Alloy resistor with reliable deflection and resistor mounting device with alloy resistor

Abstract

The utility model discloses an alloy resistor with reliable deflection and a resistor mounting device with the alloy resistor, the alloy resistor comprises an insulating layer and a resistor body chip which are stacked in sequence, and two ends of the resistor body chip are covered on the insulating layer; the two conductive bottom plates are arranged on the side, away from the resistor body chip, of the insulating layer at intervals, abut against the two ends of the insulating layer and make contact with the two ends, covering the insulating layer, of the resistor body chip; and the filling groove is arranged at the interval between the two conductive bottom plates, and the filling groove is filled with a tough material layer. According to the high-power alloy resistor, on the basis of ensuring the heat dissipation performance of the alloy resistor, the deflection is effectively improved, and the problem that the two conductive bottom plates introduced by the existing high-power alloy resistor are relatively low in deflection, so that the high-power alloy resistor is fractured and fails when being heated and expanded is solved.

Description

Technical Field

[0001] This utility model relates to the field of resistor technology, specifically to an alloy resistor with reliable flexibility and a resistor mounting device having the same. Background Technology

[0002] Alloy resistors are widely used in automotive and industrial equipment as a means of current detection. In the automotive field, with the development of high-performance vehicles, the number of motors and ECUs is constantly increasing, which will cause certain deformation to the mounting substrate. Therefore, there are certain requirements for the deflection of the alloy resistors mounted on the substrate.

[0003] Alloy resistors are resistors that use an alloy as the current-carrying medium. Ordinary alloy resistors cannot efficiently dissipate heat through the mounting substrate, causing heat to accumulate within the product and resulting in excessive temperature rise. Therefore, high-power alloy resistors are typically used. For example... Figure 1A and Figure 1B As shown, when mounting high-power alloy resistors onto a substrate, a conductive base plate 3 with excellent heat dissipation performance is usually introduced at the pad 5 position to ensure that there is a sufficient heat dissipation path from the resistor body chip 2 to the mounting substrate 6, which can suppress the product temperature rise and achieve the effect of increasing power.

[0004] In the aforementioned mounting structure of the high-power alloy resistor, two conductive substrates 3 are introduced, and to ensure the effectiveness of the alloy resistor, the two conductive substrates 3 are separated. Generally, the thicker the conductive substrate, the better the heat dissipation performance. However, the conductive substrates (such as metal plates or ceramic plates) used in the aforementioned mounting structure of the high-power alloy resistor usually have a certain rigidity, and their deflection is much less than that of the mounting substrate 6. When the mounting substrate 6 expands and deforms due to heat, the alloy resistor will break and fail. Utility Model Content

[0005] In view of this, the present invention provides an alloy resistor with reliable deflection and a resistor mounting device having the same, in order to solve the problem that the low deflection of the two conductive base plates in existing high-power alloy resistors leads to fracture failure when subjected to thermal expansion.

[0006] This utility model provides an alloy resistor with reliable deflection, comprising:

[0007] An insulating layer and a resistor chip are stacked sequentially, wherein both ends of the resistor chip are covered by the insulating layer;

[0008] Two conductive base plates are spaced apart on the side of the insulating layer away from the resistor body chip and close to both ends of the insulating layer, in contact with both ends of the resistor body chip covering the insulating layer;

[0009] And a filling groove is provided at the interval between the two conductive base plates, wherein the filling groove is filled with a tough material layer.

[0010] Optionally, the tough material layer is specifically any one of an insulating adhesive layer, a glass fiber layer, and a rubber layer.

[0011] Optionally, the elongation at break of the tough material layer is greater than or equal to 5%.

[0012] Optionally, the thickness of the tough material layer is greater than or equal to one-third of the thickness of the conductive base plate, and less than or equal to the thickness of the conductive base plate.

[0013] Optionally, the depth of the filling trench is greater than or equal to one-third of the thickness of the conductive base plate, and less than or equal to the thickness of the conductive base plate.

[0014] Optionally, the filling trench consists of at least one trench unit;

[0015] When there are two or more trench units, all the trench units are connected end to end in sequence.

[0016] Optionally, the trench unit can be a symmetrical or asymmetrical structure.

[0017] Optionally, the groove unit is any one of a straight groove, an arc groove, a right-angle bend groove, and an S-shaped groove.

[0018] Optionally, the conductive base plate is any one of a metal base plate, a ceramic base plate, and a composite material base plate.

[0019] This utility model also provides a resistor mounting device, including the aforementioned alloy resistor with reliable flexibility;

[0020] Also includes:

[0021] A mounting substrate with two pads is disposed on the side of the two conductive base plates away from the insulating layer, and the two pads are bonded to the two conductive base plates by a solder paste layer.

[0022] The beneficial effects of this utility model are:

[0023] A filling groove is formed in the gap between two conductive base plates, and a tough material layer is filled in the filling groove. On the one hand, the tough material layer can be used as a heat conduction medium to more effectively transfer the heat generated by the resistor chip to the conductive base plates, thereby improving heat dissipation efficiency. On the other hand, when the alloy resistor is mounted on the mounting substrate, the tough material layer can absorb the thermal stress generated by the heating of the mounting substrate when the mounting substrate is heated and expanded, thereby increasing the deflection of the entire alloy resistor and avoiding the phenomenon of alloy resistor breakage failure. The entire alloy resistor does not require additional structures. It only needs to utilize the gap between the two conductive base plates to effectively improve the deflection while ensuring the heat dissipation performance of the alloy resistor. This solves the problem of low deflection of the two conductive base plates in existing high-power alloy resistors, which leads to breakage failure when heated and expanded. Attached Figure Description

[0024] The features and advantages of this utility model will be more clearly understood by referring to the accompanying drawings. The drawings are schematic and should not be construed as limiting the utility model in any way. In the drawings:

[0025] Figure 1A and Figure 1B A cross-sectional view of a conventional alloy resistor mount device is shown.

[0026] Figure 2 A cross-sectional view of an alloy resistor with reliable flexibility according to Embodiment 1 of this utility model is shown.

[0027] Figures 3A-3G This shows a top view of the filling groove structure in Embodiment 1 of the present invention;

[0028] Figure 4 A cross-sectional view of the resistor-mounted device in Embodiment 2 of this utility model is shown.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. Insulating layer, 2. Resistor chip, 3. Conductive base plate, 4. Solder paste layer, 5. Pad, 6. Mounting substrate, 7. Filling trench, 8. Tough material layer, 71. Trench unit. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0032] Example 1

[0033] like Figure 2 As shown, an alloy resistor with reliable deflection includes:

[0034] An insulating layer 1 and a resistor chip 2 are stacked sequentially, wherein both ends of the resistor chip 2 are covered by the insulating layer 1;

[0035] Two conductive base plates 3 are spaced apart on the side of the insulating layer 1 away from the resistor body chip 2, and are close to both ends of the insulating layer 1, in contact with both ends of the resistor body chip 2 covering the insulating layer 1.

[0036] And a filling groove 7 is provided at the interval between the two conductive base plates 3, wherein the filling groove 7 is filled with a tough material layer 8.

[0037] In this embodiment, a filling groove is provided at the gap between the two conductive base plates, and a tough material layer is filled in the filling groove. On the one hand, the tough material layer can be used as a heat conduction medium to more effectively transfer the heat generated by the resistor chip to the conductive base plates, thereby improving heat dissipation efficiency. On the other hand, when the alloy resistor is mounted on the mounting substrate, the tough material layer can absorb the thermal stress generated by the heating of the mounting substrate when the mounting substrate is heated, thereby increasing the deflection of the entire alloy resistor and avoiding the phenomenon of alloy resistor breakage failure. The entire alloy resistor does not require additional structures. It only needs to utilize the gap between the two conductive base plates to effectively improve the deflection while ensuring the heat dissipation performance of the alloy resistor. This solves the problem that the low deflection of the two conductive base plates in existing high-power alloy resistors leads to breakage failure when heated and expanded.

[0038] In this embodiment, the insulating layer 1 is typically made of insulating materials such as ceramics or plastics, serving to protect and fix the resistor chip 2, preventing current leakage or short circuits. The core component of the resistor chip 2 is the resistive wire, usually made of a nickel-chromium or copper-nickel alloy. The conductive base plate 3 is used to transfer the heat generated by the resistor chip 2 away.

[0039] In this embodiment, the conductive base plate 3 is specifically any one of a metal base plate, a ceramic base plate, and a composite material base plate.

[0040] Metal base plates (such as aluminum base plates and copper base plates) have excellent thermal conductivity and can provide excellent heat dissipation; ceramic base plates (such as aluminum nitride ceramic base plates and alumina ceramic base plates) have high thermal conductivity and can also provide good heat dissipation; composite material base plates (such as diamond / copper composite base plates and silicon carbide / aluminum composite base plates) also have high thermal conductivity and good heat dissipation performance.

[0041] Preferably, the depth of the filling groove 7 is greater than or equal to one-third of the thickness of the conductive base plate 3, and less than or equal to the thickness of the conductive base plate 3.

[0042] The aforementioned depth of the filling groove facilitates the filling of a layer of tough material that meets the requirements, thereby ensuring that only the gap between the two conductive base plates is used. This not only ensures the heat dissipation performance of the alloy resistor but also effectively improves the deflection, solving the problem of low deflection of the two conductive base plates in existing high-power alloy resistors, which leads to fracture failure when heated and expanded.

[0043] Specifically, in this embodiment, the depth of the filling groove 7 is equal to the thickness of the conductive base plate 3.

[0044] The depth of the filling groove is the same as the thickness of the conductive base plate, which makes the entire alloy resistor flatter and facilitates the mounting of the alloy resistor while ensuring heat dissipation performance and flexibility.

[0045] Preferably, the elongation at break of the tough material layer 8 is greater than or equal to 5%.

[0046] The tough material layer with high elongation at break allows the alloy resistor to absorb the thermal stress generated by the heating of the substrate when it is mounted on the substrate. This makes the stress on the entire alloy resistor more uniform, thereby improving the deflection of the entire alloy resistor and preventing the alloy resistor from breaking and failing.

[0047] Preferably, the tough material layer 8 is any one of an insulating adhesive layer, a glass fiber layer, and a rubber layer.

[0048] The insulating adhesive layer not only provides electrical insulation, ensuring that the two conductive substrates will not short-circuit due to direct contact, but also increases the structural strength of the entire alloy resistor, effectively absorbing the thermal stress generated by the mounting substrate and improving the overall flexibility of the alloy resistor. The glass fiber layer has good thermal stability, maintaining its performance when the mounting substrate expands due to heat, thus providing good support and stability for the resistor chip and ensuring the flexibility of the entire alloy resistor. It also has good resistance to corrosive media such as acids and alkalis, protecting the resistor chip from environmental damage. The rubber layer has a certain degree of flexibility, which can adapt to the thermal stress generated by the thermal expansion of the mounting substrate on the resistor chip, maintaining the stability of the resistor chip. It can also form a tight sealing layer to prevent moisture, dust, and other impurities from entering the resistor chip, ensuring its normal operation.

[0049] Preferably, the thickness of the tough material layer 8 is greater than or equal to one-third of the thickness of the conductive base plate 3, and less than or equal to the thickness of the conductive base plate 3.

[0050] The aforementioned thickness of the tough material layer can serve as a good heat conduction medium, transferring the heat generated by the resistor chip to the conductive substrate more effectively, thereby improving heat dissipation efficiency; it can also absorb the thermal stress generated by the heating of the mounting substrate, improving the deflection of the entire alloy resistor and preventing the alloy resistor from breaking and failing; and it can also ensure the overall flatness of the entire alloy resistor, facilitating the assembly of resistor mounting devices.

[0051] Preferably, such as Figures 3A-3G As shown, the filling groove 7 is composed of at least one groove unit 71;

[0052] When there are two or more groove units 71, all the groove units 71 are connected end to end in sequence.

[0053] The filling trench, composed of at least one trench unit, can further expand the flat area of ​​the filling trench, thereby increasing the stress area of ​​the entire alloy resistor when the mounting substrate is heated and expanded, making the stress more dispersed, and further avoiding the phenomenon of alloy resistor breakage failure.

[0054] Preferably, such as Figures 3A-3G As shown, the trench unit has a symmetrical or asymmetrical structure.

[0055] Asymmetrical grooved units can meet the requirement of increasing the stress-bearing area of ​​the entire alloy resistor, effectively preventing alloy resistor breakage failure; while symmetrical grooved units, in addition to effectively preventing alloy resistor breakage failure, are also easier to design and manufacture because they are non-directional.

[0056] Among them, Figures 3A-3D In the middle, each filling groove 7 is composed of a groove unit 71, and Figure 3A , Figure 3C and Figure 3D The groove units 71 in the text are all symmetrical structures. Figure 3B The groove unit in the design is an asymmetric structure.

[0057] Among them, Figures 3E-3G In the middle, each filling trench 7 is composed of two or more trench units 71, and Figure 3E The groove unit 71 in the middle is an asymmetric structure. Figure 3F and Figure 3G The groove unit 71 in the middle has a symmetrical structure. Figure 3E and Figure 3F Only three trench units 71 were shown. Figure 3G Only two trench units 71 are shown. Of course, in these embodiments, the filling trench can also be formed by connecting other numbers of trench units end to end.

[0058] Preferably, such as Figures 3A-3G As shown, the groove unit is any one of a straight groove, an arc groove, a right-angle bend groove, and an S-shaped groove.

[0059] The groove units of the above shapes can all meet the requirement of increasing the stress-bearing area of ​​the entire alloy resistor, and can effectively avoid the phenomenon of alloy resistor fracture failure.

[0060] in, Figure 3A The groove unit 71 in the middle is a straight groove. Figure 3B and Figure 3E The groove units 71 in the text are all arc-shaped grooves. Figure 3C and Figure 3F The groove units 71 in the text are all right-angle bends. Figure 3D and Figure 3G The groove units 71 in the text are all S-shaped grooves.

[0061] In this embodiment, respectively, fabricated Figure 1A The corresponding traditional alloy resistor sample and the solution described in this embodiment Figures 3A-3D Five samples of alloy resistors with reliable flexibility were presented. The stress generated on the samples when the mounting substrate was heated and expanded was simulated. The fracture of the five samples was tested, and the test results are shown in Table 1.

[0062] Table 1. Test results of fracture of 5 samples under thermal expansion of the mounting substrate.

[0063] Sample type Test Results Figure 1A sample At a stress of 1.41 N, the insulating layer peeled off, and the resistor chip broke. Figure 3A sample At a stress of 3.54 N, the insulating layer peeled off, and the resistor chip broke. Figure 3B sample At a stress of 5.52N, the insulating layer peeled off, and the resistor chip broke. Figure 3C sample At a stress of 7.82 N, the insulating layer peeled off, and the resistor chip broke. Figure 3D sample At a stress of 6.97 N, the insulating layer peeled off, and the resistor chip broke.

[0064] As can be seen from Table 1, the alloy resistor mounting substrate with reliable flexibility in this embodiment can withstand greater stress when heated and has higher flexibility, which can effectively avoid the phenomenon of alloy resistor breakage failure.

[0065] Example 2

[0066] This embodiment provides a resistor-mount device, such as... Figure 4 As shown, this includes the alloy resistor with reliable flexibility as in Example 1;

[0067] Also includes:

[0068] A mounting substrate 6 with two pads 5 is disposed on the side of the two conductive base plates 3 away from the insulating layer 1. The two pads 5 are bonded to the two conductive base plates 3 through a solder paste layer 4.

[0069] The resistor mounting device in this embodiment uses a tough material layer in the filling groove between the two conductive substrates of the alloy resistor. This not only improves the heat dissipation efficiency but also increases the overall flexibility of the alloy resistor, preventing the alloy resistor from breaking and failing. This greatly expands the application range of the alloy resistor.

[0070] In this embodiment, the mounting substrate is a PCB printed circuit board, the pads are conventional components on the PCB printed circuit board, and the solder paste layer is a conventional solder paste layer. Specific details will not be repeated here.

[0071] The alloy resistor with reliable flexibility in the resistor mounting device described in this embodiment has the same structure as the alloy resistor with reliable flexibility described in Embodiment 1. Therefore, for details not covered in this embodiment, please refer to Embodiment 1 and Figures 1 to 12. Figure 3G The specific details will not be elaborated here.

[0072] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. An alloy resistor with reliable deflection, characterized in that, include: An insulating layer and a resistor chip are stacked sequentially, wherein both ends of the resistor chip are covered by the insulating layer; Two conductive base plates are spaced apart on the side of the insulating layer away from the resistor body chip and close to both ends of the insulating layer, in contact with both ends of the resistor body chip covering the insulating layer; And a filling groove is provided at the interval between the two conductive base plates, wherein the filling groove is filled with a tough material layer.

2. The alloy resistor with reliable flexibility according to claim 1, characterized in that, The tough material layer is specifically any one of an insulating adhesive layer, a glass fiber layer, and a rubber layer.

3. The alloy resistor with reliable flexibility according to claim 1, characterized in that, The elongation at break of the tough material layer is greater than or equal to 5%.

4. The alloy resistor with reliable flexibility according to claim 1, characterized in that, The thickness of the tough material layer is greater than or equal to one-third of the thickness of the conductive base plate, and less than or equal to the thickness of the conductive base plate.

5. The alloy resistor with reliable flexibility according to claim 1, characterized in that, The depth of the filling groove is greater than or equal to one-third of the thickness of the conductive base plate, and less than or equal to the thickness of the conductive base plate.

6. The alloy resistor with reliable flexibility according to claim 1, characterized in that, The filling trench is composed of at least one trench unit; When there are two or more trench units, all the trench units are connected end to end in sequence.

7. The alloy resistor with reliable flexibility according to claim 6, characterized in that, The trench unit can be a symmetrical or asymmetrical structure.

8. The alloy resistor with reliable flexibility according to claim 6, characterized in that, The groove unit is any one of a straight groove, an arc groove, a right-angle bend groove, and an S-shaped groove.

9. The alloy resistor with reliable deflection according to any one of claims 1 to 8, characterized in that, The conductive base plate is specifically any one of a metal base plate, a ceramic base plate, and a composite material base plate.

10. A resistor-mount device, characterized in that, Including alloy resistors with reliable flexibility as described in any one of claims 1 to 9; Also includes: A mounting substrate with two pads is disposed on the side of two conductive base plates away from the insulating layer, and the two pads are bonded to the two conductive base plates by a solder paste layer.

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