Clamping and overturning device for semiconductor wafer processing

Abstract

The utility model relates to the technical field of semiconductor processing equipment, in particular to a semiconductor wafer processing, clamping and turning device which comprises a base and a positioning, clamping and turning assembly, the positioning, clamping and turning assembly comprises a placement groove, a clamping table, a moving shaft and a rotating handle, the placement groove is fixedly connected with the base and located in the center of the interior of the base, and the clamping table is fixedly connected with the base. The clamping table is detachably connected with the base and located in the base, the clamping table is arranged in the center of the interior of the containing groove, the moving shaft is rotationally connected with the clamping table and located on the upper portion of the interior of the clamping table, the rotating handle is rotationally connected with the moving shaft and located at the end, away from the clamping table, of the moving shaft, and the rotating handle is arranged on one side of the upper portion of the base. An original clamping structure is modified and replaced with the positioning clamping turnover assembly, and therefore the problems that an existing mechanical clamping device cannot achieve accurate turnover angle control, a wafer is prone to shaking, deviation and even damage in the turnover process, and the machining quality and the production efficiency are seriously affected are effectively solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment technology, and in particular to a semiconductor wafer processing clamping and flipping device. Background Technology

[0002] In the semiconductor wafer fabrication process, precise clamping and flipping of the wafer are crucial steps.

[0003] Existing clamping and flipping devices have many problems. For example, some use complex electrical or hydraulic control systems, which not only increases equipment costs and maintenance difficulty, but is also susceptible to electromagnetic interference or liquid leakage. These complex systems have limited response speeds and cannot meet the requirements of high-precision and high-efficiency semiconductor wafer processing. Existing mechanical clamping devices cannot achieve precise flipping angle control, which can easily cause wafer wobbling, displacement or even damage during the flipping process, seriously affecting processing quality and production efficiency.

[0004] To address the aforementioned issues, we propose a semiconductor wafer processing clamping and flipping device. Utility Model Content

[0005] The purpose of this invention is to provide a semiconductor wafer processing clamping and flipping device, which solves the problem that existing mechanical clamping devices cannot achieve precise flipping angle control, and the wafer is prone to shaking, displacement or even damage during the flipping process, which seriously affects the processing quality and production efficiency.

[0006] To achieve the above objectives, this utility model employs a semiconductor wafer processing clamping and flipping device, comprising a base and a positioning clamping and flipping assembly. The positioning clamping and flipping assembly includes a placement groove, a clamping stage, a moving shaft, and a rotary handle. The placement groove is fixedly connected to the base and located at the interior center of the base. The clamping stage is detachably connected to the base and located inside the base, with the clamping stage positioned at the interior center of the placement groove. The moving shaft is rotatably connected to the clamping stage and located above the interior of the clamping stage. The rotary handle is rotatably connected to the moving shaft and located at the end of the moving shaft away from the clamping stage, with the rotary handle positioned on the upper side of the base.

[0007] The positioning, clamping, and flipping assembly further includes a fixed plate, which is rotatably connected to the moving shaft and located at the end of the moving shaft away from the throttle, and the fixed plate is disposed at the internal center of the base.

[0008] The positioning, clamping, and flipping assembly further includes a rotating disk and a clamping claw. The rotating disk is rotatably connected to the fixed disk and is located on the side of the fixed disk away from the moving axis. The clamping claw is fixedly connected to the rotating disk and is located on the side of the rotating disk away from the fixed disk.

[0009] The positioning, clamping, and flipping assembly further includes a material guide groove, which is fixedly connected to the base and located inside the lower part of the base, and is positioned below the clamping claw.

[0010] The positioning clamping and flipping assembly further includes a positioning hole and a pin. The positioning hole is fixedly connected to the base and located inside the base. The positioning hole is also located inside the placement groove and on one side of the clamping platform. The pin is detachably connected to the base and located inside the base. The pin is also located inside the positioning hole and above the placement groove.

[0011] This utility model discloses a semiconductor wafer processing clamping and flipping device, comprising a base and a positioning clamping and flipping assembly. The positioning clamping and flipping assembly includes a placement groove, a clamping stage, a moving shaft, and a rotary handle. The placement groove is fixedly connected to the base and located at the internal center of the base. The clamping stage is detachably connected to the base and located inside the base, with the clamping stage positioned at the internal center of the placement groove. The moving shaft is rotatably connected to the clamping stage and located above the inside of the clamping stage. The rotary handle is rotatably connected to the moving shaft and located at the end of the moving shaft away from the clamping stage, with the rotary handle positioned on the upper side of the base. By modifying and replacing the original clamping structure with a positioning clamping and flipping assembly, this effectively solves the problem that existing mechanical clamping devices cannot achieve precise flipping angle control, easily causing wafer wobbling, displacement, or even damage during flipping, seriously affecting processing quality and production efficiency. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0014] Figure 2 This is a top view of the entire utility model.

[0015] Figure 3 This is a side view of the entire utility model.

[0016] 101-Base, 120-Installation groove, 103-Positioning hole, 104-Pin, 105-Clamping platform, 106-Moving shaft, 107-Turner, 108-Fixed disc, 109-Rotating disc, 110-Clamping claw, 111-Guide groove. Detailed Implementation

[0017] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0018] Please see Figures 1-3 , Figure 1 This is a schematic diagram of the overall structure of this utility model. Figure 2 This is a top view of the entire utility model. Figure 3 This is a side view of the entire utility model.

[0019] This utility model provides a semiconductor wafer processing clamping and flipping device, including a base 101 and a positioning clamping and flipping assembly. The positioning clamping and flipping assembly includes a mounting groove 120, a clamping table 105, a moving shaft 106, a rotary handle 107, a fixed disk 108, a rotating disk 109, clamping claws 110, a guide groove 111, a positioning hole 103, and a pin 104. This solution solves the problem that existing mechanical clamping devices cannot achieve precise flipping angle control, which can easily lead to wafer wobbling, displacement, or even damage during flipping, seriously affecting processing quality and production efficiency. It is understood that the aforementioned solution can stably fix the base 101 on the worktable of the semiconductor processing equipment, ensuring that the base 101 is horizontal. The base is stable, providing a solid support foundation for the entire device. The clamping platform 105 is then installed into the center of the mounting slot 120 inside the base 101 via a pre-designed disassembly and connection structure, ensuring a secure and accurate installation. The mounting slot 120 provides precise positioning space for the clamping platform 105. The fixing plate 108 is installed at the end of the moving shaft 106 away from the handle 107, and the fixing plate 108 is located at the center inside the base 101, ensuring smooth rotation of the fixing plate 108 and the moving shaft 106. Depending on the size of the wafer to be processed, the operator rotates the handle 107, causing the moving shaft 106 to rotate. Since the moving shaft 106 is rotatably connected to the fixing plate 108... The fixed disk 108 also rotates, driving the rotating disk 109 connected to it to rotate. This adjusts the position of the clamping jaws 110 fixed on the side of the rotating disk 109 away from the fixed disk 108. Once the clamping jaws 110 are in the appropriate position, the semiconductor wafer is placed between the clamping jaws 110. The handle 107 is rotated again to clamp the wafer, ensuring it does not wobble or shift during processing. If the wafer needs to be flipped or its angle adjusted, the operator continues to rotate the handle 107. Through the transmission of the moving shaft 106, the fixed disk 108, and the rotating disk 109, the wafer is flipped. During the flipping process, when the desired position is reached... When the required angle is reached, positioning can be achieved using the positioning hole 103 and the pin 104. The positioning hole 103 is fixedly connected to the base 101, located inside the placement groove 120 and on one side of the clamping stage 105. The pin 104 is inserted into the positioning hole 103, located inside the base 101 and above the placement groove 120, thereby precisely fixing the angle between the clamping stage 105 and the wafer. This ensures angle stability during processing and avoids processing errors caused by angle changes. This effectively solves the problem that existing mechanical clamping devices cannot achieve precise flipping angle control, which can easily cause wafer shaking, displacement, or even damage during flipping, seriously affecting processing quality and production efficiency.

[0020] In this specific embodiment, the mounting groove 120 is fixedly connected to the base 101 and located at the internal center of the base 101. The clamping platform 105 is detachably connected to the base 101 and located inside the base 101. The clamping platform 105 is located at the internal center of the mounting groove 120. The moving shaft 106 is rotatably connected to the clamping platform 105 and located above the inside of the clamping platform 105. The handle 107 is rotatably connected to the moving shaft 106 and located at the end of the moving shaft 106 away from the clamping platform 105. The handle 107 is located on the upper side of the base 101. If it is necessary to flip the wafer or adjust its angle, the operator continues to rotate the handle 107. Through the transmission of the moving shaft 106, the fixed disk 108, and the rotating disk 109, the wafer flipping operation is realized.

[0021] The fixed disk 108 is rotatably connected to the moving shaft 106 and is located at the end of the moving shaft 106 away from the throttle 107, and the fixed disk 108 is disposed at the internal center of the base 101.

[0022] Secondly, the rotating disk 109 is rotatably connected to the fixed disk 108 and is located on the side of the fixed disk 108 away from the moving shaft 106. The clamping claw 110 is fixedly connected to the rotating disk 109 and is located on the side of the rotating disk 109 away from the fixed disk 108. If it is necessary to flip the wafer or adjust its angle, the operator continues to rotate the handle 107. Through the transmission of the moving shaft 106, the fixed disk 108 and the rotating disk 109, the wafer flipping operation is realized.

[0023] Meanwhile, the guide groove 111 is fixedly connected to the base 101 and is located inside the lower part of the base 101, and the guide groove 111 is located below the clamping claw 110.

[0024] In addition, the positioning hole 103 is fixedly connected to the base 101 and located inside the base 101. The positioning hole 103 is also located inside the placement groove 120 and on one side of the clamping table 105. The pin 104 is detachably connected to the base 101 and located inside the base 101. The pin 104 is also located inside the positioning hole 103 and above the placement groove 120. After processing, the pin 104 is pulled out first, and then the handle 107 is rotated in the opposite direction to release the wafer from the clamping claw 110. Since the guide groove 111 is fixedly connected to the base 101 and located below the base 101 and below the clamping claw 110, the processing waste will slide down the guide groove 111 under gravity, making it convenient for the operator to collect and complete the entire processing process.

[0025] When using this utility model, the base 101 is stably fixed on the worktable of the semiconductor processing equipment, ensuring that the base 101 is horizontal and stable, providing a solid support foundation for the entire device. Then, the clamping table 105 is installed into the center position of the mounting groove 120 inside the base 101 through a preset disassembly and connection structure, ensuring that the installation is firm and the position is accurate. The mounting groove 120 provides precise positioning space for the clamping table 105. The fixing plate 108 is installed on the end of the moving shaft 106 away from the throttle 107, and the fixing plate 108 is located at the... The base 101 is positioned at its internal center to ensure smooth rotation of the fixed disk 108 and the moving shaft 106. Depending on the size of the wafer to be processed, the operator rotates the handle 107, causing the moving shaft 106 to rotate. Since the moving shaft 106 is rotatably connected to the fixed disk 108, the fixed disk 108 also rotates. The fixed disk 108 then drives the rotating disk 109, which is rotatably connected to it, to rotate. This adjusts the position of the clamping jaw 110, which is fixed to the side of the rotating disk 109 away from the fixed disk 108. Once the clamping jaw 110 is adjusted to the appropriate position, the wafer is... The semiconductor wafer is placed between the clamping jaws 110. The handle 107 is rotated again to clamp the wafer tightly, ensuring it does not wobble or shift during processing. If the wafer needs to be flipped or its angle adjusted, the operator continues to rotate the handle 107. Through the transmission of the moving shaft 106, the fixed disk 108, and the rotating disk 109, the wafer is flipped. During the flipping process, when the desired angle is reached, positioning is achieved using the positioning hole 103 and the pin 104. The positioning hole 103 is fixedly connected to the base 101. Located inside the mounting groove 120 and on one side of the clamping stage 105, the pin 104 is inserted into the positioning hole 103. The pin 104 is located inside the base 101 and above the mounting groove 120, thereby precisely fixing the angle between the clamping stage 105 and the wafer, ensuring angle stability during processing, and avoiding processing errors caused by angle changes. This effectively solves the problem that existing mechanical clamping devices cannot achieve precise flipping angle control, which easily leads to wafer shaking, displacement, or even damage during flipping, seriously affecting processing quality and production efficiency.

[0026] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Those skilled in the art can understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present utility model are still within the scope of the utility model.

Claims

1. A semiconductor wafer processing clamping and flipping device, comprising a base, characterized in that, It also includes a positioning, clamping, and flipping assembly, which includes a placement groove, a clamping platform, a moving shaft, and a rotary handle. The placement groove is fixedly connected to the base and located at the interior center of the base. The clamping platform is detachably connected to the base and located inside the base, with the clamping platform positioned at the interior center of the placement groove. The moving shaft is rotatably connected to the clamping platform and located above the interior of the clamping platform. The rotary handle is rotatably connected to the moving shaft and located at the end of the moving shaft away from the clamping platform, with the rotary handle positioned on the upper side of the base.

2. The semiconductor wafer processing clamping and flipping device as described in claim 1, characterized in that, The positioning, clamping, and flipping assembly also includes a fixed plate, which is rotatably connected to the moving shaft and located at the end of the moving shaft away from the throttle, and the fixed plate is disposed at the internal center of the base.

3. The semiconductor wafer processing clamping and flipping device as described in claim 2, characterized in that, The positioning, clamping, and flipping assembly further includes a rotating disk and a clamping claw. The rotating disk is rotatably connected to the fixed disk and is located on the side of the fixed disk away from the moving axis. The clamping claw is fixedly connected to the rotating disk and is located on the side of the rotating disk away from the fixed disk.

4. The semiconductor wafer processing clamping and flipping device as described in claim 3, characterized in that, The positioning, clamping, and flipping assembly also includes a material guide groove, which is fixedly connected to the base and located inside the lower part of the base, and is positioned below the clamping claw.

5. The semiconductor wafer processing clamping and flipping device as described in claim 4, characterized in that, The positioning clamping and flipping assembly further includes a positioning hole and a pin. The positioning hole is fixedly connected to the base and located inside the base. The positioning hole is also located inside the placement groove and on one side of the clamping platform. The pin is detachably connected to the base and located inside the base. The pin is also located inside the positioning hole and above the placement groove.

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