Multi-zone temperature control device and multi-zone temperature control system

Abstract

The utility model discloses a multi-zone temperature control device and a multi-zone temperature control system, which are applied to the technical field of laser heating and comprise an area array laser, a temperature feedback module, a power regulation module and a power output module. The light emitting side of the area array laser faces a heated object, the area array laser comprises a plurality of laser emitting units, the plurality of laser emitting units correspond to a plurality of to-be-heated partitions, and the power adjusting module is independently in communication connection with each laser emitting unit through the power output module; the temperature feedback module is used for measuring the temperature value of the position of each to-be-heated partition in the heated object and sending the temperature value to the power adjusting module. By independently controlling each laser emitting unit in the area array laser, each to-be-heated partition can be independently heated through laser, so that an object can be rapidly heated in a partition manner.

Description

Technical Field

[0001] This utility model relates to the field of laser heating technology, and in particular to a multi-zone temperature control device and a multi-zone temperature control system. Background Technology

[0002] In industrial production, many precision manufacturing processes require precise temperature control of the heated material. For example, in electronics manufacturing, the soldering process of printed circuit board assemblies (PCBAs) needs to ensure that the temperature of the pads in different areas reaches specific requirements to avoid soldering defects; in semiconductor manufacturing, the heating process of wafers requires differentiated temperature control based on the heat dissipation rate of different areas to ensure process consistency.

[0003] In existing technologies, traditional industrial heating solutions generally employ indirect heating methods to maintain heating temperature balance. These methods involve heating the furnace body with hot air, which indirectly heats the object by heating the gas surrounding the object inside the furnace, such as in a reflow oven.

[0004] To maintain heating of different areas of the same object in a reflow oven, multiple ovens are typically used for repeated heating. For example, the first oven heats the object to the target temperature in one area and maintains it for a period. Then, a second oven heats the object to the target temperature in another area and maintains it for a period. This method requires a fixed preheating time for each oven; the higher the target temperature, the longer this preheating process takes, impacting heating efficiency. Switching between different target temperatures further increases the heating time exponentially.

[0005] Another approach involves using a small-spot laser for heating. However, in the soldering process of printed circuit boards, each laser spot typically covers only one pad. During soldering, the laser spot is moved one by one over the pads, and soldering is performed according to different target temperatures. This method becomes too time-consuming and inefficient when the number of pads on the board is large and dense, and is generally only suitable for scenarios with a small number of pads. Therefore, how to provide a multi-zone temperature control device that can quickly heat objects in different zones is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0006] The purpose of this invention is to provide a multi-zone temperature control device that can quickly heat objects in separate zones; another purpose of this invention is to provide a multi-zone temperature control system that can quickly heat objects in separate zones.

[0007] To solve the above-mentioned technical problems, this utility model provides a multi-zone temperature control device, including an area array laser, a temperature feedback module, a power adjustment module, and a power output module;

[0008] The light-emitting side of the area array laser faces the object to be heated. The area array laser includes multiple laser emitting units, and the multiple laser emitting units correspond to multiple zones to be heated. The power adjustment module is independently connected to each of the laser emitting units through the power output module.

[0009] The temperature feedback module is used to acquire temperature information of the location of each of the heating zones in the heated object, and send the temperature information to the power regulation module.

[0010] Optionally, the power regulation module includes an industrial control computer, and the power output module includes a drive power supply.

[0011] Optionally, the temperature feedback module includes a thermal imager, and at least one thermal imager and one area array laser correspond to the same side surface of the object being heated, and each of the heating zones has a corresponding imaging area in the image image of the thermal imager.

[0012] Optionally, it may include a plurality of said area lasers, with the light-emitting sides of the plurality of said area lasers facing the plurality of surfaces to be heated of the object being heated.

[0013] Optionally, the temperature feedback module includes multiple thermal imagers, with each surface to be heated corresponding to at least one thermal imager, and the heated partition of any of the area array lasers having a corresponding imaging area in the imaging image of the thermal imager corresponding to the same surface to be heated.

[0014] Optionally, the device includes two area array lasers and two thermal imagers. The object to be heated includes two surfaces to be heated that are arranged opposite each other. The light-emitting side of one area array laser and the object side of one thermal imager point to the same surface to be heated, while the light-emitting side of the other area array laser and the object side of the other thermal imager point to another surface to be heated.

[0015] Optionally, the power output module includes two driving power supplies, one of the area array lasers is connected to one of the driving power supplies, and the other area array laser is connected to the other driving power supply.

[0016] Optionally, a conveyor belt for moving the heated object may also be included.

[0017] Optionally, the object to be heated is a PCBA, and the first temperature solder paste pad and the second temperature solder paste pad of the PCBA correspond to different heating zones;

[0018] Alternatively, the object to be heated is a wafer, and the wafer has different regions with different heat dissipation rates corresponding to different heating zones.

[0019] This utility model also provides a multi-zone temperature control system, including the multi-zone temperature control device as described in any of the above claims.

[0020] The present invention provides a multi-zone temperature control device, comprising an area array laser, a temperature feedback module, a power adjustment module, and a power output module. The light-emitting side of the area array laser faces the object to be heated. The area array laser includes multiple laser emitting units, each corresponding to a different zone to be heated. The power adjustment module communicates independently with each laser emitting unit through the power output module. The temperature feedback module measures the temperature value at each zone to be heated in the object to be heated and sends the temperature value to the power adjustment module.

[0021] By independently controlling each laser emitting unit in the area array laser, each section to be heated can be heated independently by laser, thereby achieving rapid sectional heating of the object.

[0022] This utility model also provides a multi-zone temperature control system, which has the same beneficial effects as described above, and will not be described in detail here. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a multi-zone temperature control device provided in an embodiment of the present utility model;

[0025] Figure 2 This is a schematic diagram of the structure of a specific multi-zone temperature control device provided in an embodiment of the present invention.

[0026] In the diagram: 1. Area array laser, 2. Thermal imager, 3. Object to be heated, 4. Industrial control computer, 5. Drive power supply, 6. Conveyor belt. Detailed Implementation

[0027] The core of this invention is to provide a multi-zone temperature control device. In existing technologies, the first method using a reflow oven typically involves multiple ovens and multiple heating cycles to maintain heating at different locations on the same object. This method requires a fixed preheating time for the oven; the higher the target temperature, the longer this preheating time, impacting heating efficiency. Switching between different target temperatures further increases heating time exponentially. The second method, using a small-spot laser for heating, becomes too time-consuming and inefficient when the number of solder pads on the board is large and dense, generally only suitable for scenarios with a small number of solder pads.

[0028] The multi-zone temperature control device provided by this utility model includes an area array laser, a temperature feedback module, a power adjustment module, and a power output module. The light-emitting side of the area array laser faces the object to be heated. The area array laser includes multiple laser emitting units, each corresponding to a different zone to be heated. The power adjustment module communicates independently with each laser emitting unit through the power output module. The temperature feedback module measures the temperature value at each zone to be heated in the object to be heated and sends the temperature value to the power adjustment module.

[0029] By independently controlling each laser emitting unit in the area array laser, each section to be heated can be heated independently by laser, thereby achieving rapid sectional heating of the object.

[0030] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Example 1

[0032] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of a multi-zone temperature control device provided in an embodiment of the present invention.

[0033] See Figure 1In this embodiment of the invention, the multi-zone temperature control device includes an area array laser 1, a temperature feedback module, a power adjustment module, and a power output module. The light-emitting side of the area array laser 1 faces the object to be heated 3. The area array laser 1 includes multiple laser emitting units, each corresponding to a multiple zone to be heated. The power adjustment module is independently connected to each laser emitting unit via the power output module. The temperature feedback module measures the temperature value of the object to be heated 3 located in each of the zones to be heated and sends the temperature value to the power adjustment module.

[0034] The aforementioned area array laser 1 is the heating module in this embodiment. In this embodiment, the object to be heated 3 is heated by irradiating it with laser light. An area array laser is a laser that emits a laser beam in a planar form, and it is usually composed of multiple laser emitting units. These laser emitting units form a two-dimensional array, thereby constituting an area array laser. The specific structure of each laser emitting unit can be found in the prior art, and will not be described in detail here.

[0035] In this embodiment, the light-emitting side of the area array laser 1 faces the object being heated 3, and the light-emitting sides of each corresponding laser emitting unit also face the object being heated 3 to irradiate it. In this embodiment, each laser emitting unit has its own irradiation position, that is, each laser emitting unit has its own heating zone. Since each laser emitting unit usually irradiates different positions, multiple laser emitting units will correspond to multiple heating zones. In this embodiment, since the irradiation positions of the laser emitting units can completely overlap, partially overlap, or not overlap, the heating zones can completely overlap, partially overlap, or not overlap. However, not all heating zones can completely overlap. Therefore, the entire area array laser 1 will correspond to multiple heating zones that are at least not completely overlapping. Typically, the entire area array laser 1 will correspond to multiple completely non-overlapping heating zones to irradiate different positions of the object being heated 3.

[0036] It should be noted that the number and distribution of laser emitting units in this embodiment can be designed according to the partitioning requirements of the heated object 3. For example, if the heated object 3 is a PCBA, and there are multiple pad areas on it that require soldering at different temperatures, then each laser emitting unit or multiple laser emitting units can correspond to a pad area as a partition to be heated; if the heated object 3 is a wafer, and different areas require differentiated heating due to differences in heat dissipation rates caused by materials, then each laser emitting unit also corresponds to these areas with different heat dissipation rates as partitions to be heated.

[0037] In this embodiment, each laser emitting unit is independently connected to the power adjustment module via a power output module. This means the power adjustment module can independently control each laser emitting unit to perform irradiation. The power adjustment module determines and controls the operating parameters of each laser emitting unit, while the power output module directly supplies power to the laser emitting units and controls their operation. For example, the power adjustment module may include an industrial control computer 4, and the power output module may include an adjustable power supply 5. Thus, the industrial control computer 4 can directly control each laser emitting unit through the power supply 5, and each laser emitting unit operates independently.

[0038] The aforementioned industrial control computer 4 typically stores the target temperature parameters and corresponding power control strategies for each zone to be heated. The drive power supply 5, based on the control signals from the industrial control computer 4, provides the appropriate power to each laser emitting unit to adjust its laser output power, thereby achieving independent control of each laser emitting unit in the array laser 1, enabling each zone to be heated to its respective target temperature. Specific control algorithms for the industrial control computer 4, such as PID (Proportion Integration Differentiation) algorithms, can be set according to actual conditions and are not specifically limited here.

[0039] The aforementioned temperature feedback module is used to acquire temperature information at the locations of the various heating zones within the heated object 3. Specifically, the temperature feedback module can acquire the temperature information of the heating projection surface of each laser emitting unit in the area array laser 1 on the surface of the heated object 3. This temperature information can be a specific temperature value or information characterizing specific temperature parameters, such as infrared images. This temperature feedback module needs to be communicatively connected to the power regulation module so that it can send the aforementioned temperature information to the power regulation module.

[0040] The aforementioned temperature feedback module can be either a contact temperature measurement structure or a non-contact temperature measurement structure. For example, thermistors and thermocouples can be directly placed at different positions on the surface of the heated object 3 to achieve the zoned temperature feedback function as a contact temperature measurement structure. Alternatively, thermal imagers such as thermal imager 2 can capture infrared images of the heated object 3 and analyze the images, such as by determining the brightness or color of different areas in the image to determine the temperature of different areas, thus achieving the zoned temperature feedback function as a non-contact temperature measurement structure.

[0041] In this embodiment, the temperature feedback module preferably includes a thermal imager 2. At least one thermal imager 2 and one area laser 1 correspond to the same side surface of the heated object 3. Each heated section has a corresponding imaging area in the image captured by the thermal imager 2. The installation position of the thermal imager 2 needs to be coordinated with the area laser 1. The thermal imager 2 is typically wall-mounted next to the area laser 1, facing the heated object 3, at a specified working distance, so that at least one thermal imager 2 and one area laser 1 correspond to the same side surface of the heated object 3. That is, the object side of at least one thermal imager 2 and the light-emitting side of at least one area laser 1 face the same side surface of the heated object 3, allowing the thermal imager 2 to measure the surface of the heated object 3 heated by the area laser 1. At this time, the multiple heated sections corresponding to the area laser 1 have corresponding imaging areas in the image captured by the thermal imager 2. The thermal imager 2 or the power adjustment module can analyze the image to determine the temperature value corresponding to each imaging area, thereby obtaining the temperature value of the heated object 3 at the location of each heated section.

[0042] Then, the power adjustment module can compare the temperature value with the pre-stored target temperature parameter and adjust the control signal according to the comparison result. After receiving the adjusted control signal, the power output module can change the power output of the corresponding laser emitting unit to achieve precise control of the temperature of each heating zone.

[0043] Specifically, the multi-zone temperature control device in this embodiment may further include a conveyor belt 6 for moving the heated object 3. The conveyor belt 6 can transport the heated object 3 to the light-emitting side of the area array laser 1 at a suitable speed and position according to the needs of the actual production process, ensuring that each preset position of the heated object 3 is accurately within the irradiation range of the corresponding laser emitting unit, while facilitating continuous production operations. Of course, other structures can also be used to transport the heated object 3 in this embodiment, and no specific limitations are made here.

[0044] In actual operation, the object to be heated 3 is first transported to a predetermined position via conveyor belt 6. Each laser emitting unit of the area array laser 1 then begins operation, outputting lasers according to the initial power parameters preset by the power adjustment module (such as the industrial control computer 4) to initially heat the object 3 in its respective heating zones. A temperature feedback module (such as the thermal imager 2) collects temperature image information of the object 3 in real time, obtaining an image. After acquiring the image, the thermal imager 2 or the industrial control computer 4 can analyze the actual temperature values ​​of each heating zone on the surface of the object 3. The power adjustment module (such as the industrial control computer 4) can compare the actual temperature values ​​with the target temperature values. If the actual temperature of a heating zone is lower than the target temperature, the power adjustment module can adjust the control signal, increasing the power output of the corresponding laser emitting unit through a power output module (such as the drive power supply 5) to increase the heating speed of that area. If the actual temperature is higher than the target temperature, the power output of the corresponding laser emitting unit is reduced to decrease the heating intensity until the actual temperature of the object 3 in each heating zone stabilizes within its respective target temperature range, thus achieving precise multi-zone temperature control of the object 3.

[0045] The multi-zone temperature control device provided in this embodiment of the present invention can independently control each laser emitting unit in the array laser 1, thereby heating each zone to be heated by laser independently, thus achieving rapid zone heating of the object.

[0046] The specific structure of the multi-zone temperature control device provided by this utility model will be described in detail in the following embodiments.

[0047] Example 2

[0048] Please refer to Figure 2 , Figure 2 This is a schematic diagram of the structure of a specific multi-zone temperature control device provided in an embodiment of the present invention.

[0049] Unlike the above-described utility model embodiments, this utility model embodiment further defines the structure of the multi-zone temperature control device based on the above-described utility model embodiments. The remaining contents have been described in detail in the above-described utility model embodiments and will not be repeated here.

[0050] See Figure 2 In this embodiment of the present invention, the multi-zone temperature control device includes a plurality of the area array lasers 1, the light-emitting sides of the plurality of area array lasers 1 facing the plurality of surfaces to be heated of the object to be heated 3.

[0051] In this embodiment, when the object to be heated 3 has multiple surfaces to be heated, or when the object to be heated 3 needs to be heated from multiple surfaces as a whole, multiple area array lasers 1 can be set up in this embodiment. Each surface to be heated of the object to be heated needs to be heated by at least one area array laser 1, so that the light-emitting side of the multiple area array lasers 1 faces the multiple surfaces to be heated of the object to be heated 3, thereby controlling the multiple area array lasers 1 to heat the multiple surfaces to be heated of the object to be heated 3.

[0052] Accordingly, in this embodiment, the temperature feedback module includes multiple thermal imagers 2, with each surface to be heated corresponding to at least one thermal imager 2. The heating zones of any area laser 1 have corresponding imaging areas in the image image of the same surface-to-be-heated thermal imager 2. That is, in this embodiment, any surface of the heated object 3 corresponds to at least one thermal imager 2 and at least one area laser 1, and multiple heating zones of the area laser 1 have corresponding imaging areas in the image image of the thermal imager 2. This allows the area laser 1 and thermal imager 2 corresponding to the same surface to be heated to cooperate in achieving zoned heating control of the surface.

[0053] Typically, for plate-shaped objects 3 such as PCBAs or wafers, their opposite front and back sides are usually the surfaces to be heated. Therefore, in this embodiment, it may specifically include two area array lasers 1 and two thermal imagers 2. The object to be heated 3 includes two surfaces to be heated that are arranged opposite each other. The light-emitting side of one area array laser 1 and the object side of one thermal imager 2 point to the same surface to be heated, while the light-emitting side of the other area array laser 1 and the object side of the other thermal imager 2 point to another surface to be heated.

[0054] In this embodiment, two sets of area array lasers 1 and thermal imagers 2 are installed, with the two sets of devices arranged opposite each other. The object to be heated 3 is placed in the middle, with one set of devices located on the front of the object to be heated 3 and the other set located on the back of the object to be heated 3. Both the area array lasers 1 and the thermal imagers 2 need to face the same surface to be heated in order to achieve simultaneous zoned heating control of both the front and back of the object to be heated 3. Typically, the area array laser 1 located on the front of the object to be heated 3 is the main heating device, and the area array laser 1 located on the back of the object to be heated 3 is the auxiliary heating device.

[0055] Accordingly, in this embodiment, the power output module may include two driving power supplies 5. One area array laser 1 is connected to one driving power supply 5, and the other area array laser 1 is connected to the other driving power supply 5, thereby facilitating the control of each laser emitting unit of each area array laser 1 by a power adjustment module such as an industrial control computer 4. This configuration allows for simultaneous zoned temperature control of the two opposing surfaces of the object being heated 3, improving heating efficiency. For example, for some electronic components or semiconductor devices that require simultaneous welding or heating on both sides, the two area array lasers 1 can be aligned with their two surfaces to be heated, and each laser emitting unit can be independently controlled to heat according to the temperature requirements of different areas of each surface. Two thermal imagers 2 monitor the temperature of the two surfaces to be heated in real time and feed the data back to the power adjustment module. The power adjustment module controls the two driving power supplies 5 according to the feedback data, thereby adjusting the power output of each laser emitting unit in the two area array lasers 1, achieving multi-zone precise temperature control of the two sides of the object being heated 3.

[0056] In this embodiment, the heated object 3 can be a PCBA, and the first temperature solder paste pad and the second temperature solder paste pad of the PCBA correspond to different heating zones; or, the heated object 3 can be a wafer, and the wafer has different heat dissipation rates corresponding to different heating zones.

[0057] When the heated object 3 is a PCBA, it has solder paste pads at a first temperature and solder paste pads at a second temperature, typically high-temperature and low-temperature solder paste pads, respectively. The first-temperature solder paste pads need to be soldered based on the first temperature, and the second-temperature solder paste pads need to be soldered based on the second temperature. The first and second temperatures are usually different. For this type of PCBA, in this embodiment, the first and second-temperature solder paste pads can be configured to correspond to different heating zones. That is, the first and second-temperature solder paste pads are irradiated separately by a laser emitting unit with non-overlapping light spots, thereby achieving zoned heating control of the PCBA structure. The specific zoned temperature control function needs to be implemented in conjunction with a temperature feedback module, a power adjustment module, and a power output module. The specific operation process has been described in detail in the above embodiments and will not be repeated here.

[0058] When the heated object 3 is a wafer, different locations on it, due to the different materials used, typically have different heat dissipation rates. To ensure temperature consistency across the wafer during heating and prevent temperature differences caused by varying heat dissipation rates, this embodiment assigns different heating zones to regions with different heat dissipation rates. Specifically, a non-overlapping laser emitting unit irradiates each region with a different heat dissipation rate, thereby achieving zoned heating control of the wafer structure. The specific implementation of this zoned temperature control function has been detailed in the above embodiments and will not be repeated here.

[0059] When two area lasers 1 are arranged opposite each other in the above structure, the upper and lower area lasers 1 can heat the top metal layer and the bottom substrate of the wafer respectively. When the thermal imager 2 detects that the bottom is dissipating heat faster, it can automatically increase the bottom laser power to ensure that the temperature difference between the two sides of the wafer is small.

[0060] Of course, in this embodiment, any surface of the object to be heated 3 can correspond to multiple area laser arrays 1. In this case, one area laser array 1 is used to achieve partitioned heating of at least a portion of the surface to be heated. The specific number of area laser arrays 1 needs to be set according to the actual situation and is not specifically limited here.

[0061] The multi-zone temperature control device provided in this embodiment can achieve zoned heating control of multiple surfaces of the object being heated 3 by setting up multiple sets of area array lasers 1 and thermal imagers 2, thereby further realizing rapid zoned heating of the object.

[0062] Example 3

[0063] This utility model embodiment also provides a multi-zone temperature control system, which includes a multi-zone temperature control device as provided in any of the above utility model embodiments. Other structures in the multi-zone temperature control system can be found in the prior art, and will not be described in detail here.

[0064] Because the multi-zone temperature control system of this embodiment is equipped with the multi-zone temperature control device provided in any of the above-mentioned utility model embodiments, the multi-zone temperature control system of this embodiment can have higher heating efficiency and can achieve rapid zone heating of objects. This multi-zone temperature control system can be applied to various industrial production scenarios requiring precise multi-zone heating of objects, such as PCBA soldering production lines in the electronics manufacturing field and wafer heating processes in the semiconductor manufacturing field. By adopting the multi-zone temperature control device of this utility model, the problems of low efficiency and inability to achieve precise multi-zone temperature control in traditional heating methods can be effectively solved, improving production efficiency and product quality, and has broad application prospects.

[0065] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0066] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this invention.

[0067] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein can be implemented directly by hardware, a software module executed by a processor, or a combination of both. The software module can be located in random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art.

[0068] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0069] The above provides a detailed description of the multi-zone temperature control device and system provided by this utility model. Specific examples have been used to illustrate the principle and implementation of this utility model. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core idea of ​​this utility model. It should be noted that those skilled in the art can make various improvements and modifications to this utility model without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this utility model.

Claims

1. A multi-zone temperature control device, characterized by, The power output module is connected with the face array laser through the power adjustment module. The light emitting side of the face array laser faces the heated object, and the face array laser includes a plurality of laser emitting units corresponding to a plurality of to-be-heated sub-zones. The temperature feedback module is configured to acquire temperature information of positions of the to-be-heated sub-zones in the heated object and send the temperature information to the power adjustment module.

2. The multi-zone temperature control device of claim 1, wherein, The power output module includes a driving power supply.

3. The multi-zone temperature control device of claim 1, wherein, The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser.

4. The multi-zone temperature control device of claim 1, wherein, The power output module includes a driving power supply.

5. The multi-zone temperature control device of claim 4, wherein, The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser.

6. The multi-zone temperature control device of claim 5, wherein, The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser.

7. The multi-zone temperature control device of claim 6, wherein, The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser.

8. The multi-zone temperature control device of claim 1, wherein, The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser.

9. The multi-zone temperature control device of claim 1, wherein, The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser.

10. A multi-zone temperature control system, characterized by, The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at least one thermal imager and one face array laser. The temperature feedback module includes a thermal imager, and the same side surface of the heated object corresponds to at

Images