Centering clamping device

Abstract

The utility model provides a centering clamping device, and relates to the technical field of positioning devices. Comprising a main body, a rotating device and a centering assembly, and the main body comprises an upper carrying table suitable for placing a workpiece and a lower carrying table used for installing the rotating device and the centering assembly; the centering assembly comprises three rotating rods evenly distributed around the circumference, a connecting rod assembly used for connecting the adjacent rotating rods and a centering structure connected to the upper end of each rotating rod and located on the top face of the upper carrying table. The rotating device is rotationally connected with one of the rotating rods, and the other two rotating rods are suitable for being driven by the connecting rod assembly to synchronously rotate in the same direction, so that the three centering structures gather inwards to conduct centering clamping on a workpiece or the three centering structures expand outwards to cancel clamping on the workpiece. By means of the scheme, rapid centering clamping is achieved.

Description

Technical Field

[0001] This utility model relates to the field of positioning device technology, and more specifically, to a centering clamping device for semiconductor wafers. Background Technology

[0002] When debugging a wafer transport device, the wafer needs to be centered and calibrated in the wafer placement area to ensure it is in the center during transport calibration. Wafers often deviate during transport, causing them to fail to be placed within the designated area on the wafer storage platform, affecting subsequent processes. Invention patent CN103594406B discloses a self-centering positioning chuck and a method for centering and positioning semiconductor wafers. The self-centering positioning chuck includes a tray, a positioning component, a central suction component, and a chuck housing. The tray has radially distributed, axially extendable telescopic rods. A needle-shaped cylinder connected to an air source acts on the telescopic rods via a conical shaft, causing the rods to extend. A spring is fitted in the middle of the telescopic rods, causing them to retract and clamp the wafer for centering. A suction cup is located in the center of the tray, capable of upward or rotational movement. A clamping block can hold and release the wafer for centering. A sensor measures the positioning opening at the outer edge of the wafer for positioning. However, this scheme has a relatively complex overall structure, limited applicable wafer size, and cumbersome operation steps, resulting in insufficient process efficiency. Utility Model Content

[0003] This utility model discloses a centering clamping device to solve the problems mentioned above.

[0004] The present invention adopts the following solution:

[0005] A centering clamping device includes: a main body, a rotating device, and a centering assembly. The main body includes an upper platform suitable for placing a workpiece and a lower platform for mounting the rotating device and the centering assembly. The centering assembly includes three rotating rods evenly distributed around a circumference, a connecting rod assembly for connecting adjacent rotating rods, and a centering structure connected to the upper end of each rotating rod and located on the top surface of the upper platform. The rotating device rotatably connects to one of the rotating rods, and the other two rotating rods are adapted to rotate synchronously and in the same direction under the drive of the connecting rod assembly, so that the three centering structures converge inward to center and clamp the workpiece or expand outward to release the clamping of the workpiece.

[0006] Furthermore, the centering structure includes a swinging member and an annular roller, with the two ends of the swinging member connected to the rotating rod and the annular roller, respectively.

[0007] Furthermore, the annular roller is covered with a layer of soft material.

[0008] Furthermore, the annular roller is tactilely connected to one end of the oscillating member.

[0009] Furthermore, the loading stage for placing workpieces has chamfered edges to facilitate the handling of wafers.

[0010] Furthermore, the rotating device employs a stepper motor.

[0011] Furthermore, the linkage assembly includes a linkage connector connected to the rotating rod, and a linkage is hinged between the linkage connectors on two adjacent rotating rods so that when the rotating device drives one of the rotating rods to rotate, it drives the other two rotating rods to rotate synchronously in the same direction.

[0012] Beneficial effects:

[0013] This solution, by setting up a three-point positioning clamping scheme, can improve the problem of maintaining the wafer at the center of the storage position with high precision accuracy when it is placed in the storage area; it can effectively save the time of frequent wafer calibration and improve process efficiency; it can solve the problem of unstable and unreliable wafer clamping in related technologies; and it can be used in conjunction with optical precision lenses to solve the need for smooth calibration after inspection. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of a centering clamping device for clamping a workpiece according to an embodiment of the present invention;

[0015] Figure 2 This is a schematic diagram of the structure of a centering clamping device according to an embodiment of the present invention;

[0016] Icons: 1. Main body, 2. Loading platform, 21. Placement platform, 3. Downloading platform, 4. Rotating device, 5. Rotating rod, 6. Swinging component, 7. Circular roller, 8. Connecting rod, 9. Connecting rod connector, 10. Workpiece. Detailed Implementation

[0017] Combination Figure 1 and Figure 2As shown, this embodiment provides a centering clamping device, including: a main body 1, a rotating device 4, and a centering assembly. The main body 1 includes an upper platform 2 suitable for placing a workpiece 10 and a lower platform 3 for mounting the rotating device 4 and the centering assembly. The centering assembly includes three rotating rods 5 evenly distributed around the circumference, a connecting rod 8 assembly for connecting adjacent rotating rods 5, and a centering structure connected to the upper end of each rotating rod 5 and located on the top surface of the upper platform 2. The rotating device 4 rotatably connects to one of the rotating rods 5, and the other two rotating rods 5 are adapted to rotate synchronously and in the same direction under the drive of the connecting rod 8 assembly, so that the three centering structures converge inward to center and clamp the workpiece 10 or expand outward to release the clamping of the workpiece 10.

[0018] In this embodiment, the main body 1 is configured as a cylindrical structure. The upper platform 2 and the lower platform 3 are respectively disposed at both ends of the main body 1. The top surface of the upper platform 2 forms a placement platform 21 suitable for placing the workpiece 10. The edge of the placement platform 21 is chamfered to facilitate the placement and removal of the wafer. The three centering structures are evenly distributed around the circumference of the placement platform 21. Specifically, the centering structure includes a swinging member 6 and an annular roller 7. The two ends of the swinging member 6 are respectively connected to the rotating rod 5 and the annular roller 7. The swinging member 6 is connected to the rotating rod 5. When the rotating rod 5 rotates, it drives the swinging member 6 to swing synchronously so that the annular roller 7 swings around the rotating rod 5. The three centering structures are adapted to swing synchronously in the same direction during operation. When they converge synchronously inward, they form an equilateral triangle distribution on the three annular rollers 7 to center the wafer and simultaneously perform a clamping function. When they swing synchronously outward, the clamping function on the wafer is canceled. In a preferred embodiment, the annular roller 7 is covered with a soft material layer, such as plastic, rubber, or silicone, to avoid damaging the wafer edges. The annular roller 7 is tactilely connected to one end of the oscillating member 6, and its rolling motion with the wafer reduces frictional resistance, further minimizing damage. When the annular roller 7 contacts the workpiece 10, it applies a force perpendicular to the center of the workpiece 10. After the workpiece 10 reaches the center, the three forces interact, causing the roller to roll, thus separating and reducing damage to the wafer. To release the roller, simply reverse the rotation device 4.

[0019] The connecting rod assembly 8 includes connecting rod connectors 9 connected to the rotating rod 5. Connecting rods 8 are hinged between connecting rod connectors 9 on adjacent rotating rods 5 so that when the rotating device 4 drives one of the rotating rods 5 to rotate, it drives the other two rotating rods 5 to rotate synchronously and in the same direction. Here, the rotating rod 5 connected to the rotating device 4 can be defined as the driving rod, and the other two rotating rods 5 as driven rods. When the driving rod rotates, the connecting rod connectors 9 rotate synchronously, driving the connecting rod connectors 9 on the other two driven rods to swing through the connecting rod 8. The connecting rod connectors 9 on the driven rods can drive the driven rods to rotate. Here, the driving rod and driven rods rotate synchronously and in the same direction, causing the three centering structures to simultaneously converge inwards or swing outwards. The rotating device 4 uses a stepper motor to achieve precise positioning. This solution uses the connecting rod assembly 8 to drive the other two driven rods, thus giving the central part a force perpendicular to the center of all three parts, achieving the centering function.

[0020] This embodiment uses a three-point centering method, employing a stepper motor to drive the driven rod with the active rod, so that the annular roller 7 clamps and centers the wafer, which can meet the requirements of wafer centering and clamping. Through three-point centering calibration, only one active rod needs to be powered to drive the driven shaft, ensuring that the wafer is in the center position during transmission calibration, and the rotational torque is easy to control.

[0021] It should be understood that the above are only preferred embodiments of the present utility model, and the protection scope of the present utility model is not limited to the above embodiments. All technical solutions that fall within the scope of the present utility model are protected by the present utility model.

[0022] The accompanying drawings used in the above description of the embodiments only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

Claims

1. A centering clamping device, characterized in that, include: The system comprises a main body, a rotating device, and a centering assembly. The main body includes an upper platform suitable for placing a workpiece and a lower platform for mounting the rotating device and the centering assembly. The centering assembly includes three rotating rods evenly distributed around a circumference, a connecting rod assembly for connecting adjacent rotating rods, and a centering structure connected to the upper end of each rotating rod and located on the top surface of the upper platform. The rotating device rotatably connects to one of the rotating rods, and the other two rotating rods are adapted to rotate synchronously and in the same direction under the drive of the connecting rod assembly, so that the three centering structures converge inward to center and clamp the workpiece or expand outward to release the clamping of the workpiece.

2. The centering clamping device according to claim 1, characterized in that, The centering structure includes a swinging component and an annular roller, with the two ends of the swinging component connected to the rotating rod and the annular roller, respectively.

3. The centering clamping device according to claim 2, characterized in that, The annular roller is covered with a layer of soft material.

4. The centering clamping device according to claim 2, characterized in that, The annular roller is tactilely connected to one end of the oscillating component.

5. The centering clamping device according to claim 1, characterized in that, The loading stage, used for placing workpieces, has chamfered edges to facilitate the handling of wafers.

6. The centering clamping device according to claim 1, characterized in that, The rotating device uses a stepper motor.

7. The centering clamping device according to claim 1, characterized in that, The linkage assembly includes a linkage connector connected to the rotating rod, and a linkage is hinged between the linkage connectors on two adjacent rotating rods so that when the rotating device drives one of the rotating rods to rotate, it drives the other two rotating rods to rotate synchronously in the same direction.

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