Semiconductor bonding wire equipment clamp

Abstract

The utility model provides a semiconductor bonding wire equipment clamp which comprises a first mold and a second mold, the upper surface of the first mold is fixedly connected with a heating block, and the upper surface of the second mold is fixedly provided with a pressing plate. The heating block is designed to be made of frosted breathable materials. The bottom face of the pressing plate is designed to be a continuous pressing line, and a line pressing type structure is formed. The heating block and the pressing plate are arranged, the heating block is designed to be a frosted breathable material instead of an original vacuum hole design, the problem that the size and position design of the vacuum hole is poor can be effectively solved, the compatibility is high, the bottom cannot be suspended, and it is guaranteed that the frame is stable; the pressing plate is changed into a linear pressing structure from an original point pressing structure, the surface of the frame can be contacted to the maximum extent, the existing design is easy to machine, convenient to use and not prone to abrasion in the using process, pressing can be guaranteed, cost is saved, and working efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of frame-type packaging in semiconductor wire bonding, and more specifically, to a semiconductor wire bonding equipment fixture. Background Technology

[0002] Existing semiconductor wire bonding equipment fixtures can achieve basic locking of the frame, solving the problem of frame wobbling during wire bonding. By activating the heating block to create a vacuum and adsorbing the frame, combined with the downward pressure of the upper pressure plate, the frame is kept level and stable during operation, thus ensuring the wire bonding process.

[0003] Existing technologies address the issue of frame wobbling during wire bonding in wire bonding equipment. The heating block utilizes a vacuum hole design, requiring specific design requirements for the vacuum hole's position and size depending on the frame type. This results in poor matching, frequent rework, and issues such as weak adhesion and bottom suspension due to excessively large vacuum hole areas, leading to unsatisfactory adhesion. The cover plate design typically uses a claw-type design, requiring technicians to adjust it at different points during installation, resulting in high labor costs, poor point-contact pressing performance, and easy wear of the pressure plate, leading to high costs.

[0004] Therefore, we have made improvements to this and proposed a semiconductor wire bonding equipment fixture. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a semiconductor wire bonding equipment fixture, which solves the problems mentioned in the background art.

[0006] To achieve the above-mentioned objectives, this utility model provides the following technical solution:

[0007] Semiconductor wire bonding equipment fixtures are designed to solve the above problems.

[0008] The application is as follows:

[0009] It includes a first mold and a second mold. A heating block is fixedly connected to the upper surface of the first mold, and a pressure plate is fixedly installed on the upper surface of the second mold.

[0010] As a preferred technical solution of this application, the heating block is designed as a frosted, breathable material.

[0011] As a preferred technical solution of this application, the bottom surface of the pressure plate is designed as continuous pressing lines to form a linear pressing structure.

[0012] As a preferred technical solution of this application, the upper surface of the heating block is uniformly coated with a heat insulation layer, and the heat insulation layer is made of ceramic water-based high-temperature heat-insulating coating.

[0013] As a preferred technical solution of this application, the upper surface of the pressure plate is uniformly coated with a wear-resistant coating, and the wear-resistant coating is an epoxy resin wear-resistant coating.

[0014] As a preferred technical solution of this application, a plurality of gas guide grooves are uniformly formed on the upper surface of the pressure plate.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] In the scheme of this application:

[0017] This invention incorporates a heating block and a pressure plate. The heating block is designed with a frosted, breathable material to replace the original vacuum hole design, effectively solving the problem of poor vacuum hole size and position design. It has strong compatibility and prevents the bottom from being suspended, ensuring frame stability. The pressure plate has been changed from the original point-pressure structure to a line-pressure structure, ensuring maximum contact with the frame surface. The existing design is easy to process and use, and is not easily worn during use, ensuring proper pressing, saving costs, and improving work efficiency. Attached Figure Description

[0018] Figure 1 A schematic diagram of the structure of the heating block of the semiconductor wire bonding equipment fixture provided in this application;

[0019] Figure 2 A schematic diagram of the structure of the clamping plate of the semiconductor wire bonding equipment provided in this application;

[0020] Figure 3 A schematic diagram of the cross-section of the heating block of the semiconductor wire bonding equipment fixture provided in this application;

[0021] Figure 4 This is a structural schematic diagram of the cross-section of the clamping plate of the semiconductor wire bonding equipment provided in this application.

[0022] The image shows:

[0023] 1. First mold; 2. Second mold; 3. Heating block; 4. Pressure plate; 5. Heat insulation layer; 6. Wear-resistant coating; 7. Gas guide channel. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described examples are only some embodiments of this utility model, and not all embodiments.

[0025] Therefore, the following detailed description of the embodiments of this utility model is not intended to limit the scope of the claimed utility model, but merely to illustrate some embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0026] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0027] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0028] In the description of this utility model, it should be noted that the terms "upper" and "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use, or the orientation or positional relationship commonly understood by those skilled in the art. These terms are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this utility model. In addition, the terms "first" and "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0029] To address the technical problems in the background section, the following semiconductor wire bonding equipment fixture is provided:

[0030] Combination Figure 1 - Figure 4 As shown, the present invention provides a semiconductor wire bonding equipment fixture, including a first mold 1 and a second mold 2. A heating block 3 is fixedly connected to the upper surface of the first mold 1, and a pressure plate 4 is fixedly installed on the upper surface of the second mold 2.

[0031] In this embodiment: a heating block 3 is fixedly connected to the upper surface of the first mold 1 to heat the semiconductor component packaging frame during the wire bonding process; while a pressure plate 4 is fixedly installed on the upper surface of the second mold 2. The pressure plate 4 is designed to apply stable pressure to the packaging frame while the heating block 3 is heating, to ensure the accuracy and stability of the wire bonding operation. This structural design not only improves the wire bonding efficiency, but also ensures the positional stability and welding quality of the packaging frame during the welding process.

[0032] As a preferred embodiment, based on the above method, the heating block 3 is further designed as a frosted, breathable material.

[0033] In this embodiment, the heating block 3 is innovatively designed as a frosted, breathable material, which optimizes the surface characteristics of the heating block 3, giving it better breathability and adsorption capacity. This allows it to more effectively and stably adsorb the semiconductor component packaging frame, preventing shaking during wire bonding. At the same time, the frosted design also enhances the contact area and friction between the heating block 3 and the packaging frame, further improving the stability and reliability of the welding process. In addition, the choice of this breathable material also allows the heating block 3 to transfer heat more evenly during the heating process, thereby improving welding efficiency and welding quality.

[0034] As a preferred embodiment, based on the above method, the bottom surface of the pressure plate 4 is further designed as continuous pressing lines to form a linear pressing structure.

[0035] In this embodiment, the bottom surface of the pressure plate 4 is designed with continuous pressing lines, forming an innovative linear pressing structure. This allows the pressure plate 4 to distribute pressure more evenly across the entire surface of the semiconductor component packaging frame when pressure is applied, effectively avoiding the problems of uneven pressure and poor pressing effect that may be caused by the traditional point pressing structure. The linear pressing structure not only improves the stability and reliability of pressing, but also significantly reduces the wear of the pressure plate 4 and extends the service life of the fixture.

[0036] As a preferred embodiment, based on the above method, the upper surface of the heating block 3 is further coated with a heat insulation layer 5, and the heat insulation layer 5 is a ceramic water-based high-temperature heat-insulating coating.

[0037] In this embodiment: By uniformly coating a heat insulation layer 5 on the upper surface of the heating block 3, the heat insulation layer 5 is made of ceramic water-based high-temperature heat-insulating coating; this not only improves the thermal efficiency and energy utilization of the heating block 3, but also enables the heating block 3 to reach and maintain the required welding temperature more quickly by effectively reducing heat loss; at the same time, the heat insulation layer 5 also plays an important protective role, effectively isolating the high temperature from the surrounding environment and equipment, and improving the safety and stability of the entire welding line equipment.

[0038] As a preferred embodiment, based on the above method, the upper surface of the pressure plate 4 is further coated with a wear-resistant coating 6, and the wear-resistant coating 6 is an epoxy resin wear-resistant coating.

[0039] In this embodiment: by uniformly applying a layer of wear-resistant coating 6 to the upper surface of the pressure plate 4, the wear-resistant coating 6 is made of high-performance epoxy resin wear-resistant coating; it can improve the wear resistance and durability of the pressure plate 4, effectively resist the wear and scratches caused by frequent contact and friction during long-term use. The wear-resistant coating 6 not only extends the service life of the pressure plate 4 and reduces the frequency of replacement and maintenance, but also ensures the flatness and smoothness of the surface of the pressure plate 4, thereby ensuring the consistency and stability of the wire bonding operation;

[0040] In addition, the choice of epoxy resin wear-resistant coating also endows the wear-resistant coating with good chemical stability and corrosion resistance, enabling it to maintain excellent performance in various harsh working environments.

[0041] As a preferred embodiment, based on the above method, a plurality of gas guide grooves 7 are evenly formed on the upper surface of the pressure plate 4.

[0042] In this embodiment: Inert gases, such as nitrogen and argon, are generated during the welding process; By uniformly opening several gas guide grooves 7 on the upper surface of the pressure plate 4, the gas flow path of the pressure plate 4 during the wire welding process can be optimized, effectively promoting the uniform distribution and rapid exchange of gas in the welding area.

[0043] The above is the entire working process of the device, and all contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0044] The above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. Although the present utility model has been described in detail with reference to the above embodiments, the present utility model is not limited to the specific embodiments described above. Therefore, any modifications or equivalent substitutions to the present utility model, and all technical solutions and improvements that do not depart from the spirit and scope of the utility model, are covered within the scope of the claims of the present utility model.

Claims

1. A semiconductor wire bonding equipment fixture, comprising a first mold (1) and a second mold (2), characterized in that: A heating block (3) is fixedly connected to the upper surface of the first mold (1), and a pressure plate (4) is fixedly installed on the upper surface of the second mold (2). The heating block (3) is designed with a frosted, breathable material; The bottom surface of the pressure plate (4) is designed with continuous pressing lines to form a linear pressing structure.

2. The semiconductor wire bonding equipment fixture according to claim 1, characterized in that: The upper surface of the heating block (3) is uniformly coated with a heat insulation layer (5), and the heat insulation layer (5) is made of ceramic water-based high temperature heat insulation coating.

3. A semiconductor wire bonding equipment fixture according to claim 1, characterized in that: The upper surface of the pressure plate (4) is uniformly coated with a wear-resistant coating (6), and the wear-resistant coating (6) is made of epoxy resin wear-resistant paint.

4. A semiconductor wire bonding equipment fixture according to claim 1, characterized in that: The upper surface of the pressure plate (4) is uniformly provided with several gas guide grooves (7).

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