Universal module power supply heat dissipation tool

Abstract

The utility model relates to a universal module power supply heat dissipation tool applied to the technical field of power supplies, which realizes that a substrate is firstly placed, then a heat conduction pad is placed in the middle of the upper surface of the substrate, the bottom part of the heat conduction pad is provided with a rubber pad, so that the heat conduction pad can be adsorbed and fixed on the substrate, and then a hexagonal bi-pass stud is fixed on the substrate by using three groups of first screws. Then a plurality of module power supplies to be tested are placed on the heat conduction pad, the telescopic rod drives the protection pad to automatically abut against the side ends of the module power supplies through telescopic adjustment of the compression spring, the module power supplies are fixed to the heat conduction pad, and dislocation of the module power supplies caused by touch during subsequent continuous installation is avoided; and the cover plate bonded with the cushion block is fixed on the hexagonal bi-pass stud by using three groups of first screws, and the three groups of first screws are tightened for fixation, so that a plurality of module power supplies to be tested can be fixed on the substrate, and the heat dissipation tool is suitable for module power supplies of different models and sizes.

Description

Technical Field

[0001] This utility model relates to a general-purpose modular power supply heat dissipation fixture, and in particular to a general-purpose modular power supply heat dissipation fixture applied in the field of power supply technology. Background Technology

[0002] With the development of power supply technology, power supplies are becoming smaller and smaller, and their power density is getting higher and higher. Various modular power supplies have emerged. Commonly used modular power supply package sizes in the industry include: full brick, half brick, 1 / 4 brick, 1 / 8, 1 / 16, 1 / 32, 1*1, 2*1, and custom sizes according to actual needs. During the production process, modular power supplies need to undergo aging, room temperature operation, high temperature operation, and low temperature operation tests. Due to the high power density characteristics of modular power supplies, they often need to use additional heat sinks to help dissipate heat when performing the above tests. Otherwise, they are very easy to burn out due to excessive internal temperature during the test.

[0003] Chinese patent CN219660274U discloses a heat dissipation structure and a power module, including a power module housing. Slots are provided on the lower sides of both outer walls of the power module housing. A power circuit board is installed inside the power module housing. The structure is reasonable. This utility model incorporates a heat dissipation mechanism, with two sets of heat dissipation mechanisms installed on both sides of the inside of the power module housing, and the power circuit board placed between the two sets of heat dissipation mechanisms. Utilizing the installation and heat dissipation effects of the heat dissipation mechanism, along with multiple ventilation slots on the power module housing, the heat generated by the power circuit board during use can be promptly dissipated from the power module housing by the heat dissipation mechanism and ventilation slots. This prevents the power circuit board from overheating and causing damage or malfunction, effectively achieving heat dissipation for the power module.

[0004] Most existing heat dissipation fixtures for modular power supplies are designed for specific models or specifications of modular power supplies, and have poor versatility. When it is necessary to dissipate heat for modular power supplies of different sizes and structures, different heat dissipation fixtures are often required, which not only increases production costs but also reduces production efficiency. Utility Model Content

[0005] The technical problem that this utility model aims to solve in view of the above-mentioned prior art is that most of the existing modular power supply heat dissipation fixtures are designed for specific models or specifications of modular power supplies, and have poor versatility.

[0006] To address the aforementioned issues, this utility model provides a universal modular power supply heat dissipation fixture, comprising a base plate, a thermal pad detachably connected to the top of the base plate, a modular power supply detachably connected to the top of the thermal pad, and various models of modular power supplies, a cover plate detachably connected to the top of the modular power supply, a pad fixedly connected to the bottom of the cover plate, and the pad abutting against the top of the modular power supply, two sets of hexagonal double-through studs are threadedly connected to the top of the base plate on both sides of the thermal pad by first screws, and the cover plate is fixedly threaded to the top of the hexagonal double-through studs by first screws, multiple support rods are symmetrically and detachably connected to the top of the base plate, and telescopic rods are fixedly connected to the ends of two symmetrical support rods close to each other, a protective pad is detachably connected to the movable end of the telescopic rod, and the protective pad abuts against the modular power supply, and a compression spring is fixedly connected between the inner wall of the fixed end of the telescopic rod and the cross section of the movable end.

[0007] In the aforementioned power supply heat dissipation fixture, the module power supply placed on the thermal pad is positioned by a telescopic rod and a protective pad. Then, the cover plate and the base plate are fixed by hexagonal double studs, thereby clamping and fixing the module power supply between them. This heat dissipation fixture is suitable for module power supplies of different models and sizes.

[0008] As a further improvement of this application, multiple slots are symmetrically chiseled at the top of the substrate, and a corresponding locking block is fixedly connected to the bottom of the support rod, and the locking block engages with the slot.

[0009] As a further improvement of this application, corresponding screw holes are provided on the side end of the substrate and on the card block, and the two corresponding screw holes are internally threaded with a second screw.

[0010] As a further improvement of this application, a threaded sleeve is fixedly connected to one end of the protective pad near the movable end of the telescopic rod, and the threaded sleeve is threadedly connected to the movable end of the telescopic rod. The surface of the protective pad near the power supply of the module has a granular design.

[0011] As another improvement of this application, the length of the fixed end of the telescopic rod is equal to the distance between the end of the hexagonal double stud closest to the module power supply and the support rod.

[0012] As a further improvement to this application, the top of the substrate is a flat surface, the bottom is a heat dissipation surface with heat dissipation teeth, and the thermal pad is made of a soft material.

[0013] In summary, before testing, first place the substrate, then place the thermal pad in the center of the substrate's upper surface. Since the thermal pad has a rubber pad at the bottom, it can adhere to the substrate. Next, use three sets of first screws to fix the hexagonal double-through studs to the substrate. Then, place the power modules to be tested on the thermal pad. At this point, the telescopic rod, through the adjustment of the compression spring, will cause the protective pad to automatically contact the side of the power module, fixing the power module to the thermal pad and preventing misalignment during subsequent installation. Then, use three sets of first screws to fix the cover plate with the adhesive pad to the hexagonal double-through studs. Tighten the three sets of first screws to secure the power modules to the substrate. Since both surfaces of the fixture and the power modules are in soft contact, the appearance of the tested products is less likely to be damaged during testing. Furthermore, because the metal casing of the power module is in direct, tight contact with the high thermal conductivity thermal pad, the heat from the power module will be conducted to the substrate and dissipated. Attached Figure Description

[0014] Figure 1 This is an isometric drawing of the heat dissipation fixture according to the first embodiment of this application;

[0015] Figure 2 This is an exploded view of the heat dissipation fixture according to the first embodiment of this application;

[0016] Figure 3 This is a schematic diagram of the module power supply installation according to the first embodiment of this application;

[0017] Figure 4 This is a schematic diagram of the module power supply clamp mounting structure according to the second embodiment of this application;

[0018] Figure 5 This is a schematic diagram of the telescopic rod structure according to the second embodiment of this application;

[0019] Figure 6 This is a schematic diagram of the installation of different models of module power supply and heat dissipation fixtures according to the first embodiment of this application.

[0020] Explanation of the labels in the diagram:

[0021] 1. Substrate; 2. First screw; 3. Thermal pad; 4. Hexagonal double stud; 5. Spacer; 6. Cover plate; 7. Module power supply; 8. Support rod; 9. Telescopic rod; 10. Second screw; 11. Slot; 12. Protective pad; 13. Locking block; 14. Screw hole; 15. Threaded sleeve; 16. Compression spring. Detailed Implementation

[0022] The two embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0023] First implementation method:

[0024] Figure 1-3 and Figure 6 A general-purpose modular power supply heat dissipation fixture is shown, including a base plate 1. A thermal pad 3 is detachably connected to the top of the base plate 1. A modular power supply 7 is detachably connected to the top of the thermal pad 3. The modular power supply 7 is designed in various models. A cover plate 6 is detachably connected to the top of the modular power supply 7. A pad block 5 is fixedly connected to the bottom of the cover plate 6 and abuts against the top of the modular power supply 7. Two sets of hexagonal double-through studs 4 are threadedly connected to the top of the base plate 1 on both sides of the thermal pad 3 by first screws 2. The cover plate 6 is threadedly fixed to the top of the hexagonal double-through studs 4 by first screws 2. Multiple support rods 8 are symmetrically and detachably connected to the top of the base plate 1. Two symmetrical support rods 8 are fixedly connected to each other at one end. A telescopic rod 9 is fixedly connected to the movable end of the telescopic rod 9. A protective pad 12 is detachably connected to the movable end of the telescopic rod 9 and abuts against the modular power supply 7. A compression spring 16 is fixedly connected between the inner wall of the fixed end of the telescopic rod 9 and the cross section of the movable end.

[0025] The length of the fixed end of the telescopic rod 9 is equal to the distance between the end of the hexagonal double stud 4 near the module power supply 7 and the support rod 8. The top of the substrate 1 is a flat surface, and the bottom is a heat dissipation surface with heat dissipation teeth. The thermal pad 3 is made of soft material.

[0026] Working principle: Before testing, first place the substrate 1, then place the thermal pad 3 in the center of the upper surface of the substrate 1. Since the thermal pad 3 has a rubber pad on the bottom, it can be adsorbed and fixed on the substrate 1. Then, use three sets of first screws 2 to fix the hexagonal double studs 4 to the substrate 1. Then, place the several module power supplies 7 to be tested on the thermal pad 3. At this time, the telescopic rod 9, through the extension and retraction adjustment of the compression spring 16, drives the protective pad 12 to automatically contact the side of the module power supply 7, fixing the module power supply 7 on the thermal pad 3, avoiding contact with the module during subsequent installation and preventing damage. The power supply 7 is misaligned. Then, the cover plate 6 with the pad 5 is fixed to the hexagonal double-through stud 4 with three sets of first screws 2. Tighten the three sets of first screws 2 to fix it. Then, the several module power supplies 7 to be tested can be fixed on the substrate 1. Since the two surfaces of the tooling and the several module power supplies 7 to be tested are in soft contact, it is not easy to damage the appearance of the test product during the test. On the other hand, since the metal shell of the module power supply 7 is in close contact with the thermal pad 3 with high thermal conductivity, the heat on the module power supply 7 will be conducted to the substrate 1 during the test and then dissipated.

[0027] The module power supply 7, placed on the thermal pad 3, is positioned by the telescopic rod 9 and the protective pad 12. Then, the cover plate 6 and the base plate 1 are fixed by the hexagonal double stud 4, thereby clamping and fixing the module power supply 7 between them. This heat dissipation fixture is suitable for module power supplies 7 of different models and sizes.

[0028] Second implementation method:

[0029] Figure 4-5The substrate 1 has multiple slots 11 symmetrically cut at its top. The bottom of the support rod 8 is fixedly connected to a corresponding locking block 13, which engages with the slot 11. The side of the substrate 1 and the locking block 13 are both provided with corresponding screw holes 14. The two corresponding screw holes 14 are internally threaded with second screws 10. The protective pad 12 is fixedly connected to a threaded sleeve 15 near the movable end of the telescopic rod 9. The threaded sleeve 15 is threadedly connected to the movable end of the telescopic rod 9. The surface of the protective pad 12 near the module power supply 7 has a granular design.

[0030] Working principle: Insert the locking block 13 at the bottom of the support rod 8 into the corresponding slot 11, and then insert the second screw 10 from the outside of the base plate 1 into the corresponding two screw holes 14 for tightening, thereby fixing the support rod 8. At this time, the protective pads 12 on the two symmetrical support rods 8 can automatically clamp and position the module power supply 7 placed on the heat conduction pad 3. The contact surface between the protective pad 12 and the module power supply 7 is designed with a granular texture to increase friction and strengthen the connection. The protective pad 12 is connected to the movable end of the telescopic rod 9 by a threaded sleeve 15. When the protective pad 12 wears out during long-term use, it can be easily disassembled and replaced.

[0031] The detachable design of the support rod 8 and the protective pad 12 allows for quick and easy replacement in case of damage during long-term use.

[0032] In light of current practical needs, the above-described embodiments adopted in this application are not limited to these. Any changes made within the scope of knowledge possessed by those skilled in the art without departing from the concept of this application still fall within the protection scope of this utility model.

Claims

1. A universal module power heat dissipation tooling comprising a base plate (1), characterized in that: The top of the substrate (1) is detachably connected with a heat-conducting pad (3), the top of the heat-conducting pad (3) is detachably connected with a module power supply (7), and the module power supply (7) is designed in multiple models, the top of the module power supply (7) is detachably connected with a cover plate (6), the bottom of the cover plate (6) is fixedly connected with a pad (5), and the pad (5) abuts against the top of the module power supply (7), the top of the substrate (1) is threadedly connected with two groups of hexagonal double-pass studs (4) on both sides through first screws (2), and the cover plate (6) is threadedly fixed with the top of the hexagonal double-pass studs (4) through the first screws (2), the top of the substrate (1) is detachably connected with a plurality of supporting rods (8) symmetrically, and the ends of the two symmetric supporting rods (8) are fixedly connected with telescopic rods (9), the movable end of the telescopic rod (9) is detachably connected with a protective pad (12), and the protective pad (12) abuts against the module power supply (7), and the compression spring (16) is fixedly connected between the inner wall of the fixed end and the cross section of the movable end of the telescopic rod (9).

2. The universal module power heat sink tooling of claim 1, wherein: A plurality of clamping grooves (11) are symmetrically excavated in the top of the substrate (1), the bottom of the supporting rod (8) is fixedly connected with a clamping block (13) corresponding to the clamping groove (11), and the clamping block (13) is clamped in the clamping groove (11).

3. The universal module power heat sink tooling of claim 2, wherein: Corresponding screw holes (14) are formed in the side end of the substrate (1) and the clamping block (13), and the second screws (10) are threadedly connected in the corresponding two screw holes (14).

4. The universal module power heat sink tooling of claim 1, wherein: The protective pad (12) is fixedly connected with a threaded sleeve (15) at one end close to the movable end of the telescopic rod (9), the threaded sleeve (15) is threadedly connected with the movable end of the telescopic rod (9), and the surface of the protective pad (12) close to the module power supply (7) is designed in a granular shape.

5. The universal module power heat sink tooling of claim 1, wherein: The length of the fixed end of the telescopic rod (9) is equal to the distance between the hexagonal double-pass stud (4) close to the module power supply (7) and the supporting rod (8).

6. The universal module power heat sink tooling of claim 1, wherein: The top of the substrate (1) is a flat surface, the bottom is a heat dissipation surface provided with heat dissipation teeth, and the heat-conducting pad (3) is made of soft material.

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