Suspended dust removal structure of wafer processing cleaning device

By using positive and negative air duct cleaning technology with a suspended dust removal structure, the problem of dust on the carrier surface affecting product yield has been solved, achieving efficient and automated cleaning results and improving the stability and efficiency of semiconductor production.

CN223789102UActive Publication Date: 2026-01-13DONGGUAN VILLO ENVIRONMENTAL PROTECTION INC
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Patent Information

Application Number
CN202520064653.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-10
Publication Date
2026-01-13
Estimated Expiration
2035-01-10

AI Technical Summary

Technical Problem

In current semiconductor manufacturing, dust on the surface of the carrier affects the product yield. Manual cleaning is time-consuming, labor-intensive, and environmentally unfriendly, with low cleaning efficiency and difficulty in ensuring cleanliness.

Method used

Employing positive and negative airway cleaning technology, non-contact cleaning is achieved through a dust removal head with a suspended dust removal structure. By utilizing the combination of positive and negative pressure chambers, a combined cleaning of the central dust blowing seam and the surrounding suction seam is realized, preventing dust diffusion.

Benefits of technology

It improved cleaning efficiency, enhanced the automation level of the equipment, ensured the cleaning effect, and improved the processing stability and yield of products.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a suspension dust removal structure of a wafer processing cleaning device, which is characterized in that four corners of a bottom frame are provided with upright columns extending upwards, one end of each upright column far away from the bottom frame is provided with an upper frame body, the bottom frame, the upright columns and the upper frame body form a mounting frame, and a mounting plate is arranged in the mounting frame; a moving mechanism is arranged on the mounting plate, a dust removal mechanism is arranged below the moving mechanism, and the dust removal mechanism is connected with the moving mechanism through a hanging sliding seat; the dust removal mechanism comprises a dust removal head box, a bottom plate is arranged at the bottom of the dust removal head box, an opening is formed in the top of the dust removal head box, and a box sealing cover is arranged at the opening in the top end of the dust removal head box; a positive pressure box extending upwards from the bottom plate is arranged in the dust removal head box body, and a separation distance is formed between the top end of the positive pressure box and the top end of the dust removal head box body; a positive pressure sealing cover is arranged at the end, away from the bottom plate, of the positive pressure box. According to the dust removal head, blowing and cleaning are conducted through the middle dust blowing seam, suction is conducted through the suction seams on the periphery, dust cannot be exposed, and the cleaning efficiency is improved.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a dust removal head structure for a cleaning device used in semiconductor chip production. Background Technology

[0002] A wafer is a silicon chip used in the fabrication of silicon semiconductor integrated circuits. Wafers are used to produce integrated circuit chips. In semiconductor production, a chip box is placed on a carrier, and a tray for processing chips is placed inside the chip box. The wafers on the carrier (chip box tray) need to undergo the deposition of insulating or dielectric layer patterning processing. After a period of time, dust will remain on the surface of the carrier, affecting the yield of the product.

[0003] To maintain the cleanliness of the carriers, the carriers of semiconductor processing equipment need to be cleaned regularly. In the semiconductor industry, current semiconductor production mostly uses manual cleaning methods, which mainly involve brush contact cleaning. Moreover, cleaning can only be done when the equipment is shut down for maintenance, taking advantage of the gaps in the cleaning process. Manual cleaning is laborious, time-consuming, inefficient, and detrimental to the overall working environment, and it is also impossible to control the cleanliness. Utility Model Content

[0004] In order to solve the problems existing in the prior art, the purpose of this utility model is to provide a suspended dust removal structure for a wafer processing cleaning device, which adopts positive and negative air channels for cleaning, improves the stability and yield of product processing, and realizes intelligent cleaning.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A suspended dust removal structure for a wafer processing cleaning device includes a base frame, four corner posts extending upwards and standing upright, and an upper frame at the end of the posts away from the base frame. The base frame, posts, and upper frame form an installation frame, and an installation plate is provided in the installation frame. A moving mechanism is mounted on the installation plate, and a dust removal mechanism is provided below the moving mechanism. The dust removal mechanism is connected to the moving mechanism through a hanging slide.

[0007] The dust removal mechanism includes a dust removal head box, a bottom plate at the bottom of the dust removal head box, an opening at the top of the dust removal head box, and a box sealing cover at the opening at the top of the dust removal head box; a positive pressure box extending upward from the bottom plate is provided inside the dust removal head box, and a separation gap is provided between the top of the positive pressure box and the top of the dust removal head box.

[0008] A positive pressure sealing cover is provided at the end of the positive pressure box away from the bottom plate. An air inlet duct extends upward through the sealing cover of the box body on the positive pressure sealing cover. The end of the air inlet duct away from the positive pressure box extends out of the sealing cover of the box body. The upper end of the air inlet duct is connected to a duct pipe, and the air inlet duct is connected to the positive pressure box.

[0009] A separation gap is provided between the outer wall of the positive pressure box and the inner wall of the dust collector box. A negative pressure chamber is provided on the outside of the positive pressure box, and the negative pressure chamber is located between the inner wall of the dust collector box and the outer wall of the positive pressure box.

[0010] The housing is equipped with an exhaust vent on the sealed cover, which is connected to the negative pressure chamber. The positive pressure chamber and the negative pressure chamber are respectively located inside the dust collector housing, and the positive pressure chamber and the negative pressure chamber are isolated from each other and do not communicate with each other.

[0011] Furthermore, in some embodiments, a first dust blowing slit is provided on the bottom surface of the positive pressure box, which extends horizontally through the bottom plate. A matching and symmetrical second dust blowing slit is provided at the ends near both ends of the first dust blowing slit. The second dust blowing slit is provided with a side blowing distance from the top of the first dust blowing slit. The second dust blowing slit and the first dust blowing slit are arranged vertically and communicate with each other.

[0012] The ratio of positive pressure chamber height to dust collector head chamber height is 2 / 3 to 3 / 4:1.

[0013] Furthermore, in some embodiments, the bottom surface of the negative pressure chamber is provided with a first suction slit and a second suction slit that are transversely penetrating the bottom plate. The first suction slit, the second suction slit and the first dust blowing slit are arranged parallel to each other. The first suction slit is located close to the first dust blowing slit, and the second suction slit is located away from the first dust blowing slit. A separation gap is provided between the first suction slit and the second suction slit.

[0014] Furthermore, in some embodiments, the bottom surface of the positive pressure chamber of the positive pressure box is provided with two matching variable cross-section rods, the variable cross-section rods are arranged parallel to the first dust blowing slit, and the two variable cross-section rods are respectively arranged on both sides of the first dust blowing slit;

[0015] The variable cross-section rod has an inwardly protruding compressed airflow protrusion. There is an air inlet spacing D1 between the tops of the two corresponding variable cross-section rods, and a protrusion spacing D2 between the compressed airflow protrusions on opposite sides of the middle of the two variable cross-section rods. The air inlet spacing D1 > the protrusion spacing D2. There is an air outlet spacing D3 between the bottoms of the two corresponding variable cross-section rods. The first dust blowing slit opened on the bottom surface of the positive pressure chamber has a dust blowing spacing D4, which is also the width of the first dust blowing slit. The air inlet spacing D1 = the air outlet spacing D3, and the air outlet spacing D3 > the dust blowing spacing D4.

[0016] Furthermore, in some embodiments, the compressed airflow protrusion is a convex strip shape;

[0017] Or the compressed airflow bulge is a long strip with an arc-shaped cross-section;

[0018] Or, the compressed airflow bulge is a long strip with a short chord-shaped cross-section;

[0019] The ratio of air inlet spacing D1 to convex hull spacing D2 is 5 to 10:1;

[0020] Inlet air distance D1 = outlet air distance D3, D1 equals D3;

[0021] The ratio of dust blowing distance D4 to convex hull distance D2 is 1:1 to 1.5.

[0022] Furthermore, in some embodiments, a third suction slit is provided on the bottom surface of the short sides of both sides of the negative pressure chamber, which extends longitudinally through the bottom plate. The third suction slit is located between the outer wall of the short sides of both sides of the positive pressure chamber and the inner wall of the dust removal head box. The third suction slit is arranged parallel to the second dust blowing slit.

[0023] The second dust blowing slit is located on the inner wall of the short side of both sides of the positive pressure box.

[0024] Furthermore, in some embodiments, the ratio of the width of the first dust blowing slit to the width of the first suction slit to the width of the second suction slit is 1:4~5:4~5;

[0025] The ratio of the width of the second dust blowing slit to the width of the third suction slit is 1:4-5;

[0026] The ratio of the air volume of the first dust blowing slit to the air volume of the first suction slit is 1:1.5~3, and the air volume of the second suction slit is equal to the air volume of the first suction slit.

[0027] The ratio of air volume at the second dust blowing slit to that at the third suction slit is 1:1.5 to 3.

[0028] Furthermore, in some embodiments, the mounting plate is disposed in the middle of the mounting frame, one side of the mounting plate is connected to two adjacent columns, and the other side of the mounting plate is connected to the upper frame through a vertical plate; a vertical frame is provided between the end of the mounting plate near the column and the bottom frame, and a supporting beam is provided between the two columns away from the mounting plate; a battery is provided on the mounting plate.

[0029] The mobile mechanism is equipped with a pneumatic assembly, and the dust removal mechanism is connected to the pneumatic assembly via a conduit. The dust removal mechanism, the mobile mechanism, and the pneumatic assembly are all housed within the mounting frame.

[0030] The housing sealing cover is connected to the moving mechanism via a hanging slide.

[0031] This application involves placing a cleaning device on the carrier after the processed chip box has been removed from the carrier to clean the tray. The dust removal head (blow-suction head) of this application cleans the tray by blowing through the central dust-blowing slit and drawing it in through the surrounding suction slits. The dust removal head is suspended on the carrier and does not contact the carrier; the central dust-blowing slit blows while the surrounding suction slits draw in dust, preventing dust from escaping. The negative pressure suction (suction slits) around the edges prevents air leakage and keeps dust from drifting out.

[0032] The dust collector head has two suction slits (narrow suction channels) on each side, and the width of the suction slits is greater than the width of the dust blowing slits. The air blown down from the dust blowing slit in the middle of the dust collector head (working gun) diffuses to both sides, and two suction slits on each side form an air curtain, which then sucks away the dust. Dust blowing slits and suction slits are added to the narrow sides at both ends of the dust collector head, and the suction slits around the perimeter form an air curtain; this prevents dust from spreading out of the dust blowing gun, improves cleaning efficiency, and enhances the automation level of the equipment. Attached Figure Description

[0033] Figure 1 This is a schematic diagram illustrating the application of an embodiment of the present utility model;

[0034] Figure 2 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0035] Figure 3 This is an assembly diagram of the dust removal mechanism in an embodiment of the present utility model;

[0036] Figure 4 This is a cross-sectional schematic diagram of the dust removal mechanism in an embodiment of the present utility model;

[0037] Figure 5 This is a schematic diagram of the dust removal mechanism in an embodiment of the present utility model;

[0038] Figure 6 This is a wind direction diagram of an embodiment of the present utility model;

[0039] Figure 7 for Figure 4 A schematic diagram of the structure of one embodiment of Part A;

[0040] Figure 8 for Figure 4 A schematic diagram of another embodiment of Part A.

[0041] Explanation of markings in the diagram:

[0042] 11. Base frame, 12. Column, 13. Upper frame, 14. Mounting plate, 15. Support beam, 16. Vertical frame, 19. Compressed airflow protrusion, 21. Moving mechanism, 34. Hanging slide, 41. Dust removal mechanism, 42. Dust removal head box, 43. Negative pressure chamber, 44. Positive pressure box, 45. Variable cross-section rod, 46. Positive pressure sealing cover, 47. Air inlet, 48. Frame sealing cover, 49. Base plate, 51. Bottom surface of positive pressure chamber, 52. First suction slit, 53. Second suction slit, 54. First dust blowing slit, 55. Third suction slit, 56. Second dust blowing slit, 57. Exhaust port, 58. Battery, 59. Pipe, 61. Air pressure assembly, 81. Detailed Implementation

[0043] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. To further understand the features, technical means, and specific objectives and functions achieved by this utility model, and to analyze its advantages and spirit, a detailed description of this utility model is provided below in conjunction with the accompanying drawings and specific embodiments.

[0044] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component. The terms "vertical," "horizontal," "front," "back," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0045] Please refer to the attached drawings. This application includes a base frame 11, with upright columns 12 extending upwards from the four corners of the base frame 11. An upper frame 13 is located at the end of each column 12 away from the base frame 11. The base frame 11, columns 12, and upper frame 13 form an installation frame. An installation plate 14 is provided within the installation frame, positioned in the middle of the frame. One side of the installation plate 14 is connected to two adjacent columns 12, and the other side is connected to the upper frame 13 via a vertical plate. A vertical frame 16 is provided between the end of the installation plate 14 near the columns 12 and the base frame 11, and a supporting beam 15 is provided between the two columns 12 away from the installation plate 14. A battery 58 is provided on the installation plate 14, and the base frame 11 is placed on a carrier 81.

[0046] A moving mechanism 21 is mounted on the mounting plate 14. A dust removal mechanism 41 is located below the moving mechanism 21. A pneumatic assembly 61 is located above the moving mechanism 21. The dust removal mechanism 41 is connected to the pneumatic assembly 61 through a conduit 59. The dust removal mechanism 41, the moving mechanism 21, and the pneumatic assembly 61 are arranged in the mounting frame.

[0047] The dust removal mechanism 41 includes a dust removal head box 42, which is also a pressure chamber; the bottom of the dust removal head box 42 is provided with a bottom plate 49, and the dust removal head box 42 and the bottom plate 49 are integrally formed; the top of the dust removal head box 42 is provided with a box sealing cover 48.

[0048] Furthermore, in one embodiment, see Appendix Figure 3 As shown, attached Figure 3The diagram illustrates the structure of the dust collector head housing 42. The top of the dust collector head housing 42 has an opening, and a housing sealing cover 48 is located at the opening at the top of the dust collector head housing 42; that is, the housing sealing cover 48 is the sealing cover plate of the dust collector head housing 42. Inside the dust collector head housing 42, a positive pressure box 44 extends upwards from the bottom plate 49; that is, the dust collector head housing 42 contains a frame-shaped positive pressure box 44. A separation gap is provided between the top of the positive pressure box 44 and the top of the dust collector head housing 42; that is, there is a gap between the top of the positive pressure box 44 away from the bottom plate 49 and the housing sealing cover 48. Further details can be found in the appendix. Figure 4 As shown, the ratio of the height of the positive pressure box 44 to the height of the dust collector box 42 is 2 / 3 to 3 / 4:1.

[0049] Furthermore, in one embodiment, the positive pressure box 44 is provided with a positive pressure sealing cover 46 (positive pressure chamber cover plate) at one end away from the bottom plate 49. The positive pressure sealing cover 46 is provided with an air inlet duct 47 that extends upward and penetrates the box body sealing cover 48. The end of the air inlet duct 47 away from the positive pressure box 44 extends out of the box body sealing cover 48. The upper end of the air inlet duct 47 is connected to the conduit 59, and the air inlet duct 47 is in a through connection with the positive pressure box 44.

[0050] A separation gap is provided between the outer wall of the positive pressure box 44 and the inner wall of the dust collector head box 42. The cavity between the inner wall of the dust collector head box 42 and the outer wall of the positive pressure box 44 forms a negative pressure chamber 43. That is, a negative pressure chamber 43 is provided on the outside of the positive pressure box 44, and the annular negative pressure chamber 43 is arranged in the dust collector head box 42; see appendix. Figure 5 As shown, the housing sealing cover 48 is provided with an exhaust port 57, which is connected to the negative pressure chamber 43. The positive pressure chamber 44 and the negative pressure chamber 43 are respectively located in the dust collector housing 42, and the positive pressure chamber 44 and the negative pressure chamber 43 are isolated from each other and do not communicate with each other.

[0051] The housing sealing cover 48 is connected to the moving mechanism 21 via the hanging slide 34.

[0052] Furthermore, in one embodiment, see Appendix Figure 5 As shown, the bottom surface of the positive pressure chamber 44 has a first dust-blowing slit 54 that extends horizontally through the bottom plate 49. Near the ends of the first dust-blowing slit 54, there are matching and symmetrical second dust-blowing slits 56. The second dust-blowing slits 56 are spaced apart from the top of the first dust-blowing slit 54 by a side-blowing distance. The second dust-blowing slits 56 (side dust-blowing slits) and the first dust-blowing slits 54 (middle dust-blowing slits) are vertically arranged and interconnected. The first dust-blowing slits 54 and 56 are connected through each other on the bottom plate 49 of the positive pressure chamber 44. That is, the first dust-blowing slits 54 and 56 are connected through each other on the bottom plate 49, and the second dust-blowing slits 56 are located near the inner walls of the shorter sides of the positive pressure chamber 44. See attached diagram. Figure 6As shown, the second dust blowing slit 56 should not be too close to the side. There should be a gap between the second dust blowing slit 56 and the third suction slit 55 to allow for blowing and suction operation space. This allows the second dust blowing slit 56 to blow to the side and outwards, while the third suction slit 55 can fully suck it away, thus preventing air leakage and dust leakage.

[0053] Furthermore, in one embodiment, the bottom surface 51 of the positive pressure chamber of the positive pressure box 44 is provided with two matching variable cross-section rods 45, which are arranged parallel to the first dust blowing slit 54, and the two variable cross-section rods 45 are respectively arranged on both sides of the first dust blowing slit 54.

[0054] The variable cross-section rod 45 is provided with an inwardly protruding (facing each other, face to face) compressed airflow protrusion 19. There is an air inlet gap D1 between the tops of the two corresponding variable cross-section rods 45, and a protrusion gap D2 between the compressed airflow protrusions 19 on opposite sides of the middle of the two variable cross-section rods 45. The air inlet gap D1 > the protrusion gap D2. There is an air outlet gap D3 between the bottoms of the two corresponding variable cross-section rods 45. The first dust blowing slit 54 opened on the bottom surface 51 of the positive pressure chamber is provided with a dust blowing gap D4. The dust blowing gap D4 is also the width of the first dust blowing slit 54. The air inlet gap D1 = the air outlet gap D3, and the air outlet gap D3 > the dust blowing gap D4.

[0055] The compressed airflow convex hull 19 is a convex strip type;

[0056] Or the compressed airflow convex 19 is a long strip with an arc-shaped cross section;

[0057] Or the compressed airflow convex 19 is a long strip with a short chord-shaped cross section.

[0058] Variable cross-section rod 45: Compressed air passes through the variable cross-section air flow channel and the flow channel with varying width and width. Through repeated compression and diffusion, it generates a wavy airflow. At the outlet position (first dust blowing slit 54), a high-frequency and high-speed pulse airflow is generated, which separates the ultrafine particles from the substrate and then they are sucked away and collected by the surrounding negative pressure airflow.

[0059] The ratio of air inlet spacing D1 to convex hull spacing D2 is 5 to 10:1;

[0060] Inlet air distance D1 = outlet air distance D3, D1 equals D3;

[0061] The ratio of dust blowing distance D4 to convex hull distance D2 is 1:1 to 1.5.

[0062] The air gap size is D1=D3>D2≧D4. The airflow undergoes air duct undulation changes from wide to narrow to wide to narrow as it passes through D1→D2→D3→D4, resulting in a high-frequency, high-speed pulsed airflow that impacts and blows dust at the outlet of the first dust-blowing gap 54.

[0063] See appendix Figure 5 As shown, attached Figure 5 The diagram illustrates the structure of the negative pressure chamber 43. The bottom surface of the negative pressure chamber 43 has a first suction slit 52 and a second suction slit 53 that horizontally penetrate the bottom plate 49. The first suction slit 52 and the second suction slit 53 are arranged parallel to the first dust blowing slit 54. The first suction slit 52 (inner suction slit) is located close to the first dust blowing slit 54, and the second suction slit 53 (outer suction slit) is located away from the first dust blowing slit 54. A separation gap is provided between the first suction slit 52 and the second suction slit 53. Furthermore, the first suction slit 52 and the second suction slit 53 are horizontally penetrating the bottom plate 49 of the negative pressure chamber 43, meaning they are horizontally parallel and open on the bottom plate 49. A separation gap is provided between the first dust blowing slit 54 and the first suction slit 52.

[0064] The negative pressure chamber 43 has a third suction slit 55 that extends longitudinally through the bottom plate 49 on both short sides of the bottom surface. The third suction slit 55 is located between the outer wall of the short sides of the positive pressure chamber 44 and the inner wall of the dust removal head box 42. The third suction slit 55 is parallel to the second dust blowing slit 56. Furthermore, the third suction slit 55 (side suction slit) extends downward through the bottom plate 49 and is connected to the negative pressure chamber 43.

[0065] Furthermore, in one embodiment, the ratio of the width of the first dust blowing slit 54 to the width of the first suction slit 52 to the width of the second suction slit 53 is 1:4~5:4~5;

[0066] The width ratio of the second dust blowing slit 56 to the width of the third suction slit 55 is 1:4~5;

[0067] The width of the first dust blowing slit 54 is the same as that of the second dust blowing slit 56, and the width of the first suction slit 52, the second suction slit 53 and the third suction slit 55 are the same.

[0068] Furthermore, in one embodiment, the air volume ratio of the first dust blowing slit 54 to the first suction slit 52 is 1:1.5 to 3, and the air volume of the second suction slit 53 is equal to the air volume of the first suction slit 31.

[0069] The air volume ratio of the second dust blowing slit 56 to the third suction slit 55 is 1:1.5~3.

[0070] The above embodiments only illustrate several preferred implementations of this utility model, and their descriptions are relatively specific and detailed. It should be understood that this utility model is not limited to the forms disclosed herein and should not be considered as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be modified within the scope of the utility model concept described herein through the above teachings or related field techniques or knowledge. This should not be construed as a limitation on the scope of this utility model. It should be noted that for those skilled in the art, several modifications and improvements can be made without departing from the concept of this utility model. Such modifications and changes do not depart from the spirit and scope of this utility model, and all fall within the protection scope of the appended claims. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A hanging dust removal structure of a wafer processing cleaning device, comprising: The bottom frame (11) is provided with upward extending vertical columns (12) at four corners thereof, and the upper frame body (13) is arranged at the end of the vertical column (12) away from the bottom frame (11), and the bottom frame (11), the vertical column (12) and the upper frame body (13) form an installation frame, and the installation plate (14) is arranged in the installation frame; The installation plate (14) is provided with a moving mechanism (21), and the moving mechanism (21) is provided with a dust removal mechanism (41) below. The dust removal mechanism (41) comprises a dust removal head box (42), the bottom of the dust removal head box (42) is provided with a bottom plate (49), the top of the dust removal head box (42) is provided with an opening, and the opening at the top end of the dust removal head box (42) is provided with a box sealing cover (48); the dust removal head box (42) is provided with a positive pressure box (44) extending upwards from the bottom plate (49), and the top end of the positive pressure box (44) is provided with a separation distance from the top end of the dust removal head box (42). The end of the positive pressure box (44) away from the bottom plate (49) is provided with a positive pressure sealing cover (46), the positive pressure sealing cover (46) is provided with an air inlet cylinder (47) extending upwards and penetrating the box sealing cover (48), the end of the air inlet cylinder (47) away from the positive pressure box (44) extends above the box sealing cover (48), the upper end of the air inlet cylinder (47) is connected with a guide pipe (59), and the air inlet cylinder (47) is connected with the positive pressure box (44). The outer wall of the positive pressure box (44) and the inner wall of the dust removal head box (42) are provided with a separation distance, and the outer side of the positive pressure box (44) is provided with a negative pressure cavity (43) arranged between the inner wall of the dust removal head box (42) and the outer wall of the positive pressure box (44). The box sealing cover (48) is provided with an air outlet (57) penetratingly connected with the negative pressure cavity (43); the positive pressure box (44) and the negative pressure cavity (43) are arranged in the dust removal head box (42), and the positive pressure box (44) and the negative pressure cavity (43) are isolated from each other and do not penetrate each other.

2. The hanging dust removal structure of a wafer processing cleaning device according to claim 1, wherein, The bottom surface of the positive pressure box (44) is provided with a first dust blowing slot (54) penetrating the bottom plate (49) in the transverse direction, the end portions close to the two ends of the first dust blowing slot (54) are provided with symmetrically matched second dust blowing slots (56), the second dust blowing slots (56) are provided with a side blowing distance from the top end of the first dust blowing slot (54), and the second dust blowing slots (56) are vertically arranged and penetrate each other with the first dust blowing slot (54). The height ratio of the positive pressure box (44) to the dust removal head box (42) is 2 / 3-3 / 4:

1.

3. The hanging dust removal structure of a wafer processing cleaning device according to claim 1, wherein, The bottom surface of the negative pressure cavity (43) is provided with a first suction slot (52) and a second suction slot (53) penetrating the bottom plate (49) in the transverse direction, the first suction slot (52) and the second suction slot (53) are arranged in parallel with the first dust blowing slot (54); the first suction slot (52) is arranged close to the first dust blowing slot (54), the second suction slot (53) is arranged away from the first dust blowing slot (54), and the first suction slot (52) and the second suction slot (53) are provided with a separation distance.

4. The hanging dust removal structure of a wafer processing cleaning device according to claim 2, wherein, The positive pressure cavity bottom surface (51) of the positive pressure box (44) is provided with two matching variable cross-section rods (45), the variable cross-section rods (45) are arranged in parallel with the first dust blowing slot (54), and the two variable cross-section rods (45) are arranged on the two sides of the first dust blowing slot (54), respectively. The variable cross-section rods (45) are provided with inwardly protruding compressed air flow protrusions (19), the top portions of the two matching variable cross-section rods (45) are provided with an air inlet spacing D1, the compressed air flow protrusions (19) on the opposite sides of the middle portions of the two variable cross-section rods (45) are provided with a protrusion spacing D2, the air inlet spacing D1 is greater than the protrusion spacing D2, the bottom portions of the two matching variable cross-section rods (45) are provided with an air outlet spacing D3, the first dust blowing slot (54) arranged on the positive pressure cavity bottom surface (51) is provided with a dust blowing spacing D4, the dust blowing spacing D4 is also the width of the first dust blowing slot (54), the air inlet spacing D1 is equal to the air outlet spacing D3, and the air outlet spacing D3 is greater than the dust blowing spacing D4.

5. The hanging dust removal structure of a wafer processing cleaning device according to claim 4, wherein, The compressed air flow protrusions (19) are in the shape of convex strips. Or the compressed air flow protrusions (19) are in the shape of long strips with arc-shaped cross sections. Or the compressed air flow protrusions (19) are in the shape of long strips with short chord-shaped cross sections. The ratio of the air inlet spacing D1 to the protrusion spacing D2 is 5-10:

1. The ratio of the air inlet spacing D1 to the air outlet spacing D3 is 1:1-1.

5.

6. The hanging dust removal structure of a wafer processing cleaning device according to claim 2, wherein, The bottom surfaces of the two short sides of the negative pressure cavity (43) are provided with third suction slots (55) that longitudinally penetrate the bottom plate (49), the third suction slots (55) are arranged between the outer walls of the two short sides of the positive pressure box (44) and the inner walls of the dust removal head box body (42), and the third suction slots (55) are arranged in parallel with the second dust blowing slot (56). The second dust blowing slot (56) is arranged close to the inner walls of the two short sides of the positive pressure box (44).

7. The hanging dust removal structure of a wafer processing cleaning device according to claim 6, wherein, The ratio of the width of the first dust blowing slot (54) to the width of the first suction slot (52) to the width of the second suction slot (53) is 1:4-5:4-5. The ratio of the width of the second dust blowing slot (56) to the width of the third suction slot (55) is 1:4-5. The ratio of the air volume of the first dust blowing slot (54) to the air volume of the first suction slot (52) is 1:1.5-3, and the air volume of the second suction slot (53) is equal to the air volume of the first suction slot (52). The ratio of the air volume of the second dust blowing slot (56) to the air volume of the third suction slot (55) is 1:1.5-3.

8. The hanging dust removal structure of a wafer processing cleaning device according to claim 1, wherein, The mounting plate (14) is arranged in the middle of the mounting frame, one side of the mounting plate (14) is connected with the two adjacent vertical columns (12), the other side of the mounting plate (14) is connected with the upper frame body (13) through the vertical plate, the end of the mounting plate (14) close to the vertical column (12) is provided with a vertical frame (16) between the bottom frame (11), the two vertical columns (12) away from the mounting plate (14) are provided with a support cross beam (15), and the mounting plate (14) is provided with a battery (58). The upper surface of the moving mechanism (21) is provided with a gas pressure assembly (61), the dust removal mechanism (41) is connected with the gas pressure assembly (61) through a conduit (59), and the dust removal mechanism (41), the moving mechanism (21) and the gas pressure assembly (61) are arranged in the mounting frame; and the box body sealing cover (48) is connected with the moving mechanism (21) through the hanging sliding seat (34).