Resistance welding tool of printed circuit board
By designing components such as slides, slide blocks, and turntables, high-precision positioning and automated processing of circuit boards were achieved, solving the problems of inaccurate positioning and processing interruption in existing solder mask tooling, and improving the production efficiency and quality of circuit boards.
Patent Information
- Application Number
- CN202520127771.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2035-01-20
AI Technical Summary
Existing solder mask fixtures suffer from inaccurate positioning, board placement deviations, and frequent processing interruptions in circuit board production, resulting in high scrap rates and low processing efficiency.
By employing components such as a slide table, slide base, plate-laying turntable, negative pressure components, motor, pneumatic rotary joint, and vision probe, the circuit board position and angle are adjusted through negative pressure adsorption and precise movement. Combined with the design of a pad and plasma fan, high-precision positioning and automated processing of the circuit board are achieved.
It improves the positioning accuracy and processing efficiency of circuit boards, reduces board placement errors and friction damage, ensures processing quality and continuous production, and is suitable for complex PCB solder mask processes.
Smart Images

Figure CN223798446U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a solder resist tooling, and more particularly to a solder resist tooling for printed circuit boards. Background Technology
[0002] A solder mask fixture is a tool or device used in the production of printed circuit boards (PCBs) to ensure the correct application of the solder mask layer. The solder mask is a protective layer covering the copper foil of a PCB. Except for the areas where soldering is required, the remaining areas are covered by the solder mask to prevent short circuits and other soldering defects. Ensuring the solder mask accurately covers areas that do not require soldering while exposing the pads that need soldering helps improve soldering quality and efficiency.
[0003] Solder resist coating is typically applied using screen printing equipment. During processing, the circuit board to be coated with solder resist is placed below the screen printing equipment. Inside the equipment, a screen template with a specific pattern is installed and set according to the circuit board model. The equipment descends and presses the screen template firmly onto the circuit board. Then, a squeegee evenly spreads the solder resist ink across the screen, allowing the ink to pass through the openings in the screen and accurately deposit at the designated location on the circuit board. During the screen printing process, the board placement platform needs to be precisely positioned to ensure that the screen template and the circuit board are perfectly aligned. If the placement platform is not accurately positioned or is unstable, it will lead to alignment deviations, increased adjustment time, and higher scrap rates. Although some solder resist stations are equipped with placement fixtures with positioning functions, placement deviations may still occur during use, requiring subsequent adjustments. Furthermore, when changing circuit board models, the placement fixture needs to be changed simultaneously, which undoubtedly leads to frequent processing interruptions and prevents the equipment from operating continuously. Utility Model Content
[0004] In order to overcome the shortcomings mentioned in the background art, the purpose of this utility model is to provide a solder mask tooling for printed circuit boards to solve one of the problems.
[0005] The technical solution is as follows: A solder mask fixture for printed circuit boards includes a slide table 1, a slide table 2, a slide base, a board placement turntable, a mounting frame, a negative pressure component, a motor, a pneumatic rotary joint, a flexible support rod, and a vision probe. The slide table 1 has mounting screw holes on both its front and rear sides. The slide table 2 is mounted on the slide table 1. The slide table 1 and slide table 2 have the same structure, both consisting of a frame and a transmission component. The transmission component of the slide table 1 is connected to the slide table 2, causing the slide table 2 to move left and right on the slide table 1. A slide base is slidably mounted on the slide table 2, and the slide base is connected to the transmission component of the slide table 2. The slide base moves back and forth under the drive of the transmission component of the slide table 2. A board placement turntable is rotatably mounted inside the slide base. A mounting frame is fixedly mounted in the lower part of the slide base. A negative pressure component is located inside the mounting frame, and a mounting plate is mounted on the negative pressure component. The device includes a pneumatic rotary joint, which consists of a fixed end and a rotating end. The fixed end is fixedly connected to the negative pressure component, while the rotating end is rotatably mounted inside the fixed end. The upper end of the rotating end is fixedly connected to the slide. Both the plate-laying turntable and the pneumatic rotary joint have airflow channels that are interconnected. The plate-laying turntable also has several negative pressure holes that are connected to the airflow channels within it. When the negative pressure component is working, it creates a negative pressure area on the surface of the plate-laying turntable through the pneumatic rotary joint and the negative pressure holes. A motor is installed inside the mounting frame, and the motor's output shaft passes through the pneumatic rotary joint and connects to the plate-laying turntable. The motor drives the plate-laying turntable to rotate. A flexible support rod is provided on one side of the slide, and a vision probe is installed at the end of the flexible support rod.
[0006] Furthermore, it also includes a pad, which is snapped onto the slide, with the top of the pad at the same height as the top of the turntable.
[0007] Furthermore, it also includes positioning blocks. Four positioning blocks are embedded in the pad, forming a plate placement area around the top of the pad.
[0008] Furthermore, the pad has several air holes and an airflow channel inside. All the air holes on the pad are connected to the airflow channel inside the pad. An air connector is provided on one side of the pad, which is connected to the airflow channel. Airflow is introduced into the pad through the air connector. After the airflow introduced into the pad passes through the airflow channel inside the pad, it is blown upward from the air holes.
[0009] Furthermore, it also includes a plasma fan, a hose, and an air blower. The plasma fan is located on one side of the slide away from the flexible support rod. A hose is connected to the plasma fan, and an air blower is installed at the end of the hose. The air outlet of the air blower faces the side of the pad and the turntable surface.
[0010] The beneficial effects of this utility model are as follows: This utility model uses slide table one and slide table two to drive the slide block to be positioned and translated within a planar area, thereby driving the plate-laying turntable inside the slide block to be positioned and moved. The plate-laying turntable is driven by a motor to achieve a certain angle of rotation adjustment. At the same time, the negative pressure component will form a negative pressure area on its plate-laying turntable through the negative pressure hole. During solder resist processing, the placed circuit board will be firmly attracted to the plate-laying turntable, and the positioning adjustment and movement will be achieved. This allows the circuit board to cooperate with the solder resist processing printing equipment in the correct position and angle, greatly improving the plate-laying efficiency and reducing processing errors caused by plate-laying errors, thereby improving processing efficiency.
[0011] This invention uses a pad and a turntable to stably support the circuit board during processing. At the same time, air is blown out through the air holes on the pad when the board is picked up, causing the circuit board to float. This allows the circuit board to quickly detach from the pad and the turntable, preventing the circuit board from sticking to the pad and the turntable, and reducing friction and damage to the lower surface of the circuit board when picking up the board.
[0012] This invention utilizes a plasma dust removal mechanism. After the circuit board is placed on the tooling, the plasma dust removal machine blows air onto the surface of the circuit board, effectively removing impurities and dust particles and reducing the impact of impurities on the solder resist coating. Attached Figure Description
[0013] Figure 1 This is a three-dimensional structural diagram of the present invention.
[0014] Figure 2 This is a three-dimensional structural diagram of the slide, plate-laying turntable, and mounting frame of this utility model.
[0015] Figure 3 This is a three-dimensional structural diagram of the mounting frame, negative pressure component, and motor of this utility model.
[0016] Figure 4 This is a three-dimensional structural diagram of the slide table and dust removal mechanism of this utility model.
[0017] The components are: 1. Slide 1, 2. Slide 2, 3. Slide base, 4. Plate placement turntable, 41. Mounting frame, 42. Negative pressure component, 43. Motor, 44. Pneumatic rotary joint, 5. Flexible support rod, 51. Vision probe, 6. Pad, 61. Positioning block, 610. Air hole, 8. Plasma fan, 81. Hose, 83. Air blowing head. Detailed Implementation
[0018] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.
[0019] Example 1
[0020] A solder mask fixture for printed circuit boards, such as Figure 1-4 As shown, the fixture includes a slide table 1, a slide table 2, a slide base 3, a plate-laying turntable 4, a mounting frame 41, a negative pressure component 42, a motor 43, a pneumatic rotary joint 44, a flexible support rod 5, and a vision probe 51. Slide table 1 has mounting screw holes on both the front and rear sides for fixing the entire device to the work platform. Slide table 2 is mounted on slide table 1. Slide table 1 and slide table 2 have the same structure, both consisting of a frame and a transmission component. The transmission component of slide table 1 and slide table 2 are connected by precision gears or lead screws, enabling slide table 2 to move left and right on slide table 1. This design gives the entire fixture high positioning accuracy and stability, ensuring no deviation occurs during processing, thereby improving the product qualification rate.
[0021] A slide block 3 is slidably mounted on the slide table 2. The slide block 3 is connected to the transmission component of the slide table 2 via a ball screw or linear guide rail, ensuring that the slide block 3 can move back and forth under the drive of the transmission component on the slide table 2. This sliding mounting method not only improves the smoothness of movement, but also reduces friction and energy consumption. The slide block 3 is equipped with a plate-laying turntable 4 inside. A mounting frame 41 is fixedly installed in the lower part of the slide block 3, which provides a stable support structure for the plate-laying turntable 4.
[0022] The mounting frame 41 contains a negative pressure component 42, which is connected to an external vacuum source via a pipe to provide a stable negative pressure environment. The negative pressure component 42 is equipped with a pneumatic rotary joint 44, which consists of a fixed end and a rotating end. The fixed end is fixedly connected to the negative pressure component 42, while the rotating end is rotatably mounted within the fixed end. The upper end of the rotating end is fixedly connected to the slide block 3. Both the plate-laying turntable 4 and the pneumatic rotary joint 44 have airflow channels that are interconnected. The plate-laying turntable 4 also has several negative pressure holes, all of which communicate with the airflow channels within it. When the negative pressure component 42 is in operation, a negative pressure area is formed on the surface of the plate-laying turntable 4 through the pneumatic rotary joint 44 and the negative pressure holes. This area firmly adheres to the circuit board to be processed, preventing displacement during processing and ensuring processing accuracy.
[0023] A motor 43 is installed inside the mounting frame 41. The output shaft of the motor 43 passes through the pneumatic rotary joint 44 and is connected to the plate-laying turntable 4. The motor 43 drives the plate-laying turntable 4 to rotate. The motor 43 is a high-precision servo motor, which can accurately control the rotation angle and speed of the plate-laying turntable 4 under the command of the control system, so as to achieve precise multi-angle processing. This not only improves work efficiency, but also ensures the consistency of processing at different angles, and further improves product quality.
[0024] A flexible support rod 5 is provided on one side of the slide table 1. A vision probe 51 is installed at the end of the flexible support rod 5. The flexible support rod 5 can be flexibly adjusted in position as needed to ensure that the vision probe 51 can be accurately aligned with the circuit board on the plate-laying turntable 4. The vision probe 51 is equipped with a high-resolution camera and an image processing system, which can automatically identify and position the circuit board before processing to ensure that the position and angle of each processing meet the requirements. In addition, the vision probe 51 can also monitor the processing in real time, promptly detect and correct any possible deviations, and improve the production yield.
[0025] In practical applications, the circuit board to be processed is first placed on the board placement turntable 4. At this time, the negative pressure component 42 forms a negative pressure area through the air rotary joint 44 and the negative pressure hole on the board placement turntable 4, making the circuit board firmly adhere to the surface of the board placement turntable 4 and ensuring that it will not shift during processing. Next, slide table 1 and slide table 2 precisely control the slide block 3 to move back, forth, left, and right in the horizontal direction according to the preset program instructions, thereby accurately moving the board placement turntable 4 and the circuit board on it to the designated position. At the same time, the motor 43 installed in the mounting frame 41 drives the board placement turntable 4 to achieve a certain angle of rotation adjustment, so that the circuit board can be aligned with the solder mask processing equipment at the correct angle. The vision probe 51 flexibly adjusts its position through the flexible support rod 5, and monitors the position and angle of the circuit board in real time, ensuring that the circuit board is in the best condition before each processing. The whole process is highly automated and highly accurate, which greatly improves the board placement efficiency and significantly reduces processing errors caused by board placement errors. Finally, through this efficient and precise positioning adjustment and movement mechanism, this fixture effectively improves the overall processing efficiency and product quality, and is suitable for various complex PCB solder mask process requirements.
[0026] Example 2
[0027] Based on Example 1, such as Figure 1 and Figure 3 As shown, it also includes a pad 6. There are pre-set slots on both sides of the slide 3. The pad 6 is snapped into the slot of the slide 3. The pad 6 is detachably installed on the slide 3. After installation, the top height of the pad 6 is consistent with the top height of the plate placement turntable 4, forming a flat working surface, so that the circuit board can be placed stably during the processing and avoid processing errors caused by height difference.
[0028] The pad 6 has four embedded positioning blocks 61, which surround a board placement area to define the placement position of the circuit board and ensure that the circuit board is always in the correct position for processing. This design not only improves the positioning accuracy of the circuit board, but also reduces the time and complexity of manual adjustment, further improving work efficiency.
[0029] The pad 6 has several air holes 610 and an airflow channel inside. Each air hole 610 is connected to the airflow channel inside the pad 6. An air connector is provided on one side of the pad 6. The air connector is connected to an external air source through a pipe to introduce airflow into the pad 6. When the board needs to be removed, the airflow introduced through the air connector passes through the airflow channel inside the pad 6 and is blown upward from the air hole 610 to form a uniform airflow layer, which makes the circuit board float. This design effectively prevents the circuit board from sticking to the pad 6 and the board placement turntable 4, allowing the circuit board to be quickly removed from the work platform. At the same time, it reduces friction and damage to the lower surface of the circuit board when removing the board, protecting the integrity of the circuit board.
[0030] By using the pad 6 in conjunction with the turntable 4, not only is a stable support for the circuit board during processing provided, but the airflow from the vent 610 also enables contactless separation during board removal. This significantly improves the automation and efficiency of the entire processing, reduces the uncertainty caused by human operation, and further enhances product quality and production efficiency. In summary, this improved solder mask fixture effectively protects the circuit board while improving processing accuracy and efficiency, making it suitable for various high-precision circuit board solder mask process requirements.
[0031] In addition, such as Figure 4 As shown, the welding resist fixture also includes a plasma fan 8, a hose 81, and an air blower 83. The plasma fan 8 is installed on the side of the slide table 1 away from the flexible support rod 5. The plasma fan 8 is fixed to the slide table 1 by a sturdy bracket to ensure its stable operation. The plasma fan 8 is connected to the air blower 83 through a flexible hose 81. The hose 81 has good flexibility and durability and can be adjusted to different working positions without affecting the airflow transmission. The air blower 83 is installed at the end of the hose 81, and the air outlet of the air blower 83 is precisely facing the surface of the pad plate 6 and the plate placement turntable 4.
[0032] The high-speed airflow generated by the plasma fan 8 is transmitted to the air blower 83 through the hose 81 and is evenly sprayed out from the air outlet of the air blower 83, forming a strong and stable airflow. This airflow can not only assist the airflow blown out by the air holes 610 on the pad 6 when picking up the board, further improving the suspension effect of the circuit board, but also clean the surface of the board placement turntable 4 and the pad 6 before processing, removing any dust and impurities that may exist, ensuring the cleanliness of the surface on which the circuit board is placed, and avoiding processing defects caused by foreign objects.
[0033] The present application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present application. Therefore, the content of this specification should not be construed as a limitation of the present application.
Claims
1. A solder mask tool for printed circuit boards, comprising a sliding table (1), the sliding table (1) is provided with mounting screw holes on both sides; characterized in that It also includes sliding table two (2), sliding seat (3), plate placing rotary table (4), mounting frame (41), negative pressure piece (42), motor (43), gas rotary joint (44), flexible support rod (5) and visual probe (51), the sliding table two (2) is installed on the sliding table one (1), the sliding table one (1) and the sliding table two (2) are consistent in structure, both are composed of a frame and a transmission part, the transmission part of the sliding table one (1) is connected with the sliding table two (2), driving the sliding table two (2) to translate left and right on the sliding table one (1), the sliding seat (3) is slidingly installed on the sliding table two (2), the transmission part of the sliding seat (3) is connected with the sliding table two (2), the sliding seat (3) moves forward and backward under the driving of the transmission part of the sliding table two (2), the plate placing rotary table (4) is rotatably arranged in the sliding seat (3), the mounting frame (41) is fixedly arranged in the lower part of the sliding seat (3), the negative pressure piece (42) is arranged in the mounting frame (41), the gas rotary joint (44) is arranged on the negative pressure piece (42), the gas rotary joint (44) is composed of two sections of fixed end and rotating end, the fixed end is fixedly connected with the negative pressure piece (42), the other rotating end is rotatably arranged in the fixed end, the upper end of the rotating end is fixedly connected with the sliding seat (3), the airflow passages are arranged in the plate placing rotary table (4) and the gas rotary joint (44), the airflow passages in the plate placing rotary table (4) and the gas rotary joint (44) are mutually penetrated, a plurality of negative pressure holes are formed in the plate placing rotary table (4), the negative pressure holes are in communication with the airflow passages in the plate placing rotary table (4), when the negative pressure piece (42) works, a negative pressure area is formed on the surface of the plate placing rotary table (4) through the gas rotary joint and the negative pressure holes, the motor (43) is installed in the mounting frame (41), the output shaft of the motor (43) penetrates through the gas rotary joint (44) and is connected with the plate placing rotary table (4), the plate placing rotary table (4) is driven to rotate through the motor (43), the flexible support rod (5) is arranged on one side of the sliding table one (1), the visual probe (51) is installed at the end of the flexible support rod (5).
2. A solder resist tooling for printed circuit boards according to claim 1, characterized in that: It also includes a backing plate (6), the backing plate (6) is clamped on the sliding seat (3), the height of the top of the backing plate (6) is consistent with the height of the top of the plate placing rotary table (4).
3. A solder resist tooling for printed circuit boards according to claim 2, characterised in that: It also includes positioning blocks (61), four positioning blocks (61) are embedded in the backing plate (6), a plate placing area is formed around the top of the backing plate (6) through the positioning blocks (61).
4. A solder resist tooling for printed circuit boards according to claim 3, characterised in that: A plurality of air holes (610) are formed in the backing plate (6), the airflow passages are arranged in the backing plate (6), the air holes (610) in the backing plate (6) are in communication with the airflow passages in the backing plate (6), a gas joint is arranged on one side of the backing plate (6), the gas joint is in communication with the airflow passages, the airflow is introduced into the backing plate (6) through the gas joint, the airflow introduced into the backing plate (6) is blown upward from the air holes (610) through the airflow passages in the backing plate (6).
5. A solder resist kit for printed circuit boards according to claim 4, characterised in that: It also includes a plasma fan (8), a hose (81) and an air blower (83). The plasma fan (8) is provided on the side of the slide (1) away from the flexible support rod (5). The hose (81) is connected to the plasma fan (8). An air blower (83) is installed at the end of the hose (81). The air outlet of the air blower (83) faces the surface of the pad (6) and the plate turntable (4).