Silicon wafer bearing box and silicon wafer cleaning equipment
By designing a silicon wafer carrier box with an inclined receiving groove, comprehensive cleaning and overall drying of the front edge of the silicon wafer were achieved, solving the problem of insufficient cleaning of the silicon wafer edge and improving the quality of photovoltaic products.
Patent Information
- Application Number
- CN202422554792.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-22
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2034-10-22
AI Technical Summary
Existing silicon wafer carrier designs result in insufficient cleaning or drying of the silicon wafer edges, affecting the yield of photovoltaic products.
Design a silicon wafer carrier box with an inclined receiving groove that is wider than the thickness of the silicon wafer. The silicon wafer is inserted at an angle to prevent the edges from sticking together. It is thoroughly rinsed with chemical solution and water and kept dry throughout the drying process.
This improved the uniformity and drying of silicon wafer cleaning, reduced appearance defects at the edges, and increased the yield of photovoltaic products.
Smart Images
Figure CN223789039U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of photovoltaic manufacturing technology, specifically to a silicon wafer carrier and a silicon wafer cleaning device. Background Technology
[0002] In related technologies, photovoltaic silicon wafers need to be cleaned before use and assembly. The cleanliness of the silicon wafers affects the yield of subsequent photovoltaic products (such as monocrystalline silicon solar cells). When cleaning silicon wafers, they are usually placed in the groove of a carrier box and then subjected to chemical cleaning, pure water spraying, and drying to clean the front side of the silicon wafer. However, the groove of the existing carrier box for placing silicon wafers is usually designed to extend vertically. During the cleaning or movement of the silicon wafer with the carrier box, the edge of the front side of the silicon wafer usually adheres to the inside of the groove of the carrier box, which can easily lead to insufficient cleaning or drying of the silicon wafer edge, resulting in poor appearance at the edge of the silicon wafer and affecting the product yield. Utility Model Content
[0003] The purpose of this disclosure is to provide a silicon wafer carrier and a silicon wafer cleaning device that can prevent the edge of the front side of the silicon wafer from adhering to the groove of the carrier when carrying and cleaning the silicon wafer, thereby reducing the occurrence of poor appearance at the edge of the silicon wafer and at least partially solving the above-mentioned technical problems.
[0004] To achieve the above objectives, the first aspect of this disclosure provides a silicon wafer carrier box, including a box body with a top opening, wherein two opposite side walls of the box body are provided with a plurality of partitions, the plurality of partitions enclosing the side walls to form a plurality of receiving grooves for receiving silicon wafers, the plurality of partitions extending obliquely from the top of the box body toward the bottom of the box body to form a plurality of receiving grooves oblique to the extending direction relative to the side walls, the width of the receiving grooves being greater than the thickness of the silicon wafers.
[0005] Optionally, the plurality of receiving slots are parallel to each other, and the angle between the extending direction of the receiving slots and the extending direction of the box body from the top to the bottom is 5° to 15°.
[0006] Optionally, the partition includes a first segment, a second segment, and a third segment connected sequentially from the top of the box towards the bottom. In the extending direction from the top of the box towards the bottom, the two second segments of the opposite two sidewalls of the box extend obliquely and are close to each other.
[0007] Optionally, the outer wall of the box body is provided with a flange.
[0008] Optionally, the flange is constructed as a U-shaped structure with an opening facing the bottom of the box.
[0009] Optionally, the two side walls of the box body are connected with a front wall and a rear wall, and the front wall and the rear wall are respectively provided with a first opening and a second opening.
[0010] Optionally, the first opening and the second opening are different in shape.
[0011] Optionally, the bottom of the box body is provided with a bottom opening, and the bottom of the side wall is provided with a limiting groove.
[0012] Optionally, the limiting grooves are multiple and arranged along the two side walls of the box body.
[0013] In a second aspect of the present disclosure, a silicon wafer cleaning device is provided, comprising the silicon wafer carrying box according to any one of the optional solutions.
[0014] According to the above technical solution, i.e., the silicon wafer carrying box provided by the present disclosure, when the silicon wafer needs to be carried and cleaned, the front surface of the silicon wafer can be tilted upward in advance and inserted along the extension direction of the accommodating groove. Since the width of the accommodating groove is greater than the thickness of the silicon wafer, the edge of the front surface of the silicon wafer will not be attached to the partition member at the position where the front surface of the silicon wafer is tilted upward. When the front surface of the silicon wafer is cleaned, the center position and the edge of the front surface of the silicon wafer can be fully flushed by chemical liquid or clean water, and the entire front surface of the silicon wafer can be dried in the subsequent drying process. In addition, during the transportation process of the silicon wafer carrying box after the silicon wafer is cleaned, the tilted accommodating groove can prevent the front surface of the silicon wafer from being attached to the partition member. Through the above steps, the appearance of the silicon wafer at the edge position can be improved.
[0015] Other features and advantages of the present disclosure will be described in detail in the following specific embodiments. BRIEF DESCRIPTION OF DRAWINGS
[0016] The accompanying drawings are included to provide a further understanding of the present disclosure and constitute a part of the specification, and together with the specific embodiments below, serve to explain the present disclosure, but do not constitute a limitation on the present disclosure. In the drawings:
[0017] Figure 1 is a perspective view of the silicon wafer carrying box provided in the exemplary embodiment of the present disclosure;
[0018] Figure 2 is a left view of the silicon wafer carrying box provided in the exemplary embodiment of the present disclosure;
[0019] Figure 3 is a front view of the silicon wafer carrying box provided in the exemplary embodiment of the present disclosure.
[0020] LIST OF ELEMENTS
[0021] 1 - box; 110 - partition; 111 - first section; 112 - second section; 113 - third section; 120 - containing groove; 130 - flange portion; 140 - first opening; 150 - second opening; 160 - limiting groove. DETAILED DESCRIPTION
[0022] The specific embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely intended to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.
[0023] In the present disclosure, the orientation words such as "inner, outer" used without the opposite description refer to the inner and outer relative to the outline of the component or structure itself; "first, second" and the like are to distinguish one element from another element, and do not have sequentiality and importance, and in addition, the same reference numerals in different reference drawings represent the same elements.
[0024] In a first aspect of the present disclosure, a silicon wafer carrying box is provided, referring to Figures 1 to 3 As shown in the figure, the silicon wafer carrying box comprises a top-opened box 1, and a plurality of partitions 110 are arranged on the opposite two side walls of the box 1, and the plurality of partitions 110 enclose a plurality of containing grooves 120 for containing silicon wafers on the side walls, and the partitions 110 extend obliquely from the top of the box 1 to the bottom of the box 1 to form a plurality of containing grooves 120 obliquely relative to the extension direction of the side wall, and the width of the containing groove 120 is greater than the thickness of the silicon wafer.
[0025] Through the above technical solution, i.e. the silicon wafer carrying box provided by the present disclosure, when the silicon wafer needs to be carried and cleaned, the front surface of the silicon wafer can be obliquely upwardly inserted along the extension direction of the containing groove 120 in advance, and since the width of the containing groove 120 is greater than the thickness of the silicon wafer, the edge of the front surface of the silicon wafer will not be attached to the partition 110 forming the containing groove 120 at the position where the front surface of the silicon wafer is obliquely upwardly, and when the front surface of the silicon wafer is cleaned, the central position and the edge of the front surface of the silicon wafer can also be fully washed by chemical liquid or clean water, and the whole front surface of the silicon wafer can also be dried in the subsequent drying process, in addition, the oblique containing groove 120 can also prevent the front surface of the silicon wafer from being attached to the partition 110 during the subsequent movement and transportation process of the silicon wafer carrying box, and through the above steps, the appearance of the silicon wafer at the edge position can be prevented from being poor due to insufficient cleaning or attachment to the groove inside the carrying box during the movement process.
[0026] It should be noted that the partition 110 mentioned in the above embodiments can be any suitable structure capable of forming a plurality of oblique containing grooves 120, for example, referring to Figure 1As shown, the partition member 110 can be a plurality of partition strips extending obliquely from the top of the box body 1 towards the bottom of the box body 1, and any two adjacent partition strips can form a containing groove 120 for containing a silicon wafer. In addition, the containing groove 120 can also be configured as a groove directly excavated on the two side walls of the box body 1, so as to be capable of containing a silicon wafer. The present disclosure does not make specific limitations in this regard.
[0027] In some embodiments, with reference to Figures 1 to 3 As shown, the plurality of containing grooves 120 are parallel to each other, and the angle between the extension direction of the containing groove 120 and the extension direction of the box body 1 from the top to the bottom is 5° to 15°. In this way, the plurality of containing grooves 120 can keep the plurality of silicon wafers contained therein at the same angle of inclination, thereby ensuring the consistency of the cleaning degree of the plurality of silicon wafers when the plurality of silicon wafers are cleaned, with reference to Figure 2 As shown, the angle between the extension direction of the containing groove 120 and the extension direction of the box body 1 from the top to the bottom is 5° to 15°, that is, the angle between the extension direction of the plurality of containing grooves 120 and the height direction of the box body 1 is 5° to 15°. Under the inclination limitation of this range of angles, when the silicon wafer is obliquely inserted into the containing groove 120 and is washed by chemical agents or clean water, the front surface of the obliquely positioned silicon wafer in the box body 1 can be at least partially exposed, facilitating the cleaning of the silicon wafer, and the chemical agents or clean water can slide down the inclined silicon wafer more quickly, thereby reducing the residue of the chemical agents or clean water on the surface of the silicon wafer and improving the cleanliness of the cleaning process of the silicon wafer.
[0028] In some embodiments, with reference to Figures 1 to 3 As shown, the partition member 110 includes a first segment 111, a second segment 112 and a third segment 113 connected in sequence from the top to the bottom of the box body 1. In the extension direction from the top to the bottom of the box body 1, the two second segments 112 of the opposite two side walls of the box body 1 extend obliquely and approach each other. In this way, in the direction from the top to the bottom of the box body 1, the two first segments 111 of the two side walls are farthest apart, the two second segments 112 are in a posture of approaching each other, and the two third segments 113 are closest, that is Figure 1 As shown, the effect is that the two second segments 112 can better position the silicon wafer through the first segment 111, the second segment 112 and the third segment 113 when the silicon wafer is contained in the containing groove 120, thereby preventing the silicon wafer from falling out of the containing groove 120.
[0029] In some embodiments, with reference to Figures 1 to 3As shown, the outer side wall of the box body 1 is provided with a flange portion 130. In this way, the flange portion can be used for the external clamping device, such as a mechanical hand or the like, to clamp the box body 1, thereby facilitating the movement of the silicon wafer carrying box. For example, when the silicon wafer is cleaned, the silicon wafer carrying box needs to carry the silicon wafer to move on multiple production lines. For example, it needs to be moved to a chemical cleaning production line first, and the chemical agent is used to clean the surface of the silicon wafer. After the chemical agent is sprayed, the silicon wafer carrying box needs to be moved to a water spraying production line, and the chemical agent on the surface of the silicon wafer is sprayed to wash it clean. After washing, the silicon wafer carrying box needs to be moved to a drying production line to dry the silicon wafer before it can be used. The above movement of the silicon wafer needs to be driven by the external clamping device such as the mechanical hand to move the silicon wafer carrying box. When the box body 1 of the silicon wafer carrying box is moved, the mechanical hand can be clamped on the flange portion 130 of the outer side wall of the box body 1, thereby more stably clamping the box body 1 for movement.
[0030] In some embodiments, with reference to Figures 1 to 3 As shown, the flange portion 130 is configured as a U-shaped structure with the opening facing the bottom of the box body 1. In this way, when the box body 1 needs to be clamped, the external clamping device such as the mechanical hand can be clamped in the two U-shaped structures. When the mechanical hand is inserted into the two U-shaped structures, the U-shaped structure with the opening facing the bottom of the box body 1 can prevent the mechanical hand from being separated from the box body 1, that is, the mechanical hand can be stably inserted into the inner groove of the U-shaped structure to stably clamp the box body 1.
[0031] In some embodiments, with reference to Figures 1 to 3 As shown, the two side walls of the box body 1 are provided with a front wall and a rear wall connected to the two side walls, and the front wall and the rear wall are respectively provided with a first opening 140 and a second opening 150. In this way, the first opening 140 and the second opening 150 on the front wall and the rear wall of the box body 1 can expand the liquid immersion area of the box body, that is, when a plurality of silicon wafers are respectively inserted into a plurality of accommodation grooves 120 in the box body 1, the silicon wafers need to be immersed in a chemical agent pool for cleaning by the chemical agent. The first opening 140 and the second opening 150 can expand the liquid immersion area of the box body 1, that is, when the box body 1 is immersed in the chemical agent pool, the chemical agent can enter the inside of the box body 1 through the first opening 140 and the second opening 150, and can contact the silicon wafers in a larger area, thereby improving the cleaning effect of the silicon wafers.
[0032] In some embodiments, with reference to Figures 1 to 3As shown, the first opening 140 and the second opening 150 are different in shape. In this way, the different shapes of the first opening 140 and the second opening 150 can facilitate the staff to distinguish the front and back of the box body 1, that is, the first opening 140 and the second opening 150 can be combined with the first opening 140 and the second opening 150 to distinguish the front and back of the box body 1, and then the silicon wafer can be more conveniently inserted into the inclined extension of the accommodating groove 120, and the situation of inserting the silicon wafer in the wrong direction can be reduced. Figure 1 and Figure 2 As shown, the first opening 140 and the second opening 150 are respectively located on opposite sides of the box body 1, and the plurality of accommodating grooves 120 extend along the top of the box body 1 to the bottom, and the extension trend of the accommodating groove 120 is to extend in the direction of the first opening 140. In the configuration mode that the first opening 140 and the second opening 150 are different in shape, the staff can distinguish the front and back of the box body 1 by observing the shape of the first opening 140 and the second opening 150, and then the silicon wafer can be more conveniently inserted into the inclined extension of the accommodating groove 120, and the situation of inserting the silicon wafer in the wrong direction can be reduced.
[0033] It should be noted that the specific shape of the first opening 140 and the second opening 150 can be selected as any suitable shape according to actual conditions, as long as the shapes of the first opening 140 and the second opening 150 are different. For example, reference can be made to Figure 1 As shown, in Figure 1 In the embodiment shown, the first opening 140 is configured as a U shape, and the second opening 150 is configured as an H shape.
[0034] In some embodiments, reference can be made to Figures 1 to 3 As shown, the bottom of the box body 1 is provided with a bottom opening, and the bottom of the side wall is provided with a limiting groove 160. In this way, the opening provided at the bottom of the box body 1 can facilitate the chemical agent to contact the silicon wafer in the box body 1 more quickly when the box body 1 enters the chemical agent pool, and when the box body 1 is moved to the clean water washing pool for washing the silicon wafer, the water after washing the silicon wafer can also flow out of the box body 1 from the bottom opening, and when the box body 1 is moved on the silicon wafer cleaning production line, the limiting groove 160 provided at the bottom of the side wall can be clamped to the external base (not shown in the figure) to achieve the limiting and fixing of the box body 1, and facilitate the subsequent chemical agent soaking, clean water washing and drying operations of the silicon wafer in the box body 1.
[0035] In some embodiments, reference can be made to Figures 1 to 3 As shown, the plurality of limiting grooves 160 are arranged at intervals along the two side walls of the box body 1. In this way, the plurality of limiting grooves 160 can be used together to limit the box body 1, that is, it can be understood that on the basis of the above-mentioned embodiments, the plurality of limiting grooves 160 can be inserted into the external base one by one, and the plurality of limiting grooves 160 can further improve the limiting effect of the box body 1, and ensure the stability of the box body 1 during the silicon wafer cleaning process.
[0036] In a second aspect of the present disclosure, a silicon wafer cleaning device is provided, which comprises the silicon wafer carrying box mentioned in the above-mentioned embodiments and has all the beneficial effects of the above-mentioned embodiments. In the present disclosure, the silicon wafer cleaning device can comprise a chemical agent soaking pool, a clean water cleaning pool, a drying pool, a spraying pipe, a dryer and the like. The chemical agent soaking pool can be used for soaking the silicon wafer. The clean water cleaning pool can cooperate with the spraying pipe to spray and flush the chemical agent on the surface of the silicon wafer. The drying pool can cooperate with the dryer to dry the silicon wafer after flushing. Through the silicon wafer cleaning device, the soaking, cleaning and drying of the silicon wafer can be completed, and the batch cleaning of the silicon wafer can be realized, thereby improving the cleaning efficiency.
[0037] The preferred embodiments of the present disclosure are described in detail above with reference to the drawings, but the present disclosure is not limited to the specific details in the above-mentioned embodiments. Within the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.
[0038] In addition, it should be noted that each specific technical feature described in the above-mentioned specific embodiments can be combined in any appropriate manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combination manners.
[0039] Furthermore, any combination of various different embodiments of the present disclosure can also be made as long as it does not deviate from the idea of the present disclosure, and it should also be considered as the disclosed content of the present disclosure.
Claims
1. A silicon wafer carrier comprising a top open box, characterized in that, The opposite two side walls of the box body are provided with a plurality of partition members, the plurality of partition members enclose a plurality of containing grooves for containing silicon wafers, the plurality of partition members extend obliquely from the top of the box body towards the bottom of the box body to form a plurality of containing grooves oblique to the extending direction of the side walls, and the width of the containing grooves is greater than the thickness of the silicon wafers.
2. The silicon wafer carrier box of claim 1, wherein, The plurality of containing grooves are parallel to each other, and the angle between the extending direction of the containing grooves and the extending direction of the box body from the top towards the bottom is 5°-15°.
3. The silicon wafer carrier box of claim 1, wherein, The partition member comprises a first segment, a second segment and a third segment connected in sequence from the top of the box body towards the bottom, and the two second segments of the opposite two side walls of the box body extend obliquely and close to each other in the extending direction of the box body from the top towards the bottom.
4. The silicon wafer carrier box of claim 3, wherein, The outer side wall of the box body is provided with a flange portion.
5. The silicon wafer carrier box of claim 4, wherein, The flange portion is configured as a U-shaped structure with an opening facing the bottom of the box body.
6. The silicon wafer carrier box of claim 2, wherein, The two side walls of the box body are provided with a front wall and a rear wall connected to the two side walls, and the front wall and the rear wall are respectively provided with a first opening and a second opening.
7. The silicon wafer carrier box according to claim 6, wherein The first opening and the second opening are different in shape.
8. The silicon wafer carrier box of claim 1, wherein, The bottom of the box body is provided with a bottom opening, and the bottom of the side wall is provided with a limiting groove.
9. The silicon wafer carrier box of claim 8, wherein, The number of the limiting grooves is a plurality and is arranged in intervals along the two side walls of the box body.
10. A silicon wafer cleaning apparatus, characterized by comprising: A silicon wafer carrying box comprising any one of claims 1-9.