Wafer cleaning machine for wafer processing

Abstract

The utility model relates to the technical field of wafer processing, and discloses a wafer cleaning machine for wafer processing, which comprises a cleaning placing box, the outer surface of the cleaning placing box is fixedly connected with a conduction block, the conduction block is internally provided with a vibration motor, the inner wall of the cleaning placing box is fixedly connected with an air cylinder, and the air cylinder is internally provided with a vibration motor. The output end of the air cylinder is fixedly connected with a telescopic rod, the other end of the telescopic rod is fixedly connected with a clamping block, and the inner wall of the cleaning containing box is fixedly connected with a bearing grid plate. The wafer cleaning device has the following advantages and effects that a worker puts a wafer into the cleaning placement box, a driving air cylinder controls a telescopic rod to drive a clamping block to clamp and fix the wafer, and then a vibration motor is driven to enable the cleaning placement box to vibrate to drive a cleaning water source in the cleaning placement box to vibrate to strengthen cleaning of dust on the outer surface of the wafer; and dust and chippings brought in by a bearing grating fall to a discharge pipe to discharge waste liquid, so that the flexibility of the whole device is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer cleaning machine for wafer processing. Background Technology

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seed crystals. Then it is slowly pulled out to form a cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, which is a wafer. Domestic wafer production lines are mainly 8-inch and 12-inch. The main processing methods for wafers are wafer processing and batch processing, that is, processing one or more wafers at the same time.

[0003] According to Chinese Patent Publication No. CN221947129U, a cleaning machine for wafer processing is provided, which relates to the field of wafer processing technology. This invention aims to solve the current technical problem of inconvenience in fixing and clamping the position of wafers. It includes a wafer cleaning machine body and a fixing assembly. The wafer cleaning machine body includes a machine body and a door. The door is hinged to the machine body. The fixing assembly is arranged within the fixing assembly. The fixing assembly includes a fixing block, a slot, a return spring, a pressure plate, a limiting slot, a groove, a wedge-shaped groove, a clamping plate, and limiting slide rods. The fixing block is connected to the machine body by bolts. A slot is formed on the fixing block. The return spring is located in the slot. The pressure plate slides within the slot. A limiting slot is formed within the pressure plate. Two grooves are symmetrically formed on one side of the limiting slot. Two wedge-shaped grooves are symmetrically formed within the slot. The clamping plate passes through the groove. Two limiting slide rods are symmetrically arranged within the limiting slots, with their ends extending through the limiting slots into the wedge-shaped grooves. This invention has the advantage of facilitating the fixing and clamping of the wafer position.

[0004] The aforementioned patent has the effect of facilitating the fixing and clamping of the wafer position; however, it is not thorough enough in cleaning the wafer, and the method of filling and discharging the cleaned material is not flexible and convenient enough. Utility Model Content

[0005] The purpose of this invention is to provide a wafer cleaning machine for wafer processing, which enhances the cleaning effect and improves the filling and discharge of cleaned materials.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a wafer cleaning machine for wafer processing, comprising a cleaning placement box, a conductive block fixedly connected to the outer surface of the cleaning placement box, a vibration motor disposed inside the conductive block, a cylinder fixedly connected to the inner wall of the cleaning placement box, a telescopic rod fixedly connected to the output end of the cylinder, a clamping block fixedly connected to the other end of the telescopic rod, a receiving grid plate fixedly connected to the inner wall of the cleaning placement box, a pipe arrangement disposed on the inner wall of the cleaning placement box, a side opening provided on one side of the cleaning placement box, and a receiving box slidably connected to the inner wall of the side opening.

[0007] By adopting the above technical solution, the staff puts the disc into the cleaning placement box, drives the cylinder to control the telescopic rod to move the clamping block to clamp and fix the disc, and then drives the vibration motor to make the cleaning placement box vibrate, which in turn causes the cleaning water source inside to vibrate, thus strengthening the cleaning of dust on the outer surface of the disc. Combined with the receiving grid plate carrying in dust and debris, the waste liquid falls to the discharge pipe and is discharged, which improves the flexibility of the overall device, makes the overall device easy to adjust, improves the working efficiency of the overall device, saves labor costs and working time, and improves the convenience of the overall device.

[0008] A further feature of this invention is that a transmission block is fixedly connected to one side of the cleaning placement box, and a pipe opening is provided on the top of the transmission block.

[0009] By adopting the above technical solution, the number of cleaning placement boxes is two, which facilitates the cleaning of multiple discs at the same time and improves cleaning efficiency.

[0010] A further feature of this invention is that a through pipe is provided inside the transmission block, and a water pump is provided inside the through pipe.

[0011] By adopting the above technical solution, combined with water pumps and pipes, the discharge of cleaning water is facilitated.

[0012] A further feature of this invention is that a cleaning water bucket is inserted into the inner wall of the pipe opening, and a motor is fixedly connected to the inner wall of the cleaning water bucket.

[0013] By adopting the above technical solution, the staff inserts the inner wall of the corresponding pipe opening of the cleaning water bucket, making the whole device easy to install and disassemble.

[0014] A further feature of this invention is that a stirring rod is fixedly connected to the output end of the motor, and a water inlet is fixedly connected to the top of the cleaning bucket.

[0015] By adopting the above technical solution, the staff put the cleaning agent into the corresponding water inlet, and the drive motor controls the stirring rod to rotate and stir, thereby enhancing the mixing.

[0016] A further feature of this invention is that the inner wall of the water inlet is threaded with a sealing block, and the inner wall of the drain pipe is threaded with a second sealing block.

[0017] By adopting the above technical solution, the sealing of the water inlet and the drain pipe is strengthened by the sealing block and the second sealing block, thereby improving flexibility.

[0018] A further feature of this invention is that a strainer is fixedly connected to the inner wall of the cleaning water tank, and a second cylinder is fixedly connected to the inner wall of the cleaning water tank.

[0019] By adopting the above technical solution, the outer surface of the funnel frame is provided with a funnel opening, and the staff drives the second cylinder to control the second telescopic rod to extend and retract.

[0020] A further feature of this invention is that a second telescopic rod is fixedly connected to the output end of the second cylinder, and a pressure frame is fixedly connected to the bottom end of the second telescopic rod.

[0021] By adopting the above technical solution, the height of the pressure frame can be adjusted by controlling the second telescopic rod.

[0022] A further feature of this invention is that both the outer surface of the pressure frame and the outer surface of the leakage frame are fixedly connected with blocking blocks.

[0023] By adopting the above technical solution, gaps are created by raising the pressure frame, which facilitates the downward discharge of water.

[0024] A further feature of this invention is that the pressure frame is slidably connected to the inner wall of the cleaning water bucket.

[0025] By adopting the above technical solution, the pressure frame is slidably connected to the inner wall of the cleaning water tank, improving the flexibility of the overall device.

[0026] The beneficial effects of this utility model are:

[0027] 1. This utility model, through the coordinated arrangement of a cleaning placement box, a conductive block, a vibration motor, a cylinder, a telescopic rod, a clamping block, a receiving grid, a drain pipe, a side opening, and a receiving box, enables the device to be used by placing a circular piece into the cleaning placement box. The cylinder drives the telescopic rod to move the clamping block to clamp and fix the circular piece. Subsequently, the vibration motor drives the cleaning placement box to vibrate, which in turn vibrates the cleaning water source inside, enhancing the cleaning of dust on the outer surface of the circular piece. Combined with the receiving grid bringing in dust and debris that falls to the drain pipe for waste liquid discharge, this improves the flexibility of the overall device, makes the device easy to adjust, increases the overall working efficiency, saves labor costs and working time, and enhances the convenience of the overall device. The number of cleaning placement boxes is two, which facilitates the cleaning of multiple circular pieces at the same time, improving cleaning efficiency.

[0028] 2. This utility model, through the coordinated arrangement of the cleaning bucket, motor, stirring rod, water inlet, sealing block, and second sealing block, enables the device to facilitate the discharge of cleaning water when used in conjunction with the water pump and the connecting pipe. The operator inserts the inner wall of the cleaning bucket corresponding to the pipe opening, making the entire device easy to install and disassemble. The operator puts the cleaning agent into the water inlet corresponding to the cleaning agent, drives the motor to control the stirring rod to rotate and stir, and strengthens the mixing. The sealing block and the second sealing block strengthen the sealing of the water inlet and the drain pipe, improving flexibility. The operator drives the second cylinder to control the extension and retraction of the second telescopic rod, and the gap created by the lifting of the pressure frame facilitates the discharge of water. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the structure of this utility model;

[0031] Figure 2 This is a schematic diagram of the cleaning and placement box structure of this utility model;

[0032] Figure 3 This is a schematic diagram of the transmission block structure of this utility model;

[0033] Figure 4 This is a schematic diagram of the structure of the cleaning bucket of this utility model.

[0034] In the diagram: 1. Cleaning placement box; 2. Transmission block; 3. Vibration motor; 4. Cylinder; 5. Telescopic rod; 6. Clamping block; 7. Receiving grid plate; 8. Pipeline; 9. Side opening; 10. Receiving box; 11. Transmission block; 12. Pipe opening; 13. Through pipe; 14. Water pump; 15. Cleaning water bucket; 16. Motor; 17. Stirring rod; 18. Water inlet; 19. Sealing block; 20. Second sealing block; 21. Slot frame; 22. Second cylinder; 23. Second telescopic rod; 24. Pressure frame; 25. Blocking block. Detailed Implementation

[0035] The technical solution of this utility model will now be clearly and completely described with reference to specific embodiments. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0036] Reference Figure 1-4A wafer cleaning machine for wafer processing includes a cleaning placement box 1. A conductive block 2 is fixedly connected to the outer surface of the cleaning placement box 1. A vibration motor 3 is installed inside the conductive block 2. A cylinder 4 is fixedly connected to the inner wall of the cleaning placement box 1. A telescopic rod 5 is fixedly connected to the output end of the cylinder 4. A clamping block 6 is fixedly connected to the other end of the telescopic rod 5. A receiving grid plate 7 is fixedly connected to the inner wall of the cleaning placement box 1. A pipe 8 is installed on the inner wall of the cleaning placement box 1. A side opening 9 is opened on one side of the cleaning placement box 1. A receiving box 10 is slidably connected to the inner wall of the side opening 9. When an operator puts a wafer into the cleaning placement box 1, the cylinder 4 drives the telescopic rod 5 to move the clamping block 6 to move the wafer. The device is clamped and fixed, and then the vibration motor 3 is driven to vibrate the cleaning placement box 1, which in turn vibrates the cleaning water source inside to enhance the cleaning of dust on the outer surface of the disc. Combined with the receiving grid 7, the dust and debris are carried down to the discharge pipe 8 to discharge the waste liquid, which improves the flexibility of the overall device, makes the device easy to adjust, improves the working efficiency of the overall device, saves labor costs and working time, and improves the convenience of the overall device. There are two cleaning placement boxes 1, which can facilitate the cleaning of multiple discs at the same time and improve the cleaning efficiency. A transmission block 11 is fixedly connected to one side of the cleaning placement box 1. The top of the transmission block 11 is provided with a pipe opening 12, and the inside of the transmission block 11 is provided with a through pipe 13. A water pump 14 is installed inside pipe 13. A cleaning water tank 15 is inserted into the inner wall of pipe opening 12. A motor 16 is fixedly connected to the inner wall of cleaning water tank 15. A stirring rod 17 is fixedly connected to the output end of motor 16. A water inlet 18 is fixedly connected to the top of cleaning water tank 15. A sealing block 19 is threadedly connected to the inner wall of water inlet 18. A second sealing block 20 is threadedly connected to the inner wall of drain pipe 8. A drain frame 21 is fixedly connected to the inner wall of cleaning water tank 15. A second cylinder 22 is fixedly connected to the inner wall of cleaning water tank 15. A second telescopic rod 23 is fixedly connected to the output end of second cylinder 22. A pressure frame 24 is fixedly connected to the bottom end of second telescopic rod 23. The outer surface of pressure frame 24 is flush with the drain frame 21. All outer surfaces of the device are fixedly connected with blocking blocks 25. The pressure frame 24 is slidably connected to the inner wall of the cleaning water tank 15. Combined with the water pump 14 and the connecting pipe 13, it facilitates the discharge of cleaning water. The operator inserts the inner wall of the cleaning water tank 15 into the corresponding pipe opening 12, making the whole device easy to install and disassemble. The operator puts the cleaning agent into the corresponding water inlet 18. The drive motor 16 controls the stirring rod 17 to rotate and stir, strengthening the mixing. The sealing blocks 19 and the second sealing block 20 strengthen the sealing of the water inlet 18 and the drain pipe 8, improving flexibility. The operator drives the second cylinder 22 to control the second telescopic rod 23 to extend and retract. The lifting of the pressure frame 24 creates a gap, facilitating the discharge of water.

[0037] In this invention, through the coordinated arrangement of the cleaning placement box 1, the conductive block 2, the vibration motor 3, the cylinder 4, the telescopic rod 5, the clamping block 6, the receiving grid 7, the drain pipe 8, the side opening 9, and the receiving box 10, the device allows the operator to place a circular piece into the cleaning placement box 1 during use. The cylinder 4 drives the telescopic rod 5 to clamp the circular piece with the clamping block 6. Then, the vibration motor 3 drives the cleaning placement box 1 to vibrate, causing the internal cleaning water source to vibrate and intensify the cleaning of dust on the outer surface of the circular piece. Combined with the receiving grid 7 carrying dust and debris down to the drain pipe 8 for waste liquid discharge, this improves the flexibility of the overall device, making it easier to adjust, increasing its working efficiency, saving labor costs and working time, and enhancing its convenience. The number of cleaning placement boxes 1 is [number missing]. Two components are used to clean multiple discs simultaneously, improving cleaning efficiency. The coordinated arrangement of the cleaning bucket 15, motor 16, stirring rod 17, water inlet 18, sealing block 19, and second sealing block 20 allows for easy water discharge when used in conjunction with the water pump 14 and the connecting pipe 13. The operator inserts the cleaning bucket 15 into the inner wall of the corresponding pipe opening 12, facilitating installation and disassembly. The operator then adds the cleaning agent to the corresponding water inlet 18, driving the motor 16 to control the stirring rod 17 to rotate and stir, enhancing mixing. The sealing blocks 19 and 20 further seal the water inlet 18 and the drain pipe 8, improving flexibility. The operator drives the second cylinder 22 to control the extension and retraction of the second telescopic rod 23, creating a gap through the lifting of the pressure frame 24, facilitating water discharge.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer cleaning machine for wafer processing, comprising a cleaning placement box (1), characterized in that: A conductive block (2) is fixedly connected to the outer surface of the cleaning placement box (1). A vibration motor (3) is installed inside the conductive block (2). A cylinder (4) is fixedly connected to the inner wall of the cleaning placement box (1). A telescopic rod (5) is fixedly connected to the output end of the cylinder (4). A clamping block (6) is fixedly connected to the other end of the telescopic rod (5). A receiving grid plate (7) is fixedly connected to the inner wall of the cleaning placement box (1). A pipe (8) is installed on the inner wall of the cleaning placement box (1). A side opening (9) is opened on one side of the cleaning placement box (1). A receiving box (10) is slidably connected to the inner wall of the side opening (9).

2. A wafer cleaning machine for wafer processing according to claim 1, characterized in that: A transmission block (11) is fixedly connected to one side of the cleaning placement box (1), and a pipe opening (12) is provided on the top of the transmission block (11).

3. A wafer cleaning machine for wafer processing according to claim 2, characterized in that: The transmission block (11) is equipped with a through pipe (13), and the through pipe (13) is equipped with a water pump (14).

4. A wafer cleaning machine for wafer processing according to claim 2, characterized in that: A cleaning water tank (15) is inserted into the inner wall of the pipe (12), and a motor (16) is fixedly connected to the inner wall of the cleaning water tank (15).

5. A wafer cleaning machine for wafer processing according to claim 4, characterized in that: The output end of the motor (16) is fixedly connected to a stirring rod (17), and the top of the cleaning water tank (15) is fixedly connected to a water inlet (18).

6. A wafer cleaning machine for wafer processing according to claim 5, characterized in that: The inner wall of the water inlet (18) is threaded with a sealing block (19), and the inner wall of the drain pipe (8) is threaded with a second sealing block (20).

7. A wafer cleaning machine for wafer processing according to claim 4, characterized in that: The inner wall of the cleaning water tank (15) is fixedly connected to a drain rack (21), and the inner wall of the cleaning water tank (15) is fixedly connected to a second cylinder (22).

8. A wafer cleaning machine for wafer processing according to claim 7, characterized in that: The output end of the second cylinder (22) is fixedly connected to a second telescopic rod (23), and the bottom end of the second telescopic rod (23) is fixedly connected to a pressure frame (24).

9. A wafer cleaning machine for wafer processing according to claim 8, characterized in that: The outer surface of the pressure frame (24) and the outer surface of the drain frame (21) are both fixedly connected with a block (25).

10. A wafer cleaning machine for wafer processing according to claim 9, characterized in that: The pressure frame (24) is slidably connected to the inner wall of the cleaning water tank (15).

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