained by adjusting its composition. Paraffin has a high latent heat of phase change and stable chemical properties, but its thermal conductivity is low. Adding graphite and activated carbon can improve its thermal conductivity. Since the upper shell 3 does not directly contact the chip for heat exchange, it utilizes the cold storage capacity of the phase change material within the upper cavity as a reserve cold storage unit to cope with transient thermal shocks.

[0035] The upper shell 3 has multiple integrally formed second heat-conducting columns 31 inside, forming an array of columns to increase the contact area with the phase change material, thereby enhancing the heat exchange effect.

[0036] like Figure 2 and Figure 4 As shown, the internal cavity of the upper shell 3 is connected to the outside through the second water inlet 41 to achieve the filling or maintenance of the phase change material. In this embodiment, the second water inlet 41 is provided on the cover plate 4. However, in other alternative embodiments, as long as the function of connecting the upper cavity to the outside can be achieved, the second water inlet 41 can also be directly provided on the body of the upper shell 3.

[0037] In this embodiment, as Figure 2-4 As shown, the lower shell 1, middle shell 2, and upper shell 3 are all upward-opening concave structures. The upper shell 3 can be a sealed structure or composed of an upward-opening concave structure and a cover plate 4. The liquid cooling head can be connected into a single unit using various processes such as brazing, diffusion welding, and bonding. This structure prevents the loss of cold energy from the middle shell 2 into the environment. It is understood that the scope of protection of this utility model is not limited to the absolute geometric shape shown in the figure. Equivalent transformations or modifications made by those skilled in the art to the specific contours, angles, or local shapes of the above-mentioned concave structure without departing from the core inventive concept of "achieving an integrated low thermal resistance structure through interlayer sealing" should all fall within the scope of protection of this utility model. For example, the sidewalls of the concave structure can be vertical or have a certain angle; its corners can be right angles or rounded corners.

[0038] It should be noted that the "concave mutual sealing" mentioned in the claims and specification of this utility model refers to a specific connection relationship between two stacked shells. Specifically, it is defined as follows: the lower shell is an upwardly open receiving cavity, i.e., a "concave" structure, and the upper shell seals the open opening downwards with its bottom plate, thereby forming an independent sealed cavity. This structure eliminates the need for additional connecting parts between the two shells to achieve cavity sealing and achieves large-area, low-thermal-resistance physical contact. The "concave" structure is a general description of the shape of the upwardly open receiving cavity. Its cross-section is not limited to a strict "U" shape, but also includes "U" shape, trapezoidal shape, or other upwardly open groove structures. Its core lies in the functional feature of being "upwardly open" and "sealed downwards" by the upper layer.

[0039] The working principle of this utility model is as follows:

[0040] Before the liquid cooling head is operational, cooling water is filled into the lower housing 1 through the first water inlet 22 and the second water inlet 41, while the upper housing 3 is filled with phase change material. During operation, the liquid cooling head is attached to the chip surface, and its three-layer structure works dynamically and collaboratively according to changes in chip temperature.

[0041] Basic heat dissipation stage: The continuous heat generated by the chip is absorbed and carried away by the internal cooling water through the bottom plate of the lower casing 1 via sensible heat exchange.

[0042] Active cooling and high-efficiency heat exchange stage: Low-temperature liquid refrigerant from the external cooling system enters the flow channel 21 of the middle shell 2 through the refrigerant inlet 32 ​​and flows, while absorbing heat from the lower shell 1 and the chip. The gaseous refrigerant that evaporates after absorbing heat returns to the external cooling system from the refrigerant outlet 33.

[0043] Transient thermal shock buffering and backup cooling stage: The phase change material inside the upper shell 3 serves as a backup cooling unit. When encountering a transient thermal shock, excess heat is further conducted to the phase change material in the upper cavity. The phase change material melts and absorbs a large amount of latent heat, effectively suppressing the chip temperature peak. After the thermal shock, the system has excess heat dissipation capacity, the phase change material releases the stored heat, re-solidifies, and restores its cooling capacity, preparing for the next thermal shock.

[0044] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model, and all such modifications or substitutions should be covered within the protection scope of this utility model.

Claims

1. An integrated phase change liquid cooling head, characterized in that, include: The upper shell (3), the middle shell (2), and the lower shell (1) are: the upper shell (3) is an independent sealed shell, which is encapsulated with phase change material; the middle shell (2) is an upwardly open concave structure, whose opening is sealed by the bottom plate of the upper shell (3), together forming an independent sealed cavity for containing refrigerant; the middle shell (2) is provided with a flow channel (21) for refrigerant flow and evaporation; the lower shell (1) is an upwardly open concave structure, whose opening is sealed by the bottom plate of the middle shell (2), together forming an independent sealed cavity for containing cooling water; the upper shell (3), the middle shell (2), and the lower shell (1) are fixedly connected as an integral structure to achieve thermal coupling between the three; the liquid cooling head is provided with a refrigerant inlet (32) and a refrigerant outlet (33) communicating with the flow channel (21).

2. The integrated phase change liquid cooling head according to claim 1, characterized in that, The upper shell (3) is formed by a concave structure that opens upwards and a cover plate (4) that are sealed together.

3. The integrated phase change liquid cooling head according to claim 1, characterized in that, The lower shell (1) is provided with a first heat-conducting column (11) for increasing the heat exchange area. The first heat-conducting column (11) is integrally formed with the lower shell (1).

4. The integrated phase change liquid cooling head according to claim 1, characterized in that, The upper shell (3) is provided with a second heat-conducting column (31) for increasing the heat exchange area. The second heat-conducting column (31) is integrally formed with the upper shell (3).

5. The integrated phase change liquid cooling head according to claim 1, characterized in that, The flow channel (21) is a meandering flow channel.

6. The integrated phase change liquid cooling head according to claim 1, characterized in that, The internal cavity of the lower shell (1) is connected to the outside through the first water inlet (22).

7. The integrated phase change liquid cooling head according to claim 1, characterized in that, The internal cavity of the upper shell (3) is connected to the outside through the second water inlet (41).

8. The integrated phase change liquid cooling head according to claim 1, characterized in that, The lower shell (1) and the middle shell (2) are joined by a concave mutual sealing method.

9. The integrated phase change liquid cooling head according to claim 1, characterized in that, The liquid cooling head has at least two shell layers joined together by a concave inter-sealing method.

10. The integrated phase change liquid cooling head according to claim 3, characterized in that, The first heat-conducting column (11) is an array of columns.

11. The integrated phase change liquid cooling head according to claim 4, characterized in that, The second heat-conducting column (31) is an array of columns.

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