Multilayer circuit board with efficient heat dissipation structure
By employing an FR4 substrate, heat sinks, heat dissipation holes, and thermal conductive structures in a multilayer circuit board, the problem of heat concentration is solved, achieving efficient heat dissipation and improving the performance and reliability of electronic components.
Patent Information
- Application Number
- CN202423290295.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Existing multilayer circuit boards may experience heat concentration in certain areas, leading to localized overheating, which affects the performance and reliability of electronic components. Furthermore, an unreasonable heat conduction path design can reduce heat dissipation efficiency.
Using an FR4 substrate as the main layer, combined with heat sinks, heat dissipation holes, metal guide pillars, and thermal conductive structures, including thermal conductive plates, thermal conductive sheets, and coatings, it is designed as a multi-layer circuit board to achieve efficient heat dissipation. The heat dissipation efficiency is improved through the natural convection of the heat sinks and the heat conduction of the thermal conductive structures.
It effectively disperses heat, increases the area and efficiency of heat dissipation zone, reduces component operating temperature, improves overall performance and reliability, and also has high strength and flame retardancy.
Smart Images
Figure CN223798404U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board technology, specifically to a multilayer circuit board with a high-efficiency heat dissipation structure. Background Technology
[0002] With the continuous miniaturization and high performance of integrated circuits and electronic components, the design of multilayer printed circuit boards (PCBs) with efficient heat dissipation structures is one of the key technologies for solving the overheating problem of electronic devices. While multilayer PCBs with heat dissipation structures offer many advantages in design and application, they also have the following drawbacks: In multilayer PCBs, heat may concentrate in certain areas, leading to localized overheating. This heat concentration can affect the performance and reliability of electronic components. Furthermore, if the heat conduction path is not designed properly, heat cannot be effectively conducted to the heat dissipation structure, resulting in reduced heat dissipation efficiency. Summary of the Invention
[0003] To overcome the shortcomings of existing technical solutions, this utility model provides a multilayer circuit board with a high-efficiency heat dissipation structure, which can effectively solve the problems mentioned in the background art.
[0004] The technical solution adopted by this utility model to solve its technical problem is:
[0005] A multilayer circuit board with a high-efficiency heat dissipation structure includes a circuit board assembly and a protective structure disposed on the circuit board assembly. The circuit board assembly includes a main body layer, a heat dissipation structure and a heat conduction structure. The main body layer includes an FR4 substrate. At least two mounting portions for connecting electronic components are formed on the surface of the FR4 substrate. The mounting portions are provided with heat dissipation grooves and a plurality of heat dissipation holes. The heat dissipation structure includes a plurality of metal guide pillars corresponding to the heat dissipation holes.
[0006] The heat-conducting structure includes a heat-conducting plate, on which a first heat-conducting area and a second heat-conducting area are provided. The first heat-conducting area and the second heat-conducting area are respectively connected to metal guide posts. The first heat-conducting area and the second heat-conducting area are respectively fitted onto the mounting part. The first heat-conducting area is connected to a first heat-conducting sheet, and the second heat-conducting area is connected to a second heat-conducting sheet and a third heat-conducting sheet.
[0007] As a further description of the above technical solution, the heat dissipation groove has a triangular cross-sectional shape and is horizontally disposed on the surface of the FR4 substrate.
[0008] As a further description of the above technical solution, the heat dissipation holes are distributed in a matrix, and the mounting part is also provided with a plurality of positioning posts 108. The positioning posts 108 are arranged along the longitudinal direction of the FR4 substrate, and the positioning posts 108 are connected to the heat conduction plate.
[0009] As a further description of the above technical solution, the protective structure includes a first insulating plate and a second insulating plate, which are distributed and attached to the upper and lower surfaces of the FR4 substrate.
[0010] As a further description of the above technical solution, the number of heat-conducting plates is two, and the two heat-conducting plates are respectively disposed on opposite sides of the FR4 substrate.
[0011] As a further description of the above technical solution, thermally conductive adhesive is also provided at the connection between the first insulating plate, the second insulating plate and the FR4 substrate.
[0012] As a further description of the above technical solution, the first heat-conducting sheet is disposed on one side of the first heat-conducting area, the second heat-conducting sheet is arranged sequentially along the transverse direction of FR4 on one side of the second heat-conducting area, and the third heat-conducting sheet is arranged sequentially along the longitudinal direction of FR4 on one side of the second heat-conducting area.
[0013] As a further description of the above technical solution, the first heat-conducting area and the second heat-conducting area are coated with a heat-conducting coating, and the first heat-conducting sheet, the second heat-conducting sheet and the third heat-conducting sheet are all graphite heat-conducting sheets.
[0014] Compared with the prior art, the beneficial effects of this utility model are:
[0015] The multilayer circuit board with a high-efficiency heat dissipation structure of this utility model has at least one of the following beneficial effects during use:
[0016] The FR4 substrate is cooled by air intake through heat sinks, which draw in surrounding air for natural convection, thus improving heat dissipation efficiency. Furthermore, a thermally conductive structure is connected to the mounting section to conduct heat to electronic components that require cooling or generate significant heat, effectively increasing the heat dissipation area and further enhancing heat dissipation efficiency. This combination of a heat dissipation structure and a thermally conductive structure on the FR4 substrate results in a circuit board that is not only strong and flame-retardant but also boasts high heat dissipation efficiency. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the overall structure of a multilayer circuit board with a high-efficiency heat dissipation structure according to the present invention.
[0018] Figure 2 This is an exploded structural diagram of a multilayer circuit board with a high-efficiency heat dissipation structure according to the present invention.
[0019] Figure 3 This is a schematic diagram of the substrate structure of a multilayer circuit board with a high-efficiency heat dissipation structure according to the present invention.
[0020] Figure 4 This is a perspective view of the first side portion of a multilayer circuit board with a high-efficiency heat dissipation structure according to the present invention.
[0021] Figure 5 This is a perspective view of the second side portion of a multilayer circuit board with a high-efficiency heat dissipation structure according to the present invention.
[0022] Figure 6 This is a perspective view of the third side portion of a multilayer circuit board with a high-efficiency heat dissipation structure according to the present invention.
[0023] Numbering on the map:
[0024] 1. Circuit board assembly; 101. Main body layer; 102. Heat dissipation structure; 103. FR4 substrate; 104. Heat dissipation hole; 105. Heat dissipation groove; 106. Metal guide post; 107. Thermally conductive adhesive; 108. Positioning post; 2. Thermally conductive structure; 201. Thermally conductive plate; 202. First thermally conductive zone; 203. Second thermally conductive zone; 204. First thermally conductive sheet; 205. Second thermally conductive sheet; 206. Third thermally conductive sheet; 3. Protective structure; 301. First insulating plate; 302. Second insulating plate. Detailed Implementation
[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0026] like Figure 1-6 As shown, this utility model provides a multilayer circuit board with a high-efficiency heat dissipation structure, including a circuit board assembly 1 and a protective structure 3 disposed on the circuit board assembly 1. The circuit board assembly 1 includes a main layer 101, a heat dissipation structure 102 and a heat conduction structure 2. The main layer 101 includes a plurality of FR4 substrates 103 stacked sequentially. The surface of the FR4 substrates 103 is provided with a plurality of mounting parts for connecting electronic components and a plurality of heat dissipation grooves 105. The mounting parts are connected to the heat dissipation grooves 105. The mounting parts are provided with a plurality of heat dissipation holes 104. The heat dissipation structure 102 includes a plurality of metal guide posts 106 corresponding to the heat dissipation holes 104.
[0027] This embodiment uses FR4 material as the substrate, which has excellent electrical insulation, mechanical strength, and thermal stability. The circuit board combining the heat dissipation structure 102 and the heat conduction structure 2 with FR4 material as the substrate not only has high strength and good flame retardancy but also high heat dissipation efficiency.
[0028] The heat-conducting structure 2 includes multiple heat-conducting plates 201. Each heat-conducting plate 201 has a first heat-conducting area 202 and a second heat-conducting area 203. The first heat-conducting area 202 and the second heat-conducting area 203 are respectively connected to metal guide posts 106. The first heat-conducting area 202 and the second heat-conducting area 203 are correspondingly fitted onto the mounting part. The first heat-conducting area 202 is connected to a first heat-conducting sheet 204, and the second heat-conducting area 203 is connected to multiple second heat-conducting sheets 205 and a third heat-conducting sheet 206.
[0029] The main body layer 101 consists of two FR4 substrates 103, each with a heat sink 105. One of the FR4 substrates 103 has a recessed mounting section for mounting electronic components. The mounting section communicates with the heat sink 105, allowing air to enter and dissipate heat from the entire FR4 substrate 103. The heat sink 105 also introduces surrounding air, achieving natural convection cooling and thus improving heat dissipation efficiency. Furthermore, a heat-conducting structure 2 is connected to the mounting section to conduct heat to electronic components requiring heat dissipation or those generating significant amounts of heat, dispersing the heat.
[0030] In this embodiment, the heat-conducting plate 201 is made of thermally conductive plastic. The main body of the heat-conducting plate 201 is polyimide, which is then mixed and filled with aluminum oxide, which can significantly improve its thermal conductivity. The first heat-conducting area 202 and the second heat-conducting area 203 corresponding to the mounting portion of the heat-conducting plate 201 are coated with a zinc oxide coating. This structure concentrates heat dissipation from the mounting portion. Furthermore, the first heat-conducting area 202 and the second heat-conducting area 203 are also provided with a first heat-conducting sheet 204, a second heat-conducting sheet 205, and a third heat-conducting sheet 206 made of graphite. The first heat-conducting sheet 204 is located on the outer edge of the circuit board, with its surface exposed to the air. The second heat-conducting sheet 205 and the third heat-conducting sheet 206 are laid on the FR4 substrate 103 in a longitudinal and transverse manner, respectively, and are connected to the heat sink 105.
[0031] Furthermore, the heat dissipation groove 105 has a triangular cross-sectional shape, is horizontally disposed on the surface of the FR4 substrate 103, and has a depth of no more than 2 mil.
[0032] Meanwhile, the heat dissipation grooves 105 on the substrate effectively increase the area of the heat dissipation zone, thereby improving heat dissipation efficiency. This helps to reduce the operating temperature of components and improve overall performance. With a groove depth of less than 2 mil, it maintains effective heat dissipation without occupying excessive space, making it suitable for high-density wiring circuit boards and miniaturized designs.
[0033] Furthermore, the heat dissipation holes 104 are distributed in a matrix, and the mounting part is also provided with multiple positioning posts. The positioning posts are arranged along the longitudinal direction of the FR4 substrate 103, and the positioning posts 108 are connected to the heat conduction plate 201.
[0034] The matrix-distributed heat dissipation holes 104 can be uniformly distributed across the entire substrate surface, ensuring that heat can be effectively dissipated from the heat-generating elements to the surrounding environment. This uniform heat dissipation design helps reduce the risk of localized overheating and improves overall heat dissipation performance. Multiple positioning posts in the mounting section ensure precise alignment between the heat-conducting plate 201 and the FR4 substrate 103. This improves structural stability and prevents loosening or displacement due to thermal expansion and contraction or vibration. The positioning posts 108 are also made of thermally conductive material; connecting the positioning posts 108 to the heat-conducting plate 201 effectively conducts heat, ensuring that heat is quickly transferred from the heat source to the heat-conducting plate 201.
[0035] Furthermore, the protective structure 3 includes a first insulating plate 301 and a second insulating plate 302, which are distributed and attached to the upper and lower surfaces of the FR4 substrate 103. There are two heat-conducting plates 201, which are respectively disposed on opposite surfaces of the FR4 substrate 103. Thermally conductive adhesive 107 is also provided at the connection points between the first insulating plate 301, the second insulating plate 302, and the FR4 substrate 103.
[0036] The overall structure is compact, and the arrangement of the first insulating plate 301 and the second insulating plate 302 can effectively isolate the electrical parts of the circuit board, preventing short circuits and leakage, thereby improving the safety and reliability of the equipment. The use of thermally conductive adhesive 107 further enhances the thermal conductivity, ensuring that heat can be transferred quickly and effectively.
[0037] Furthermore, the first heat-conducting sheet 204 is disposed on one side of the first heat-conducting area 202, the second heat-conducting sheet 205 is arranged sequentially along the transverse direction of FR4 on one side of the second heat-conducting area 203, and the third heat-conducting sheet 206 is arranged sequentially along the longitudinal direction of FR4 on one side of the second heat-conducting area 203. The first heat-conducting area 202 and the second heat-conducting area 203 are coated with a thermally conductive coating, and the first heat-conducting sheet 204, the second heat-conducting sheet 205, and the third heat-conducting sheet 206 are all graphite heat-conducting sheets. The arrangement of the first heat-conducting sheet 204, the second heat-conducting sheet 205, and the third heat-conducting sheet 206 (transverse and longitudinal arrangement) enables multi-directional heat conduction, which helps to evenly distribute heat and avoid local overheating. The graphite heat-conducting sheets can effectively conduct heat from the heat source to the heat dissipation area, ensuring that electronic components maintain a low temperature during operation and improving the thermal management efficiency of the system.
[0038] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A multilayer circuit board with a high-efficiency heat dissipation structure, comprising a circuit board assembly and a protective structure disposed on the circuit board assembly, characterized in that, The circuit board assembly includes a main body layer, a heat dissipation structure, and a heat conduction structure. The main body layer includes an FR4 substrate. The surface of the FR4 substrate has at least two mounting portions for connecting electronic components. The mounting portions are provided with heat dissipation grooves and a plurality of heat dissipation holes. The heat dissipation structure includes a plurality of metal guide pillars corresponding to the heat dissipation holes. The heat-conducting structure includes a heat-conducting plate, on which a first heat-conducting area and a second heat-conducting area are provided. The first heat-conducting area and the second heat-conducting area are respectively connected to metal guide posts. The first heat-conducting area and the second heat-conducting area are respectively fitted onto the mounting part. The first heat-conducting area is connected to a first heat-conducting sheet, and the second heat-conducting area is connected to a second heat-conducting sheet and a third heat-conducting sheet.
2. The multilayer circuit board with a high-efficiency heat dissipation structure according to claim 1, characterized in that: The heat sink has a triangular cross-sectional shape and is horizontally disposed on the surface of the FR4 substrate.
3. A multilayer circuit board with a high-efficiency heat dissipation structure according to claim 1, characterized in that: The heat dissipation holes are arranged in a matrix, and the mounting part is also provided with multiple positioning posts. The positioning posts are arranged along the longitudinal direction of the FR4 substrate and are connected to the heat conduction plate.
4. A multilayer circuit board with a high-efficiency heat dissipation structure according to claim 1, characterized in that: The protective structure includes a first insulating plate and a second insulating plate, which are distributed and attached to the upper and lower surfaces of the FR4 substrate.
5. A multilayer circuit board with a high-efficiency heat dissipation structure according to claim 3, characterized in that: The number of heat-conducting plates is two, and the two heat-conducting plates are respectively disposed on opposite sides of the FR4 substrate.
6. A multilayer circuit board with a high-efficiency heat dissipation structure according to claim 4, characterized in that: Thermally conductive adhesive is also provided at the connection points between the first insulating plate, the second insulating plate and the FR4 substrate.
7. A multilayer circuit board with a high-efficiency heat dissipation structure according to claim 1, characterized in that: The first heat-conducting sheet is disposed on one side of the first heat-conducting area, the second heat-conducting sheet is arranged sequentially along the transverse direction of FR4 on one side of the second heat-conducting area, and the third heat-conducting sheet is arranged sequentially along the longitudinal direction of FR4 on one side of the second heat-conducting area.
8. A multilayer circuit board with a high-efficiency heat dissipation structure according to claim 1 or 7, characterized in that: The first and second heat-conducting areas are coated with a heat-conducting coating, and the first, second, and third heat-conducting sheets are all graphite heat-conducting sheets.