Chemical supply machine for semiconductor gluing and developing process

Abstract

The utility model relates to the technical field of semiconductors, and discloses a chemical supply machine for a semiconductor gluing and developing process, which comprises a supply cabinet body, three storage tanks are equidistantly arranged on the supply cabinet body, a stirring mechanism is arranged in each storage tank, operation assemblies are equidistantly arranged at the front part of the supply cabinet body, and the operation assemblies are arranged on the front part of the supply cabinet body. A first tee joint is arranged on the rear portion of each storage tank, the outer side of each first tee joint is connected with a feeding pipe through a pipeline, a feeding flange is arranged at the outer end of each feeding pipe, a mounting plate is arranged in the feeding cabinet body, and a second tee joint is arranged at the bottom of each storage tank. According to the utility model, efficient stirring is realized through transmission of the stirring mechanism and the gear, uniform mixing of chemicals is ensured, the problems of non-uniform stirring and precipitation in the prior art are solved, and the supply stability is improved; a liquid nitrogen protection layer, a heat preservation design and an electrothermal film heating technology are adopted, a temperature control guarantee is provided, and the problem of temperature fluctuation of chemicals in the storage process is solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a chemical supply machine for semiconductor coating and developing processes. Background Technology

[0002] With the continuous development of semiconductor technology, the coating and developing process, as a key process in semiconductor chip manufacturing, requires extremely high precision and stability. During the coating and developing process, the quality, concentration, temperature, and supply quantity of chemicals directly affect the precision and performance of the chips. Therefore, a precise and reliable chemical supply system plays a crucial role in ensuring product quality and improving production efficiency. To meet this demand, the design of chemical supply machines for semiconductor coating and developing processes is gradually developing towards greater efficiency, intelligence, and precise temperature control.

[0003] Existing chemical supply machines for semiconductor coating and developing processes typically consist of multiple storage tanks for storing different types of chemicals, which are supplied to the production line by pumps or gravity. Each storage tank is generally equipped with a stirring mechanism, usually a motor-driven stirrer, to ensure the uniformity of the chemicals and prevent sedimentation.

[0004] Chemical supply machine stirring systems often rely on a single motor drive, which can easily lead to uneven stirring or sedimentation, affecting the stability of chemicals. They also cannot provide low-temperature protection and heating at the same time, resulting in large temperature fluctuations and failing to maintain the optimal storage state of chemicals. To address these issues, a chemical supply machine for semiconductor coating and developing processes is proposed. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a chemical supply machine for semiconductor coating and developing processes. It aims to improve the problems in the prior art where the stirring system of the chemical supply machine mostly relies on a single motor drive, which easily leads to uneven stirring or precipitation, affecting the stability of the chemicals, and cannot provide low-temperature protection and heating at the same time, resulting in large temperature fluctuations and failure to maintain the optimal storage state of the chemicals.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a chemical supply machine for semiconductor coating and developing processes, comprising a supply cabinet, three storage tanks equidistantly arranged in the supply cabinet, each storage tank having a stirring mechanism inside, an operating component equidistantly arranged at the front of the supply cabinet, a T-junction 1 at the rear of each storage tank, the outer side of each T-junction 1 being connected to a feed pipe via a pipe, the outer end of each feed pipe having a feed flange, an installation plate inside the supply cabinet, a T-junction 2 at the bottom of each storage tank, a discharge pipe at the outer end of each T-junction 2, and a discharge flange at the outer end of each discharge pipe;

[0007] As a further description of the above technical solution: the stirring mechanism includes a motor, all of which are mounted on the top of the storage tank. Each motor has a stirring rod at its output end. A gear ring is mounted inside the storage tank. A drive gear is mounted on the top of each stirring rod, and each drive gear meshes with two driven gears. A spiral stirring blade is mounted at the bottom of each driven gear. The bottom of both the stirring rod and the spiral stirring blade are rotatably connected to a cross plate. A ring plate is mounted on the bottom side of the storage tank. A groove is opened on the inner side of each ring plate, and the cross plate slides inside the groove.

[0008] As a further description of the above technical solution: the inner walls of both storage tanks are provided with electric heating films, the outer wall of one of the storage tanks is provided with a liquid nitrogen protective layer, the outside of the liquid nitrogen protective layer is provided with a heat insulation layer, two liquid nitrogen pumps are equidistantly arranged on the top of the mounting plate, the input end of the liquid nitrogen pump is connected to the outlet of the corresponding liquid nitrogen tank through a pipe, the output end of the liquid nitrogen pump is connected to the liquid nitrogen protective layer through a pipe, and the liquid nitrogen tanks are all located on the inner bottom wall of the feeding cabinet;

[0009] As a further description of the above technical solution: the operating component includes operating buttons and a control panel, and a plurality of the operating buttons and the control panel are equidistantly arranged at the front of the feeding cabinet;

[0010] As a further description of the above technical solution: the top of the mounting plate is provided with multiple discharge pumps, the discharge pumps are respectively located on the outside of the discharge pipe, and flow meter one and flow meter two are respectively located on the outside of the inlet pipe and the discharge pipe, and flow meter one and flow meter two are close to tee one and tee two.

[0011] As a further description of the above technical solution: both the outer sides of the three-way valve one and the three-way valve two are provided with manual valves, and the two manual valves are one closed and one open, for manual closing or opening;

[0012] As a further description of the above technical solution: adjustable support legs are provided at the four bottom corners of the feeding cabinet, and transparent tempered glass is provided at the front of the feeding cabinet;

[0013] As a further description of the above technical solution: the rear part of the feeding cabinet is connected to the cabinet door through multiple hinges.

[0014] This utility model has the following beneficial effects:

[0015] 1. This utility model employs a stirring mechanism and gear transmission. Through the meshing of the driving gear and the driven gear, the spiral stirring blades are driven to rotate efficiently, ensuring uniform stirring of chemicals within the storage tank. This achieves the technical effect of efficient stirring and uniform chemical mixing. Compared to the simpler stirring methods in existing technologies, it solves the problems of uneven stirring or unstable effects caused by chemical precipitation, ensuring the accuracy and stability of chemical supply.

[0016] 2. This utility model employs a liquid nitrogen protective layer, insulation design, and electrothermal film heating technology. One storage tank uses a liquid nitrogen pump to supply liquid nitrogen to the liquid nitrogen protective layer, which, in conjunction with an external insulation layer, provides chemical storage in a low-temperature environment. Simultaneously, electrothermal films are installed in two storage tanks to provide heating functionality, ensuring that the chemicals requiring heating can maintain a suitable temperature. By choosing between liquid nitrogen and electrothermal film phases, the problem of performance instability caused by excessively high or low temperatures during chemical storage is solved, ensuring ideal temperature conditions for chemical storage and use. Attached Figure Description

[0017] Figure 1 This is an overall structural diagram of a chemical supply machine for semiconductor coating and developing processes proposed in this utility model;

[0018] Figure 2 This is an unfolded view of a chemical supply machine for a semiconductor coating and developing process proposed in this utility model;

[0019] Figure 3 This is a cross-sectional view of a chemical supply machine for a semiconductor coating and developing process proposed in this utility model;

[0020] Figure 4 for Figure 3 Enlarged detail view of the stirring mechanism in the mid-section view.

[0021] Legend:

[0022] 1. Feeding cabinet; 2. Liquid nitrogen pump; 3. Operation button; 4. Stirring mechanism; 401. Gear ring; 402. Motor; 403. Drive gear; 404. Spiral stirring blade; 405. Driven gear; 406. Stirring rod; 407. Cross plate; 408. Ring plate; 409. Slide groove; 5. Control panel; 6. Transparent tempered glass; 7. Discharge flange; 8. Cabinet door; 9. Storage tank; 10. T-junction 1; 11. Manual valve; 12. Flow meter 1; 13. Feed pipe; 14. Discharge pump; 15. Flow meter 2; 16. T-junction 2; 17. Insulation layer; 18. Liquid nitrogen protective layer; 19. Heating film; 20. Feed flange; 21. Discharge pipe; 22. Mounting plate; 23. Liquid nitrogen pump. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Reference Figures 1-2 This utility model provides an embodiment of a chemical supply machine for semiconductor coating and developing processes, comprising a supply cabinet 1, providing a structure for containing and storing chemicals. Three storage tanks 9 are equidistantly arranged in the supply cabinet 1. These storage tanks 9 are used to store different chemicals and can ensure stable storage between tanks during the chemical supply process, avoiding interference from external factors. Each storage tank 9 is equipped with a stirring mechanism 4, which ensures the uniformity of the chemicals within the tank 9 through stirring, prevents sedimentation, and ensures that the chemicals are not affected by physical changes during use, always maintaining optimal working condition. An operating component is equidistantly arranged at the front of the supply cabinet 1, including operating buttons 3 and a control panel 5, facilitating real-time monitoring and control of the chemical supply process by the operator, ensuring simple and intuitive operation of the equipment. Each storage tank 9 is equipped with a tee 10 at the rear. The outer side of each tee 10 is connected to the feed pipe 13 via a pipe. The outer end of each feed pipe 13 is equipped with a feed flange 20. The inside of the feeding cabinet 1 is equipped with a mounting plate 22. Each storage tank 9 is equipped with a tee 26 at the bottom. The outer end of each tee 26 is equipped with a discharge pipe 21. The outer end of each discharge pipe 21 is equipped with a discharge flange 7. The function of the tee is to connect the pipeline system, allowing for the control of chemical feeding and discharging. By connecting to the feed pipe 13 via a pipe, it ensures that the chemicals in each storage tank 9 can smoothly enter the feeding system. Alternatively, by connecting to the discharge pipe 21, it ensures that the chemicals can be accurately and safely transported to downstream equipment. The flange is used for connection with other equipment to ensure a stable connection and sealing between the feed pipe 13 and the discharge pipe 21, preventing chemical leakage.

[0025] Multiple discharge pumps 14 are installed on the top of the mounting plate 22. The discharge pumps 14 are respectively located on the outside of the discharge pipe 21. Each discharge pump 14 is used to push the chemicals through the discharge pipe 21 to ensure that the required chemicals are output to other process links according to the precise flow rate, avoiding over- or under-supply. Flow meter 12 and flow meter 25 are respectively installed on the outside of the feed pipe 13 and the discharge pipe 21. Flow meter 12 and flow meter 25 are close to T-junction 10 and T-junction 26. Manual valves 11 are installed on the outside of T-junction 10 and T-junction 26. Manual valves 11 allow the flow rate to be manually controlled under specific conditions, providing operational flexibility. The two manual valves 11 are one closed and one open, used for manual closing or opening. The flow meters are used to monitor the feed and discharge flow rates in real time to ensure the accuracy and stability of the supply system.

[0026] The bottom four corners of the feeding cabinet 1 are equipped with adjustable support legs, which can adjust the height of the cabinet according to actual needs. The front of the feeding cabinet 1 is equipped with transparent tempered glass 6, which allows operators to easily observe the state of the chemicals in the storage tank 9 and also provides safety protection to prevent chemical leakage or splashing. The rear of the feeding cabinet 1 is connected to the cabinet door 8 through multiple hinges, which facilitates the inspection and maintenance of the equipment and ensures that the equipment can still be easily inspected and repaired after long-term operation, thereby improving the service life and operating efficiency of the equipment.

[0027] Reference Figures 3-4 The inner walls of both storage tanks 9 are equipped with electric heating films 19, which are used to heat the chemicals in the storage tanks 9 and keep them within a preset temperature range to prevent low temperatures from affecting the stability and effectiveness of the chemicals. One of the storage tanks 9 has a liquid nitrogen protective layer 18 on its outer wall, which provides space for the liquid nitrogen. An insulation layer 17 is provided outside the liquid nitrogen protective layer 18 to further reduce heat loss and improve the effectiveness of the liquid nitrogen, ensuring that the temperature inside the storage tank 9 is always kept within the required low temperature range, thereby extending the storage life of the chemicals. Two liquid nitrogen pumps 23 are equidistantly arranged on the top of the mounting plate 22 to deliver liquid nitrogen into the liquid nitrogen protective layer 18. The input end of the liquid nitrogen pump 23 is connected to the outlet of the corresponding liquid nitrogen tank 2 through a pipe, and the output end of the liquid nitrogen pump 23 is connected to the liquid nitrogen protective layer 18 through a pipe. The liquid nitrogen tanks 2 are all located on the inner bottom wall of the supply cabinet 1.

[0028] The stirring mechanism 4 includes a motor 402, which is mounted on the top of the storage tank 9. Each motor 402 has a stirring rod 406 at its output end. Each storage tank 9 has a toothed ring 401 inside. Each stirring rod 406 has a driving gear 403 at its top, which is connected to two driven gears 405. Each driven gear 405 has a spiral stirring blade 404 at its bottom. The bottoms of the stirring rod 406 and the spiral stirring blade 404 are rotatably connected to a cross plate 407. Each storage tank 9 has an annular plate 408 on its inner bottom side, with a groove 409 on its inner side. The cross plate 407 slides within the groove 409. The motor 402 is mounted on the top of the storage tank 9 and connected to the stirring rod 406 via its output end. The stirring rod 406 drives the spiral stirring blade 404 to stir, ensuring uniform mixing of the chemicals within the storage tank 9.

[0029] Working principle: The chemical supply machine for semiconductor coating and developing processes stores and supplies chemicals between multiple storage tanks 9 through the supply cabinet 1. Each storage tank 9 is equipped with a stirring mechanism 4. The stirring rod 406 is driven by a motor 402, which, together with the drive gear 403 and the driven gear 405, drives the spiral stirring blade 404 to stir, ensuring the uniformity of the chemicals in the storage tank 9 and preventing sedimentation from affecting the performance. The stirring rod 406 is rotatably connected to the spiral stirring blade 404 through a cross plate 407. At the same time, a ring plate 408 is installed on the bottom side of the inside of the storage tank 9 and a slide groove 409 is provided. The cross plate 407 slides in the slide groove 409 to ensure the smooth operation of the stirring mechanism 4.

[0030] To ensure that the chemicals are not affected by temperature changes during storage, the inner walls of the two storage tanks 9 are equipped with electric heating films 19 for heating, so as to ensure that the internal temperature of the storage tanks 9 is maintained within a suitable range and to avoid the impact of excessively low temperatures on the properties of the chemicals. The outer wall of the other storage tank 9 is equipped with a heat insulation layer 17, which can provide thermal insulation protection to ensure that the chemicals in the storage tank 9 remain stable when low-temperature storage is required, and to prevent external temperature changes from affecting the internal temperature. The liquid nitrogen protection layer 18 draws liquid nitrogen into the liquid nitrogen tank 2 through a liquid nitrogen pump 23, and the liquid nitrogen is transported to the liquid nitrogen protection layer 18 through pipelines, effectively reducing the external temperature of the storage tank 9, ensuring that the chemicals in the storage tank 9 have an ideal storage environment at low temperatures, thereby improving the stability and performance of the chemicals.

[0031] To ensure chemical supply, the feed cabinet 1 is equipped with an installation plate 22, on which multiple discharge pumps 14 are mounted to drive chemicals through the discharge pipe 21. Flow meters 12 and 15 are installed on the outside of the feed pipe 13 and discharge pipe 21, respectively. Real-time monitoring of the flow meters ensures the accuracy of chemical supply. T-junctions 10 and 26 on the feed and discharge pipes 21 are controlled by manual valves 11 to open and close the flow rate, and are connected to the feed pipe 13 and discharge pipe 21, allowing for precise regulation of the inflow and outflow of chemicals.

[0032] When manual adjustments are required, the manual valve 11 allows users to adjust the flow direction of the pipeline as needed, thereby ensuring the flexibility and accuracy of the entire supply process. The front of the supply cabinet 1 is equipped with operation buttons 3 and control panel 5 for operating and displaying the supply status of chemicals. The cabinet door 8 is connected to the rear of the supply cabinet 1 through multiple hinges, which facilitates the inspection and maintenance of the equipment.

[0033] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A chemical supply machine for semiconductor coating and developing processes, comprising a supply cabinet (1), characterized in that: The feeding cabinet (1) has three storage tanks (9) arranged at equal intervals. Each storage tank (9) is equipped with a stirring mechanism (4). The front of the feeding cabinet (1) is equipped with operating components at equal intervals. Each storage tank (9) has a T-junction (10) at the rear. The outside of each T-junction (10) is connected to the feed pipe (13) through a pipe. The outer end of each feed pipe (13) is equipped with a feed flange (20). The feeding cabinet (1) has an installation plate (22) inside. Each storage tank (9) has a T-junction (26) at the bottom. The outer end of each T-junction (26) is equipped with a discharge pipe (21). The outer end of each discharge pipe (21) is equipped with a discharge flange (7).

2. The chemical supply machine for semiconductor coating and developing processes according to claim 1, characterized in that: The stirring mechanism (4) includes a motor (402), which is located on the top of the storage tank (9). The output end of the motor (402) is provided with a stirring rod (406). The storage tank (9) is provided with a gear ring (401). The top of the stirring rod (406) is provided with a driving gear (403). The driving gear (403) is meshed with two driven gears (405). The bottom of the driven gear (405) is provided with a spiral stirring blade (404). The bottom of the stirring rod (406) and the spiral stirring blade (404) are rotatably connected to a cross plate (407). The bottom of the storage tank (9) is provided with a ring plate (408). The inner side of the ring plate (408) is provided with a sliding groove (409). The cross plate (407) slides inside the sliding groove (409).

3. The chemical supply machine for semiconductor coating and developing processes according to claim 1, characterized in that: The inner walls of both storage tanks (9) are provided with electric heating film (19), and the outer wall of one of the storage tanks (9) is provided with liquid nitrogen protection layer (18). The outer side of the liquid nitrogen protection layer (18) is provided with heat insulation layer (17). Two liquid nitrogen pumps (23) are equidistantly arranged on the top of the mounting plate (22). The input end of the liquid nitrogen pump (23) is connected to the outlet of the corresponding liquid nitrogen tank (2) through a pipe. The output end of the liquid nitrogen pump (23) is connected to the liquid nitrogen protection layer (18) through a pipe. The liquid nitrogen tanks (2) are all located on the inner bottom wall of the feeding cabinet (1).

4. A chemical supply machine for semiconductor coating and developing processes according to claim 1, characterized in that: The operating components include operating buttons (3) and control panels (5), with multiple operating buttons (3) and control panels (5) equidistantly arranged at the front of the feeding cabinet (1).

5. A chemical supply machine for semiconductor coating and developing processes according to claim 1, characterized in that: The top of the mounting plate (22) is provided with multiple discharge pumps (14), which are respectively located on the outside of the discharge pipe (21). Flow meter one (12) and flow meter two (15) are respectively located on the outside of the inlet pipe (13) and the discharge pipe (21), and the flow meter one (12) and flow meter two (15) are close to the three-way one (10) and three-way two (16).

6. A chemical supply machine for semiconductor coating and developing processes according to claim 1, characterized in that: Both the outer sides of the three-way one (10) and the three-way two (16) are equipped with manual valves (11), and the two manual valves (11) are one closed and one open, for manual closing or opening.

7. A chemical supply machine for semiconductor coating and developing processes according to claim 1, characterized in that: The bottom four corners of the feeding cabinet (1) are provided with adjustable support legs, and the front of the feeding cabinet (1) is provided with transparent tempered glass (6).

8. A chemical supply machine for semiconductor coating and developing processes according to claim 1, characterized in that: The rear of the feeding cabinet (1) is connected to the cabinet door (8) by multiple hinges.

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