Shielding module, controller and computer equipment

Abstract

The utility model discloses a shielding module, a controller and computer equipment. The shielding module is composed of three main parts: an integrated component, an insulating layer and a shielding layer. Wherein the insulating layer is covered on the integrated component, and the shielding layer is covered on the insulating layer. Specifically, the integrated component is responsible for data transmission and / or data processing. The insulating layer is used for insulating the integrated assembly so as to prevent current leakage and short circuit. And the shielding layer is used for shielding external electromagnetic interference and ensuring stable operation of the integrated assembly, so that the electromagnetic compatibility of the whole module is improved. According to the shielding module, electromagnetic wave transmission can be effectively inhibited, good electromagnetic compatibility is provided, the material and processing cost can be remarkably reduced, the product weight and size are reduced, and therefore portability and installation flexibility are improved.

Description

Technical Field

[0001] This application relates to the field of electronic technology, specifically to a shielding module, a controller, and a computer device. Background Technology

[0002] Controllers typically consist of multiple modules. To improve the controller's electromagnetic compatibility (EMC), these modules often use metal housings to suppress electromagnetic wave transmission. Metal housings not only provide physical protection but also effectively shield against external electromagnetic interference, ensuring the stable operation of internal electronic components. However, the material and processing costs of metal housings are relatively high, increasing the product's manufacturing cost. Furthermore, using metal housings also leads to increased product weight and size, thus affecting its portability. Utility Model Content

[0003] In view of this, embodiments of this application provide a shielding module, a controller, and a computer device, which can reduce manufacturing costs, lighten weight, and optimize product size while ensuring electromagnetic compatibility, thereby improving the portability of the controller.

[0004] To address the above problems, the technical solutions provided in this application are as follows:

[0005] A shielding module, the shielding module comprising: an integrated component, an insulating layer, and a shielding layer;

[0006] The insulating layer covers the integrated component; the shielding layer covers the insulating layer;

[0007] The integrated component is used for data transmission and / or data processing;

[0008] The insulating layer is used to insulate the integrated component;

[0009] The shielding layer is used to shield the integrated component from electromagnetic interference.

[0010] In one possible implementation, the insulating layer is made of an insulating material.

[0011] In one possible implementation, the shielding layer is made of a conductive material.

[0012] In one possible implementation, the insulating layer is made of materials including plastic, rubber, or epoxy resin.

[0013] In one possible implementation, the material used to make the shielding layer includes silver paste or graphene.

[0014] In one possible implementation, the integrated components include any one of a main controller module, a central communication module, an extended communication module, and an input / output (I / O) module.

[0015] A controller comprising a plurality of shielding modules as described above.

[0016] A computer device comprising a controller as described above.

[0017] Therefore, the embodiments of this application have the following beneficial effects:

[0018] The shielding module of this application includes an integrated component, an insulating layer, and a shielding layer. The insulating layer covers the integrated component, and the shielding layer covers the insulating layer. The integrated component is used for data transmission and / or data processing. The insulating layer insulates the integrated component. The shielding layer shields the integrated component from electromagnetic interference. The shielding module of this application not only effectively suppresses electromagnetic wave transmission and provides good electromagnetic compatibility, but also significantly reduces material and processing costs, decreases product weight and size, thereby improving portability and installation flexibility. Furthermore, this design is more modular, facilitating maintenance and upgrades, and improving the overall system reliability and efficiency. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in this embodiment or the prior art, the drawings used in the description of the embodiment or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of a shielding module provided in an embodiment of this application;

[0021] Figure 2 This is a schematic diagram of the structure of a controller provided in an embodiment of this application. Detailed Implementation

[0022] To facilitate understanding of the technical solutions provided in the embodiments of this application, the background technology involved in the embodiments of this application will be described below.

[0023] A controller is typically a complex system composed of multiple functional modules, encompassing key components such as a main control module, communication module, and input / output modules. These modules work together through precise design and coordinated collaboration to achieve the product's various functional and performance objectives. Electromagnetic compatibility (EMC) is a crucial aspect, especially in applications requiring high precision and stability, where electromagnetic interference can severely impact normal operation. Therefore, to ensure the controller's stability in environments with high electromagnetic interference, many modules are designed with metal housings.

[0024] The metal casing effectively shields the product, preventing external electromagnetic waves from interfering with the internal circuitry. It also suppresses the leakage of electromagnetic waves generated by the product itself, reducing interference with surrounding equipment. This shielding significantly improves the product's electromagnetic compatibility (EMC), enabling it to meet higher EMC standards and ensuring excellent performance even in complex working environments.

[0025] However, while metal casings offer significant advantages in improving electromagnetic compatibility, they also present several challenges. First, metal is more expensive than plastic. Manufacturing metal casings requires more raw materials, and the cutting, welding, and surface treatment processes are relatively complex, further increasing manufacturing costs. Furthermore, the high precision required for metal casing manufacturing often necessitates advanced processing technologies, making the overall production process more expensive.

[0026] Secondly, since metals generally have a higher density, using a metal casing will increase the overall weight of the controller. This may cause some inconvenience for certain applications that require portability and high efficiency.

[0027] To address this issue, this application provides a shielding module comprising an integrated component, an insulating layer, and a shielding layer. The integrated component is used for data transmission and / or data processing, while the insulating layer covers the integrated component, providing insulation. The shielding layer covers the insulating layer and effectively shields against external electromagnetic interference, ensuring the stability and reliability of the integrated component during operation. This shielding module effectively suppresses electromagnetic wave transmission and improves electromagnetic compatibility while significantly reducing material and processing costs, lightening product weight and size, thereby enhancing portability and installation flexibility.

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0029] See Figure 1 , Figure 1 This is a schematic diagram of the structure of a shielding module provided in an embodiment of this application, as shown below. Figure 1As shown, this shielding module is part of the control product; therefore, it is soldered (or printed) onto the PCB board of the control product. The shielding module includes: an integrated component, an insulating layer, and a shielding layer. The insulating layer covers the integrated component. The shielding layer covers the insulating layer. The integrated component is used for data transmission and / or data processing. The insulating layer is used to insulate the integrated component. The shielding layer is used to shield against electromagnetic interference to the integrated component.

[0030] In addition, the shielding layer does not make direct contact with the floor of the control product, but is provided with a grounding area (i.e., grounding area).

[0031] In one possible implementation, the insulating layer is made of an insulating material.

[0032] In one possible implementation, the insulating layer is made of materials such as plastics, rubber, or epoxy resin. These materials have good electrical insulation properties, weather resistance, and ease of processing, and can effectively insulate the integrated components, prevent current leakage or electrical short circuits, and ensure the stable operation of the controller.

[0033] Plastics: Common plastic materials such as polycarbonate, polypropylene and polyamide have good electrical insulation, corrosion resistance and strong processing adaptability, making them suitable for large-scale production.

[0034] Rubber: such as silicone or neoprene rubber, has excellent elasticity and resistance to high and low temperatures, and can effectively isolate electrical components from external contact, making it especially suitable for applications requiring high protection and durability.

[0035] Epoxy resin: Epoxy resin is a high-strength electrical insulating material, widely used in the encapsulation and coating of electronic components, and has good heat resistance, corrosion resistance and mechanical shock resistance.

[0036] These materials can effectively protect integrated components from external electromagnetic interference while meeting electrical insulation requirements, thus helping to improve the overall electromagnetic compatibility and reliability of the product.

[0037] In one possible implementation, the shielding layer is made of a conductive material.

[0038] In one possible implementation, the material used to make the shielding layer includes silver paste or graphene, which have excellent conductivity and electromagnetic shielding effects and are often used to improve the electromagnetic compatibility of electronic devices.

[0039] Silver paste: Silver paste is a conductive paste containing silver particles, commonly used in electronic devices as a conductive material due to its very high conductivity. Silver paste provides excellent electromagnetic shielding, preventing external electromagnetic interference from entering electronic devices and suppressing internal electromagnetic radiation. It is suitable for high-performance, high-frequency electronic products, but its cost is relatively high.

[0040] Graphene: Graphene is a two-dimensional material composed of a single layer of carbon atoms. It possesses excellent electrical and thermal conductivity and strength, as well as good electromagnetic shielding properties. Graphene not only provides excellent shielding in electronic devices, but its low weight and high flexibility also make it suitable for thin, lightweight, and highly integrated electronic products. Graphene also exhibits strong corrosion resistance and durability, making it suitable for use in complex environments.

[0041] Both materials have significant advantages in electromagnetic shielding applications. Silver paste is widely used in high-end applications due to its excellent conductivity, while graphene, due to its novel properties, is gradually becoming an important shielding material in next-generation electronic devices, especially in devices that pursue high performance and lightweight design.

[0042] In one possible implementation, the integrated components include any one of a main controller module, a central communication module, an extended communication module, and an input / output (I / O) module. Each module performs a different function in the electronic device and is combined according to specific application requirements.

[0043] Main Controller Module: The main controller module is responsible for the overall operation and decision-making of the controller. It typically consists of a microprocessor that processes input signals, executes predefined program logic, and generates output signals to control other modules or devices. The main controller is the "brain" of the entire controller, determining the overall performance and response speed of the system.

[0044] Central Communication Module: The central communication module is responsible for internal and external communication functions within the controller. It manages data exchange between different controllers and modules, supporting multiple communication protocols (such as Ethernet, Wi-Fi, Bluetooth, etc.). The function of this module is to ensure that all parts of the controller can efficiently and stably transmit data and coordinate their operations.

[0045] Extended Communication Module: The extended communication module enhances the communication capabilities of the main controller module, supporting a wider range of communication interfaces and protocols. It can connect to more external devices and exchange data with other controllers, sensors, or actuators.

[0046] I / O Module: The I / O module is responsible for handling input and output signals between the controller and external hardware devices. As needed, the I / O module can provide interfaces such as Digital Input / Output (DIO) and Analog Input / Output (AIO) to connect to sensors, actuators, and other devices, and transmit information to the main controller module.

[0047] In addition, embodiments of this application also provide a controller, such as Figure 2 As shown, the controller has multiple shielding modules as described above. The shielding modules are soldered (or printed) onto the controller base plate.

[0048] In one possible implementation, the controller also includes integrated components that do not require shielding.

[0049] In one possible implementation, if the shielding module on the controller does not meet the shielding requirements, a secondary shielding layer is applied to the outer surface of the shielding module using an insulating layer and a shielding layer. During this secondary shielding, the shielding layer covers the outermost layer of the shielding module, and the insulating layer covers the shielding layer.

[0050] It should be noted that the materials used for the insulation and shielding layers covering the outer layer of the shielding module during secondary shielding are the same as those used for the insulation and shielding layers covering the surface of the integrated components in the shielding module, which will not be elaborated here.

[0051] In addition, embodiments of this application also provide a computer device, which includes the controller described above.

[0052] This application provides a shielding module, controller, and computer device. The module includes an integrated component, an insulating layer, and a shielding layer. Specifically, the insulating layer covers the integrated component, while the shielding layer covers the insulating layer. The integrated component is responsible for data transmission and / or data processing, ensuring the normal functioning of the system. The main function of the insulating layer is to insulate the integrated component, preventing current leakage and short circuits. The shielding layer is used to shield external electromagnetic interference, ensuring the stable operation of the integrated component, thereby improving the electromagnetic compatibility of the entire module. The shielding module of this application can effectively shield electromagnetic waves, improve electromagnetic compatibility, and reduce material and processing costs, weight, and size, thereby enhancing the portability and installation adaptability of the product.

[0053] The shielding module, controller, and computer device provided in this application have been described in detail above. The various embodiments in the specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to in the method section. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

[0054] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0055] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A shielding module, characterized in that The shielding module comprises an integrated component, an insulating layer and a shielding layer. The insulating layer is covered on the integrated component, and the shielding layer is covered on the insulating layer. The integrated component is used for data transmission and / or data processing. The insulating layer is used for insulating the integrated component. The shielding layer is used for shielding electromagnetic interference on the integrated component.

2. Shielding module according to claim 1, characterized in that The insulating layer is made of insulating material.

3. The shielding module of claim 1, wherein, The shielding layer is made of conductive material.

4. The shielding module of claim 2, wherein, The material of the insulating layer comprises plastic, rubber or epoxy resin.

5. The shielding module of claim 3, wherein, The material of the shielding layer comprises silver paste or graphene.

6. The shielding module of claim 1, wherein, The integrated component comprises any one of a main controller module, a central communication module, an extended communication module and an input / output (IO) module.

7. A controller characterized by comprising: The controller comprises a plurality of shielding modules as claimed in any one of claims 1-6.

8. A computer device, comprising: The computer device comprises the controller as claimed in claim 7.

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