Seed polishing device for grain hardness measurement

Abstract

The utility model discloses a seed polishing device for grain hardness measurement, which comprises a polishing assembly, a driving assembly and a holding assembly, the polishing assembly comprises a polishing head and a connecting part, one end of the connecting part is connected with the driving assembly, the other end of the connecting part is connected with the polishing head, and the polishing head is used for polishing the surface of a seed. The driving assembly is used for driving the connecting component to rotate so as to drive the polishing head to rotate, one end of the holding assembly is connected with the fixed end of the driving assembly, the other end of the holding assembly is located below the polishing head, and the side, close to the polishing head, of the holding assembly is used for clamping seeds. According to the seed polishing device for measuring the grain hardness, the polishing efficiency of the seed surface can be improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of agricultural machinery, and particularly relates to a seed polishing device for grain hardness measurement. BACKGROUND

[0002] With the development of the scale of agriculture, the research on crop seeds is paid more and more attention, and the grain hardness is an important parameter in the research process of seeds, and the determination mode mainly comprises the following steps: the surface of the polished seed is pressed or forced by using a grain hardness tester, however, since some crop seeds are irregular in shape and have attachments such as dust and impurities on the outer surface, the accuracy and measurement standard of the hardness measurement are adversely affected, and therefore, the surface needs to be polished.

[0003] In the related art, sandpaper is mostly used for polishing, however, the polishing efficiency is low, and manual fixing of the seed is required, and the labor intensity is large. SUMMARY

[0004] The utility model aims at at least one of the technical problems in the related art to some extent. Therefore, the embodiment of the utility model provides a seed polishing device for grain hardness measurement, and the polishing efficiency of the seed surface can be improved.

[0005] The seed polishing device for grain hardness measurement provided by the embodiment of the utility model comprises a polishing assembly and a driving assembly, the polishing assembly comprises a polishing head and a connecting component, one end of the connecting component is connected with the driving assembly, the other end of the connecting component is connected with the polishing head, the polishing head is used for polishing the surface of the seed, and the driving assembly is used for driving the connecting component to rotate so as to drive the polishing head to rotate; a holding assembly, one end of the holding assembly is connected with the fixed end of the driving assembly, the other end of the holding assembly is located below the polishing head, and the side adjacent to the polishing head of the holding assembly is used for clamping the seed.

[0006] The seed polishing device for grain hardness measurement provided by the embodiment of the utility model can improve the polishing efficiency of the surface of the seed.

[0007] In some embodiments, the connecting component comprises a chuck and a connecting rod, one end of the chuck is connected with the connecting rod, the other end of the chuck is connected with the polishing head, and the end of the connecting rod away from the chuck is connected with the driving assembly.

[0008] In some embodiments, the polishing head is detachably connected with the connecting rod, and the number of the polishing heads is multiple, and one of the polishing heads in the multiple polishing heads is connected with the connecting rod.

[0009] In some embodiments, the driving assembly comprises a housing, a driver and a control switch, the driver is installed in the housing, a conveying shaft of the driver is connected with the chuck, and the control switch is connected with the driver to control rotation and stop of the driver.

[0010] In some embodiments, the control switch comprises a first switch and a second switch, and the first switch and the second switch control the driver respectively.

[0011] In some embodiments, the seed polishing device for grain hardness measurement further comprises a power supply connected with the control switch, and the power supply is used to supply power to the driver.

[0012] In some embodiments, the holding assembly comprises a clamping arm and a telescopic part, a fixed end of the telescopic part is connected with the housing, and a telescopic end of the telescopic part is connected with the clamping arm to drive the clamping arm to approach or move away from the polishing head, and one side of the clamping arm adjacent to the polishing head is used to clamp a seed.

[0013] In some embodiments, one side of the clamping arm facing the polishing head is provided with a clamping hole used to store a seed. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is a structural schematic view of the seed polishing device for grain hardness measurement according to an embodiment of the present application.

[0015] Figure 2 is Figure 1 the front view of the seed polishing device for grain hardness measurement in the embodiment.

[0016] Figure 3 is a schematic view of polished grain seeds.

[0017] REFERENCE SIGNS

[0018] the polishing assembly 100, the driving assembly 200, the holding assembly 300,

[0019] the polishing head 1,

[0020] the connecting part 2, the chuck 21, the connecting rod 22,

[0021] the housing 3, the driver 4,

[0022] the control switch 5, the first switch 51, the second switch 52,

[0023] the power supply 6,

[0024] the clamping arm 7, the clamping hole 71, the telescopic part 8. DETAILED DESCRIPTION

[0025] The embodiments of the present application are described in detail below, examples of which are shown in the drawings. The embodiments described below by reference to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0026] As shown in Figure 1 and Figure 2 The seed polishing device for grain hardness measurement of the embodiment of the present application comprises a polishing assembly 100, a driving assembly 200 and a holding assembly 300. The polishing assembly 100 comprises a polishing head 1 and a connecting component 2. One end of the connecting component 2 is connected with the driving assembly 200, and the other end of the connecting component 2 is connected with the polishing head 1. The polishing head 1 is used for polishing the surface of the seed. The driving assembly 200 is used for driving the connecting component 2 to rotate to drive the polishing head 1 to rotate. One end of the holding assembly 300 is connected with the fixed end of the driving assembly 200. The other end of the holding assembly 300 is located below the polishing head 1, and the side of the holding assembly 300 adjacent to the polishing head 1 is used for clamping the seed.

[0027] Specifically, as shown in Figure 1 The left end of the connecting component 2 is connected with the polishing head 1, and the right end of the connecting component 2 is connected with the driving assembly 200. The driving assembly 200 drives the polishing head 1 to rotate through the connecting component 2. The left end of the holding assembly 300 can clamp the seed, and the left end of the holding assembly 300 is located directly below the polishing head 1.

[0028] It should be noted that the polishing of the outer surface of the grain does not need to be fully polished. Only one plane of the grain needs to be polished. In other words, the polishing of the certain plane of the grain can facilitate the measurement end of the hardness measuring instrument to exert pressure on the grain.

[0029] In addition, it should be noted that since only the outer surface of the grain is polished, the purpose is to remove impurities and establish a standard surface for exerting pressure, so the hardness of the grain itself will not be changed. In other words, the polishing of the outer surface of the grain will not affect the hardness of the grain itself.

[0030] The seed polishing device for grain hardness measurement of the embodiment of the present application can polish the surface of the seed through the polishing head 1. Compared with the related art of polishing by using sandpaper, the polishing efficiency of the surface of the seed can be improved. The seed can be clamped through the holding assembly 300. Not only the polishing quality can be improved, but also the seed does not need to be manually taken, and the safety of polishing is improved.

[0031] In some embodiments, the connecting component 2 comprises a chuck 21 and a connecting rod 22. One end of the chuck 21 is connected with the connecting rod 22, and the other end of the chuck 21 is connected with the polishing head 1. The end of the connecting rod 22 away from the chuck 21 is connected with the driving assembly 200.

[0032] Specifically, as shown in Figure 1 and Figure 2 , the left end of the chuck 21 is connected with the right end of the polishing head 1, the left end of the connecting rod 22 is connected with the right end of the chuck 21, the connecting rod 22 and the chuck 21 can be connected by screw thread or clamping, and the polishing head 1 and the connecting rod 22 are connected by screw thread or clamping. By setting the detachable connecting rod 22 and the chuck 21, the polishing head 1 is convenient to install, and the efficiency of the polishing head 1 is improved.

[0033] In some embodiments, the polishing head 1 is detachably connected with the connecting rod 22, and the number of the polishing head 1 is multiple, and one of the multiple polishing heads 1 is connected with the connecting rod 22.

[0034] It should be noted that the sizes and models of the multiple polishing heads 1 are different, and different polishing heads 1 can be selected according to the types and sizes of the seeds, so as to be suitable for the polishing operation of different seeds.

[0035] In some embodiments, the driving assembly 200 includes a shell 3, a driver 4 and a control switch 5, the driver 4 is installed in the shell 3, the conveying shaft of the driver 4 is connected with the chuck 21, and the control switch 5 is connected with the driver 4 to control the rotation and stop of the driver 4.

[0036] Specifically, as shown in Figure 1 and Figure 2 , the driver 4 is installed in the shell 3, and the output shaft of the driver 4 partially extends out of the shell 3, the driver 4 can be a motor, and the control switch 5 controls the rotation and rotation speed of the motor. It should be noted that the control of the rotation and rotation speed of the motor by the control switch 5 is prior art, which will not be described in detail here.

[0037] In some embodiments, the control switch 5 includes a first switch 51 and a second switch 52, and the first switch 51 and the second switch 52 control the driver 4 respectively.

[0038] Specifically, as shown in Figure 1 , the first switch 51 is located on the outer peripheral wall of the shell 3, and the second switch 52 is installed on the right end face of the shell 3. The first switch 51 can be a jog switch, that is, when the first switch 51 is pressed, the driver 4 starts to rotate, and when the first switch 51 is released, the driver 4 stops rotating. The second switch 52 is a mechanical switch, that is, after the second switch 52 is turned on, the driver 4 continuously rotates, and by adjusting different gears of the second switch 52, the effect of adjusting the rotation speed of the driver 4 is achieved.

[0039] In some embodiments, the seed polishing device for grain hardness measurement further includes a power supply 6, the power supply 6 is connected with the control switch 5, and the power supply 6 is used to supply power to the driver 4.

[0040] Specifically, as shown in Figure 1 and Figure 2 The power supply 6 is mounted on the right end surface of the shell 3, and the power supply 6 is detachably connected with the shell 3, for example, the power supply 6 can be connected with the shell 3, and the power supply 6 is arranged to facilitate the movement of the entire polishing device and improve its portability.

[0041] In some embodiments, the holding assembly includes a clamping arm 7 and a telescopic part 8, the fixed end of the telescopic part 8 is connected with the shell 3, and the telescopic end of the telescopic part 8 is connected with the clamping arm 7 to drive the clamping arm 7 to approach or away from the polishing head 1, and the side of the clamping arm 7 adjacent to the polishing head 1 is used to clamp the seed.

[0042] Specifically, as shown in Figure 1 and Figure 2 The upper end of the telescopic part 8 is connected with the shell 3, and the lower end of the telescopic part 8 is connected with the right end of the clamping arm 7, and the telescopic part 8 can drive the clamping arm 7 to move up and down to make the clamping arm 7 approach or away from the polishing head 1, thereby controlling the polishing depth of the seed.

[0043] It should be noted that the polishing of the outer surface of the grain seed in the embodiment still needs manual operation, so the distance between the clamping arm 7 and the polishing head 1 can be observed by the human eye, thereby avoiding the damage to the seed and the damage to the polishing head 1 caused by the too close distance between the polishing head 1 and the seed. In other words, the telescopic part 8 in the embodiment of the application can adjust the polishing depth of the grain seed by adjusting the height of the clamping arm 7, thereby avoiding damage to the grain seed caused by excessive polishing.

[0044] For example, the telescopic part 8 can be a telescopic cylinder, a hydraulic rod or an electric telescopic rod, and the telescopic part 8 has a self-locking function. It should be noted that the telescopic cylinder, the hydraulic rod or the electric telescopic rod with the self-locking function are all prior art, and their internal structures are not described in detail here.

[0045] In some embodiments, the side of the clamping arm 7 facing the polishing head 1 is provided with a clamping hole 71 for storing the seed.

[0046] Specifically, as shown in Figure 1 and Figure 2 The clamping hole 71 is provided with an elastic sheet, and after the seed is inserted into the clamping hole 71, the elastic sheet is used to clamp and fix the seed. By arranging the clamping hole 71 and the elastic sheet, the seed can be clamped so that it is not necessary to hold the seed for polishing, thereby improving the safety of polishing.

[0047] It should be noted that although the grain seeds are small in size and irregular in shape, the elastic sheet can be wrapped around the four sides of the grain seeds to achieve clamping and fixing of the four sides of the grain, and the polishing head 1 is only slightly polished on the outer surface of the grain, and the polishing impact of the polishing head 1 on the grain is not large, so that the elastic change of the elastic sheet is not changed when the polishing head 1 polishes the outer surface of the grain, thereby achieving stable clamping of the grain seeds.

[0048] Optionally, the elastic clamping force of the elastic sheet 7 is greater than the polishing impact of the polishing head 1 on the grain seeds. Since the position of the polishing head is fixed and the rotating speed is relatively large, the centrifugal force generated by the polishing head is limited, and therefore, by selecting a suitable elastic sheet 7, stable clamping of the seeds can be achieved.

[0049] It should be noted that the clamping force of the elastic sheet 7 should also be less than the average hardness of the seeds to avoid damage to the seeds caused by excessive clamping force. In other words, when the clamping force of the elastic sheet 7 causes damage to the seeds, the seeds are unqualified measurement samples, and do not need to be polished. Replace the qualified samples.

[0050] In addition, it should be noted that when the grain seeds are inserted into the clamping hole 71, the height of the elastic sheet is lower than the height of the grain seeds, that is, the surface to be polished of the grain seeds is located outside the clamping hole 71, and the elastic sheet is located inside the clamping hole 71, so that the elastic sheet does not block the grain seeds, thereby not affecting the normal polishing of the grain seeds.

[0051] Optionally, the elastic sheet can also be replaced by an inflatable air bag, which is inflated after the grain seeds are placed in the clamping hole 71 to clamp the four sides of the seeds.

[0052] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0053] In addition, the terms "first", "second", "third", etc. are used only for descriptive purposes and do not connote or imply any relative importance or any meaning pertaining to the quantity of the features being described. Thus, a feature defined with "first", "second", etc. can include at least one of the features, explicitly or implicitly. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless specifically defined otherwise.

[0054] In the present application, unless specifically defined and limited otherwise, the terms "mounting", "connecting", "connection", "fixed", and the like should be interpreted broadly, for example, can be fixed connection, can also be detachable connection, or integrated; can be mechanical connection, can also be electrical connection or communication with each other; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements, unless specifically defined otherwise. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0055] In the present application, unless specifically defined and limited otherwise, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact, or the first and second features can be in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0056] In the present application, the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or features of different embodiments or examples described in the present application without contradiction.

[0057] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and cannot be understood as limiting the present application. Those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A seed polishing device for grain hardness measurement, characterized by, The utility model relates to a seed polishing device, which comprises the following components: a polishing assembly and a driving assembly, the polishing assembly comprises a polishing head and a connecting component, one end of the connecting component is connected with the driving assembly, the other end of the connecting component is connected with the polishing head, the polishing head is used for polishing the surface of seeds, and the driving assembly is used for driving the connecting component to rotate to drive the polishing head to rotate; a holding assembly, one end of the holding assembly is connected with the fixed end of the driving assembly, the other end of the holding assembly is located below the polishing head, and the side of the holding assembly adjacent to the polishing head is used for clamping seeds.

2. The seed polishing device for grain hardness measurement according to claim 1, characterized by, The connecting component comprises a chuck and a connecting rod, one end of the chuck is connected with the connecting rod, the other end of the chuck is connected with the polishing head, and the end of the connecting rod away from the chuck is connected with the driving assembly.

3. The seed polishing device for grain hardness measurement according to claim 2, characterized by, The polishing head is detachably connected with the connecting rod, and the number of the polishing head is multiple, one of the polishing heads is connected with the connecting rod.

4. The seed polishing device for grain hardness measurement according to claim 2, wherein The driving assembly comprises a shell, a driver and a control switch, the driver is installed in the shell, the transmission shaft of the driver is connected with the chuck, and the control switch is connected with the driver to control the rotation and stop of the driver.

5. The seed polishing device for grain hardness measurement according to claim 4, characterized by, The control switch comprises a first switch and a second switch, and the first switch and the second switch control the driver respectively.

6. The seed polishing device for grain hardness measurement according to claim 5, wherein The utility model further comprises a power supply, the power supply is connected with the control switch, and the power supply is used for supplying power to the driver.

7. The seed polishing device for grain hardness measurement according to claim 4, wherein The holding assembly comprises a clamping arm and a telescopic component, the fixed end of the telescopic component is connected with the shell, the telescopic end of the telescopic component is connected with the clamping arm to drive the clamping arm to approach or move away from the polishing head, and the side of the clamping arm adjacent to the polishing head is used for clamping seeds.

8. The seed polishing device for grain hardness measurement according to claim 7, characterized by, The side of the clamping arm towards the polishing head is provided with a clamping hole, and the clamping hole is used for storing seeds.

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