Electroplating assembly and electroplating device
By designing inlet channels, partition channels, and outlet channels in the electroplating assembly, the problem of slow electroplating solution exchange speed is solved, enabling timely replenishment of the electroplating solution and increasing the flow rate, thereby improving electroplating efficiency.
Patent Information
- Application Number
- CN202423236806.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2034-12-25
AI Technical Summary
In existing electroplating components, the exchange rate of the electroplating solution on the surface of the solar cell is slow, and the consumed metal ions cannot be replenished in time, resulting in low current density and slow electroplating speed.
Design an electroplating assembly including an electroplating area between the electroplating body and the work station, outputting electroplating solution through an inlet channel and continuously replenishing electroplating solution during the electroplating process, and controlling the flow and discharge of electroplating solution by combining a partition channel and an outlet channel, thereby improving the flow rate and exchange speed of the electroplating solution.
It increases the exchange rate of the electroplating solution on the surface of the battery cells, enhances the current density, and improves the electroplating efficiency.
Smart Images
Figure CN223793260U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of battery cell processing technology, and in particular to an electroplating component and an electroplating device. Background Technology
[0002] In the metallization process of solar cells and other plated components, the positive terminal of the power supply is connected to the conductive anode in the electroplating solution, and the negative terminal is connected to the conductive cathode. The solar cell is supported on a carrier and electrically connected to the conductive cathode to form an electroplating circuit. After energization, metal cations in the electroplating solution can adhere to the surface of the solar cell in contact with the conductive cathode. The conductive cathode, acting as the negative electrode, can improve the conductivity of the solar cell and reduce its internal resistance, thereby improving the cell's performance.
[0003] However, in existing electroplating components, the exchange rate of the electroplating solution on the surface of the solar cell is slow, and the consumed metal ions cannot be replenished in time, resulting in low current density and slow electroplating speed. Utility Model Content
[0004] Therefore, it is necessary to provide an electroplating component and an electroplating apparatus to address the above problems and improve electroplating efficiency.
[0005] This utility model first provides an electroplating assembly, comprising: an electroplating component, including an electroplating body and a station for accommodating a battery cell, wherein an electroplating area is formed between the electroplating body and the station, the electroplating body is provided with a liquid inlet channel communicating with the electroplating area, the liquid inlet channel being used to output electroplating solution into the electroplating area, the electroplating body including an anode element at least partially exposed in the electroplating area, the anode element being a conductive element; and a cathode element, spaced apart from the electroplating body and used to contact the battery cell accommodated in the station, the cathode element being a conductive element.
[0006] In the aforementioned electroplating assembly, the anode is connected to the positive terminal of the power supply, and the cathode is connected to the negative terminal. Electroplating solution is output to the electroplating area through the liquid inlet channel, and the electroplating assembly is energized. The metal cations in the electroplating solution can adhere to the electroplating surface of the battery cell. During the electroplating process, electroplating solution is continuously replenished to the electroplating area through the liquid inlet channel, which can replenish the consumed metal ions in a timely manner and increase the flow rate of the electroplating solution in the electroplating area, thereby increasing the exchange rate of the electroplating solution on the electroplating surface of the battery cell, increasing the current density, and thus improving the electroplating efficiency.
[0007] In one embodiment, the distance H between the electroplating body and the work station satisfies: 0mm < H ≤ 5mm.
[0008] With this configuration, the distance H between the electroplating body and the battery cell is smaller, which can further increase the flow rate of the electroplating solution in the electroplating area and increase the electroplating speed.
[0009] In one embodiment, the electroplating body includes a working surface, and the electroplating area is formed between the working surface and the work station.
[0010] This setup makes the electroplating area between the work surface and the work station more clearly defined, and also facilitates the processing of the electroplated body.
[0011] In one embodiment, the liquid inlet channel includes a first inclined section communicating with the electroplating area, the first inclined section being arranged at an angle relative to the workstation so that the electroplating liquid is output along a first direction.
[0012] With this configuration, the electroplating solution output from the first inclined section to the electroplating area has a velocity component on the surface of the battery cell that is parallel to the surface of the battery cell and oriented in the first direction. This allows the electroplating solution to flow rapidly on the surface of the battery cell, thereby increasing the exchange rate of metal ions in the electroplating solution on the surface of the battery cell.
[0013] In one embodiment, the electroplating body is further provided with a partition channel communicating with the electroplating area. The partition channel is arranged at an interval from the liquid inlet channel. The partition channel is used to output a partition fluid to block the electroplating solution.
[0014] This design prevents the plating solution on the surface of the solar cell from flowing outwards from the connection between the flow channel and the plating area, thereby preventing the plating solution from overflowing and affecting the exchange rate of the plating solution on the surface of the solar cell. It also prevents the plating solution from overflowing and causing the cathode to be plated.
[0015] In one embodiment, the isolation channel includes a second inclined section communicating with the electroplating area, the second inclined section being arranged at an angle relative to the workstation and inclined toward the liquid inlet channel so that the output isolation fluid blocks the electroplating liquid.
[0016] With this configuration, the isolation fluid output from the second inclined section has a velocity component on the surface of the battery cell that is parallel to the surface of the battery cell and toward the inlet channel, thereby improving the isolation effect.
[0017] In one embodiment, the liquid inlet channel includes a first inclined section communicating with the electroplating area, the first inclined section being arranged at an angle relative to the workstation so that the electroplating liquid is output along a first direction; the isolation channel is provided on the side of the liquid inlet channel facing the first direction so that the isolation fluid is output in the opposite direction along the first direction.
[0018] This design confines the electroplating solution to the area between the inlet channel and the electroplating area and the area between the outlet channel and the electroplating area, preventing the electroplating solution from overflowing.
[0019] In one embodiment, the liquid inlet channel includes a first inclined section communicating with the electroplating area, the first inclined section being arranged at an angle relative to the workstation so that the electroplating liquid is output along a first direction; the partition channel is disposed on both sides of the liquid inlet channel, a portion of the partition channel being disposed on the side of the liquid inlet channel facing the first direction so that the partition fluid is output in the opposite direction of the first direction, and the remaining portion of the partition channel being disposed on the side of the liquid inlet channel facing the opposite direction of the first direction so that the partition fluid is output along the first direction.
[0020] This design confines the electroplating solution to the area between the two second inclined sections and the electroplating zone, preventing the solution from overflowing.
[0021] In one embodiment, the partition channels are located on both sides of the liquid inlet channel, and the connection points between the partition channels and the electroplating area on both sides are located opposite to each other on both sides of the liquid inlet channel.
[0022] This design confines the electroplating solution to the area between the two partitioned flow channels and the electroplating zone, preventing the solution from overflowing.
[0023] In one embodiment, the electroplating body is further provided with a liquid outlet channel communicating with the electroplating area. The liquid outlet channel is used to discharge the electroplating liquid from the electroplating area. The connection between the liquid outlet channel and the electroplating area is located between the liquid inlet channel and the partition channel.
[0024] With this setup, the electroplating solution in the electroplating area can be discharged in a timely manner through the outlet channel, preventing excessive electroplating solution from overflowing.
[0025] This utility model also provides an electroplating apparatus, including a carrier and an electroplating assembly as described above, wherein the carrier includes a carrier surface and the work station is formed on the carrier surface. Attached Figure Description
[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0027] Figure 1 This is a cross-sectional structural diagram of an electroplating apparatus according to one embodiment of the present invention.
[0028] Reference numerals: 1. Supporting component; 11. Supporting surface; 2. Electroplating body; 21. Liquid inlet channel; 211. First inclined section; 212. First connecting section; 22. Anode component; 23. Isolation channel; 231. Second inclined section; 232. Second connecting section; 24. Liquid outlet channel; 25. Working surface; 3. Cathode component; 4. Battery cell. Detailed Implementation
[0029] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0030] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.
[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0032] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0033] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.
[0034] In the metallization process of solar cells and other plated components, the positive terminal of the power supply is connected to the conductive anode in the electroplating solution, and the negative terminal is connected to the conductive cathode. The solar cell is supported on a carrier and electrically connected to the conductive cathode to form an electroplating circuit. After energization, metal cations in the electroplating solution can adhere to the surface of the solar cell in contact with the conductive cathode. The conductive cathode, acting as the negative electrode, can improve the conductivity of the solar cell and reduce its internal resistance, thereby improving the cell's performance. However, in existing electroplating assemblies, the exchange rate of the electroplating solution on the surface of the solar cell is slow, and the consumed metal ions cannot be replenished in time, resulting in low current density and slow electroplating speed.
[0035] To solve the above problems, such as Figure 1 As shown, this utility model provides an electroplating component and an electroplating apparatus to improve electroplating efficiency.
[0036] like Figure 1 As shown, specifically, the electroplating assembly includes an electroplating component and a cathode component 3, wherein: the electroplating component includes an electroplating body 2 and a station for accommodating the battery cell 4, an electroplating area is formed between the electroplating body 2 and the station, the electroplating body 2 is provided with a liquid inlet channel 21 communicating with the electroplating area, the liquid inlet channel 21 is used to output electroplating solution into the electroplating area, the electroplating body 2 includes an anode component 22 that is at least partially exposed in the electroplating area, the anode component 22 is a conductive component; the cathode component 3 is arranged at intervals with the electroplating body 2 and is used to contact the battery cell 4 accommodated in the station, the cathode component 3 is a conductive component.
[0037] It should be noted that when the battery cell 4 is housed in the workstation, the workstation is the location of the electroplated surface of the battery cell 4, which is the surface of the battery cell 4 facing the electroplated part. Contact between the cathode component 3 and the battery cell 4 housed in the workstation means that the cathode component 3 and the battery cell 4 can touch each other, i.e., there is no interaction force between them; or they can abut each other, i.e., there is an interaction force between them, as long as the cathode component 3 and the battery cell 4 are electrically connected.
[0038] In the electroplating assembly provided in this embodiment of the present invention, the anode 22 is connected to the positive terminal of the power supply, and the cathode 3 is connected to the negative terminal of the power supply. Electroplating solution is output to the electroplating area through the liquid inlet channel 21, and the electroplating assembly is powered on. The metal cations in the electroplating solution can adhere to the electroplating surface of the battery cell 4. During the electroplating process, the electroplating solution is continuously replenished to the electroplating area through the liquid inlet channel 21, which can replenish the consumed metal ions in a timely manner and increase the flow rate of the electroplating solution in the electroplating area, thereby increasing the exchange rate of the electroplating solution on the electroplating surface of the battery cell 4, increasing the current density, and thus improving the electroplating efficiency.
[0039] The electroplating body 2 can be entirely configured as an anode 22, in which case the liquid inlet channel 21 is located on the anode 22. Alternatively, the electroplating body 2 can also include an insulating component (not shown), with the anode 22 located on the side of the insulating component facing the bearing surface 11. In this case, the liquid inlet channel 21 can be located on the insulating component or on the anode 22.
[0040] like Figure 1 As shown, the distance H between the electroplating body 2 and the station satisfies: 0mm < H ≤ 5mm. A smaller distance H between the electroplating body 2 and the station allows for a further increase in the flow rate of the electroplating solution within the electroplating area, thus increasing the electroplating speed. Preferably, the distance H between the electroplating body 2 and the station is 1mm, 2mm, 3mm, 4mm, or 5mm.
[0041] To facilitate the installation and removal of the battery cell 4, the electroplating body 2 and the cathode component 3 are designed to move together or separately relative to the workstation. When installing the battery cell 4, first control the electroplating body 2 and the cathode component 3 to move towards the side away from the workstation, and place the battery cell 4 on the workstation. Then control the electroplating body 2 and the cathode component 3 to move towards the side closer to the workstation, so that the electroplated surfaces of the cathode component 3 and the battery cell 4 come into contact, and the distance H between the electroplated surfaces of the electroplating body 2 and the battery cell 4 meets the above-mentioned dimensions.
[0042] like Figure 1 As shown, the cathode element 3 is configured as a flexible element. The cathode element 3 moves towards the side closest to the workstation, so that when the cathode element 3 comes into contact with the battery cell 4, the flexible element can act as a buffer, preventing the cathode element 3 from causing excessive impact on the battery cell 4 and thus preventing damage to the battery cell 4. The flexible element can be a flexible conductive electrode such as a metal brush.
[0043] like Figure 1 As shown, the electroplating body 2 includes a working surface 25, and an electroplating area is formed between the working surface 25 and the work station. This makes the electroplating area between the working surface 25 and the work station more clearly defined and also facilitates the processing of the electroplating body 2. Preferably, the working surface 25 is planar. Of course, the working surface 25 can also be configured as an arc surface or other shapes as needed.
[0044] like Figure 1 As shown, in one embodiment, the liquid inlet channel 21 includes a first inclined section 211 communicating with the electroplating area. The first inclined section 211 is arranged at an inclination relative to the workstation so that the electroplating liquid is output along a first direction. In the illustrated embodiment, the first direction is the +X direction, and the opposite direction of the first direction is the -X direction. In other embodiments, the orientation of the first direction can be adjusted according to the specific structure and position of the electroplated part, the cathode part 3, and the battery cell 4. This embodiment of the present invention does not impose specific limitations here. The electroplating liquid introduced into the electroplating area from the first inclined section 211 has a velocity component parallel to the surface of the battery cell 4 and oriented towards the first direction, which allows the electroplating liquid to flow rapidly on the surface of the battery cell 4, thereby further improving the exchange rate of metal ions in the electroplating liquid on the surface of the battery cell 4. The end of the first inclined section 211 away from the electroplating area is connected to the outlet of an electroplating liquid driving component (not shown). The electroplating liquid driving component can provide power for the flow of the electroplating liquid to drive the electroplating liquid from the first inclined section 211 into the electroplating area. The first inclined segment 211 can be straight or arc-shaped, so that the output electroplating solution has a velocity component on the surface of the battery cell 4 that is parallel to the surface of the battery cell 4 and oriented toward the first direction.
[0045] In another embodiment, the liquid inlet channel 21 includes a first inclined section 211 communicating with the electroplating area and a first connecting section 212 communicating with the end of the first inclined section 211 away from the electroplating area. The first inclined section 211 is arranged at an angle relative to the workstation, and the first connecting section 212 is perpendicular to the workstation. The end of the first connecting section 212 away from the first inclined section 211 is connected to the outlet of the electroplating liquid driving component. This facilitates the processing of the liquid inlet channel 21, and the first connecting section 212 reduces the space occupied by the liquid inlet channel 21 within the electroplating body 2, avoiding interference with other structures within the electroplating body 2. In other embodiments, the first connecting section 212 may also be arranged parallel to the workstation or inclined relative to the workstation; or, the liquid inlet channel 21 may only include the first connecting section 212, with both ends of the first connecting section 212 connected to the electroplating area and the outlet of the electroplating liquid driving component, respectively; of course, the liquid inlet channel 21 may also be in other regular or irregular shapes such as wavy or Z-shaped, as long as the electroplating liquid can be introduced into the electroplating area through the liquid inlet channel 21. This utility model embodiment does not impose specific limitations here.
[0046] like Figure 1As shown, the electroplating body 2 is also provided with a partition channel 23 communicating with the electroplating area. The partition channel 23 is arranged alternately with the liquid inlet channel 21. The partition channel 23 is used to output a partition fluid to block the electroplating solution. During the electroplating process, the partition fluid is continuously output through the partition channel 23. The partition fluid can prevent the electroplating solution on the surface of the battery cell 4 from flowing to the outside of the connection between the partition channel 23 and the electroplating area, thereby preventing the electroplating solution from overflowing and affecting the exchange rate of the electroplating solution on the surface of the battery cell 4. At the same time, it can also prevent the electroplating solution from overflowing and causing the cathode 3 to be plated, thus avoiding affecting the performance of the cathode 3 or requiring the cathode 3 to be stripped. The partition fluid can be a gas or an extractant, or other fluid that can block the flow of the electroplating solution without affecting the performance of the electroplating solution. This embodiment of the present invention does not impose specific limitations. One end of the isolation channel 23 away from the electroplating area is connected to the outlet of the isolation fluid drive (not shown). The isolation fluid drive can provide power for the flow of the isolation fluid to drive the isolation fluid from the isolation channel 23 into the electroplating area.
[0047] like Figure 1 As shown, in one embodiment, the isolation channel 23 includes a second inclined section 231 communicating with the electroplating area. The second inclined section 231 is arranged at an angle relative to the workstation and is inclined toward the liquid inlet channel 21 so that the output isolation fluid blocks the electroplating liquid. One end of the second inclined section 231 away from the electroplating area is connected to the outlet of the isolation fluid drive unit. The isolation fluid output from the second inclined section 231 has a velocity component on the surface of the battery cell 4 that is parallel to the surface of the battery cell 4 and toward the liquid inlet channel 21. This causes the electroplating liquid flowing on the surface of the battery cell 4 toward the connection between the isolation channel 23 and the electroplating area to flow in the opposite direction under the action of the isolation fluid, that is, to flow toward the liquid inlet channel 21, thereby further preventing the electroplating liquid from overflowing and improving the isolation effect. The second inclined section 231 can be straight or arc-shaped so that the output isolation fluid has a velocity component on the surface of the battery cell 4 that is parallel to the surface of the battery cell 4 and toward the liquid inlet channel 21.
[0048] In another embodiment, the isolation channel 23 includes a second inclined section 231 communicating with the electroplating area and a second connecting section 232 communicating with the end of the second inclined section 231 away from the electroplating area. The second inclined section 231 is arranged at an angle relative to the workstation, and the second connecting section 232 is perpendicular to the workstation. The end of the second connecting section 232 away from the second inclined section 231 is connected to the outlet of the isolation fluid drive component. This facilitates the fabrication of the isolation channel 23, and the second connecting section 232 reduces the space occupied by the isolation channel 23 within the electroplating body 2, avoiding interference with other structures within the electroplating body 2. In other embodiments, the second connecting section 232 may also be arranged parallel to the workstation or inclined relative to the workstation; or, the isolation channel 23 may only include the second connecting section 232, with both ends of the second connecting section 232 connected to the electroplating area and the outlet of the electroplating liquid driving component, respectively; of course, the isolation channel 23 may also be in other regular or irregular shapes such as wavy or Z-shaped, as long as the isolation fluid can be passed into the electroplating area through the isolation channel 23. This utility model embodiment does not impose specific limitations here.
[0049] In one embodiment, since the electroplating solution introduced into the electroplating area from the first inclined section 211 has a velocity component parallel to the surface of the battery cell 4 and oriented in the first direction, the electroplating solution is mainly output along the first direction. Therefore, the isolation channel 23 can be provided on the side of the inlet channel 21 facing the first direction. When the isolation channel 23 is provided with a second inclined section 231, the second inclined section 231 causes the isolation fluid to be output in the opposite direction along the first direction. The isolation fluid output from the second inclined section 231 has a velocity component parallel to the surface of the battery cell 4 and oriented in the opposite direction along the first direction, thereby allowing the electroplating solution at the connection between the isolation channel 23 and the electroplating area to flow in the opposite direction along the first direction, preventing the isolation fluid from overflowing. In this way, the electroplating solution can be confined between the connection between the inlet channel 21 and the electroplating area and the connection between the isolation channel 23 and the electroplating area, preventing the electroplating solution from overflowing and affecting the exchange rate of the electroplating solution on the surface of the battery cell 4, or causing the cathode 3 to be plated. The number of isolation channels 23 can be set to one, two or more as needed, and multiple isolation channels 23 are all located on the side of the liquid inlet channel 21 facing the first direction.
[0050] like Figure 1As shown, in another embodiment, since some of the electroplating solution will also be output in the reverse direction of the first direction, the isolation channel 23 can also be provided on both sides of the liquid inlet channel 21, and the connection between the isolation channel 23 on both sides and the electroplating area is provided on both sides of the liquid inlet channel 21. When the isolation channel 23 is provided with a second inclined section 231, part of the isolation channel 23 is provided on the side of the liquid inlet channel 21 facing the first direction, so that the isolation fluid is output in the reverse direction of the first direction. The isolation fluid output from the second inclined section 231 has a velocity component on the surface of the battery cell 4 that is parallel to the surface of the battery cell 4 and in the reverse direction of the first direction, so that the electroplating liquid at the connection between the isolation channel 23 and the electroplating area can flow in the reverse direction of the first direction; the remaining part of the isolation channel 23 is provided on the side of the liquid inlet channel 21 facing the reverse direction of the first direction, so that the isolation fluid is output in the first direction. The isolation fluid output from the second inclined section 231 has a velocity component on the surface of the battery cell 4 that is parallel to the surface of the battery cell 4 and in the first direction, so that the electroplating liquid at the connection between the isolation channel 23 and the electroplating area can flow in the first direction. In this way, the electroplating solution can be confined between the connection points of the partition channels 23 on both sides and the electroplating area, preventing the electroplating solution from overflowing and affecting the exchange rate of the electroplating solution on the surface of the battery cell 4, or causing the cathode element 3 to be plated. The number of partition channels 23 can be set to two, three or more as needed, and this embodiment of the present invention does not impose a specific limitation.
[0051] like Figure 1As shown, the electroplating body 2 is also provided with an outlet channel 24 communicating with the electroplating area. The outlet channel 24 is used to discharge the electroplating solution from the electroplating area. The connection between the outlet channel 24 and the electroplating area is located between the inlet channel 21 and the partition channel 23. The electroplating solution in the electroplating area can be discharged in a timely manner through the outlet channel 24, avoiding excessive electroplating solution overflow. The end of the outlet channel 24 away from the electroplating area can be connected to the inlet of the electroplating solution driving component (not shown). The electroplating solution driving component can provide power for the flow of the electroplating solution to drive the electroplating solution out of the outlet channel 24 from the electroplating area, and also keep the electroplating solution in the electroplating area in a circulating state to improve the flow rate and uniformity of the electroplating solution, thereby increasing the exchange rate of metal ions in the electroplating solution on the surface of the battery cell 4. The outlet channel 24 can be arranged perpendicular to the workstation, parallel to the workstation, or inclined relative to the workstation. It can also be in other regular or irregular shapes such as wavy or Z-shaped, as long as it can discharge the electrolyte in the electroplating area through the outlet channel 24. This embodiment of the present invention does not impose specific limitations. Furthermore, the distance between the connection point of the outlet channel 24 and the electroplating area and the isolation channel 23 is less than the distance between the connection point of the outlet channel 24 and the electroplating area and the inlet channel 21, to prevent the electroplating solution introduced into the electroplating area from the inlet channel 21 from being directly discharged through the outlet channel 24. The number of outlet channels 24 can be set to one, two, three, or more as needed. When the isolation channel 23 is located on both sides of the inlet channel 21, there are at least two outlet channels 24, and the outlet channels 24 are located on both sides of the inlet channel 21.
[0052] like Figure 1 As shown, when the partition channel 23 is located on both sides of the liquid inlet channel 21, the cathode element 3 is positioned opposite to each other on both sides of the electroplating body 2. The cathode elements 3 on both sides can improve the uniformity of the conductive electric field, thereby improving the uniformity of plating on the surface of the battery cell 5 and enhancing the electroplating effect. The number of cathode elements 3 can be set to two, three, four, or more as needed; this embodiment of the invention does not impose a specific limitation. Of course, in other embodiments, the number of cathode elements 3 can also be one, with one cathode element 3 located on one side of the electroplating body 2.
[0053] This utility model embodiment also provides an electroplating apparatus, including a carrier 1 and the aforementioned electroplating components. The carrier 1 includes a carrier surface 11, and a work station is formed on the carrier surface 11. A negative pressure device can be used to adsorb and fix the battery cell 4 onto the carrier surface 11, so that the battery cell 4 is stably housed in the work station. Alternatively, fasteners or other methods can be used to tightly fix the battery cell 4 to the carrier surface 11. This utility model embodiment does not impose specific limitations here.
[0054] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0055] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.
Claims
1. An electroplating assembly, characterized by, The application relates to an electroplating device, which comprises an electroplating body (2) and a work station for accommodating a battery sheet (4), the electroplating body (2) and the work station form an electroplating area, the electroplating body (2) is provided with a liquid inlet channel (21) which is communicated with the electroplating area and is used for outputting electroplating liquid into the electroplating area, the electroplating body (2) comprises an anode member (22) which is exposed to the electroplating area at least partially and is an electrically-conductive member; and a cathode member (3) which is arranged in a spaced-apart manner with the electroplating body (2) and is used for contacting the battery sheet (4) accommodated in the work station, the cathode member (3) is an electrically-conductive member. The distance H between the electroplating body (2) and the work station satisfies 0mm The electroplating body (2) comprises a working surface (25), and the working surface (25) and the work station form the electroplating area. The liquid inlet channel (21) comprises a first inclined section (211) which is communicated with the electroplating area and is arranged in an inclined manner relative to the work station so that the electroplating liquid is outputted in a first direction.
2. The electroplating assembly of claim 1, wherein, The electroplating body (2) is further provided with a partition channel (23) which is communicated with the electroplating area and is arranged in a spaced-apart manner with the liquid inlet channel (21), and the partition channel (23) is used for outputting partition fluid to block the electroplating liquid.
3. The electroplating assembly of claim 1, wherein, The partition channel (23) comprises a second inclined section (231) which is communicated with the electroplating area and is arranged in an inclined manner relative to the work station, and the second inclined section (231) is inclined towards the liquid inlet channel (21) so that the outputted partition fluid blocks the electroplating liquid.
4. The electroplating assembly of claim 1, wherein, The liquid inlet channel (21) comprises a first inclined section (211) which is communicated with the electroplating area and is arranged in an inclined manner relative to the work station so that the electroplating liquid is outputted in a first direction.
5. The electroplating assembly of claim 1, wherein, The partition channel (23) is arranged on one side of the liquid inlet channel (21) towards the first direction so that the partition fluid is outputted in a reverse direction of the first direction.
6. The electroplating assembly of claim 5, wherein, The liquid inlet channel (21) comprises a first inclined section (211) which is communicated with the electroplating area and is arranged in an inclined manner relative to the work station so that the electroplating liquid is outputted in a first direction.
7. The electroplating assembly of claim 6, wherein, The partition channel (23) is arranged on both sides of the liquid inlet channel (21), and part of the partition channel (23) is arranged on one side of the liquid inlet channel (21) towards the first direction so that the partition fluid is outputted in a reverse direction of the first direction, and the rest of the partition channel (23) is arranged on one side of the liquid inlet channel (21) towards a reverse direction of the first direction so that the partition fluid is outputted in the first direction. The partition channel (23) is arranged on both sides of the liquid inlet channel (21), and the partition channels (23) on both sides are arranged on both sides of the liquid inlet channel (21) relative to the communication positions of the electroplating area.
8. The electroplating assembly of claim 6, wherein, 9. The electroplating assembly of claim 5, wherein, 10. The electroplating assembly of any one of claims 5-9, wherein, The electroplating body (2) is further provided with a liquid outlet channel (24) in communication with the electroplating area, the liquid outlet channel (24) being used for discharging the electroplating liquid from the electroplating area, and the communication position of the liquid outlet channel (24) with the electroplating area is between the liquid inlet channel (21) and the partition channel (23).
11. An electroplating apparatus characterized by comprising: The electroplating assembly according to any one of claims 1-10, comprising a carrier (1) comprising a carrier surface (11), the work station being formed on the carrier surface (11).