Cooling fin and cooling back clamp

Abstract

The utility model discloses a radiating fin and a radiating back splint, and belongs to the technical field of radiating of electronic equipment. The cooling fin comprises a protective film, a heat-conducting silica gel sheet, a first adhesive layer, a heat-conducting copper foil, a second adhesive layer and a release film which are sequentially stacked, the heat-conducting silica gel sheet comprises a heat-conducting silica gel cloth and a heat-conducting silica gel layer which are sequentially stacked, one face of the heat-conducting silica gel cloth is connected with the protective film, and the other face of the heat-conducting silica gel cloth is covered with the heat-conducting silica gel layer. And the heat-conducting silica gel layer is connected with the heat-conducting copper foil through the first adhesive layer. The cooling fin is provided with the heat-conducting silica gel sheet made of the heat-conducting silica gel layer and the heat-conducting silica gel adhesive tape, the heat-conducting silica gel layer can uniformly conduct heat of all parts of the electronic equipment to the heat-conducting copper foil, then the heat is diffused out through the copper foil, heat dissipation is carried out through cooperation with the semiconductor chilling plate, and the heat dissipation effect and the soaking effect can be improved; and meanwhile, the heat-conducting silica gel cloth has excellent wear resistance and structural strength, so that the service life of the whole cooling fin can be prolonged.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation technology for electronic devices, and specifically relates to a heat sink and a heat dissipation back clip. Background Technology

[0002] With the rapid development of electronic devices, their functions have expanded beyond basic tasks like making calls and sending text messages. Modern electronic devices also offer features such as gaming, photography, and video recording. As electronic devices become more sophisticated and powerful, the heat generated by their components increases significantly, posing a growing threat to these devices. Therefore, effective heat dissipation is becoming increasingly crucial for electronic devices.

[0003] To better dissipate heat from electronic devices, heat dissipation back clips are commonly installed on them. These back clips contain heat sinks, and when the clip holds the electronic device in place, the heat sinks assist in heat dissipation, thereby improving the device's heat dissipation performance.

[0004] Furthermore, the heat sinks currently used in heat dissipation back clips often have poor structural strength and short service life; at the same time, the heat dissipation effect of existing heat sinks is poor, resulting in uneven heat dissipation and failing to dissipate heat evenly from various parts of electronic devices. Utility Model Content

[0005] To solve the above problems, the primary objective of this utility model is to provide a heat sink with good structural strength and long service life;

[0006] Another objective of this invention is to provide a heat sink with excellent heat dissipation effect. When applied to a heat dissipation back clip, it can evenly dissipate heat from various parts of the electronic device.

[0007] To achieve the above objectives, the technical solution of this utility model is as follows:

[0008] This utility model provides a heat sink, comprising: a protective film, a thermally conductive silicone sheet, a first adhesive layer, a thermally conductive copper foil, a second adhesive layer, and a release film stacked sequentially. The thermally conductive silicone sheet comprises a thermally conductive silicone cloth and a thermally conductive silicone layer stacked sequentially. One side of the thermally conductive silicone cloth is connected to the protective film, and the other side is covered with the thermally conductive silicone layer. The thermally conductive silicone layer is connected to the thermally conductive copper foil through the first adhesive layer.

[0009] When using this heatsink, remove the release film, attach it to the heatsink back clip using the second adhesive layer, and then remove the protective film to allow the thermally conductive silicone pad to adhere to the electronic device. The thermally conductive silicone layer can evenly conduct heat from various parts of the electronic device to the thermally conductive copper foil, which then dissipates the heat, thereby improving the heat dissipation effect of the heatsink back clip. At the same time, the thermally conductive silicone cloth has excellent wear resistance and structural strength, thus extending the service life of the entire heatsink.

[0010] Furthermore, a semiconductor cooling chip is attached to the thermally conductive copper foil. When energized, it generates cooling energy that is rapidly conducted through the thermally conductive copper foil to the surface of the thermally conductive silicone pad, forming a frost layer, thereby improving the heat dissipation effect of the heat sink.

[0011] Furthermore, the thermally conductive silicone cloth has a thickness of 0.18 mm and is made by brushing thermally conductive material onto fiberglass cloth, with a thermal conductivity of 1.5 W / m·K.

[0012] Furthermore, the thermally conductive material is made by mixing spherical alumina with a particle size of 1-5μm, dilute boron, and fumed silica gel with a solvent, and is brushed onto the upper surface of the thermally conductive silicone cloth.

[0013] Furthermore, the thickness of the thermally conductive silicone layer is 0.22 mm.

[0014] Furthermore, the thermally conductive silicone layer is made by mixing spherical alumina with a particle size of 1-10μm, fumed silica gel, and solvent, and is brushed onto the lower surface of the thermally conductive silicone cloth.

[0015] Furthermore, the thermally conductive copper foil has a thickness of 0.2 mm and is made of copper, resulting in better heat distribution and higher structural strength.

[0016] Furthermore, both the first adhesive layer and the second adhesive layer are made of double-sided adhesive, and the thickness of the first adhesive layer is 0.03 mm and the thickness of the second adhesive layer is 0.05 mm.

[0017] Furthermore, the thickness of the protective film is 0.08 mm.

[0018] This utility model provides a heat dissipation back clip, including a back clip body and the aforementioned heat dissipation plate, wherein the heat dissipation plate is bonded and fixed to the surface of the back clip body by a second adhesive layer.

[0019] The beneficial effects of this invention are that, compared with the prior art, this heat sink is equipped with a thermally conductive silicone sheet made of a thermally conductive silicone layer and a thermally conductive silicone cloth. The thermally conductive silicone layer can evenly conduct the heat from various parts of the electronic device to the thermally conductive copper foil, and then diffuse it out through the copper foil. By cooperating with the semiconductor cooling chip for heat dissipation, the heat dissipation effect and heat uniformity can be improved. At the same time, the thermally conductive silicone cloth has excellent wear resistance and structural strength, thereby improving the service life of the entire heat sink. Attached Figure Description

[0020] Figure 1 This is an exploded view of the heat sink.

[0021] Figure 2 This is a cross-sectional view of the heat sink.

[0022] Figure 3 This is a cross-sectional structural diagram of a thermally conductive silicone pad. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0024] To achieve the above objectives, the technical solution of this utility model is as follows:

[0025] See Figure 1-3 As shown, this embodiment provides a heat sink, including: a protective film 1, a thermally conductive silicone sheet 2, a first adhesive layer 3, a thermally conductive copper foil 4, a second adhesive layer 5, and a release film, which are stacked in sequence. The thermally conductive silicone sheet 2 includes a thermally conductive silicone cloth 21 and a thermally conductive silicone layer 22, which are stacked in sequence. One side of the thermally conductive silicone cloth 21 is connected to the protective film 1, and the other side is covered with the thermally conductive silicone layer 22. The thermally conductive silicone sheet layer 22 is connected to the thermally conductive copper foil 4 through the first adhesive layer 3.

[0026] When using this heat sink, remove the release film and attach it to the heat sink back clip using the second adhesive layer 5. Then, remove the protective film 1 to allow the thermally conductive silicone pad 2 to adhere to the electronic device. The thermally conductive silicone layer 22 can evenly conduct the heat from various parts of the electronic device to the thermally conductive copper foil 4, and then dissipate it through the thermally conductive copper foil 4, thereby improving the heat dissipation effect of the heat sink back clip. At the same time, the thermally conductive silicone cloth 21 has excellent wear resistance and structural strength, thereby improving the service life of the entire heat sink.

[0027] Furthermore, a semiconductor cooling chip is attached to the thermally conductive copper foil. When energized, it generates cooling energy that is rapidly conducted through the thermally conductive copper foil to the surface of the thermally conductive silicone pad, forming a frost layer, thereby improving the heat dissipation effect of the heat sink.

[0028] Furthermore, the thermally conductive silicone cloth 21 has a thickness of 0.18 mm and is made of fiberglass cloth brushed with thermally conductive material, with a thermal conductivity of 1.5 W / m·K.

[0029] Furthermore, the thermally conductive material is made by mixing spherical alumina with a particle size of 1-5μm, dilute boron, and fumed silica gel with a solvent, and is brushed onto the upper surface of the thermally conductive silicone cloth 21.

[0030] Furthermore, the thickness of the thermally conductive silicone layer 22 is 0.22 mm.

[0031] Furthermore, the thermally conductive silicone layer 22 is made by mixing spherical alumina with a particle size of 1-10μm, fumed silica gel, and solvent, and is brushed onto the lower surface of the thermally conductive silicone cloth 21.

[0032] Furthermore, the thermally conductive copper foil 4 has a thickness of 0.2 mm and is made of copper, resulting in better heat distribution and higher structural strength.

[0033] Furthermore, both the first adhesive layer 3 and the second adhesive layer 5 are made of double-sided adhesive, and the thickness of the first adhesive layer 3 is 0.03 mm and the thickness of the second adhesive layer 5 is 0.05 mm.

[0034] Furthermore, the thickness of the protective film 1 is 0.08 mm.

[0035] This embodiment also provides a heat dissipation back clip, including a back clip body and the aforementioned heat dissipation plate, wherein the heat dissipation plate is bonded and fixed to the surface of the back clip body by a second adhesive layer 5.

[0036] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat sink, characterized by, The application relates to a heat-dissipating back clamp, which comprises a protective film, a heat-conducting silica gel sheet, a first adhesive layer, a heat-conducting copper foil, a second adhesive layer and a release film which are sequentially arranged in layers. The heat-conducting copper foil is attached with a semiconductor refrigeration sheet.

2. A heat sink as claimed in claim 1, wherein The thickness of the heat-conducting silica gel cloth is 0.18 mm, and the heat-conducting silica gel cloth is made of a glass cloth on which a heat-conducting material is brushed, and the heat-conducting coefficient is 1.5 W / m*K.

3. The heat sink of claim 1, wherein, The heat-conducting material is made of spherical alumina with a particle size of 1-5 microns, boron, fumed silica and a solvent, and is brushed on the upper surface of the heat-conducting silica gel cloth.

4. A heat sink as claimed in claim 3, wherein The thickness of the heat-conducting silica gel layer is 0.22 mm.

5. The heat sink of claim 1, wherein The heat-conducting silica gel layer is made of spherical alumina with a particle size of 1-10 microns, fumed silica and a solvent, and is brushed on the lower surface of the heat-conducting silica gel cloth.

6. A heat sink as claimed in claim 5, wherein The thickness of the heat-conducting copper foil is 0.2 mm, and the material is red copper.

7. The heat sink of claim 1, wherein The first adhesive layer and the second adhesive layer are both double-sided adhesive tapes, the thickness of the first adhesive layer is 0.03 mm, and the thickness of the second adhesive layer is 0.05 mm.

8. The heat sink of claim 1, wherein, The thickness of the protective film is 0.08 mm.

9. The heat sink of claim 1, wherein, 10. A heat-dissipating back clamp using the heat-dissipating sheet according to any one of claims 1-9, which comprises a back clamp body, and the heat-dissipating sheet is fixed to the surface of the back clamp body through the second adhesive layer. ​

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