Semiconductor laser marking device

Abstract

The utility model relates to the field of laser marking devices, and discloses a laser marking device of a semiconductor, which comprises a laser marking machine, a laser marking head is arranged at the front end of the laser marking machine, the upper surface of the laser marking machine is fixedly connected with a support table, a positioning assembly is arranged above the laser marking machine, and the support table is fixedly connected with the support table. A fixing mechanism is arranged above the laser marking machine; and the fixing mechanism comprises a driving assembly and a clamping assembly, the driving assembly comprises an electric push rod, and the left end of an output shaft of the electric push rod is fixedly connected with a sliding block. According to the utility model, through the cooperation of the fixing mechanism, the semiconductor can be rapidly clamped and positioned, the fixing mechanism adopts an elastic clamping design, and the rear end of the clamping plate is made of leather, so that the surface abrasion of the semiconductor can be effectively avoided, the clamping force can be adjusted through the elasticity of the spring II, and the semiconductor is prevented from being damaged due to the overlarge clamping force; and the yield of products can be improved.

Description

Technical Field

[0001] This utility model relates to the field of laser marking devices, and more particularly to a laser marking device for semiconductors. Background Technology

[0002] In the semiconductor manufacturing industry, laser marking technology is widely used to mark product models, production dates, batch numbers, and other information, facilitating product traceability, quality control, and market circulation. However, existing semiconductor laser marking devices have some problems that need to be addressed.

[0003] A search revealed Chinese Patent Publication No. CN218169089U, which discloses a laser marking device for semiconductors. The device includes a marking table and an auxiliary mechanism. The auxiliary mechanism comprises a fixed base and a sliding base. The fixed base is fixedly connected to the top of the marking table, and the sliding base is slidably connected to the top of the fixed base. A slider is fixedly connected to the bottom of the fixed base, and a groove is formed at the top of the fixed base. The outer wall of the slider is slidably connected to the inner wall of the groove. A limit mechanism is provided at the bottom of the slider, and two sets of clamping mechanisms are provided at the top of the sliding base. This invention utilizes the fixed base, sliding base, and two sets of clamping mechanisms. By moving the sliding base on the fixed base, while one set of clamping mechanisms is performing marking, the semiconductor processed by the other set of clamping mechanisms can be removed and replaced with a new semiconductor. This allows the marking head to continue marking during the process, achieving continuous marking of the semiconductor and thus improving the marking efficiency.

[0004] Although the device has some improvements, the position of the semiconductor held and fixed by the fixed plate and the movable plate cannot be adjusted back and forth during use. This easily leads to a relatively fixed laser marking position, which cannot meet the needs of different marking positions. At the same time, the fixed plate and the movable plate in the device hold the semiconductor in a rigid manner and it is operated manually. This makes it easy for personnel to damage the semiconductor due to excessive clamping force when fixing the semiconductor, thus reducing the yield.

[0005] To address this problem, a semiconductor laser marking device is proposed. Utility Model Content

[0006] To overcome the above shortcomings, this utility model provides a laser marking device for semiconductors, which aims to solve the problems in the prior art where the marking position is fixed after the semiconductor is fixed, which cannot meet the needs of different marking positions and the rigid clamping is prone to damaging the semiconductor and reducing the yield.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor laser marking device, including a laser marking machine, wherein a laser marking head is provided at the front end of the laser marking machine, a support platform is fixedly connected to the upper surface of the laser marking machine, a positioning component is provided above the laser marking machine, and a fixing mechanism is provided above the laser marking machine.

[0008] The fixing mechanism includes a driving assembly and a clamping assembly. The driving assembly includes an electric push rod, and a slider is fixedly connected to the left end of the output shaft of the electric push rod. A connecting rod is hinged to the front surface of the slider, and a U-shaped plate is hinged to the front end of the connecting rod. The clamping assembly includes a sliding rod, and a clamping plate is fixedly connected to the rear surface of the sliding rod. One end of a second spring is fixedly connected to the inner wall of the front side of the U-shaped plate, and the other end of the second spring is fixedly connected to the front surface of the sliding rod.

[0009] As a further description of the above technical solution:

[0010] The positioning component includes a motor, the output shaft of which is fixedly connected to a screw, the outer wall of which is threadedly connected to an I-beam, the top of the outer wall of which is slidably connected to a support plate, the inner wall of the right side of the support plate is provided with a slot, one end of a spring is fixedly connected to the inner wall of the left side of the I-beam, and the other end of the spring is fixedly connected to a locking block.

[0011] As a further description of the above technical solution:

[0012] The motor is mounted on the left surface of the support platform, and the screw passes through and is rotatably connected to the left surface of the support platform.

[0013] As a further description of the above technical solution:

[0014] The I-beam is configured in the shape of an I-beam and is slidably connected to the upper surface of the support platform.

[0015] As a further description of the above technical solution:

[0016] The card block is slidably connected to the right surface of the I-beam block, and the card block is inserted into the inner wall of the card slot. Both the front and rear ends of the right surface of the card block are set as bevels.

[0017] As a further description of the above technical solution:

[0018] The electric push rod is mounted on the right surface of the support plate, and the slider is slidably connected to the bottom end of the inner wall of the support plate.

[0019] As a further description of the above technical solution:

[0020] The U-shaped plate is configured in a U-shape and is slidably connected to the front surface of the support plate.

[0021] As a further description of the above technical solution:

[0022] The connecting rod, U-shaped plate, and clamping assembly are each provided in two sets, and the two sets of connecting rod, U-shaped plate, and clamping assembly are symmetrically distributed front and back with respect to the center line of the support plate.

[0023] As a further description of the above technical solution:

[0024] The slide bar passes through and is slidably connected to the rear surface of the U-shaped plate.

[0025] This utility model has the following beneficial effects:

[0026] 1. In this utility model, the semiconductor can be quickly clamped and positioned by the cooperation of the fixing mechanism. The fixing mechanism adopts an elastic clamping design and the rear end of the clamping plate is made of leather. This design can effectively avoid wear on the semiconductor surface and adjust the clamping force by utilizing the elasticity of the second spring, preventing damage to the semiconductor due to excessive clamping force, and helping to improve the product yield.

[0027] 2. In this utility model, the semiconductor position can be accurately positioned through the coordinated action of the positioning component and the fixing mechanism. The motor-driven screw moves the I-beam block, thereby adjusting the position of the support plate. Combined with the limiting action of the locking block and slot, the marking position of the semiconductor can be flexibly changed to meet different marking requirements, improving marking flexibility and accuracy. Attached Figure Description

[0028] Figure 1 This is a front view of the three-dimensional structure of the overall device in this utility model;

[0029] Figure 2 This is a front view of the three-dimensional cross-sectional structure of the support platform in this utility model;

[0030] Figure 3 This is a side view of the three-dimensional cross-sectional structure of the support plate in this utility model;

[0031] Figure 4 This is a top view of the three-dimensional cross-sectional structure of the support plate and I-beam block in this utility model;

[0032] Figure 5 This is a top view of the three-dimensional cross-sectional structure of the support plate in this utility model.

[0033] Legend:

[0034] 1. Laser marking machine; 2. Laser marking head; 3. Support platform; 41. Motor; 42. Screw; 43. I-beam; 44. Support plate; 45. Clamping block; 46. Spring 1; 401. Slot; 51. Electric push rod; 52. Slider; 53. Connecting rod; 54. U-shaped plate; 61. Spring 2; 62. Slide rod; 63. Clamping plate. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0036] Reference Figure 1 - Figure 3 This utility model provides an embodiment of a semiconductor laser marking device, including a laser marking machine 1, a laser marking head 2 at the front end of the laser marking machine 1, both the laser marking machine 1 and the laser marking head 2 are existing technologies and can be implemented by those skilled in the art, wherein the laser marking head 2 is a part of the laser marking machine 1, a support platform 3 is fixedly connected to the upper surface of the laser marking machine 1, the laser marking head 2 is located directly above the support platform 3, a positioning component is provided above the laser marking machine 1, and a fixing mechanism is provided above the laser marking machine 1, the positioning component can flexibly control the position of the fixing mechanism, and the fixing mechanism can clamp and position the semiconductor to ensure accurate positioning during subsequent marking;

[0037] Reference Figure 1 - Figure 3The fixing mechanism includes a drive assembly and a clamping assembly. The drive assembly includes an electric push rod 51, which is prior art and can be implemented by those skilled in the art. A slider 52 is fixedly connected to the left end of the output shaft of the electric push rod 51. After the electric push rod 51 is started, its output shaft will extend and retract, and the slider 52 will move left and right. A connecting rod 53 is hinged to the front surface of the slider 52, and a U-shaped plate 54 is hinged to the front end of the connecting rod 53. When the slider 52 moves left and right, the connecting rod 53 will be squeezed and swing, which will drive the U-shaped plate 54 to move back and forth. The clamping assembly includes a slide rod 62. A clamping plate 63 is fixedly connected to the rear surface of slide rod 62. The rear end of the clamping plate 63 is made of thin leather. When clamping the semiconductor, the semiconductor is in direct contact with the leather, which can effectively prevent wear and damage to the semiconductor surface. One end of spring 61 is fixedly connected to the inner wall of the front side of U-shaped plate 54, and the other end of spring 61 is fixedly connected to the front surface of slide rod 62. The slide rod 62 and U-shaped plate 54 are elastically connected. Therefore, when clamping the semiconductor, the clamping plate 63 does not clamp rigidly, and the elasticity of spring 61 is constant, which can effectively prevent excessive clamping force from damaging the semiconductor. At the same time, laser marking has almost no external force affecting the semiconductor, so the clamping plate 63 can clamp and position the semiconductor stably.

[0038] Reference Figure 1 , Figure 2 , Figure 4 The positioning component includes a motor 41, and a screw 42 is fixedly connected to the output shaft of the motor 41. Both the motor 41 and the screw 42 are existing technologies and can be implemented by those skilled in the art. The motor 41 is a servo motor. When started, its output shaft can drive the screw 42 to rotate forward or reverse. An I-beam block 43 is threadedly connected to the outer wall of the screw 42. When the screw 42 rotates, it will drive the I-beam block 43 to move left and right. The thread helix angle of the outer wall of the screw 42 is five degrees. When the screw 42 stops rotating, it can be locked. A support plate 44 is slidably connected to the top of the outer wall of the I-beam block 43. The support plate 44 moves in the front and back direction. A slot 401 is opened on the inner wall of the right side of the support plate 44. Multiple slots 401 are opened and are distributed at equal intervals in the front and back. One end of a spring 46 is fixedly connected to the inner wall of the left side of the I-beam block 43. The other end of the spring 46 is fixedly connected to a locking block 45.

[0039] Reference Figure 1 , Figure 2 , Figure 4The motor 41 is installed on the left surface of the support platform 3. The motor 41 is fixed to the left surface of the support platform 3 with bolts and can be disassembled. The screw 42 passes through and is rotatably connected to the left surface of the support platform 3. The I-beam 43 is set in the shape of an I-beam and passes through and slides on the upper surface of the support platform 3. It moves in the left and right direction. There are two sets of I-beam 43, support plate 44 and fixing mechanism, which are distributed horizontally at equal intervals to avoid wasting time due to material replacement. The locking block 45 passes through and slides on the right surface of the I-beam 43. When the locking block 45 moves to the left, it will retract into the I-beam 43 and gradually squeeze the spring 46 to generate a reaction force. The locking block 45 is inserted into the inner wall of the slot 401 and can limit the support plate 44. The support plate 44 can remain stable without external force interference in the front and back directions. The front and rear ends of the right surface of the locking block 45 are set as inclined surfaces. When the inclined surfaces are squeezed, the locking block 45 will move to the left.

[0040] Reference Figure 1 - Figure 3 An electric push rod 51 is installed on the right surface of the support plate 44. The electric push rod 51 passes through the right surface of the support plate 44, but the mounting point is on the right surface of the support plate 44 and it is fixed with bolts. The slider 52 is slidably connected to the bottom end of the inner wall of the support plate 44 and moves in the left and right direction. The U-shaped plate 54 is U-shaped and passes through and is slidably connected to the front surface of the support plate 44. There are two sets of connecting rods 53, U-shaped plates 54 and clamping components. The two sets of connecting rods 53, U-shaped plates 54 and clamping components are symmetrically distributed in front and back with respect to the center line of the support plate 44, which can ensure that the semiconductor is clamped synchronously from the front and back directions and keep the semiconductor centered. The slide rod 62 passes through and is slidably connected to the rear surface of the U-shaped plate 54. When the slide rod 62 moves forward, it will gradually retract into the interior of the U-shaped plate 54 and squeeze the spring 61 to produce a reaction. The rear end of the lower surface of the slide rod 62 is provided with a protrusion. The protrusion is slidably connected to the inner wall of the U-shaped plate 54, which can ensure the stability of the slide rod 62 when sliding.

[0041] Working principle: When using this device, first place the semiconductor on the support plate 44, then activate the electric push rod 51 to move the slider 52 to the left. The leftward movement of the slider 52 will pull the two sets of connecting rods 53 to swing. The two sets of swinging connecting rods 53 will cause the U-shaped plates 54, sliding rods 62, and clamping plates 63 on the front and rear sides to move closer together. Gradually, the leather side of the clamping plate 63 will come into contact with the semiconductor, and the clamping plate 63 will be unable to move. The U-shaped plate 54 will move closer to the clamping plate 63, and the sliding rod 62 will gradually retract into the U-shaped plate 54 and compress the second spring 61 to generate a reaction force. When half of the sliding rod 62 is retracted into the U-shaped plate 54, the electric push rod 51 is turned off. At this time, the semiconductor will be clamped and positioned by the clamping plate 63 due to the elasticity of the second spring 61.

[0042] Then, adjust the front and rear positions of the support plate 44 according to the position to be marked on the semiconductor. When adjusting, simply move the support plate 44 with force. When the support plate 44 moves, the slot 401 will press the inclined surface of the block 45, causing the block 45 to retract into the I-block 43 to release the obstruction. When the block 45 moves, it will also press the spring 46 to generate a reaction force.

[0043] When the support plate 44 is adjusted to the appropriate position, the support plate 44 is released, and the locking block 45 will be inserted into the nearest locking slot 401 under the influence of the elasticity of the spring 46, thus positioning the support plate 44.

[0044] Then, the motor 41 is started to drive the screw 42 to rotate. The rotating screw 42 will drive the two sets of I-beams 43, the support plate 44 and the semiconductor to move synchronously. When one set of semiconductors moves to below the laser marking head 2, marking can be performed. During marking, the other set of marked semiconductors can be removed and a new semiconductor can be fixed to facilitate subsequent direct processing and avoid interruption.

[0045] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A laser marking device for semiconductors, comprising a laser marking machine (1), characterized in that: The laser marking machine (1) is provided with a laser marking head (2) at the front end, a support platform (3) is fixedly connected to the upper surface of the laser marking machine (1), a positioning component is provided above the laser marking machine (1), and a fixing mechanism is provided above the laser marking machine (1). The fixing mechanism includes a driving component and a clamping component. The driving component includes an electric push rod (51). A slider (52) is fixedly connected to the left end of the output shaft of the electric push rod (51). A connecting rod (53) is hinged to the front surface of the slider (52). A U-shaped plate (54) is hinged to the front end of the connecting rod (53). The clamping component includes a slide rod (62). A clamping plate (63) is fixedly connected to the rear surface of the slide rod (62). One end of a second spring (61) is fixedly connected to the inner wall of the front side of the U-shaped plate (54). The other end of the second spring (61) is fixedly connected to the front surface of the slide rod (62).

2. The laser marking device for semiconductors according to claim 1, characterized in that: The positioning assembly includes a motor (41), the output shaft of the motor (41) is fixedly connected to a screw (42), the outer wall of the screw (42) is threadedly connected to an I-beam (43), the top of the outer wall of the I-beam (43) is slidably connected to a support plate (44), the inner wall on the right side of the support plate (44) is provided with a slot (401), the inner wall on the left side of the I-beam (43) is fixedly connected to one end of a spring (46), and the other end of the spring (46) is fixedly connected to a locking block (45).

3. The laser marking device for semiconductors according to claim 2, characterized in that: The motor (41) is mounted on the left surface of the support platform (3), and the screw (42) passes through and is rotatably connected to the left surface of the support platform (3).

4. The laser marking device for semiconductors according to claim 2, characterized in that: The I-shaped block (43) is configured in the shape of an I-shaped block and is slidably connected to the upper surface of the support platform (3).

5. The laser marking device for semiconductors according to claim 2, characterized in that: The card block (45) is slidably connected to the right surface of the I-beam (43), the card block (45) is inserted into the inner wall of the card slot (401), and both the front and rear ends of the right surface of the card block (45) are set as inclined surfaces.

6. The laser marking device for semiconductors according to claim 2, characterized in that: The electric push rod (51) is mounted on the right surface of the support plate (44), and the slider (52) is slidably connected to the bottom end of the inner wall of the support plate (44).

7. The laser marking device for semiconductors according to claim 2, characterized in that: The U-shaped plate (54) is configured as U-shaped and is slidably connected to the front surface of the support plate (44).

8. The laser marking device for semiconductors according to claim 2, characterized in that: The connecting rod (53), U-shaped plate (54), and clamping assembly are each provided in two sets, and the two sets of connecting rod (53), U-shaped plate (54), and clamping assembly are symmetrically distributed front and back with respect to the center line of the support plate (44).

9. The laser marking device for semiconductors according to claim 2, characterized in that: The slide bar (62) passes through and is slidably connected to the rear surface of the U-shaped plate (54).

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