Product cutting jig

By setting up product and edge material adsorption holes on the cutting platform and using a vacuum device for independent adsorption, the problem of unstable position of irregularly shaped products during the cutting process is solved, achieving efficient and non-destructive cutting results.

CN223790768UActive Publication Date: 2026-01-13RONGCHENG GOERTEK MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202423128942.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-18
Publication Date
2026-01-13
Estimated Expiration
2034-12-18

AI Technical Summary

Technical Problem

Existing cutting platforms cannot efficiently hold irregularly shaped products, and the impact of water flow during the cutting process causes the product to tilt, affecting the cutting quality.

Method used

Design a product cutting fixture, comprising a support platform and an elastic platform, with product adsorption holes and edge material adsorption holes, independently adsorbing the product and edge material through a vacuum device, and cutting using a laser or cutting blade to prevent edge material from impacting the product.

Benefits of technology

To ensure the integrity of the product's appearance, improve cutting quality and efficiency, prevent edge materials from colliding with the product, and guarantee the integrity of the cut product.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a product cutting jig which comprises a supporting platform and an elastic platform matched with the supporting platform. The supporting platform and the elastic platform are provided with product adsorption holes corresponding in position and offcut adsorption holes distributed in the peripheries of the product adsorption holes. A to-be-cut packaging plate is limited on the elastic platform; the product adsorption hole is used for adsorbing and positioning a single product on the to-be-cut packaging plate, and the offcut adsorption hole is used for adsorbing and positioning an offcut after the single product is cut; and the single product is cut through an external cutting device. By means of the cutting device, position deviation of a product caused by impact of cutting water or external force in the cutting process can be avoided, and therefore high-quality cutting is achieved.
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Description

Technical Field

[0001] This utility model relates to the field of product cutting technology in system-level packaging, and more specifically, to a product cutting fixture. Background Technology

[0002] SIP (System In a Package) packaging mainly integrates multiple functional wafers, including processor and memory wafers, into a single package based on factors such as application scenario and number of packaging substrate layers, thereby achieving a packaging solution where a single substrate has complete functions.

[0003] After packaging is completed, cutting is usually required to separate the entire product board into individual chips. The commonly used cutting fixture is a cutting platform. The product is limited on the cutting platform by the vacuum adsorption of a rubber plate, and then the cutting operation is completed with the help of a cutter.

[0004] However, existing cutting platforms cannot achieve efficient cutting of irregularly shaped products. Furthermore, during the cutting process, the high-intensity cutting water flow can impact the cut product or material edge, causing the product to tilt, resulting in deformation or damage to the product's appearance and seriously affecting the cutting quality. Utility Model Content

[0005] In view of the above problems, the purpose of this utility model is to provide a product cutting fixture to solve the quality problems of existing product cutting platforms, such as the inability to fix the position of the cut product and edge material, resulting in product deformation or damage.

[0006] The product cutting fixture provided by this utility model includes a support platform and an elastic platform adapted to the support platform; wherein,

[0007] The support platform and the elastic platform are provided with product adsorption holes corresponding to their positions and edge material adsorption holes distributed around the product adsorption holes.

[0008] The packaging board to be cut is confined on the elastic platform;

[0009] The product adsorption hole is used to adsorb and position a single product on the packaging board to be cut, and the edge material adsorption hole is used to adsorb and position the edge material after the single product is cut.

[0010] The individual product is cut using an external cutting device.

[0011] Furthermore, an optional structural feature is that the product adsorption hole is connected to an external first-stage vacuum device, and the edge material adsorption hole is connected to an external second-stage vacuum device; and...

[0012] The first vacuum device and the second vacuum device adsorb independently.

[0013] In addition, an optional structural feature is that at least one edge material adsorption hole is provided;

[0014] When multiple edge material adsorption holes are provided, the multiple edge material adsorption holes are symmetrically distributed about the single product.

[0015] In addition, an optional structural feature is that the shape of the edge material adsorption hole is rectangular, arc-shaped, or circular.

[0016] In addition, an optional structural feature is that the product adsorption pore is provided with at least one.

[0017] In addition, an optional structural feature is that the external cutting device includes a laser cutting device for locally cutting the single product, and a cutting blade for dicing the partially cut product.

[0018] In addition, an optional structural feature is that a cutting path is provided on the elastic platform that corresponds to the cutting trajectory of the cutting blade.

[0019] In addition, an optional structural feature is that the size of the support platform is not smaller than the size of the elastic platform;

[0020] The size of the elastic platform is not smaller than the size of the packaging board to be cut.

[0021] In addition, an optional structural feature is that the individual products are distributed in a regular array on the packaging board to be cut.

[0022] Using the aforementioned product cutting fixture, product adsorption holes and edge material adsorption holes are set on the support platform and the elastic platform. After the packaging board to be cut is limited on the elastic platform, the product adsorption holes adsorb and position the individual products on the packaging board to be cut. At the same time, the edge material adsorption holes adsorb and position the edge material after the individual products are cut. This can prevent the edge material after cutting from impacting the individual products under the action of cutting water, and can ensure the integrity of the product appearance after the material edge is cut, thereby improving the cutting quality and efficiency. Attached Figure Description

[0023] Other objects and results of this invention will become more apparent and readily understood with reference to the following description taken in conjunction with the accompanying drawings, and with a more complete understanding of the invention. In the drawings:

[0024] Figure 1 This is a schematic diagram of the structure of the packaging board to be cut according to an embodiment of the present utility model;

[0025] Figure 2This is a schematic diagram of the product cutting fixture according to an embodiment of the present utility model;

[0026] Figure 3 This is a schematic diagram of the cutting principle of the product cutting fixture according to an embodiment of the present utility model.

[0027] The reference numerals in the above figures include: 1. Packaging board to be cut; 11. Single product; 12. Dicing and cutting position; 13. Laser cutting outline; 2. Support platform; 3. Elastic platform; 31. Cutting track; 4. Product adsorption hole; 5. Edge material adsorption hole.

[0028] In all the accompanying drawings, the same reference numerals indicate similar or corresponding features or functions. Detailed Implementation

[0029] In the following description, numerous specific details are set forth for illustrative purposes and to provide a thorough understanding of one or more embodiments. However, it will be apparent that these embodiments may also be implemented without these specific details. In other instances, well-known structures and devices are shown in block diagram form for ease of description of one or more embodiments.

[0030] In the following description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0031] To provide a detailed description of the product cutting fixture within this utility model, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0032] Figures 1 to 3 The schematic structures of the packaging board to be cut and the product cutting fixture according to embodiments of the present invention are shown respectively.

[0033] like Figure 1 This Figure 3As shown in the figure, the product cutting fixture of this utility model embodiment includes a support platform 2 and an elastic platform 3 adapted to the support platform 2; wherein, the support platform 2 and the elastic platform 3 are provided with product adsorption holes 4 corresponding to the positions and edge material adsorption holes 5 distributed around the product adsorption holes 4; the packaging plate 1 to be cut is fixed on the elastic platform 3 as a whole, and the single product 11 on the packaging plate 1 to be cut is adsorbed and positioned through the product adsorption holes 4, and the edge material adsorption holes 5 are adsorbed and positioned through the edge material adsorption holes 5. Then, the single product 11 is cut by an external cutting device, which can position the cut single product 11 and the edge material separately, thereby preventing the cut edge material from causing collision damage to the product.

[0034] The product adsorption hole 4 and the edge material adsorption hole 5 are respectively connected to two vacuum suction devices. For example, the product adsorption hole 4 is connected to the first external vacuum device, and the edge material adsorption hole 5 is connected to the second external vacuum device. Furthermore, the first and second vacuum devices adsorb independently. After the cutting water is turned on, the edge material will not collide with the individual product 11. After the product is cleaned, it can be transported away by the material handling equipment. At this time, the first vacuum device is released, while the second vacuum device remains in the adsorption state. After all the individual products 11 are taken away, the second vacuum device is released, and then the cleaning of the support platform 2 and the elastic platform 3 is completed. This ensures the integrity of the individual product 11 and effectively improves the cutting quality and cutting efficiency of the product.

[0035] It can be seen that the function of the above-mentioned edge material adsorption hole 5 is mainly to adsorb and position the edge material remaining after the single product 11 is cut. Therefore, at least one edge material adsorption hole 5 can be provided. When there is one edge material adsorption hole 5, the edge material adsorption hole can be set as a continuous hole on one side of the single product 11, that is, a long strip-shaped through hole. When there are multiple edge material adsorption holes 5, the multiple edge material adsorption holes are spaced apart from each other and are symmetrically distributed about the single product 11. The specific setting can be based on the shape and size of the edge material, and is not limited to the three long strip-shaped edge material adsorption hole 5 structure (corresponding to one three-product) shown in the figure.

[0036] Furthermore, the shape of the edge material adsorption hole 5 can be set to various forms such as rectangle, arc, or circle. Similarly, the product adsorption hole 4 is distributed below each individual product 11. For each individual product 11, at least one product adsorption hole 4 is provided. Its shape is usually set to the circle shown in the attached figure, but other shapes of adsorption holes can also be set according to the shape of the cut individual product 11, such as irregularly shaped products.

[0037] In one specific embodiment of this utility model, the external cutting device includes a laser cutting device for partially cutting a single product 11, and a cutting blade for dicing the partially cut product. When cutting irregularly shaped products, laser cutting can be used, or a combination of laser and cutting blade can be used. For example, firstly, a single product 11 is partially cut by laser according to the laser cutting contour 13, and then the remaining part of the product is diced by the cutting blade according to the dicing cutting position 12. Dicing cutting can perform a one-time cutting operation on a row or column of products, thereby improving cutting efficiency and the consistency of a single product 11.

[0038] Specifically, a cutting path 31 that corresponds to the cutting trajectory of the cutting blade can be set on the elastic platform 3. The distribution of the cutting path 31 corresponds to the dicing position of the individual product 11 in the product to be cut. The specific settings can be flexibly configured according to the product and cutting requirements.

[0039] In the cutting fixture of this utility model, a single product 11 can be arranged in a regular array on the packaging plate 1 to be cut. Through the mutual positioning of the packaging plate 1 to be cut and the elastic platform 3 or the support platform 2, the positioning between the single product 11 and the product adsorption hole 4 at the corresponding position is realized. The size of the support platform 2 can be set to be no less than the size of the elastic platform 3, and the size of the elastic platform 3 can be set to be no less than the size of the packaging plate 1 to be cut, so that each product can be accurately adsorbed and positioned, and the product can be prevented from shifting during the cutting process.

[0040] According to the product cutting fixture of this utility model, a product adsorption hole and an edge material adsorption hole are provided. After the packaging board to be cut is limited on the elastic platform, the product adsorption hole adsorbs and positions the individual products on the packaging board to be cut. At the same time, the edge material adsorption hole adsorbs and positions the edge material after the individual products are cut. This can prevent the edge material after cutting from impacting the individual products during the cleaning process, ensure that the positions of the product and the edge material do not interfere with each other, ensure the integrity of the appearance of the cut product, and achieve the effect of improving the cutting quality and cutting efficiency of the product.

[0041] The product cutting fixture according to the present invention has been described above by way of example with reference to the accompanying drawings. However, those skilled in the art should understand that various modifications can be made to the product cutting fixture proposed in the present invention without departing from the scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the contents of the appended claims.

Claims

1. A product cutting fixture, characterized in that, This includes a support platform and a flexible platform adapted to the support platform; wherein, The support platform and the elastic platform are provided with product adsorption holes corresponding to their positions and edge material adsorption holes distributed around the product adsorption holes. The packaging board to be cut is confined on the elastic platform; The product adsorption hole is used to adsorb and position a single product on the packaging board to be cut, and the edge material adsorption hole is used to adsorb and position the edge material after the single product is cut. The individual product is cut using an external cutting device.

2. The product cutting fixture according to claim 1, characterized in that, The product adsorption hole is connected to an external first-stage vacuum device, and the edge material adsorption hole is connected to an external second-stage vacuum device; furthermore... The first vacuum device and the second vacuum device adsorb independently.

3. The product cutting fixture according to claim 1, characterized in that, At least one edge material adsorption hole is provided; When multiple edge material adsorption holes are provided, the multiple edge material adsorption holes are symmetrically distributed about the single product.

4. The product cutting fixture according to claim 1, characterized in that, The shape of the edge material adsorption hole is rectangular, arc-shaped, or circular.

5. The product cutting fixture according to claim 1, characterized in that, The product has at least one adsorption pore.

6. The product cutting fixture according to claim 1, characterized in that, The external cutting device includes a laser cutting device for locally cutting the single product, and a cutting blade for dicing the partially cut product.

7. The product cutting fixture according to claim 6, characterized in that, A cutting path that corresponds to the cutting trajectory of the cutting blade is provided on the elastic platform.

8. The product cutting fixture according to claim 1, characterized in that, The size of the support platform is not smaller than the size of the elastic platform; The size of the elastic platform is not smaller than the size of the packaging board to be cut.

9. The product cutting fixture according to claim 1, characterized in that, The individual products are arranged in a regular array on the packaging board to be cut.