Liquid supply system and semiconductor equipment

Abstract

The utility model provides a liquid supply system and semiconductor equipment, the liquid supply system comprises a tank body, a filter, a pipeline and an ultrasonic generation device, the tank body is used for containing liquid, the pipeline is communicated with the tank body and the filter and used for enabling the liquid to flow from the tank body to the filter, and the filter is used for filtering the liquid. At least part of the pipeline is located in the inner space of the ultrasonic generating device, the ultrasonic generating device can generate ultrasonic waves, the ultrasonic waves can eliminate bubbles in liquid, and the bubbles are eliminated before the liquid enters the filter, so that the situation that the bubbles are broken to cause breakage of a filter membrane and damage to the filter is avoided; furthermore, the replacement period of the filter can be prolonged, the process cost is reduced, and the stability of the liquid flow can be improved. Meanwhile, under the action of ultrasonic defoaming, the influence of bubble accumulation on the temperature detection accuracy is avoided, real-time power adjustment is carried out in cooperation with a heating device, and stable temperature control over liquid can be achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor equipment, in particular to a liquid supply system and a semiconductor equipment. BACKGROUND

[0002] In a wet process equipment, a liquid supply system is often used to provide a reaction chamber with a liquid, such as a chemical liquid, so as to complete a process such as cleaning, etching, surface modification, etc.

[0003] In the related art, the chemical liquid flows out of a tank, is filtered by a filter, and is then transmitted to a reaction chamber for use.

[0004] The chemical liquid is prone to bubbles due to the physicochemical properties of its components. The pore size of the filter membrane of the filter is extremely small, at the nanometer level. When the bubbles in the chemical liquid burst, they will generate a certain impact force on the filter membrane, causing the filter membrane to rupture and damaging the filter. SUMMARY

[0005] Therefore, the present application aims to provide a liquid supply system and a semiconductor equipment, which can avoid damaging the filter, thereby prolonging the replacement cycle of the filter, reducing the process cost, improving the stability of the liquid flow, and avoiding the accumulation of bubbles affecting the dynamic temperature control of the liquid.

[0006] In one aspect, the present application provides a liquid supply system, which comprises:

[0007] a tank and a filter; the tank is used to hold a liquid, and the filter is used to filter the liquid;

[0008] a pipeline in communication with the tank and the filter; the pipeline is used to make the liquid flow from the tank to the filter;

[0009] an ultrasonic wave generating device; at least part of the pipeline is located in the internal space of the ultrasonic wave generating device; the ultrasonic wave generating device is used to generate ultrasonic waves.

[0010] In one possible implementation, the liquid supply system further comprises a temperature detection device.

[0011] The temperature detection device is located in the internal space of the pipeline and is used to detect the temperature of the liquid.

[0012] In one possible implementation, the pipeline comprises a first pipeline.

[0013] The first pipeline is located between the temperature detection device and the filter.

[0014] At least part of the first pipeline is located in an internal space of the ultrasonic wave generating device.

[0015] In a possible implementation, the pipeline further comprises a second pipeline;

[0016] The second pipeline is located between the tank body and the temperature detecting device;

[0017] At least part of the second pipeline is located in an internal space of the ultrasonic wave generating device.

[0018] In a possible implementation, the pipeline comprises a third pipeline;

[0019] The temperature detecting device is located in an internal space of the third pipeline;

[0020] The third pipeline is located in an internal space of the ultrasonic wave generating device.

[0021] In a possible implementation, at least part of the pipeline located in the internal space of the ultrasonic wave generating device is a target pipeline, and the liquid supply system further comprises at least one fluid baffle member;

[0022] The fluid baffle member is located on an inner wall of the target pipeline.

[0023] In a possible implementation, the target pipeline has a target direction, and the target direction is from an inflow port of the target pipeline to an outflow port of the target pipeline;

[0024] An angle between a surface of the fluid baffle member and the target direction is less than 90°.

[0025] In a possible implementation, the liquid supply system further comprises a fixing member;

[0026] The fixing member connects the target pipeline and the ultrasonic wave generating device, and is used for fixing the target pipeline.

[0027] In a possible implementation, the liquid supply system further comprises a heating device;

[0028] The heating device is located in an internal space of the pipeline, and the heating device is used for heating liquid.

[0029] In another aspect, an embodiment of the present application further provides a semiconductor device, which comprises:

[0030] The liquid supply system;

[0031] a reaction chamber, the liquid supply system being in communication with the reaction chamber, the liquid supply system being configured to supply the liquid to the reaction chamber.

[0032] The embodiment of the present application provides a liquid supply system and a semiconductor device, the liquid supply system comprises a tank, a filter, a pipeline and an ultrasonic wave generating device, the tank is used for containing liquid, the pipeline is in communication between the tank and the filter, and is used for flowing the liquid from the tank to the filter, and the filter is used for filtering the liquid. At least part of the pipeline is located in the internal space of the ultrasonic wave generating device, because the ultrasonic wave generating device can generate ultrasonic waves, the ultrasonic waves act on the liquid through the pipeline, when the ultrasonic waves propagate in the liquid, strong vibration is generated, high-intensity local molecular motion and shear force are generated in the liquid, the bubbles in the liquid are eliminated, the bubbles are eliminated before the liquid enters the filter, so that the filter membrane is prevented from being broken due to the rupture of the bubbles, damage to the filter is avoided, and the replacement cycle of the filter can be prolonged, process cost is reduced, the stability of liquid flow is improved, and the influence of bubble accumulation on dynamic temperature control of the liquid is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0034] Figure 1 A structure schematic diagram of a liquid supply system provided by an embodiment of the present application is shown;

[0035] Figure 2 A structure schematic diagram of another liquid supply system provided by an embodiment of the present application is shown;

[0036] Figure 3 A structure schematic diagram of another liquid supply system provided by an embodiment of the present application is shown;

[0037] Figure 4 A structure schematic diagram of another liquid supply system provided by an embodiment of the present application is shown;

[0038] Figure 5 An internal schematic diagram of an ultrasonic wave generating device provided by an embodiment of the present application is shown;

[0039] Figure 6 A structure schematic diagram of a semiconductor device provided by an embodiment of the present application is shown. DETAILED DESCRIPTION

[0040] In order to make the above objectives, characteristics and advantages of the present application more apparent, a detailed description of the specific embodiments of the present application will be given below with reference to the drawings.

[0041] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in other ways not described herein, and it is understood that similar modifications can be made without departing from the scope of the present application, and it is therefore understood that the present application is not limited to the specific embodiments disclosed below.

[0042] Secondly, the present application is described in detail in combination with the schematic diagram, and in the detailed description of the embodiments of the present application, the sectional view of the device structure is partially enlarged without the general proportion for the convenience of description, and the schematic diagram is only an example, which should not limit the scope of protection of the present application herein. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in the actual manufacture.

[0043] As described in the background, the gas bubbles in the chemical liquid will generate a certain impact force on the filter membrane when they break, which will cause the filter membrane to break and damage the filter.

[0044] Based on the above technical problems, the embodiments of the present application provide a liquid supply system and a semiconductor equipment, the liquid supply system comprises a tank, a filter, a pipeline and an ultrasonic wave generating device, the tank is used for containing liquid, the pipeline is connected between the tank and the filter, and is used for making the liquid flow from the tank to the filter, and the filter is used for filtering the liquid. At least part of the pipeline is located in the internal space of the ultrasonic wave generating device. Since the ultrasonic wave generating device can generate ultrasonic waves, the ultrasonic waves act on the liquid through the pipeline, and the ultrasonic waves generate strong vibration when they propagate in the liquid, which generates high-intensity local molecular motion and shear force in the liquid, so as to eliminate the gas bubbles in the liquid. The gas bubbles are eliminated before the liquid enters the filter, so as to avoid the breakage of the filter membrane caused by the breakage of the gas bubbles, avoid the damage to the filter, and further prolong the replacement period of the filter, reduce the process cost, improve the stability of the liquid flow, and avoid the influence of the accumulation of the gas bubbles on the dynamic temperature control of the liquid.

[0045] In order to facilitate understanding, the liquid supply system and the semiconductor equipment provided by the embodiments of the present application will be described in detail below with reference to the drawings.

[0046] Reference Figure 1 As shown in the figure, the liquid supply system provided by the embodiments of the present application can comprise a tank 101, a filter 102, a pipeline 103 connected between the tank 101 and the filter 102, and an ultrasonic wave generating device 104.

[0047] The tank 101 is used to hold liquid, and can be a square tank or a circular tank. The liquid held can be water or other chemical liquid, such as SC1, SC2, SPM, etc. SC1 is a mixture of ammonia and hydrogen peroxide, SC2 is a mixture of hydrochloric acid and hydrogen peroxide, and SPM is a mixture of sulfuric acid and hydrogen peroxide.

[0048] The filter 102 is used to filter the liquid, and has a filter membrane with extremely small pore size in the filter 102. The pore size of the filter membrane is in nanometer level, usually several nanometers. The filtered liquid can be transmitted backward, such as to the reaction cavity, to achieve cleaning, etching, surface modification, etc.

[0049] The tank 101 and the filter 102 are connected through the pipeline 103, which is used to make the liquid flow from the tank 101 to the filter 102, i.e. the liquid flows out of the tank 101, is transmitted in the pipeline 103, and flows to the filter 102. Figure 1 The arrow shown in the figure is the flow direction of the liquid. The shape and material of the pipeline 103 are not limited here, which can be a circular pipeline 103 or a square pipeline 103.

[0050] At least part of the pipeline 103 is located in the internal space of the ultrasonic wave generating device 104, which is a device capable of generating ultrasonic waves and is used to generate ultrasonic waves. As shown in Figure 1 Part of the pipeline 103 is located in the internal space of the ultrasonic wave generating device 104.

[0051] The liquid held in the tank 101 can generate bubbles due to various reasons, such as the physical and chemical properties of the liquid composition, or due to the local low pressure area generated in the pipeline 103 by the circulating pump 109, which further generates bubbles.

[0052] The bubbles will be transmitted to the filter 102 together with the liquid, causing damage to the filter membrane. By placing the pipeline 103 inside the ultrasonic wave generating device 104, the ultrasonic waves act on the liquid through the pipeline 103, and the ultrasonic waves generate strong vibration when propagating in the liquid, which generates high-intensity local molecular motion and shear force in the liquid, achieving elimination of bubbles in the liquid. That is, the bubbles are eliminated by penetration and reflection of ultrasonic waves, and the bubbles are eliminated before the liquid enters the filter 102, thereby avoiding the rupture of the filter membrane caused by the rupture of the bubbles and avoiding damage to the filter 102. Compared with shortening the replacement cycle of the filter 102 to ensure normal use of the filter 102, the present scheme can prolong the replacement cycle of the filter 102, reduce the process cost, and improve the stability of the liquid flow.

[0053] In the actual process, since the filter 102 is damaged quickly, a shorter filter 102 replacement cycle is required, and the filter 102 is expected to be replaced every 1-2 months. The present solution introduces the ultrasonic wave generating device 104 to eliminate bubbles, so that the replacement cycle of the filter 102 can be extended to 6 months, greatly reducing the cost of filter 102 replacement and reducing the process cost.

[0054] In addition, all the pipelines 103 can also be located inside the ultrasonic wave generating device 104, so as to eliminate bubbles in the entire pipeline 103 and further reduce damage to the filter 102.

[0055] In a possible implementation, the liquid supply system further includes a temperature detection device 105 located in the internal space of the pipeline 103, configured to detect the temperature of the liquid.

[0056] The temperature detection device 105 can be a temperature sensor, for example, so as to realize temperature measurement. By arranging the temperature detection device 105 inside the pipeline 103, the temperature detection device 105 can be directly in contact with the liquid, so that the detection of the liquid temperature is more accurate, so as to control the liquid temperature accordingly. Figure 2 As shown in the figure, the temperature detection device 105 is located inside the pipeline 103.

[0057] In a possible implementation, the pipeline 103 includes a first pipeline 1031; the first pipeline 1031 is located between the temperature detection device 105 and the filter 102; at least part of the first pipeline 1031 is located in the internal space of the ultrasonic wave generating device 104.

[0058] Specifically, the pipeline 103 can be divided into several sections, and a section of the pipeline 103 located between the temperature detection device 105 and the filter 102 is denoted as the first pipeline 1031, as shown in the figure. Figure 2 As shown in the figure, the pipeline 103 in the dashed box in the figure is the first pipeline 1031.

[0059] Further, at least part of the first pipeline 1031 can be arranged in the internal space of the ultrasonic wave generating device 104, for example, a section of the first pipeline 1031 can be arranged in the ultrasonic wave generating device 104, or all of the first pipeline 1031 can be arranged in the ultrasonic wave generating device 104.

[0060] In this way, since the first pipeline 1031 is closer to the filter 102, the bubbles in the first pipeline 1031 are eliminated by the ultrasonic wave generating device 104, so as to ensure that the liquid entering the filter 102 is basically free of bubbles, and the filter 102 is further protected from being damaged.

[0061] In a possible implementation, the pipeline 103 can further include a second pipeline 1032; the second pipeline 1032 is located between the tank 101 and the temperature detection device 105; at least part of the second pipeline 1032 is located in the internal space of the ultrasonic wave generating device 104.

[0062] Specifically, a section of the pipeline 103 between the tank 101 and the temperature detection device 105 is recorded as the second pipeline 1032, as shown in Figure 3 the pipeline 103 in the dashed box in the figure is the second pipeline 1032. At least part of the second pipeline 1032 can be arranged in the internal space of the ultrasonic wave generating device 104, for example, a section of the second pipeline 1032 can be arranged in the ultrasonic wave generating device 104, or the entire second pipeline 1032 can be arranged in the ultrasonic wave generating device 104.

[0063] In this way, since the bubbles will affect the temperature detection result of the temperature detection device 105, resulting in an inaccurate measured temperature value, the second pipeline 1032 is arranged in the internal space of the ultrasonic wave generating device 104, so that the liquid is basically free of bubbles before flowing through the temperature detection device 105, thereby ensuring that the temperature detection device 105 can be in contact with the liquid rather than the bubbles, improving the accuracy of temperature detection, and facilitating subsequent accurate temperature control of the liquid. In addition, the elimination of bubbles in the pipeline 103 can avoid damage to the filter 102, and achieve the protection effect of the filter 102.

[0064] In a possible implementation, the pipeline 103 includes a third pipeline 1033; the temperature detection device 105 is located in the internal space of the third pipeline 1033; and the third pipeline 1033 is located in the internal space of the ultrasonic wave generating device 104.

[0065] Specifically, a section of the pipeline 103 before and after the temperature detection device 105 can be recorded as the third pipeline 1033, as shown in Figure 4 the pipeline 103 in the dashed box is the third pipeline 1033, and the temperature detection device 105 is located in the third pipeline 1033. In addition, the length of the third pipeline 1033 can also be as long as possible, for example, the third pipeline 1033 is the entire pipeline 103, and the third pipeline 1033 is the entire pipeline 103 between the end face of the tank 101 and the inlet of the filter 102.

[0066] By arranging the third pipeline 1033 in the internal space of the ultrasonic wave generating device 104, the position of the temperature detection device 105 does not need to be considered, so that the elimination of bubbles in the entire pipeline 103 can be realized, and the process design is also simplified, that is, the entire pipeline 103 can be directly placed in the internal space of the ultrasonic wave generating device 104, which is more convenient to operate and reduces the complexity of operation.

[0067] In a possible implementation, at least part of the pipeline 103 located in the internal space of the ultrasonic wave generating device 104 is a target pipeline 1034, and the liquid supply system further comprises at least one fluid baffle piece 106; the fluid baffle piece 106 is located on the inner wall of the target pipeline 1034.

[0068] Specifically, the pipeline 103 placed inside the ultrasonic wave generating device 104 can be recorded as the target pipeline 1034, and the fluid baffle piece 106 can be arranged on the inner wall of the target pipeline 1034. The fluid baffle piece 106 can be one or more. For example, the fluid baffle piece 106 can be a flat plate, and the material of the flat plate is not limited. Referring to Figure 5 As shown, six fluid baffle pieces 106 are arranged on the inner wall of the target pipeline 1034, of which three are arranged on the bottom wall and the other three are arranged on the top wall. In addition, when the fluid baffle piece 106 is multiple, it can be distributed as evenly as possible, and of course it can also be unevenly distributed.

[0069] In this way, after the ultrasonic wave generating device 104 generates ultrasonic waves, the ultrasonic waves are transmitted to the liquid through the inner wall of the target pipeline 1034 and the fluid baffle piece 106, and act on the liquid. The fluid baffle piece 106 can achieve efficient mechanical transmission, that is, not only the vibration effect of the ultrasonic waves can be transmitted through the inner wall of the target pipeline 1034, but also the vibration can be transmitted based on the fluid baffle piece 106, so that the ultrasonic waves can act on the liquid more and eliminate more bubbles, and further protect the filter 102.

[0070] In a possible implementation, the target pipeline 1034 has a target direction, the target direction is from the inflow port of the target pipeline 1034 to the outflow port of the target pipeline 1034; and the angle between the surface of the fluid baffle piece 106 and the target direction is less than 90°.

[0071] Specifically, the target direction is the transmission direction of the liquid in the target pipeline 1034, that is, the direction from the inflow port to the outflow port. In Figure 5 In the arrow direction is the target direction, and the target direction is from left to right. The angle between the surface of the fluid baffle piece 106 and the target direction can be recorded as a, and a < 90°.

[0072] In this way, the inclined direction of the fluid baffle piece 106 can be as parallel as possible to the target direction, so as not to hinder the flow of the liquid when transmitting the vibration effect of the ultrasonic waves, that is, the fluid baffle piece 106 is arranged along the direction of the liquid flow, so as to guarantee the normal flow of the liquid and improve the flow stability.

[0073] In a possible implementation, the liquid supply system further includes a fixing member 107; the fixing member 107 is connected to the target pipeline 1034 and the ultrasonic wave generating device 104, and is configured to fix the target pipeline 1034.

[0074] The fixing member 107 can be configured to fix the target pipeline 1034 in the ultrasonic wave generating device 104, so as to avoid movement of the target pipeline 1034 and ensure that the entire pipeline 103 can be stably and firmly connected between the tank 101 and the filter 102. Figure 5 As shown, the target pipeline 1034 and the ultrasonic wave generating device 104 are connected by two fixing members 107.

[0075] In a possible implementation, the liquid supply system further includes a heating device 108; the heating device 108 is located in the internal space of the pipeline 103; and the heating device 108 is configured to heat the liquid.

[0076] Specifically, after measuring the temperature value, the temperature detection device 105 can feed back the temperature value to the heating device 108 in real time, so as to realize accurate dynamic temperature control. The heating device 108 can heat the liquid based on the temperature value, so as to realize control of the temperature of the liquid, thereby avoiding the influence of bubble accumulation on dynamic temperature control of the liquid. Figure 6 As shown, the heating device 108 is located in the pipeline 103 between the temperature detection device 105 and the filter 102.

[0077] In addition, the liquid supply system can further include a circulating pump 109; the circulating pump 109 is located in the pipeline 103 and is configured to extract the liquid. The liquid supply system can further include a three-way valve 110; the three-way valve 110 is configured to control the flow direction of the liquid. The three-way valve 110 can control the liquid to flow to the reaction chamber 201 through the fourth pipeline 115 and the fifth pipeline 114 after flowing out of the filter 102. The three-way valve 110 can also control the liquid to flow to the tank 101 through the fourth pipeline 115 and the sixth pipeline 113 after flowing out of the filter 102, for example, when the liquid is not needed in the reaction chamber 201.

[0078] The liquid supply system can further include a pre-tank 111, configured to contain one or more liquids, so that the liquid flows from the pre-tank 111 to the tank 101. The liquid supply system can further include a discharge tank 112, configured to discharge the liquid in the tank 101.

[0079] The embodiments of the present application further provide a semiconductor device, as shown in Figure 6As shown, the semiconductor equipment includes a liquid supply system 100 and a reaction chamber 201, the liquid supply system 100 is in communication with the reaction chamber 201, and the liquid supply system 100 is used to provide liquid to the reaction chamber 201, so that the reaction chamber 201 can carry out a wet process. Ultrasonic waves act on the liquid through the pipeline, and the ultrasonic waves produce strong vibration when propagating in the liquid, generating high-intensity local molecular motion and shear force in the liquid, achieving the elimination of bubbles in the liquid, eliminating bubbles before the liquid enters the filter, thereby avoiding the rupture of the filter membrane caused by the rupture of the bubbles, avoiding damage to the filter, and thus the replacement cycle of the filter can be extended, reducing the process cost, and also improving the stability of the liquid flow, while avoiding the accumulation of bubbles affecting the dynamic temperature control of the liquid.

[0080] Each of the embodiments in the specification is described in a progressive manner, and the same and similar parts between the embodiments can be referred to each other, and each embodiment focuses on the difference from other embodiments. In particular, for the semiconductor equipment embodiment, since it is basically similar to the liquid supply system embodiment, it is described relatively simply, and the relevant parts can be referred to the part of the liquid supply system embodiment.

[0081] The above is only the preferred embodiment of the present application, although the present application has been disclosed as above, however, it is not intended to limit the present application. Any skilled person in the art, without departing from the scope of the technical scheme of the present application, can make many possible changes and modifications to the technical scheme of the present application by using the disclosed methods and technical contents, or modify equivalent embodiments with equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application, without departing from the content of the technical scheme of the present application, still belongs to the scope of protection of the technical scheme of the present application.

Claims

1. A liquid supply system characterized by comprising: The liquid supply system comprises: a tank for containing liquid, and a filter for filtering the liquid; a pipeline for flowing the liquid from the tank to the filter; an ultrasonic wave generating device, at least part of the pipeline being located in an internal space of the ultrasonic wave generating device, the ultrasonic wave generating device being used for generating ultrasonic waves.

2. The liquid supply system according to claim 1, wherein The liquid supply system further comprises a temperature detecting device; the temperature detecting device being located in an internal space of the pipeline, and being used for detecting the temperature of the liquid.

3. The liquid supply system according to claim 2, wherein The pipeline comprises a first pipeline; the first pipeline being located between the temperature detecting device and the filter; at least part of the first pipeline being located in the internal space of the ultrasonic wave generating device.

4. The liquid supply system according to claim 2 or 3, wherein The pipeline further comprises a second pipeline; the second pipeline being located between the tank and the temperature detecting device; at least part of the second pipeline being located in the internal space of the ultrasonic wave generating device.

5. The liquid supply system according to claim 2, wherein The pipeline comprises a third pipeline; the temperature detecting device being located in an internal space of the third pipeline; the third pipeline being located in the internal space of the ultrasonic wave generating device.

6. The liquid supply system according to claim 1, wherein At least part of the pipeline located in the internal space of the ultrasonic wave generating device is a target pipeline, and the liquid supply system further comprises at least one fluid baffle member; the fluid baffle member being located on an inner wall of the target pipeline.

7. The liquid supply system according to claim 6, wherein The target pipeline has a target direction, the target direction being from an inflow port of the target pipeline to an outflow port of the target pipeline; an angle between a surface of the fluid baffle member and the target direction is less than 90°.

8. The liquid supply system according to claim 6, wherein The liquid supply system further comprises a fixing member; the fixing member connecting the target pipeline and the ultrasonic wave generating device, and being used for fixing the target pipeline.

9. The liquid supply system according to claim 1, wherein The liquid supply system further comprises a heating device; the heating device being located in an internal space of the pipeline, and being used for heating the liquid.

10. A semiconductor device, characterized by comprising: The semiconductor device comprises: the liquid supply system according to any one of claims 1-9; a reaction chamber, the liquid supply system being in communication with the reaction chamber, and the liquid supply system being used for providing the liquid to the reaction chamber.

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