Electronic packaging structure

Abstract

The utility model discloses an electronic packaging structure which comprises an annular electronic element, a chip, a first support and a second support. The chip is coupled to the annular electronic component. The first support wraps the annular electronic component and the chip from a first side. The second support wraps the annular electronic component and the chip from a second side. Wherein the first side is opposite to the second side. The first support and the second support are combined with each other, so that the annular electronic component and the chip are sealed between the first support and the second support. Therefore, the complete waterproof effect can be achieved, and internal elements cannot be exposed.

Description

Technical Field

[0001] This utility model relates to an electronic packaging structure, and more particularly to an electronic packaging structure that is completely waterproof and does not expose internal components. Background Technology

[0002] Currently, small coils containing chips are packaged in a bracket via injection molding. Because the coils lack rigidity and are prone to deformation, ejector pins are needed to support them within the mold. After the bracket is formed, the bracket's exterior will have support holes corresponding to the ejector pins, causing the coil and / or chip to be exposed through these holes, thus failing to meet waterproofing requirements. Utility Model Content

[0003] Therefore, this invention provides an electronic packaging structure that is completely waterproof and does not expose internal components, in order to solve the above problems.

[0004] According to one embodiment, the electronic packaging structure of this utility model includes: a ring-shaped electronic component; a chip coupled to the ring-shaped electronic component; a first support covering the ring-shaped electronic component and the chip from a first side; and a second support covering the ring-shaped electronic component and the chip from a second side, wherein the first side and the second side are opposite to each other; wherein the first support and the second support are combined with each other, such that the ring-shaped electronic component and the chip are sealed between the first support and the second support.

[0005] In one embodiment, the first bracket is first formed by a first injection molding process, and the second bracket is then formed by a second injection molding process.

[0006] In one embodiment, a plurality of grooves are formed on one side of the first bracket in the first injection molding process, and a plurality of protrusions are formed on one side of the second bracket in the second injection molding process, the plurality of protrusions fitting into the plurality of grooves.

[0007] In one embodiment, the ring-shaped electronic component is a coil or a circuit board.

[0008] In one embodiment, the first support and the second support are transparent.

[0009] In summary, this invention encapsulates a ring-shaped electronic component and a chip within a first and second interlocking support. In one embodiment, the first support is first formed via a first injection molding process to encapsulate the ring-shaped electronic component and the chip. At this point, the first support can fix the ring-shaped electronic component, which may lack rigidity, preventing deformation. Next, the second support is formed via a second injection molding process, allowing the first and second supports to interlock. After encapsulation, neither the first nor the second support will have any holes. Thus, the ring-shaped electronic component and the chip are sealed within the interlocking first and second supports, achieving complete waterproofing and preventing the internal components from being exposed. This invention's electronic packaging structure not only offers fast processing speed but also allows for modular mold design, increasing production efficiency.

[0010] The advantages and spirit of this utility model can be further understood through the following detailed technical solution and accompanying drawings. Attached Figure Description

[0011] Figure 1 This is a perspective view of an electronic packaging structure according to an embodiment of the present invention.

[0012] Figure 2 for Figure 1 An exploded view of the electronic packaging structure.

[0013] Figure 3 for Figure 1 The electronic packaging structure is shown in a three-dimensional view from another perspective.

[0014] Figure 4 for Figure 3 An exploded view of the electronic packaging structure.

[0015] Figure 5 This is a schematic diagram of a first injection molding process according to an embodiment of the present invention.

[0016] Figure 6 This is a schematic diagram of a second injection molding process according to an embodiment of the present invention.

[0017] Figure 7 This is a flowchart of a method for manufacturing an electronic packaging structure according to an embodiment of the present invention.

[0018] Explanation of reference numerals in the attached figures:

[0019] 1: Electronic Packaging Structure

[0020] 3: First mold

[0021] 5: Second mold

[0022] 10: Ring-shaped electronic components

[0023] 12: Chip

[0024] 14: First stent

[0025] 16: Second stent

[0026] 30: First public mold

[0027] 32: First master mold

[0028] 50: Second public mold

[0029] 52: Second master mold

[0030] 140: Groove

[0031] 160: Bump

[0032] 300: Trench

[0033] 302: Protrusion

[0034] S1: First side

[0035] S2: Second side

[0036] S10, S12, S14, S16: Steps Detailed Implementation

[0037] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. The embodiments provided are for illustrative purposes only and are not intended to be limiting in any way.

[0038] Please refer to Figures 1 to 4 , Figure 1 This is a perspective view of an electronic packaging structure 1 according to an embodiment of the present invention. Figure 2 for Figure 1 Exploded view of electronic packaging structure 1 in the image. Figure 3 for Figure 1 A three-dimensional view of the electronic packaging structure 1 from another perspective. Figure 4 for Figure 3 Exploded view of electronic packaging structure 1 in the image.

[0039] like Figures 1 to 4As shown, the electronic package structure 1 includes a ring-shaped electronic component 10, a chip 12, a first support 14, and a second support 16. The chip 12 is coupled to the ring-shaped electronic component 10. The ring-shaped electronic component 10 can be a coil or a circuit board, depending on the application. The ring-shaped electronic component 10 can be used as an antenna, but is not limited thereto. The first support 14 covers the ring-shaped electronic component 10 and the chip 12 from a first side S1, and the second support 16 covers the ring-shaped electronic component 10 and the chip 12 from a second side S2, wherein the first side S1 and the second side S2 are opposite each other. The first support 14 and the second support 12 are respectively joined to each other from the first side S1 and the second side S2, so that the ring-shaped electronic component 10 and the chip 12 are sealed between the first support 14 and the second support 16.

[0040] In other words, this invention encapsulates the annular electronic component 10 and the chip 12 within a first support 14 and a second support 16 that are joined together, thereby forming an electronic packaging structure 1. After packaging, neither the first support 14 nor the second support 16 will have any holes in their external appearance. Thus, the annular electronic component 10 and the chip 12 are sealed within the joined first support 14 and the second support 16, achieving complete waterproofing and preventing the internal components from being exposed. In this embodiment, the first support 14 and the second support 16 can be transparent, allowing the position of the annular electronic component 10 and the chip 12 located inside the first support 14 and the second support 16 to be visible after packaging. It should be noted that the first support 14 and the second support 16 are not limited to being transparent.

[0041] Please refer to Figures 5 to 7 , Figure 5 This is a schematic diagram of a first injection molding process according to an embodiment of the present invention. Figure 6 This is a schematic diagram of a second injection molding process according to an embodiment of the present invention. Figure 7 This is a flowchart of a method for manufacturing an electronic packaging structure 1 according to an embodiment of the present invention.

[0042] In this embodiment, the first bracket 14 can be formed first via a first injection molding process, such as... Figure 5 As shown. Next, the second support 16 is formed through a second injection molding process, as shown. Figure 6 As shown. The following is through... Figure 7 Combination Figure 5 and Figure 6 The manufacturing method of electronic packaging structure 1 is described.

[0043] First, step S10 is performed, in which the annular electronic component 10 and the chip 12 are placed in a first mold 3, such as... Figure 5As shown. In this embodiment, the first mold 3 may include a first male mold 30 and a first female mold 32. The first male mold 30 may have a plurality of grooves 300 and a plurality of protrusions 302, wherein the plurality of grooves 300 and the plurality of protrusions 302 are arranged in a ring at intervals. The ring-shaped electronic component 10 may be placed on the protrusions 302, such that the protrusions 302 support the ring-shaped electronic component 10 above the grooves 300. Next, the first female mold 32 is covered on the first male mold 30. Next, step S12 is executed, and a first support 14 is formed in the first mold 3 through a first injection molding process, such that the first support 14 covers the ring-shaped electronic component 10 and the chip 12 from the first side S1. Since the protrusion 302 supports the annular electronic component 10 above the groove 300, a plurality of grooves 140 will be formed on one side of the first bracket 14 in the first injection molding process, wherein the positions of the plurality of grooves 140 correspond to the positions of the plurality of protrusions 302 of the first mold 30.

[0044] Next, the ring-shaped electronic component 10, the chip 12, and the first support 14 are removed from the first mold 3. Then, step S14 is executed, placing the ring-shaped electronic component 10, the chip 12, and the first support 14 into a second mold 5, as shown... Figure 6 As shown. In this embodiment, the second mold 5 may include a second male mold 50 and a second female mold 52. The annular electronic component 10, the chip 12, and the first support 14 can be placed on the second male mold 50 first, and then the second female mold 52 is placed on the second male mold 50. When the annular electronic component 10, the chip 12, and the first support 14 are placed on the second male mold 50, the first support 14 is in contact with the second male mold 50, while the annular electronic component 10 is not in contact with the second male mold 50. Next, step S16 is executed, and the second support 16 is formed in the second mold 5 through a second injection molding process, so that the second support 16 covers the annular electronic component 10 and the chip 12 from the second side S2. At this time, the first support 14 and the second support 16 will be combined with each other, so that the annular electronic component 10 and the chip 12 are sealed between the first support 14 and the second support 16. Since a plurality of grooves 140 are formed on one side of the first bracket 14 during the first injection molding process, a plurality of protrusions 160 will be formed on one side of the second bracket 16 during the second injection molding process (e.g., ...). Figure 4 As shown in the figure, the positions of the plurality of protrusions 160 correspond to the positions of the plurality of grooves 140. Therefore, after the second bracket 16 is formed, the plurality of protrusions 160 of the second bracket 16 will fit into the plurality of grooves 140 of the first bracket 14 (as shown in the figure). Figure 3 (As shown), to ensure that the annular electronic component 10 and the chip 12 are not exposed. In this way, the annular electronic component 10 and the chip 12 are sealed in the first bracket 14 and the second bracket 16 that are joined together, so as to achieve complete waterproofing and prevent the internal components from being exposed.

[0045] In this embodiment, the materials of the first bracket 14 and the second bracket 16 can be plastic or other materials suitable for injection molding.

[0046] In summary, this invention encapsulates a ring-shaped electronic component and a chip within a first and second interlocking support. In one embodiment, the first support is first formed via a first injection molding process to encapsulate the ring-shaped electronic component and the chip. At this point, the first support can fix the ring-shaped electronic component, which may lack rigidity, preventing deformation. Next, the second support is formed via a second injection molding process, allowing the first and second supports to interlock. After encapsulation, neither the first nor the second support will have any holes. Thus, the ring-shaped electronic component and the chip are sealed within the interlocking first and second supports, achieving complete waterproofing and preventing the internal components from being exposed. This invention's electronic packaging structure not only offers fast processing speed but also allows for modular mold design, increasing production efficiency.

[0047] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, several equivalent substitutions or obvious modifications can be made without departing from the concept of the present invention, and all such modifications, with identical performance or use, should be considered within the protection scope of the present invention.

Claims

1. An electronic packaging structure, characterized in that, include: A ring-shaped electronic component; A chip, coupled to the ring-shaped electronic component; A first support frame covers the annular electronic component and the chip from a first side; as well as A second support covers the annular electronic component and the chip from a second side, wherein the first side and the second side are opposite to each other; The first bracket and the second bracket are combined with each other, so that the annular electronic component and the chip are sealed between the first bracket and the second bracket.

2. The electronic packaging structure as described in claim 1, characterized in that, The first bracket is formed by a first injection molding process, and the second bracket is formed by a second injection molding process.

3. The electronic packaging structure as described in claim 2, characterized in that, The first bracket has a plurality of grooves formed on one side during the first injection molding process, and the second bracket has a plurality of protrusions formed on one side during the second injection molding process, the plurality of protrusions fitting into the plurality of grooves.

4. The electronic packaging structure as described in claim 1, characterized in that, The ring-shaped electronic component is a coil or a circuit board.

5. The electronic packaging structure as described in claim 1, characterized in that, The first bracket and the second bracket are transparent.

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