Ethernet power supply tester

Abstract

The Ethernet power supply tester comprises a device body, a plurality of slave controllers are uniformly arranged in the device body, the slave controllers are fixedly connected with the device body through bolts, the upper surfaces of the slave controllers are fixedly provided with main radiators, and the main radiators are fixedly connected with the device body through bolts. A partition plate used for adjusting an air duct is arranged on one side of the slave controller and the main radiator and located in the device body. According to the technical scheme, the POE / PD and the electronic load of the ADI PD design scheme are respectively controlled through the microcontroller, so that the program control of the full-level CLASS 0-CLASS 8 and the program control input of the full power range are realized, the access to the MES system is facilitated, and the automation of the test process and the full-cycle tracking of the result are effectively realized.

Description

Technical Field

[0001] This utility model relates to the field of power supply testing equipment technology, specifically to an Ethernet power supply tester. Background Technology

[0002] Since the Institute of Electrical and Electronics Engineers (IEEE) released the latest IEEE 802.3bt standard, higher-power switches (PSE / power supply unit, which can provide up to 90W of power to PD devices) that conform to this IEEE 802.3bt standard have become the mainstream in the market. Switches that conform to the new standard can support more high-power PD devices, thus eliminating the need for repeated network and power supply arrangements, and providing a more convenient and faster networking method for Ethernet.

[0003] However, corresponding R&D and production testing equipment is very rare. Most brands and manufacturers conduct R&D and production testing by making simple jigs. These simple jigs are mostly made of bakelite and use the most primitive resistive load method with fixed classes. This testing method cannot achieve full-level (class 0 to class 8) settings and full-range power input (0 to 90W).

[0004] Furthermore, the most primitive method of testing using resistive loads leads to excessive heat generation and power supply load, which can easily damage components and require frequent maintenance. In actual use, it lacks flexibility and cannot provide a comprehensive and thorough evaluation of the power supply to the switch. In view of the problems exposed in the use of current power supply testing equipment, it is necessary to improve and optimize the structure of Ethernet power supply testing equipment. Utility Model Content

[0005] To address the aforementioned technical problems, this utility model provides an Ethernet Power Supply Tester, which facilitates the testing of Ethernet Power Supply equipment and effectively extends the equipment's lifespan.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an Ethernet power supply tester, comprising a device body, wherein a plurality of slave controllers are evenly arranged inside the device body, the slave controllers are fixedly connected to the device body by bolts, a main heat sink is fixedly mounted on the upper surface of the slave controllers, a partition for adjusting the air duct is provided on one side of the slave controllers and the main heat sink inside the device body, a main heat dissipation hole is opened on one side of the slave controllers at one end of the device body, a plurality of cooling fans are embedded on the other side of the slave controllers on the side surface of the device body, and a sealing plate is fixedly mounted on the upper surface of the device body.

[0007] As a preferred technical solution of the Ethernet power supply tester of this utility model, a number of first limiting grooves are evenly arranged on the inner walls of both sides of the device body, the two ends of the partition are fitted into the first limiting grooves, and a number of air guides are evenly opened on the side surface of the partition, the number and position of the air guides matching the number of controllers.

[0008] As a preferred technical solution of the Ethernet power supply tester of this utility model, auxiliary heat dissipation holes are evenly opened on both sides of the device body on the side of the controller near the main heat dissipation hole, and the auxiliary heat dissipation holes are used to further increase the air flow.

[0009] As a preferred technical solution of the Ethernet power supply tester of this utility model, the device body has fixed extension strips inside on both sides. The fixed extension strips are used to improve the structural strength and limit and fix the partition.

[0010] As a preferred technical solution of the Ethernet power supply tester of this utility model, a heat dissipation plate is provided inside the device body at the end of the controller near the main heat dissipation hole, and the heat dissipation plate is made of heat-conducting components.

[0011] As a preferred technical solution of the Ethernet power supply tester of this utility model, the sealing plate is provided with a number of second limiting grooves evenly opened on one side surface facing the controller. A fixing strip can be fitted inside the second limiting groove. A number of heat dissipation fins are evenly arranged on the bottom surface of the fixing strip. The bottom end of the heat dissipation fins can contact the heat spreader plate to reduce vibration and improve the heat exchange efficiency inside the equipment.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. In this technical solution, the POE / PD and electronic load of the ADIPD design scheme are controlled by a microcontroller, thereby realizing program control of all levels from CLASS 0 to CLASS 8 and programmable input of the full power range. This facilitates integration into the MES system and effectively realizes the automation of the testing process and the full life cycle tracking of the results.

[0014] 2. This technical solution sets up main heat sinks and heat dissipation fins of different specifications inside the device body, which effectively improves the heat exchange efficiency inside the device body, effectively avoids damage to internal components due to excessive heat, and effectively extends the service life of the testing equipment. During the use of the equipment, the fan speed can also be controlled according to the power received, ensuring heat dissipation while effectively reducing noise at low power settings. Attached Figure Description

[0015] To make the contents of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the internal structure of the device in this utility model;

[0018] Figure 3 In this utility model Figure 2 A top-view structural diagram;

[0019] Figure 4 This is a schematic diagram of the bottom structure of the sealing cap in this utility model;

[0020] Figure 5 This is a hardware circuit block diagram of the present invention;

[0021] Figure 6 This is a software flowchart of the present invention;

[0022] In the diagram: 1. Device body; 2. Sealing plate; 3. Auxiliary heat dissipation hole; 4. Main heat dissipation hole; 5. Heat dissipation fan; 6. First limiting groove; 7. Fixing extension strip; 8. Partition plate; 9. Air vent; 10. Slave controller; 11. Main radiator; 12. Heat spreader plate; 13. Second limiting groove; 14. Fixing strip; 15. Heat dissipation fins. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Example

[0025] like Figure 1-6As shown, the Ethernet power supply tester disclosed in this utility model includes a device body 1. Several slave controllers 10 are evenly arranged inside the device body 1. The slave controllers 10 are fixedly connected to the device body 1 by bolts. A main heat sink 11 is fixedly installed on the upper surface of the slave controllers 10. A partition 8 for adjusting the air duct is provided inside the device body 1 on one side of the slave controllers 10 and the main heat sink 11. A main heat dissipation hole 4 is opened at one end of the device body 1 on one side of the slave controllers 10. Several cooling fans 5 are embedded on the side surface of the device body 1 on the other side of the slave controllers 10. A sealing plate 2 is fixedly installed on the upper surface of the device body 1. A main controller is also provided inside the device. The main controller is electrically connected to the slave controllers.

[0026] Specifically, several first limiting grooves 6 are evenly arranged on the inner walls of both sides of the device body 1. The two ends of the partition plate 8 are fitted into the first limiting grooves 6. Several air guides 9 are evenly opened on the side surface of the partition plate 8. The number and position of the air guides 9 match those of the controller 10. In this embodiment, the partition plate 8 is used to guide the airflow, so that the airflow can flow from the main heat sink 11 and quickly dissipate heat from the components.

[0027] Specifically, auxiliary heat dissipation holes 3 are evenly provided on both sides of the device body 1 from the side of the controller 10 near the main heat dissipation hole 4. The auxiliary heat dissipation holes 3 are used to further increase the air flow.

[0028] Specifically, the device body 1 has fixed extension strips 7 inside on both sides. The fixed extension strips 7 are used to improve the structural strength and limit and fix the partition 8.

[0029] Specifically, a heat spreader 12 is installed inside the device body 1 from the end of the controller 10 near the main heat dissipation hole 4. The heat spreader 12 is made of heat-conducting components. In this embodiment, a number of second limiting grooves 13 are evenly opened on the surface of the sealing plate 2 facing the controller 10. A fixing strip 14 can be fitted inside the second limiting groove 13. A number of heat dissipation fins 15 are evenly arranged on the bottom surface of the fixing strip 14. The bottom end of the heat dissipation fins 15 can contact the heat spreader 12 to reduce vibration and improve the heat exchange efficiency inside the device. In this embodiment, the fixing strip 14 is made of heat-conducting metal strip. The cross-sectional structure of the fixing strip 14 is an isosceles trapezoidal structure. The second limiting groove 13 fits the structure of the fixing strip 14, which facilitates the disassembly or installation of components. The bottom end of the heat dissipation fins 15 contacts the heat spreader 12, which can guide the heat on the heat spreader 12 to the heat dissipation fins 15 for heat exchange with the air.

[0030] The working principle and usage process of this utility model: The power supply tester in this technical solution uses the STM32F1 series microprocessor as the main controller and the STM32F0 series as the slave controller. It adopts ADI's PD design scheme. The microcontroller controls the POE / PD and the size of the electronic load of the ADI PD design scheme respectively, thereby realizing the program control of all levels CLASS 0 to CLASS 8 and the programmable input of the full power range.

[0031] The testing device is equipped with a main heat sink 11 as the main heat dissipation device. The sealing plate 2 is fixed on the device body 1 to seal the device. The heat exchange is completed by pressurizing the airflow inside the device body 1 through the cooling fan 5. The cold air enters the interior of the device body 1 through the auxiliary heat dissipation hole 3 and the main heat dissipation hole 4 to exchange heat with the main heat sink 11 and the fixing strip 14. Several first limiting grooves 6 are set inside the device body 1 to facilitate the placement of the partition plate 8 in different areas inside the device body 1, and to facilitate the installation of different specifications of slave controllers 10 inside the device body 1. The fixing strip 14 and heat dissipation fins 15 set at the bottom of the sealing plate 2 further improve the heat exchange efficiency inside the device body 1, effectively avoid the damage of the internal components of the device body 1 due to excessive heat, and effectively improve the service life of the testing equipment.

[0032] The above description is only a preferred embodiment of the present utility model and is not intended to further limit the present utility model. All equivalent changes made based on the description and drawings of the present utility model are within the protection scope of the present utility model.

Claims

1. A Power over Ethernet tester comprising a device body (1), characterized in that: The inside of the device body (1) is uniformly arranged with several slave controllers (10), the slave controllers (10) are fixedly connected with the device body (1) through bolts, the upper surface of the slave controller (10) is fixedly provided with a main radiator (11), one side of the slave controller (10) and the main radiator (11) is provided with a baffle (8) for adjusting the air duct in the inside of the device body (1), one side of the slave controller (10) is provided with a main heat dissipation hole (4) at one end of the device body (1), the other side of the slave controller (10) is embedded with several heat dissipation fans (5) on the side surface of the device body (1), and the upper surface of the device body (1) is fixedly provided with a sealing plate (2).

2. The Power over Ethernet tester of claim 1, wherein: The inside of the device body (1) is uniformly arranged with several first limiting grooves (6), the baffle (8) is embedded in the inside of the first limiting groove (6), and the side surface of the baffle (8) is uniformly provided with several air guide openings (9), the number and position of the air guide openings (9) are matched with the slave controller (10).

3. The PoE tester of claim 1, wherein: The side surface of the slave controller (10) near the main heat dissipation hole (4) is uniformly provided with an auxiliary heat dissipation hole (3) on the two side surfaces of the device body (1), and the auxiliary heat dissipation hole (3) is used for further improving the air flow.

4. The PoE tester of claim 1, wherein: The inside of the device body (1) is provided with a fixed extension strip (7), which is used for improving the structural strength and limiting and fixing the baffle (8).

5. The PoE tester of claim 1, wherein: The end of the slave controller (10) near the main heat dissipation hole (4) is provided with a heat equalizing plate (12) in the inside of the device body (1), and the heat equalizing plate (12) is composed of a heat conducting part.

6. The Power over Ethernet tester of claim 5, wherein: The side surface of the sealing plate (2) towards the slave controller (10) is uniformly provided with several second limiting grooves (13), the inside of the second limiting groove (13) is embedded with a fixed strip (14), the bottom surface of the fixed strip (14) is uniformly arranged with several heat dissipation fins (15), the bottom end of the heat dissipation fin (15) can be in contact with the heat equalizing plate (12), which is used for reducing vibration and improving the heat exchange efficiency inside the equipment.

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