IC carrier plate copper plating device

Abstract

The utility model belongs to the field of IC (integrated circuit) support plate processing, particularly relates to an IC support plate copper plating device, and aims to solve the problems that the copper plating quality is influenced due to the fact that the concentration of copper plating liquid in a local area is too high and the IC support plate is inconvenient to take out in the prior art, the following scheme is provided: the IC support plate copper plating device comprises a copper plating machine main body, a copper plating bin is fixedly mounted on the inner side of the copper plating machine body, a grid bin is slidably mounted on the inner side of the copper plating bin, an IC carrier plate is placed on the inner side of the grid bin, two displacement mechanisms are arranged on the top of the grid bin, and a linkage base is fixedly mounted on the top of the copper plating machine body. A transmission shaft is rotationally installed on one side of the linkage base in a penetrating mode, and the transmission shaft is fixedly sleeved with a transmission gear. According to the utility model, copper plating liquid in the copper plating bin can be stirred, so that the liquid is uniformly mixed, and an IC (Integrated Circuit) support plate in the copper plating bin is convenient to take.

Description

Technical Field

[0001] This utility model relates to the field of IC substrate processing technology, and in particular to an IC substrate copper plating device. Background Technology

[0002] The IC carrier copper plating device uses electroplating to deposit a layer of copper on the surface of the IC carrier to achieve electrical connection and protection of the IC carrier.

[0003] However, existing copper plating equipment is prone to having excessively high copper plating solution concentrations in localized areas, which affects the quality of copper plating. Furthermore, existing copper plating equipment often involves immersing the IC substrate in the copper plating solution for plating, which makes it inconvenient to remove the IC substrate. Utility Model Content

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] An IC substrate copper plating apparatus includes a copper plating machine body. A copper plating chamber is fixedly installed on the inner side of the copper plating machine body, and a grid chamber is slidably installed on the inner side of the copper plating chamber. An IC substrate is placed on the inner side of the grid chamber. Two displacement mechanisms are provided on the top of the grid chamber. Each displacement mechanism includes a connecting metal block, a grooved rack, a linkage base, and a transmission gear. The connecting metal block is fixedly installed on the top of the grid chamber, and the grooved rack is fixedly installed on the top of the connecting metal block. The linkage base is fixedly installed on the top of the copper plating machine body. A transmission shaft is rotatably installed through one side of the linkage base, and a transmission gear is fixedly sleeved on the transmission shaft. The transmission gear meshes with the grooved rack.

[0006] Specifically, a traction shaft is fixedly installed on one side of each of the two linkage bases, and a traction wheel is rotatably sleeved on each of the two traction shafts. The two traction wheels are respectively adapted to the grooves on one side of the corresponding grooved straight rack. The two traction wheels can effectively ensure the stability of the corresponding grooved bevel gear when it moves.

[0007] Specifically, braking grooves are provided on both the upper and lower sides of the two linkage bases. The same control handle is fixedly installed on the side of the two drive shafts that are far apart from each other. Two limit bases are fixedly installed on the inner side of the control handle. Limit rods are rotatably installed on the inner side of the two limit bases. Limit springs are fixedly installed on the inner wall of one side of the two limit bases. The other end of the two limit springs is connected to the corresponding limit rods respectively. The two limit rods are respectively adapted to the corresponding braking grooves.

[0008] Specifically, the copper plating machine body has a mixing chamber inside. A mixing base is fixedly installed on one inner wall of the mixing chamber. An active bevel gear is rotatably installed on the bottom inner wall of the mixing base. A mixing servo motor is fixedly installed on the bottom inner wall of the mixing chamber. The output shaft of the mixing servo motor is connected to the active bevel gear, so that the active bevel gear can be rotated by the mixing servo motor.

[0009] Specifically, a positive bevel gear is rotatably mounted on one inner wall of the mixing base. The positive bevel gear meshes with the driving bevel gear. A positive shaft is fixedly mounted on one side of the positive bevel gear, which can drive the positive shaft to rotate.

[0010] Specifically, a reverse bevel gear is rotatably mounted on one inner wall of the mixing base. The reverse bevel gear meshes with the driving bevel gear. A reverse sleeve is fixedly mounted on one side of the reverse bevel gear. The reverse sleeve rotatably passes through the mixing base. The forward shaft rotates inside the reverse sleeve. The reverse bevel gear can drive the reverse sleeve to rotate.

[0011] Specifically, a plurality of forward stirring blades are fixedly sleeved on the forward shaft, and a plurality of reverse stirring blades are fixedly sleeved on the reverse sleeve, so that the forward shaft can drive the plurality of forward stirring blades to rotate clockwise, and the reverse sleeve can drive the plurality of reverse stirring blades to rotate counterclockwise.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] (1) The IC substrate copper plating device of this utility model can stir the copper plating liquid in the copper plating tank through the set mechanism, so that the liquid is mixed evenly, and prevents the copper plating liquid concentration in some areas from being too high, thereby improving the copper plating quality of IC substrate.

[0014] (2) The IC carrier copper plating device of this utility model can conveniently and quickly put the IC carrier into or take out the copper plating chamber through the set mechanism, which increases the practicality of the device. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of an IC carrier copper plating device proposed in this utility model;

[0016] Figure 2 This is a partial three-dimensional structural diagram of the lifting mechanism of the IC carrier copper plating device proposed in this utility model.

[0017] Figure 3 This is a partial three-dimensional structural diagram of the limiting mechanism of the IC carrier copper plating device proposed in this utility model.

[0018] Figure 4 This is a three-dimensional cross-sectional view of the hybrid mechanism of the IC substrate copper plating device proposed in this utility model;

[0019] Figure 5 This is an exploded three-dimensional structural diagram of the hybrid mechanism of the IC substrate copper plating device proposed in this utility model.

[0020] In the diagram: 1. Copper plating machine body; 2. Copper plating chamber; 3. Mesh chamber; 4. Connecting metal block; 5. Grooved straight rack; 6. Linkage base; 7. Traction shaft; 8. Traction wheel; 9. Transmission shaft; 10. Transmission gear; 11. Control handle; 12. Mixing base; 13. Active bevel gear; 14. Mixing servo motor; 15. Forward bevel gear; 16. Forward shaft; 17. Forward stirring blade; 18. Reverse bevel gear; 19. Reverse sleeve; 20. Reverse stirring blade; 21. Limiting base; 22. Limiting rod; 23. Limiting spring. Detailed Implementation

[0021] Reference Figure 1-5 An IC substrate copper plating apparatus includes a copper plating machine body 1, a copper plating chamber 2 fixedly installed inside the copper plating machine body 1, a grid chamber 3 slidably installed inside the copper plating chamber 2, and an IC substrate placed inside the grid chamber 3; the top of the grid chamber 3 is provided with two displacement mechanisms, each displacement mechanism including a connecting metal block 4, a grooved rack 5, a linkage base 6, and a transmission gear 10. The connecting metal block 4 is fixedly installed on the top of the grid chamber 3, and the grooved rack 5 is fixedly installed on the top of the connecting metal block 4. The linkage base 6 is fixedly installed on the top of the copper plating machine body 1, and a transmission shaft 9 is rotatably installed through one side of the linkage base 6. The transmission gear 10 is fixedly sleeved on the transmission shaft 9, and the transmission gear 10 meshes with the grooved rack 5.

[0022] In this embodiment, a traction shaft 7 is fixedly installed on one side of each of the two linkage bases 6, and a traction wheel 8 is rotatably sleeved on each of the two traction shafts 7. The two traction wheels 8 are respectively adapted to the grooves on one side of the corresponding grooved straight rack 5. The two traction wheels 8 can effectively ensure the stability of the corresponding grooved bevel gear 5 when it moves.

[0023] In this embodiment, brake grooves are provided on both the upper and lower sides of the two linkage bases 6. The same control handle 11 is fixedly installed on the side of the two transmission shafts 9 that are far apart from each other. Two limit bases 21 are fixedly installed on the inner side of the control handle 11. Limit rods 22 are rotatably installed on the inner side of the two limit bases 21. Limit springs 23 are fixedly installed on the inner wall of one side of the two limit bases 21. The other end of the two limit springs 23 is connected to the corresponding limit rods 22 respectively. The two limit rods 22 are respectively adapted to the corresponding brake grooves.

[0024] In this embodiment, a mixing chamber is provided inside the copper plating machine body 1. A mixing base 12 is fixedly installed on one inner wall of the mixing chamber. An active bevel gear 13 is rotatably installed on the bottom inner wall of the mixing base 12. A mixing servo motor 14 is fixedly installed on the bottom inner wall of the mixing chamber. The output shaft of the mixing servo motor 14 is connected to the active bevel gear 13, so that the active bevel gear 13 can be rotated by the mixing servo motor 14.

[0025] In this embodiment, a positive bevel gear 15 is rotatably mounted on one inner wall of the mixing base 12. The positive bevel gear 15 meshes with the driving bevel gear 13. A positive shaft 16 is fixedly mounted on one side of the positive bevel gear 15. The positive bevel gear 15 can drive the positive shaft 16 to rotate.

[0026] In this embodiment, a reverse bevel gear 18 is rotatably mounted on one inner wall of the mixing base 12. The reverse bevel gear 18 meshes with the driving bevel gear 13. A reverse sleeve 19 is fixedly mounted on one side of the reverse bevel gear 18. The reverse sleeve 19 rotatably passes through the mixing base 12. The forward shaft 16 rotates inside the reverse sleeve 19. The reverse bevel gear 18 can drive the reverse sleeve 19 to rotate.

[0027] In this embodiment, a plurality of forward stirring blades 17 are fixedly sleeved on the forward shaft 16, and a plurality of reverse stirring blades 20 are fixedly sleeved on the reverse sleeve 19, so that the forward shaft 16 can drive the plurality of forward stirring blades 17 to rotate clockwise, and at the same time, the reverse sleeve 19 can drive the plurality of reverse stirring blades 20 to rotate counterclockwise.

[0028] Working Principle: When copper plating an IC substrate, the operator places the IC substrate into the grid compartment 3 and then starts the machine via the control console. The hybrid servo motor 14 starts, driving the active bevel gear 13 to rotate. The active bevel gear 13 rotates, driving the forward bevel gear 15 and the reverse bevel gear 18 to rotate. The forward bevel gear 15 rotates, driving the forward shaft 16 to rotate. The forward shaft 16 rotates, driving multiple forward stirring blades 17 to rotate clockwise. Simultaneously, the reverse bevel gear 18 rotates, driving the reverse sleeve 19 to rotate. The reverse sleeve 19 rotates, driving multiple reverse stirring blades 20 to rotate counterclockwise. The rotation of the multiple forward stirring blades 17 and multiple reverse stirring blades 20 stirs and mixes the copper plating liquid, reducing the occurrence of excessively high copper plating liquid concentration in local areas. When copper plating is performed, the operator holds both sides of the control handle 11 and presses the two limit rods 22 with both hands. The two limit rods 22 are released from the control handle. When the corresponding brake groove is engaged, the control handle 11 is manually pressed down. The control handle 11 drives the two drive shafts 9 to rotate, which in turn drives the corresponding drive gears 10 to rotate. The two drive gears 10 then drive the corresponding grooved rack 5 to move downwards. As the two grooved racks 5 move downwards, they are restricted by the two traction wheels 8, which effectively ensures the stability of the downward movement of the two grooved racks 5. The downward movement of the two grooved racks 5 drives the corresponding connecting metal block 4 to move downwards, which in turn drives the same mesh chamber 3 to move downwards. The downward movement of the mesh chamber 3 drives the IC carrier board to move downwards, so that the IC carrier board is encapsulated by the copper plating liquid for copper plating. At the same time, to prevent the mesh chamber 3 from moving, the operator stops pressing the two limit rods 22. The two limit rods 22 rebound under the influence of the rebound force of the corresponding limit springs 23 and are locked into the corresponding brake groove to complete the fixation, thereby ensuring the stability of the copper plating of the IC carrier board.

[0029] The technological advancements of this invention compared to existing technologies are as follows: the mechanism allows for stirring of the copper plating liquid within the copper plating tank 2, ensuring uniform mixing and preventing excessively high concentrations of copper plating liquid in localized areas. This improves the copper plating quality of the IC substrate. Furthermore, the mechanism facilitates convenient and quick placement and removal of the IC substrate from the copper plating tank 2, enhancing the device's practicality.

Claims

1. An apparatus for copper plating of IC carrier boards, characterized by The application relates to a copper plating machine, which comprises a copper plating machine body (1), a copper plating bin (2) fixedly arranged on the inner side of the copper plating machine body (1), a grid bin (3) slidably arranged on the inner side of the copper plating bin (2), and an IC carrier plate placed on the inner side of the grid bin (3). Two displacement mechanisms are arranged on the top of the grid bin (3), and the displacement mechanism comprises a connecting metal block (4), a recessed straight rack (5), a linkage base (6) and a transmission gear (10). The connecting metal block (4) is fixedly arranged on the top of the grid bin (3), the recessed straight rack (5) is fixedly arranged on the top of the connecting metal block (4), the linkage base (6) is fixedly arranged on the top of the copper plating machine body (1), a transmission shaft (9) is rotatably arranged on one side of the linkage base (6), the transmission gear (10) is fixedly arranged on the transmission shaft (9), and the transmission gear (10) is engaged with the recessed straight rack (5).

2. The IC board copper plating device according to claim 1, wherein, A traction shaft (7) is fixedly arranged on one side of each of the two linkage bases (6), and a traction wheel (8) is rotatably arranged on each of the two traction shafts (7). The two traction wheels (8) are respectively matched with the recesses on one side of the corresponding recessed straight racks (5).

3. The apparatus for copper plating of IC boards according to claim 2, wherein, Brake grooves are arranged on the upper and lower sides of the two linkage bases (6), a same control handle (11) is fixedly arranged on the side, away from each other, of the two transmission shafts (9), two limiting bases (21) are fixedly arranged on the inner side of the control handle (11), limiting rods (22) are rotatably arranged on the inner sides of the two limiting bases (21), limiting springs (23) are fixedly arranged on the inner walls of one side of the two limiting bases (21), the other ends of the two limiting springs (23) are respectively connected with the corresponding limiting rods (22), and the two limiting rods (22) are respectively matched with the corresponding brake grooves.

4. The apparatus for copper plating of IC boards according to claim 1, wherein, A mixing chamber is arranged in the copper plating machine body (1), a mixing base (12) is fixedly arranged on the inner wall of one side of the mixing chamber, a driving bevel gear (13) is rotatably arranged on the bottom inner wall of the mixing base (12), a mixing servo motor (14) is fixedly arranged on the bottom inner wall of the mixing chamber, and the output shaft of the mixing servo motor (14) is connected with the driving bevel gear (13).

5. The apparatus for copper plating of IC boards according to claim 4, wherein, A positive bevel gear (15) is rotatably arranged on the inner wall of one side of the mixing base (12), the positive bevel gear (15) is engaged with the driving bevel gear (13), and a positive shaft (16) is fixedly arranged on one side of the positive bevel gear (15).

6. The apparatus for copper plating of IC boards according to claim 5, wherein, A reverse bevel gear (18) is rotatably arranged on the inner wall of one side of the mixing base (12), the reverse bevel gear (18) is engaged with the driving bevel gear (13), a reverse sleeve (19) is fixedly arranged on one side of the reverse bevel gear (18), the reverse sleeve (19) rotatably penetrates the mixing base (12), and the positive shaft (16) is rotatably arranged on the inner side of the reverse sleeve (19).

7. The apparatus for copper plating of IC boards according to claim 6, wherein, A plurality of positive stirring blades (17) are fixedly arranged on the positive shaft (16), and a plurality of reverse stirring blades (20) are fixedly arranged on the reverse sleeve (19).

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