Electroplating device
By setting insulating baffles and blocking the flow channels in the electroplating device, the problem of conductive cathodes being plated is solved, thus achieving the prevention of plated components and improving electroplating efficiency, ensuring electroplating uniformity and current density.
Patent Information
- Application Number
- CN202423224552.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2034-12-25
AI Technical Summary
In existing electroplating equipment, some current flows through the electroplating solution to the conductive cathode, causing the conductive cathode to be plated, affecting its performance, and requiring deplating.
In the electroplating apparatus, insulating baffles are arranged at intervals with conductive anodes to form gaps of less than 5 mm. Isolation channels or fluid barriers are installed at the gaps to prevent the formation of current loops and avoid plating on the cathode. At the same time, electroplating solution is replenished in a timely manner through replenishment components to improve electroplating efficiency.
It effectively prevents the cathode from being plated, maintains its performance, improves electroplating efficiency and current density, and ensures electroplating uniformity and the exchange rate of the electroplating solution.
Smart Images
Figure CN223793263U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of battery cell processing technology, and in particular to an electroplating device. Background Technology
[0002] In the metallization process of solar cells and other plated components, the positive terminal of the power supply is connected to the conductive anode in the electroplating solution, and the negative terminal is connected to the conductive cathode. The solar cell is supported on a carrier and electrically connected to the conductive cathode to form an electroplating circuit. After energization, metal cations in the electroplating solution can adhere to the surface of the solar cell in contact with the conductive cathode. The conductive cathode, acting as the negative electrode, can improve the conductivity of the solar cell and reduce its internal resistance, thereby improving the cell's performance.
[0003] However, in existing electroplating equipment, some current flows through the electroplating solution to the conductive cathode, causing the conductive cathode to be plated, which affects the performance of the conductive cathode and requires stripping of the plated conductive cathode. Utility Model Content
[0004] Therefore, it is necessary to provide an electroplating apparatus to prevent the cathode from being plated, in order to address the above-mentioned problems.
[0005] This utility model provides an electroplating apparatus, comprising: a fixture having an electroplating tank for containing an electroplating solution, the fixture including a station located within the electroplating tank for accommodating a battery cell; an anode element arranged at a distance from the station, the anode element being a conductive element; a baffle element arranged at a distance from the anode element, the baffle element being an insulating element, the baffle element having a gap with the battery cell, the height H of the gap satisfying: 0mm < H ≤ 5mm; and a cathode element disposed on the side of the baffle element away from the anode element, for contacting the battery cell accommodated at the station, the cathode element being a conductive element.
[0006] In the aforementioned electroplating apparatus, the anode is connected to the positive terminal of the power supply, and the cathode is connected to the negative terminal. Electroplating solution is introduced into the electroplating tank, and the electroplating apparatus is powered on. Current flows through the anode, electroplating solution, and battery cells to the cathode, forming a current loop. Metal cations in the electroplating solution can adhere to the electroplated surface of the battery cells. During the electroplating process, electroplating solution is introduced into the entire electroplating tank, completely covering the electroplated surface of the battery cells. The anode, baffle, and cathode are all at least partially in contact with the electroplating solution. Because the gap between the baffle and the battery cells is small, the resistance at the gap is large. The current in the current loop formed by the anode, the electroplating solution at the gap, and the cathode is less than the electroplating current threshold of the cathode, thereby preventing the cathode from being plated and avoiding affecting the performance of the cathode or requiring stripping of the cathode.
[0007] In one embodiment, the height H of the gap satisfies: 0mm < H < 2mm.
[0008] This setup improves the blocking effect of the baffle, ensuring that the cathode component is not plated.
[0009] This utility model also provides an electroplating apparatus, comprising: a tooling including a station for accommodating a battery cell; an anode element, spaced apart from the station, the anode element being a conductive element; a baffle element, spaced apart from the anode element, the baffle element being an insulating element; an electroplating area for accommodating electroplating liquid is formed between the baffle element, the anode element, and the station, the baffle element having a gap with the station, the baffle element having a blocking flow channel whose bottom communicates with the gap, the blocking flow channel being used to output blocking fluid to block the electroplating liquid; and a cathode element, disposed on the side of the baffle element away from the anode element, and used to contact the battery cell accommodated in the station, the cathode element being a conductive element.
[0010] In the aforementioned electroplating apparatus, the anode is connected to the positive terminal of the power supply, and the cathode is connected to the negative terminal. Electroplating solution is introduced into the electroplating tank, and the electroplating apparatus is powered on. Current flows through the anode, electroplating solution, and battery cells to the cathode, forming a current loop. Metal cations in the electroplating solution can adhere to the electroplating surface of the battery cells. During the electroplating process, electroplating solution is introduced into the electroplating area, and a blocking fluid is continuously output through the blocking channel. The blocking fluid prevents the electroplating solution from flowing through the gaps towards the side of the baffle facing the cathode, so that the electroplating solution covers part of the electroplating surface of the battery cells. The anode and the baffle are at least partially in contact with the electroplating solution, while the cathode is basically not in contact with the electroplating solution. Current cannot flow through the anode, the electroplating solution at the gaps, and the cathode to form a current loop, thereby preventing the cathode from being plated and avoiding affecting the performance of the cathode or requiring stripping of the cathode. At the same time, it also prevents the electroplating solution from overflowing and affecting the exchange rate of the electroplating solution on the surface of the battery cells.
[0011] In one embodiment, the isolation channel includes an inclined section whose bottom communicates with the gap, the inclined section being arranged at an angle relative to the station and inclined toward the anode, so that the output isolation fluid blocks the electroplating solution.
[0012] With this configuration, the blocking fluid output from the inclined section has a velocity component on the surface of the solar cell that is parallel to the surface of the solar cell and toward the anode, thereby blocking the electroplating solution on the surface of the solar cell from flowing toward the gap and improving the blocking effect.
[0013] In one embodiment, the partition channel further includes a connecting section that communicates with the end of the inclined section away from the gap, the connecting section being perpendicular to the workstation.
[0014] This design facilitates the processing of the flow channel and avoids increasing the size of the baffle.
[0015] In one embodiment, the electroplating apparatus further includes a replenishing element disposed on the side of the baffle near the anode, the replenishing element being used to output electroplating solution into the electroplating area.
[0016] This setup allows for timely replenishment of consumed metal ions and also increases the flow rate of the electroplating solution in the electroplating tank, thereby increasing the exchange rate of the electroplating solution on the surface of the battery cells, increasing the current density, and thus improving electroplating efficiency.
[0017] In one embodiment, the baffles are disposed opposite to each other on both sides of the anode.
[0018] This configuration allows the electroplating solution to be confined within the area enclosed by the baffles on both sides.
[0019] In one embodiment, the cathode element is disposed opposite to the anode element on both sides, and the cathode elements on both sides are respectively disposed on the side of the baffles away from the anode element.
[0020] This setup improves the uniformity of the conductive electric field, thereby enhancing the uniformity of plating on the electroplated surface of the solar cell and improving the electroplating effect.
[0021] In one embodiment, the tooling further includes a support surface for supporting the battery cell so that the battery cell is accommodated at the work station.
[0022] With this configuration, the non-plated surface of the battery cell is in close contact with the supporting surface, preventing the non-plated surface of the battery cell from being plated.
[0023] In one embodiment, the cathode element is configured as a flexible element.
[0024] With this design, the flexible component can act as a buffer, preventing the cathode component from causing excessive impact on the solar cells and thus damaging them. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a cross-sectional structural schematic diagram of an electroplating apparatus according to one embodiment of the present invention.
[0027] Figure 2 This is a cross-sectional structural diagram of an electroplating apparatus according to another embodiment of the present invention.
[0028] Reference numerals: 1. Tooling; 11. Electroplating tank; 12. Bearing surface; 2. Anode component; 3. Baffle; 31. Gap; 32. Isolation channel; 321. Inclined section; 322. Connecting section; 4. Cathode component; 5. Liquid replenishment component; 6. Battery cell. Detailed Implementation
[0029] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0030] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.
[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0032] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0033] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.
[0034] In the metallization process of solar cells and other plated components, the positive terminal of the power supply is connected to the conductive anode in the electroplating solution, and the negative terminal is connected to the conductive cathode. The solar cell is supported on a carrier and electrically connected to the conductive cathode to form an electroplating circuit. After energization, metal cations in the electroplating solution can adhere to the surface of the solar cell in contact with the conductive cathode. The conductive cathode, as the negative electrode, can improve the conductivity of the solar cell and reduce its internal resistance, thereby improving the cell's performance. However, in existing electroplating equipment, some current flows through the electroplating solution to the conductive cathode, causing the conductive cathode to be plated, which affects its performance and necessitates stripping the plated conductive cathode. Although some existing electroplating equipment incorporates a baffle between the conductive anode and cathode, gaps often exist between the baffle and the solar cell due to processing and assembly errors. This allows current to flow through the conductive anode, the electroplating solution at the gap, and to the conductive cathode, forming a current loop that still results in the conductive cathode being plated.
[0035] To solve the above problems, such as Figures 1 to 2 As shown, this utility model provides an electroplating apparatus to prevent the cathode component from being plated.
[0036] like Figure 1 As shown, in one embodiment, the electroplating apparatus includes a fixture 1, an anode 2, a baffle 3, and a cathode 4, wherein: the fixture 1 is provided with an electroplating tank 11 for containing electroplating solution, and the fixture 1 includes a station located in the electroplating tank 11 for accommodating the battery cell 6; the anode 2 is arranged at a distance from the station, and the anode 2 is a conductive component; the baffle 3 is arranged at a distance from the anode 2, and the baffle 3 is an insulating component, and there is a gap 31 between the baffle 3 and the battery cell 6, the height H of the gap 31 satisfying: 0mm<H≤5mm; the cathode 4 is located on the side of the baffle 3 away from the anode 2, and is used to contact the battery cell 6 accommodated in the station, and the cathode 4 is a conductive component.
[0037] It should be noted that when the battery cell 6 is placed in the work station, the work station is the location of the electroplated surface of the battery cell 6.
[0038] In the electroplating apparatus provided in this embodiment of the present invention, the anode 2 is connected to the positive terminal of the power supply, and the cathode 4 is connected to the negative terminal of the power supply. Electroplating solution is introduced into the electroplating tank 11, and the electroplating apparatus is powered on. The current flows through the anode 2, the electroplating solution, the battery cell 6, and the cathode 4 to form a current loop. The metal cations in the electroplating solution can adhere to the electroplating surface of the battery cell 6. During the electroplating process, electroplating solution is introduced into the entire electroplating tank 11, and the electroplating solution completely covers the electroplating surface of the battery cell 6. The anode 2, the baffle 3, and the cathode 4 are all at least partially in contact with the electroplating solution. Since the gap 31 between the baffle 3 and the battery cell 6 is small, the resistance at the gap 31 is large. The current in the current loop formed by the anode 2, the electroplating solution at the gap 31, and the cathode 4 is less than the electroplating current threshold of the cathode 4, thereby preventing the cathode 4 from being plated and avoiding affecting the performance of the cathode 4 or requiring the cathode 4 to be stripped.
[0039] According to experimental analysis, when the height H of gap 31 is 6 mm, the plated area of cathode component 4 accounts for approximately 70%; when the height H of gap 31 is 5.8 mm, the plated area of cathode component 4 accounts for approximately 25.20%; when the height H of gap 31 is 5.6 mm, the plated area of cathode component 4 accounts for approximately 2.47%; when the height H of gap 31 is 5.4 mm, the plated area of cathode component 4 accounts for approximately 0.14%; when the height H of gap 31 is 5.2 mm, the plated area of cathode component 4 accounts for approximately 0.08%; and when the height H of gap 31 is less than 5 mm, the plated area of cathode component 4 accounts for approximately 0%. Therefore, the height H of the gap 31 in the electroplating device is controlled within the range of 0mm < H ≤ 5mm, for example, 0.5mm, 1mm, 2mm, 3mm, 4mm, or 5mm. By controlling the range of the height H of the gap 31, the current flowing from the anode 2 and the electroplating solution at the gap 31 to the cathode 4 cannot form a current loop, or the current in the formed current loop is less than the electroplating current threshold of the cathode 4, thus preventing the cathode 4 from being plated. Since the smaller the height of the gap 31, the greater the resistance at the gap 31, and the smaller the current in the current loop formed from the anode 2 and the electroplating solution at the gap 31 to the cathode 4, the height H of the gap 31 is preferably satisfied: 0mm < H < 2mm, thereby improving the blocking effect of the baffle 3 and ensuring that the cathode 4 is not plated.
[0040] like Figure 2As shown, in another embodiment, the electroplating apparatus includes a fixture 1, an anode 2, a baffle 3, and a cathode 4, wherein: the fixture 1 includes a station for accommodating the battery cell 6; the anode 2 is arranged at a distance from the station and is a conductive element; the baffle 3 is arranged at a distance from the anode 2 and is an insulating element; an electroplating area for accommodating electroplating solution is formed between the baffle 3, the anode 2, and the station; a gap 31 is provided between the baffle 3 and the station; the baffle 3 is provided with a blocking flow channel 32 whose bottom communicates with the gap 31; the blocking flow channel 32 is used to output blocking fluid to block the electroplating solution; the cathode 4 is located on the side of the baffle 3 away from the anode 2 and is used to contact the battery cell 6 accommodated in the station; the cathode 4 is a conductive element.
[0041] It should be noted that when the battery cell 6 is placed in the work station, the work station is the location of the electroplated surface of the battery cell 6.
[0042] In the electroplating apparatus provided in this embodiment, the anode 2 is connected to the positive terminal of the power supply, and the cathode 4 is connected to the negative terminal of the power supply. Electroplating solution is introduced into the electroplating tank 11, and the electroplating apparatus is powered. Current flows through the anode 2, the electroplating solution, the battery cell 6, and the cathode 4 to form a current loop. Metal cations in the electroplating solution can adhere to the electroplating surface of the battery cell 6. During the electroplating process, electroplating solution is introduced into the electroplating area, specifically into the side of the baffle 3 facing the anode 2, and a blocking fluid is continuously output through the blocking channel 32. The blocking fluid can... To prevent the electroplating solution from flowing through the gap 31 to the side of the baffle 3 facing the cathode 4, the electroplating solution covers part of the electroplating surface of the battery cell 6. The anode 2 and the baffle 3 are at least partially in contact with the electroplating solution, while the cathode 4 is basically not in contact with the electroplating solution. The current cannot pass through the anode 2 and the electroplating solution at the gap 31 to the cathode 4 to form a current loop. This can prevent the cathode 4 from being plated, avoid affecting the performance of the cathode 4 or requiring the cathode 4 to be stripped. At the same time, it can also prevent the electroplating solution from overflowing and affecting the exchange rate of the electroplating solution on the surface of the battery cell 6.
[0043] The blocking fluid can be a gas or extractant, or any fluid that can block the flow of the electroplating solution without affecting its performance. This embodiment of the invention does not impose specific limitations on this. The end of the blocking channel 32 furthest from the gap 31 is connected to the outlet of the blocking fluid drive (not shown). The blocking fluid drive provides power for the flow of the blocking fluid to output the blocking fluid.
[0044] like Figure 2As shown, in one embodiment, the isolation flow channel 32 includes an inclined section 321 whose bottom communicates with the gap 31. The inclined section 321 is arranged at an angle relative to the workstation and is inclined toward the anode 2 so that the output isolation fluid blocks the electroplating solution. The end of the inclined section 321 away from the gap 31 is connected to the outlet of the isolation fluid drive. The isolation fluid output from the inclined section 321 has a velocity component on the surface of the battery cell 6 that is parallel to the surface of the battery cell 6 and toward the anode 2, so as to block the electroplating solution on the surface of the battery cell 6 from flowing toward the gap 31, thereby further preventing the electroplating solution from overflowing and improving the isolation effect. The inclined section 321 can be straight or arc-shaped so that the output isolation fluid has a velocity component on the surface of the battery cell 6 that is parallel to the surface of the battery cell 6 and toward the anode 2.
[0045] like Figure 2 As shown, in another embodiment, the isolation channel 32 includes an inclined section 321 communicating with the bottom and the gap 31, and a connecting section 322 communicating with the end of the inclined section 321 away from the gap 31. The inclined section 321 is arranged at an angle relative to the workstation and is inclined toward the anode 2 so that the output isolation fluid blocks the electroplating solution. The connecting section 322 is perpendicular to the workstation, and the end of the connecting section 322 away from the inclined section 321 is connected to the outlet of the isolation fluid drive. In this way, the isolation channel 32 can be easily processed, and the connecting section 322 can reduce the space occupied by the isolation channel 32 in the baffle 3, avoiding increasing the volume of the baffle 3. In other embodiments, the connecting section 322 may be arranged parallel to the workstation or inclined relative to the workstation; or, the isolation channel 32 may only include the connecting section 322, with both ends of the connecting section 322 connected to the gap 31 and the outlet of the electroplating liquid driving component, respectively; of course, the isolation channel 32 may also be in other regular or irregular shapes such as wavy or Z-shaped, as long as it can output the isolation fluid, and this utility model embodiment does not impose specific limitations here.
[0046] like Figure 2 As shown, since some of the electroplating solution in the electroplating area may flow through the gap 31 towards the side of the baffle 3 facing the cathode 4, in order to prevent the electroplating solution from flowing out and causing the exchange rate of the electroplating solution on the surface of the battery cell to slow down, the electroplating device also includes a replenishing component 5. The replenishing component 5 is located on the side of the baffle 3 near the anode 2, and is used to output the electroplating solution into the electroplating area. During the electroplating process, the electroplating solution is continuously replenished into the electroplating tank 11 through the replenishing component 5, which can replenish the consumed metal ions in a timely manner, and can also increase the flow rate of the electroplating solution in the electroplating tank 11, thereby increasing the exchange rate of the electroplating solution on the surface of the battery cell 6, increasing the current density, and thus improving the electroplating efficiency.
[0047] like Figure 2As shown, the fixture 1 may also include an electroplating tank 11, with the workstation located inside the electroplating tank 11. During the electroplating process, electroplating solution is only introduced into the electroplating area within the electroplating tank 11. When a portion of the electroplating solution in the electroplating area flows through the gap 31 toward the side of the baffle 3 facing the cathode 4, the electroplating tank 11 can accommodate the overflowing electroplating solution, preventing it from dripping onto the external platform.
[0048] like Figures 1 to 2 As shown, in the above-mentioned electroplating apparatus, the tooling 1 further includes a bearing surface 12, which is used to support the battery cell 6 so that the battery cell 6 is housed in the work position, that is, the electroplated surface of the battery cell 6 is located in the work position. When the tooling 1 is provided with an electroplating tank 11, the bearing surface 12 is preferably located on the bottom wall of the electroplating tank 11. A negative pressure device can be used to adsorb and fix the battery cell 6 onto the bearing surface 12, or fasteners or other methods can be used to tightly fix the battery cell 6 to the bearing surface 12. The specific bearing method is not limited, as long as the electroplated surface of the battery cell 6 is located in the work position and the non-electroplated surface of the battery cell 6 is tightly attached to the bearing surface 12, so that the non-electroplated surface of the battery cell 6 is not plated. This embodiment of the present invention does not impose specific limitations here.
[0049] like Figures 1 to 2 As shown, the anode 2, the stop 3, and the cathode 4 can move together or independently relative to the fixture 1 to move closer to or further away from the workstation. When installing the battery cell 6, first control the anode 2, the stop 3, and the cathode 4 to move away from the workstation, placing the electroplated surface of the battery cell 6 on the workstation. Then control the anode 2, the stop 3, and the cathode 4 to move closer to the workstation, ensuring a certain distance between the anode 2 and the electroplated surface of the battery cell 6. The height H of the gap 31 between the stop 3 and the electroplated surface of the battery cell 6 meets the aforementioned dimensions. The cathode 4 is electrically connected to the electroplated surface of the battery cell 6. This facilitates the installation and removal of the battery cell 6. When the anode 2, the stop 3, and the cathode 4 can move independently relative to the fixture 1, their positions relative to the battery cell 6 can also be controlled according to the actual dimensions of the battery cell 6.
[0050] like Figures 1 to 2 As shown, the cathode component 4 is configured as a flexible component. When the cathode component 4 moves towards the side closest to the workstation, the flexible component acts as a buffer when the cathode component 4 and the electroplated surface of the battery cell 6 are electrically connected, preventing the battery cell 6 from being damaged due to excessive impact from the cathode component 4. The flexible component can be a flexible conductive electrode such as a metal brush.
[0051] like Figures 1 to 2As shown, in one embodiment, the baffles 3 are disposed opposite to each other on both sides of the anode 2. Thus, when electroplating solution is introduced into the entire electroplating tank 11, the baffles 3 on both sides can prevent the cathode 4, located on the side of the baffle 3 away from the anode 2, from being plated; when electroplating solution is introduced into the electroplating area, the baffles 3 on both sides can confine the electroplating solution within the area enclosed by the baffles 3 on both sides, preventing the electroplating solution from overflowing and affecting the exchange rate of the electroplating solution on the surface of the battery cell 6, and also preventing the cathode 4 from being plated. The number of baffles 3 can be set to two, three, four, or more as needed; this embodiment of the present invention does not impose a specific limitation. Of course, in other embodiments, the number of baffles 3 can also be one, with one baffle 3 disposed on one side of the anode 2, in which case the cathode 4 is disposed on the side of the baffle 3 away from the anode 2.
[0052] like Figures 1 to 2 As shown, in one embodiment, when the baffles 3 are disposed opposite to each other on both sides of the anode 2, the cathodes 4 are disposed opposite to each other on both sides of the anode 2, and the cathodes 4 on both sides are respectively disposed on the side of the baffles 3 away from the anode 2. The cathodes 4 on both sides can improve the uniformity of the conductive electric field, thereby improving the uniformity of plating on the electroplating surface of the battery cell 6 and improving the electroplating effect. The number of cathodes 4 can be set to two, three, four or more as needed, and this embodiment of the present invention does not impose a specific limitation. Of course, in other embodiments, the number of cathodes 4 can also be one, with one cathode 4 disposed on the side of one of the baffles 3 away from the anode 2.
[0053] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0054] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.
Claims
1. An electroplating apparatus, characterized in that, include: The tooling (1) is provided with an electroplating tank (11) for containing electroplating solution. The tooling (1) includes a station located in the electroplating tank (11) for accommodating the battery cell (6). An anode component (2) is arranged at a distance from the work station, and the anode component (2) is a conductive component; A baffle (3) is arranged at a distance from the anode (2). The baffle (3) is an insulating component. A gap (31) exists between the baffle (3) and the workstation. The height H of the gap (31) satisfies: 0mm < H ≤ 5mm; and, A cathode element (4) is disposed on the side of the baffle (3) away from the anode element (2) and is used to contact the battery cell (6) housed in the work station. The cathode element (4) is a conductive element.
2. The electroplating apparatus according to claim 1, characterized in that, The height H of the gap (31) satisfies: 0mm < H < 2mm.
3. An electroplating apparatus, characterized in that, include: Tooling (1), including a station for accommodating the battery cell (6); An anode component (2) is arranged at a distance from the work station, and the anode component (2) is a conductive component; A baffle (3) is arranged at a distance from the anode (2). The baffle (3) is an insulating component. An electroplating area for containing electroplating liquid is formed between the baffle (3), the anode (2), and the work station. A gap (31) is provided between the baffle (3) and the work station. The baffle (3) is provided with a blocking flow channel (32) whose bottom is connected to the gap (31). The blocking flow channel (32) is used to output blocking fluid to block the electroplating liquid. as well as, A cathode element (4) is disposed on the side of the baffle (3) away from the anode element (2) and is used to contact the battery cell (6) housed in the work station. The cathode element (4) is a conductive element.
4. The electroplating apparatus according to claim 3, characterized in that, The isolation channel (32) includes an inclined section (321) whose bottom is connected to the gap (31). The inclined section (321) is arranged at an inclination relative to the work station and is inclined toward the anode (2) so that the output isolation fluid blocks the electroplating solution.
5. The electroplating apparatus according to claim 4, characterized in that, The partition channel (32) further includes a connecting section (322) that communicates with one end of the inclined section (321) away from the gap (31), and the connecting section (322) is perpendicular to the work station.
6. The electroplating apparatus according to claim 3, characterized in that, The electroplating apparatus further includes a liquid replenishing component (5), which is located on the side of the baffle (3) near the anode (2) and is used to output electroplating solution into the electroplating area.
7. The electroplating apparatus according to any one of claims 1-6, characterized in that, The baffle (3) is disposed on both sides of the anode (2).
8. The electroplating apparatus according to claim 7, characterized in that, The cathode element (4) is disposed opposite to the anode element (2) on both sides, and the cathode elements (4) on both sides are respectively disposed on the side of the baffle (3) away from the anode element (2).
9. The electroplating apparatus according to any one of claims 1-6, characterized in that, The tooling (1) also includes a bearing surface (12) for bearing the battery cell (6) so that the battery cell (6) is accommodated in the work station.
10. The electroplating apparatus according to any one of claims 1-6, characterized in that, The cathode element (4) is configured as a flexible element.