Tile type semiconductor wafer silicon boat

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and discloses a tile-type semiconductor wafer silicon boat, which comprises a silicon boat body made of high-purity polycrystalline columnar silicon as a base material, the cross section of the silicon boat body is tile-shaped, and a plurality of arc-shaped grooves which are linearly and uniformly distributed are formed on the upper side wall of the silicon boat body; the base material of the silicon boat body is polycrystalline columnar silicon with the purity of 99.999999999%, and the silicon boat body has the characteristics of high melting point and high purity and a thermal expansion coefficient consistent with that of a wafer, and can effectively avoid wafer warping and improve wafer surface staggered layers, thereby improving the qualified rate of the wafer; a supporting plane is formed on the lower side wall of the silicon boat body. The integrated silicon boat is manufactured by taking high-purity polycrystalline columnar silicon as a basic material, so that the problem that an existing quartz boat and an existing silicon carbide boat are easy to deform at high temperature is solved, and the problem that spliced diatom is easy to peptize is also solved; the supporting plane is arranged at the bottom of the silicon boat, so that the working stability of the silicon boat can be effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing, especially relates to a tile type semiconductor wafer silicon boat. BACKGROUND

[0002] The carrier for bearing silicon wafer on the market is made of quartz or silicon carbide. In the process of silicon wafer heat treatment, the temperature often exceeds 1000 DEG C, even reaches 1250 DEG C, if quartz boat is used as the carrier for bearing silicon wafer under such high temperature, deformation softening will appear after long time use, and the material of quartz boat is different from that of silicon wafer, the thermal expansion coefficient is inconsistent, cold spots will appear when heating and cooling, leading to lattice collapse, forming grain misplacement, the above factors will affect the quality of silicon wafer. There is also a kind of silicon boat which is composed of multiple components and fused as a whole, the current fusion method is to use glue to fuse and combine the components at high temperature. Because the material of glue is different from that of silicon boat, the glue is easy to overflow and pollute the silicon wafer during use at high temperature, and there is a risk of delamination and disintegration of the components of silicon boat during use. SUMMARY

[0003] The utility model discloses a tile type semiconductor wafer silicon boat which is made of high-purity polycrystalline columnar silicon as a base material, solves the problems of the existing silicon boat in the background art.

[0004] The support plane arranged at the bottom of the silicon boat can effectively improve the stability of the silicon boat during operation.

[0005] The above technical purpose of the utility model is realized by the following technical scheme.

[0006] A tile type semiconductor wafer silicon boat includes a silicon boat body made of high-purity polycrystalline columnar silicon as a base material and having a tile-shaped cross section, and a plurality of linearly distributed circular-arc grooves formed on the upper side wall of the silicon boat body. The base material of the silicon boat body is made of polycrystalline columnar silicon with a purity of 99.999999999%, which has the characteristics of high melting point and high purity and a thermal expansion coefficient consistent with that of the wafer, so as to effectively avoid wafer warping and improve wafer surface layering, thereby improving the yield of wafers.

[0007] A support plane is formed on the lower side wall of the silicon boat body.

[0008] During use, the wafers are inserted into the circular-arc grooves, so that the adjacent wafers are spaced apart and do not contact each other. Meanwhile, the support plane arranged at the bottom of the silicon boat body can prevent the silicon boat body from shaking or the like, so that the wafer is more stable during processing.

[0009] The utility model further sets up: the round -arc shaped groove's slot both sides are formed with fillet, through setting up fillet, can conveniently wafer's insertion work.

[0010] The utility model further sets up: a plurality of weight reduction through -groove that the round -arc shaped groove is formed on the silicon boat body, through setting up a plurality of weight reduction through -groove, can reduce the weight of whole silicon boat greatly, also can reduce the contact area of wafer insertion to the round -arc shaped groove, put in wafer insertion and reduce abrasion.

[0011] The utility model further sets up: the end of the silicon boat body is formed with the positioning hole, through setting up the positioning hole, can be convenient for silicon boat positioning and wafer accurate insertion to the round -arc shaped groove.

[0012] The utility model further sets up: the central angle of the silicon boat body is θ, and the value range of θ is 100 ° ~ 150 °.

[0013] The utility model can also be set up as: the center of the round -arc shaped groove is eccentric with the center of the silicon boat body.

[0014] The center of the round -arc shaped groove is located above the center of the silicon boat body.

[0015] Through eccentric setting and the groove center is located above the center of the silicon boat body, can be the depth of the both ends of the round -arc shaped groove big, the depth of the middle small, to make wafer insertion to the round -arc shaped groove more stable, also can further reduce the overall weight of the silicon boat.

[0016] The utility model has the advantages of:

[0017] Compared with the prior art, the integrated silicon boat made of high-purity polycrystalline columnar silicon as a base material solves the problem of deformation of existing quartz boats and silicon carbide boats at high temperature, and also solves the problem of easy gel dissolution of spliced silicon boats.

[0018] By providing a support plane at the bottom of the silicon boat, the stability of the silicon boat during operation can be effectively improved.

[0019] The plurality of weight reduction through -grooves can greatly reduce the overall weight of the silicon boat. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a structure schematic view of the utility model embodiment 1.

[0021] Figure 2 It is a sectional view of the utility model embodiment 1.

[0022] Figure 3 It is Figure 2 It is a sectional view of A-A.

[0023] Figure 4 Structure diagram of the embodiment 2 of the utility model.

[0024] Sign: 10, silicon boat body;

[0025] 20, circular arc-shaped groove;

[0026] 30, support plane;

[0027] 40, positioning hole;41, counterbore;

[0028] 50, bushing;51, convex ring;52, retaining ring;

[0029] 60, weight reduction groove. DETAILED DESCRIPTION

[0030] The specific embodiments of the utility model are described in further detail below in combination with the drawings and embodiments. The following embodiments are used to illustrate the utility model, but not to limit the scope of the utility model.

[0031] The following refers to Figures 1 to 4 The embodiment of the utility model is explained as follows: EMBODIMENT

[0032] A tile type semiconductor wafer silicon boat, as shown in Figure 1 , Figure 2 , includes the silicon boat body 10 that the high purity polycrystalline columnar silicon is made into the tile-shaped cross section, the upper side wall of the silicon boat body 10 is formed with several linearly distributed circular arc-shaped grooves 20;The base material of the silicon boat body adopts the purity 99.999999999% polycrystalline columnar silicon, has the characteristics of high melting point, high purity and the thermal expansion coefficient consistent with wafer, can effectively avoid wafer warping, improve wafer surface layer, thereby improve the qualified rate of wafer;

[0033] The lower side wall of the silicon boat body 10 is formed with a support plane 30.

[0034] In practical, the wafer is inserted into the circular arc-shaped groove, and the adjacent wafers can be left with a gap and not contact each other. At the same time, the support plane is arranged at the bottom of the silicon boat body, so that the silicon boat body will not shake and other phenomena, and the wafer is more stable when processing.

[0035] As shown in Figure 3 , the circular arc-shaped groove 20 of the embodiment is formed with a fillet 201 on both sides of the slot, and the fillet can facilitate the insertion of the wafer.

[0036] As shown in Figure 1As shown, the silicon boat body 10 of this embodiment has a plurality of weight-reducing channels 60 formed on the through arc-shaped grooves 20. By setting multiple weight-reducing channels, the weight of the entire silicon boat can be greatly reduced, and the contact area between the wafer inserted into the arc-shaped groove and the arc-shaped groove can be reduced, thus reducing wafer insertion and wear.

[0037] The silicon boat body 10 has a positioning hole 40 formed at its end. By setting the positioning hole, the silicon boat can be positioned easily and the wafer can be accurately inserted into the arc-shaped groove.

[0038] The central angle of the silicon boat body 10 is θ, and the value of θ ranges from 100° to 150°. Example

[0039] like Figure 4 As shown, in this embodiment, the center of the arc-shaped groove 20 is offset from the center of the silicon boat body 10.

[0040] The center of the arc-shaped groove 20 is located above the center of the silicon boat body 10.

[0041] By setting the trench eccentrically with its center above the center of the silicon boat body, the depth of the arc-shaped trench is greater at both ends and less in the middle, which makes the wafer more stable when inserted into the arc-shaped trench, and also further reduces the overall weight of the silicon boat.

[0042] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model. These improvements and modifications assumed above should also be considered within the protection scope of the present utility model.

Claims

1. A tile-type semiconductor wafer silicon boat, characterized in that: The silicon boat body (10) is made of high-purity polycrystalline columnar silicon as the base material and has a tile-shaped cross-section. Several linearly distributed arc-shaped grooves (20) are formed on the upper side wall of the silicon boat body (10). A support plane (30) is formed on the lower side wall of the silicon boat body (10).

2. The tile-type semiconductor wafer silicon boat according to claim 1, characterized in that: The arc-shaped groove (20) has rounded corners (201) formed on both sides of the groove opening.

3. The tile-type semiconductor wafer silicon boat according to claim 1, characterized in that: The silicon boat body (10) has multiple weight-reducing channels (60) formed on it, which are through arc-shaped grooves (20).

4. The tile-type semiconductor wafer silicon boat according to claim 1, characterized in that: The end of the silicon boat body (10) is formed with positioning holes (40).

5. The tile-type semiconductor wafer silicon boat according to claim 1, characterized in that: The central angle of the silicon boat body (10) is θ, and the value of θ ranges from 100° to 150°.

6. The tile-type semiconductor wafer silicon boat according to claim 1, characterized in that: The center of the arc-shaped groove (20) is offset from the center of the silicon boat body (10).

7. A tile-type semiconductor wafer silicon boat according to claim 6, characterized in that: The center of the arc-shaped groove (20) is located above the center of the silicon boat body (10).

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