Rigid-flex board

Abstract

The utility model discloses a rigid-flex board, and relates to the technical field of circuit board design. The rigid-flex board comprises a first circuit board, a second circuit board and a plastic package part, the first circuit board and the second circuit board are partially overlapped, the first circuit board is connected with the second circuit board, the plastic package part is arranged on the first circuit board, the second circuit board is provided with a glue blocking part, the glue blocking part is in contact with the plastic package part, and the plastic package part is arranged on the second circuit board. Therefore, the excessive glue between the plastic package piece and the first circuit board is retarded. According to the scheme, the problem that a mold is easily polluted due to glue overflow in the plastic packaging process of the rigid-flex board at present can be solved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of circuit board design, and particularly relates to a soft and hard combination board. BACKGROUND

[0002] The soft and hard combination board is a new type of circuit board combining the characteristics of a flexible printed circuit (FPC) and a printed circuit board (PCB), which is combined together according to relevant process requirements through pressing and other processes, thereby having the advantages of both.

[0003] In actual application, for the soft and hard combination board needing selective injection molding, when the hard board area needs to be injected, the uneven thickness of the hard board area causes the overflow of fine plastic sealing particles between the plastic sealing part and the hard circuit board through the interstice, and the soft board area is pre-divided by the strip-shaped groove, at this time, the overflow glue flows to the bottom of the mold through the strip-shaped groove, thereby polluting the mold, and further causing the subsequent soft and hard combination board needing injection molding to be pressed or have glue sticking. CONTENT OF THE INVENTION

[0004] The purpose of the embodiment of the application is to provide a soft and hard combination board, which can solve the problem that the current soft and hard combination board is easily polluted by overflow glue during plastic sealing.

[0005] In order to solve the above technical problems, the application is implemented as follows:

[0006] The embodiment of the application provides a soft and hard combination board, which comprises a first circuit board, a second circuit board and a plastic sealing part, the first circuit board and the second circuit board are partially overlapped, and the first circuit board and the second circuit board are connected,

[0007] The plastic sealing part is arranged on the first circuit board, the second circuit board is provided with a glue blocking part, the glue blocking part is in contact with the plastic sealing part, so as to block the overflow glue between the plastic sealing part and the first circuit board.

[0008] Optionally, the second circuit board is further provided with a strip-shaped groove, one end of the strip-shaped groove extends to the edge of the second circuit board away from the plastic sealing part in the length direction of the soft and hard combination board, the other end of the strip-shaped groove is arranged in a spaced manner with the plastic sealing part, so as to form the glue blocking part between the strip-shaped groove and the plastic sealing part, and the strip-shaped groove is used for forming part of the board dividing groove of the soft and hard combination board.

[0009] Optionally, the first circuit board and the second circuit board each comprise a plurality of stacked trace layers and a protective layer, the strip-shaped groove is arranged on the protective layer, and part of the protective layer forms the glue-blocking portion.

[0010] Optionally, the first circuit board and the second circuit board each further comprise a metal layer, and the metal layer is arranged between the trace layer and the protective layer.

[0011] Optionally, the number of the strip-shaped grooves is at least two, and each of the strip-shaped grooves is arranged in sequence and at intervals along the width direction of the rigid-flexible combined board, and the glue-blocking portion is arranged in one-to-one correspondence with the strip-shaped groove.

[0012] Optionally, the width of the strip-shaped groove is 1.2-1.5 mm.

[0013] Optionally, the length of the glue-blocking portion is 3-4 mm.

[0014] Optionally, the first circuit board is a rigid circuit board, and the second circuit board is a flexible circuit board, and in a direction perpendicular to the first circuit board, the contour line of the orthographic projection of the plastic package coincides with the contour line of the orthographic projection of the first circuit board.

[0015] Optionally, the first circuit board is a flexible circuit board, and the second circuit board is a rigid circuit board, the first circuit board comprises a first part and a second part connected to each other, the first part is stacked with the second circuit board, the second part protrudes from the second circuit board, the plastic package is arranged on the second part, and in a direction perpendicular to the second circuit board, the contour line of the orthographic projection of the plastic package coincides with the contour line of the orthographic projection of the second part.

[0016] The second circuit board is further provided with a strip-shaped groove, one end of the strip-shaped groove extends to the edge of the second circuit board away from the plastic package in the length direction of the rigid-flexible combined board, the other end of the strip-shaped groove is arranged in a spaced manner from the plastic package to form the glue-blocking portion between the strip-shaped groove and the plastic package, and the strip-shaped groove is used to form part of the board separation groove of the rigid-flexible combined board.

[0017] Optionally, the rigid-flexible combined board further comprises an adhesive layer, the adhesive layer is arranged between the second circuit board and the first circuit board, and the second circuit board is bonded to the first circuit board through the adhesive layer.

[0018] In the embodiment of the present application, the plastic sealing member is arranged on the first circuit board, the second circuit board is provided with a glue blocking part, the glue blocking part is in contact with the plastic sealing member to block the overflow glue between the plastic sealing member and the first circuit board, so as to avoid the overflow glue flowing to the bottom of the mold and then polluting the mold. In addition, the adhesive glue used for connecting the plastic sealing member and the first circuit board is blocked by the glue blocking part, so that the adhesive glue can be used for full connection, thereby improving the connection firmness between the plastic sealing member and the first circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0019] Fig. 1 A structural schematic diagram of the soft and hard combination board disclosed in the embodiment of the present application is shown.

[0020] Fig. 2 A partial structural schematic diagram of the soft and hard combination board disclosed in the embodiment of the present application is shown.

[0021] Fig. 3 A sectional view of the soft and hard combination board disclosed in the embodiment of the present application is shown.

[0022] Explanation of reference signs:

[0023] 110-first circuit board, 111-wiring layer, 112-protection layer, 113-metal layer, 120-second circuit board, 130-plastic sealing member, 140-glue blocking part, 150-strip-shaped groove. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0025] The terms “first”, “second”, and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by “first”, “second”, etc. are usually a category and do not limit the number of objects, for example, the first object can be one or more. In addition, “and / or” in the specification and claims means at least one of the connected objects, and the character “ / ” generally represents an “or” relationship between the front and rear associated objects.

[0026] The soft and hard combination board provided by the embodiments of the present application will be described in detail below in combination with the drawings and specific embodiments and application scenarios.

[0027] AsFigs. 1 to 3 As shown, the embodiment of the present application provides a soft and hard combination board, which comprises a first circuit board 110, a second circuit board 120 and a plastic sealing piece 130. Optionally, one of the first circuit board 110 and the second circuit board 120 can be a hard circuit board, and the other can be a flexible circuit board. The flexible circuit board has the characteristics of high integration, thin and light, flexibility, etc. The hard circuit board has the characteristics of high hardness, good bending resistance, high reliability, long service life, etc.

[0028] The first circuit board 110 and the second circuit board 120 are partially overlapped, and the first circuit board 110 and the second circuit board 120 are connected. The plastic sealing piece 130 is arranged on the first circuit board 110, and the plastic sealing piece 130 is used to protect electronic components integrated on the first circuit board 110. The second circuit board 120 is provided with a glue blocking part 140, and the glue blocking part 140 is in contact with the plastic sealing piece 130 to block the overflow glue between the plastic sealing piece 130 and the second circuit board 120.

[0029] In the embodiment of the present application, the plastic sealing piece 130 is arranged on the first circuit board 110, and the second circuit board 120 is provided with the glue blocking part 140, which is in contact with the plastic sealing piece 130 to block the overflow glue between the plastic sealing piece 130 and the first circuit board 110, thereby avoiding the overflow glue flowing to the bottom of the mold and polluting the mold. Therefore, the embodiment of the present application can solve the problem that the soft and hard combination board is easily polluted by overflow glue during the plastic sealing process.

[0030] In addition, the above embodiment blocks the adhesive glue used to connect the plastic sealing piece 130 and the first circuit board 110 through the glue blocking part 140, so that the adhesive glue can be fully connected, thereby improving the connection firmness between the plastic sealing piece 130 and the first circuit board 110.

[0031] In an optional embodiment, the second circuit board 120 is further provided with a strip-shaped groove 150. In the length direction (i.e. the X-axis direction) of the soft and hard combination board, one end of the strip-shaped groove 150 extends to the edge of the second circuit board 120 away from the plastic sealing piece 130, and the other end of the strip-shaped groove 150 is arranged in a spaced manner with the plastic sealing piece 130 to form the glue blocking part 140 between the strip-shaped groove 150 and the plastic sealing piece 130. The strip-shaped groove 150 is used to form part of the board separation groove of the soft and hard combination board. After the soft and hard combination board is packaged, the board separation groove is used for separation to form multiple circuit boards. Optionally, when the plastic sealing piece 130 is assembled, the strip-shaped groove 150 can be extended to be in communication with the plastic sealing piece 130, thereby extending the length of the board separation groove. Since the thickness of the board separation groove is small, it is beneficial to the separation process. The scheme reduces the length of the board separation groove to form the glue blocking part 140, thereby making the structure of the soft and hard combination board simple to facilitate processing and manufacturing. Of course, the glue blocking part 140 and the board separation groove can be arranged in a staggered manner. At this time, the glue blocking part 140 can be a protruding part.

[0032] In a further optional embodiment, the first circuit board 110 and the second circuit board 120 each comprise a plurality of stacked wiring layers 111 and a protective layer 112, the strip-shaped groove 150 is arranged on the protective layer 112, and part of the protective layer 112 forms the glue blocking part 140, that is, the glue blocking part 140 is formed by using the structure of the first circuit board 110 or the second circuit board 120 itself, thereby reducing the number of components of the rigid-flex printed circuit board.

[0033] In a further optional embodiment, the first circuit board 110 and the second circuit board 120 each further comprise a metal layer 113 arranged between the wiring layer 111 and the protective layer 112, and the metal layer 113 is used to enhance the electrical conductivity and corrosion resistance of the rigid-flex printed circuit board. Of course, the metal layer 113 can also not be arranged.

[0034] In another optional embodiment, the number of strip-shaped grooves 150 is one; or the number of strip-shaped grooves 150 is at least two, each strip-shaped groove 150 is arranged in sequence along the width direction (i.e., the Y-axis direction) of the rigid-flex printed circuit board, and the glue blocking part 140 is arranged in one-to-one correspondence with the strip-shaped groove 150. This scheme improves the glue blocking effect by arranging a plurality of glue blocking parts 140, and the rigid-flex printed circuit board can be divided into a plurality of circuit boards after packaging, thereby improving the manufacturing efficiency of the circuit board.

[0035] In yet another optional embodiment, the width of the strip-shaped groove 150 is 1.2-1.5 mm. When the width of the strip-shaped groove 150 is too small, it is not convenient to process; when the width of the strip-shaped groove 150 is too large, it will cause the proportion of the effective part of the rigid-flex printed circuit board to decrease, thereby causing waste of the rigid-flex printed circuit board. Therefore, the width of the strip-shaped groove 150 is 1.2-1.5 mm, which is convenient for processing and reduces the waste of materials of the rigid-flex printed circuit board. Optionally, the width of the strip-shaped groove 150 can be 1.25 mm, 1.3 mm, 1.35 mm, 1.4 mm, etc., and the embodiments of the present application do not make specific limitations thereon.

[0036] In still another optional embodiment, the length of the glue blocking part 140 is 3-4 mm. When the length of the glue blocking part 140 is too large, it is not convenient to extend the strip-shaped groove 150 to the plastic package 130 after packaging; when the length of the glue blocking part 140 is too small, it is not convenient for the processing and manufacturing of the rigid-flex printed circuit board. Therefore, the length of the glue blocking part 140 is set to 3-4 mm, which is convenient for extending the strip-shaped groove 150 to the plastic package 130 and for the processing and manufacturing of the rigid-flex printed circuit board. Optionally, the length of the glue blocking part 140 can be 3.2 mm, 3.5 mm, 3.7 mm, etc., and the embodiments of the present application do not make specific limitations thereon.

[0037] It should be noted that the width of the strip-shaped groove 150 and the length of the glue-blocking portion 140 can be selected according to actual needs, and the embodiments of the present application do not make specific limitations thereto.

[0038] In optional embodiments, the first circuit board 110 is a rigid circuit board, and the second circuit board 120 is a flexible circuit board, that is, the plastic sealing member 130 is arranged on the rigid circuit board, and the glue-blocking portion 140 is arranged on the flexible circuit board. In a direction perpendicular to the first circuit board 110, the contour line of the orthographic projection of the plastic sealing member 130 coincides with the contour line of the orthographic projection of the first circuit board 110, so as to protect the electronic components integrated on the rigid circuit board. Moreover, the plastic sealing member 130 is arranged on the rigid circuit board, and since the structural strength of the rigid circuit board is relatively large, it is convenient for the arrangement of the plastic sealing member 130.

[0039] In other optional embodiments, the first circuit board 110 is a flexible circuit board, and the second circuit board 120 is a rigid circuit board, that is, the plastic sealing member 130 is arranged on the flexible circuit board, and the glue-blocking portion 140 is arranged on the rigid circuit board. The first circuit board 110 includes a first portion and a second portion connected with each other. The first portion is stacked with the second circuit board 120, and the second portion protrudes from the second circuit board 120. Here, the protruding specifically refers to that, in the length direction of the rigid-flexible combined board, the second portion of the first circuit board 110 protrudes from the second circuit board 120. The plastic sealing member 130 is arranged on the second portion of the flexible circuit board. In a direction perpendicular to the second circuit board 120, the contour line of the orthographic projection of the plastic sealing member 130 coincides with the contour line of the orthographic projection of the second portion, so as to protect the electronic components on the flexible circuit board.

[0040] The second circuit board 120 is further provided with a strip-shaped groove 150. In the length direction of the rigid-flexible combined board, one end of the strip-shaped groove 150 extends to the edge of the second circuit board 120 away from the plastic sealing member 130, and the other end of the strip-shaped groove 150 is arranged in a spaced manner with the plastic sealing member 130, so as to form the glue-blocking portion 140 between the strip-shaped groove 150 and the plastic sealing member 130. The strip-shaped groove 150 is used to form part of a board separation groove of the rigid-flexible combined board. The board separation groove is used to separate along the board separation groove after the packaging of the rigid-flexible combined board is completed, so as to form a plurality of circuit boards. Optionally, when the plastic sealing member 130 is assembled, the strip-shaped groove 150 can be extended to be in communication with the plastic sealing member 130, so as to extend the length of the board separation groove. Since the thickness of the board separation groove is small, it is beneficial to the separation process. In the scheme, the plastic sealing member 130 is arranged on the flexible circuit board, and correspondingly, the strip-shaped groove 150 is arranged on the rigid circuit board, which can reduce the difficulty of separating the rigid circuit board.

[0041] Optionally, the first circuit board 110 and the second circuit board 120 can be connected by welding; or in other embodiments, the rigid-flexible combined board further comprises an adhesive layer, which is arranged between the first circuit board 110 and the second circuit board 120, and the first circuit board 110 is adhered to the second circuit board 120 through the adhesive layer. Since the adhesive process has the characteristics of reducing stress concentration, ensuring the strength of the adhered object, improving the fatigue life of the structure, and being corrosion-resistant and low in processing cost, the first circuit board 110 and the second circuit board 120 are connected by the adhesive method, which is conducive to improving the service life of the rigid-flexible combined board.

[0042] Based on the rigid-flexible combined board disclosed in the embodiments of the present application, the specific processing and manufacturing process is as follows:

[0043] S100, preparing raw materials according to the design scheme.

[0044] S200, selecting materials (such as wiring layers) of rigid circuit boards and flexible circuit boards that meet the specification requirements and screening, removing impurities that do not meet the requirements, and processing the screened materials, such as cutting, punching, etc., for subsequent process use.

[0045] S300, rigid-flexible combination processing: cleaning the surface of the rigid material to remove oil and impurities, improving the adhesive strength of the rigid-flexible combined board, and selecting appropriate adhesives according to the use requirements of the rigid-flexible combined board, such as commonly used adhesives such as glue and tape.

[0046] S400, uniformly applying the adhesive on the surface of the rigid material, and placing the flexible material on the adhesive, and using pressure or heating method to promote the flexible material and the rigid material to be better adhered together as needed.

[0047] S500, hot pressing treatment: stacking the materials into a hot press, setting the temperature and pressure parameters according to the product requirements, and performing hot pressing treatment. During the hot pressing process, the materials of the rigid-flexible combined board will undergo melting, flowing and solidification changes, thereby forming a solid overall structure.

[0048] S600, drilling, drilling cleaning, etching and other process treatments.

[0049] S700, chemical copper plating, electroplating copper and other processes are performed to form a metal layer, thereby enhancing the conductivity and corrosion resistance of the rigid-flexible combined board.

[0050] S800, surface solder resist and weldability treatment are performed to form a protective layer, thereby protecting the wiring layer and the metal layer and improving the weldability.

[0051] S900, the rigid-flexible circuit board is processed in shape by a predetermined program, such as local slotting, punching, etc., to meet the shape requirements of the rigid-flexible combined board.

[0052] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A rigid-flex printed circuit board, characterized by, The soft and hard combination board comprises a first circuit board (110), a second circuit board (120) and a plastic sealing member (130), the first circuit board (110) is partially overlapped with the second circuit board (120), and the first circuit board (110) is connected with the second circuit board (120), The plastic sealing member (130) is arranged on the first circuit board (110), the second circuit board (120) is provided with a glue blocking part (140), the glue blocking part (140) is in contact with the plastic sealing member (130) to block overflow glue between the plastic sealing member (130) and the first circuit board (110).

2. The rigid-flex printed circuit board of claim 1, wherein, The second circuit board (120) is further provided with a strip-shaped groove (150), one end of the strip-shaped groove (150) extends to the edge of the second circuit board (120) away from the plastic sealing member (130) in the length direction of the soft and hard combination board, and the other end of the strip-shaped groove (150) is arranged in a spaced manner with the plastic sealing member (130) to form the glue blocking part (140) between the strip-shaped groove (150) and the plastic sealing member (130), and the strip-shaped groove (150) is used for forming part of the board separation groove of the soft and hard combination board.

3. The rigid-flex printed circuit board of claim 2, wherein, The first circuit board (110) and the second circuit board (120) each comprise an overlapped wiring layer (111) and a protection layer (112), the strip-shaped groove (150) is arranged on the protection layer (112), and part of the protection layer (112) forms the glue blocking part (140).

4. The rigid-flex printed circuit board of claim 3, wherein, The first circuit board (110) and the second circuit board (120) each further comprise a metal layer (113), and the metal layer (113) is arranged between the wiring layer (111) and the protection layer (112).

5. The rigid-flex printed circuit board of claim 2, wherein, The number of the strip-shaped grooves (150) is at least two, and each strip-shaped groove (150) is arranged in a spaced manner in sequence along the width direction of the soft and hard combination board, and the glue blocking part (140) is arranged in a one-to-one corresponding manner with the strip-shaped groove (150).

6. The rigid-flex printed circuit board of claim 2, wherein, The width of the strip-shaped groove (150) is 1.2-1.5 mm.

7. The rigid-flex printed circuit board of claim 1, wherein, The length of the glue blocking part (140) is 3-4 mm.

8. The rigid-flex printed circuit board of claim 1, wherein, The first circuit board (110) is a rigid circuit board, the second circuit board (120) is a flexible circuit board, and the contour line of the orthographic projection of the plastic sealing member (130) coincides with the contour line of the orthographic projection of the first circuit board (110) in the direction perpendicular to the first circuit board (110).

9. The rigid-flex printed circuit board of claim 1, wherein, The first circuit board (110) is a flexible circuit board, the second circuit board (120) is a rigid circuit board, the first circuit board (110) comprises a first part and a second part connected with each other, the first part is partially overlapped with the second circuit board (120), the second part protrudes from the second circuit board (120), the plastic sealing member (130) is arranged on the second part, and the contour line of the orthographic projection of the plastic sealing member (130) coincides with the contour line of the orthographic projection of the second part in the direction perpendicular to the second circuit board (120), The second circuit board (120) is further provided with a strip-shaped groove (150), one end of the strip-shaped groove (150) extends to the edge of the second circuit board (120) away from the plastic package (130) in the length direction of the soft and hard combination board, and the other end of the strip-shaped groove (150) is arranged in a spaced manner from the plastic package (130) to form the glue blocking part (140) between the strip-shaped groove (150) and the plastic package (130), and the strip-shaped groove (150) is used to form part of the board separation groove of the soft and hard combination board.

10. The rigid-flex printed circuit board of claim 1, wherein, The soft and hard combination board further comprises an adhesive layer arranged between the first circuit board (110) and the second circuit board (120), and the first circuit board (110) is bonded to the second circuit board (120) through the adhesive layer.

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