Die with heat dissipation guide pillar
By introducing a guiding air blowing and buffer agitation mechanism into the mold, and utilizing the combination of a semiconductor cooler and a stirring paddle, the problem of slow heat dissipation of the mold guide pillars during high-temperature processing is solved, achieving rapid heat dissipation and high-quality surface treatment for both the mold and the workpiece.
Patent Information
- Application Number
- CN202423248043.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2034-12-27
AI Technical Summary
Existing mold guide pillars are difficult to assist in the rapid heat dissipation of the mold and workpiece during high-temperature processing, and their function is relatively limited.
A heat dissipation guide column with a guiding air blowing mechanism and a buffer stirring mechanism was designed. The cold air generated by the semiconductor cooler flows in the coolant and is blown towards the workpiece through the air blowing pipe. Combined with the stirring paddle to stir the coolant, it can achieve rapid heat dissipation and cooling, and reduce scratches and deformation on the workpiece surface through buffering.
It enhances the heat dissipation effect of molds and workpieces, improves the surface quality of workpieces, and achieves the dual functions of guiding and positioning and heat dissipation.
Smart Images
Figure CN223801359U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to mould technical field, concretely a mould with heat dissipation guide post. BACKGROUND
[0002] Mould is a kind of industrial tool for forming, shaping or processing material (such as metal, plastic, rubber, glass, ceramic, etc.), and mould guide post is an important component in mould structure, which is used to support and position mould parts during mould working process.
[0003] At present, during the mould clamping processing of moving mould and static mould, guide post cooperates with guide sleeve to carry out accurate guiding and positioning, to ensure accurate mould clamping processing, but in actual use process, mould processing often needs to be in high-temperature environment, and after processing, mould and workpiece need to be cooled, to facilitate workpiece taking and subsequent workpiece placing, and the guide post in the mould structure of prior art only plays a guiding role, cannot assist mould and workpiece to carry out rapid heat dissipation, and the function is relatively single, therefore, the utility model provides a mould with heat dissipation guide post. UTILITY MODEL CONTENT
[0004] The utility model aims at making up for the deficiency of prior art, and provides a mould with heat dissipation guide post.
[0005] To realize the above-mentioned purpose, the utility model provides the following technical scheme: a mould with heat dissipation guide post, including workbench, the top of workbench is fixedly connected with liquid storage heat conduction frame, and the top of liquid storage heat conduction frame is fixedly connected with lower mould, the top of workbench is fixedly connected with two pairs of fixed rods, and the top between two pairs of fixed rods is fixedly connected with top plate, the top of top plate is embeddedly connected with a plurality of electric telescopic rods, and the bottom between a plurality of electric telescopic rods is fixedly connected with upper mould, the both ends of upper mould are fixedly connected with link plates, and the bottom between link plates and the inside of liquid storage heat conduction frame is equipped with guiding air blowing mechanism, and the outside wall between the one end of link plate and fixed rod and the inside of liquid storage heat conduction frame is equipped with buffer stirring mechanism.
[0006] The top end of the workbench is fixedly connected with a pair of sealing guide sleeves, and the pair of T-shaped columns are located in the pair of sealing guide sleeves and tightly contact with the inner walls thereof, the inner top end of the pair of sealing guide sleeves is drilled with a pair of round holes, the top end of the pair of T-shaped columns respectively passes through the pair of round holes and is fixedly connected with the bottom end of a pair of link plates, the outer wall of the pair of sealing guide sleeves is embedded and connected with a semiconductor refrigerator, the end close to the semiconductor refrigerator is a refrigeration end, and the end away from the semiconductor refrigerator is a heat dissipation end, the outer wall of the pair of sealing guide sleeves and the inside of the liquid storage heat conducting frame are embedded and connected with a waterproof air-permeable square tube, and the end close to the semiconductor refrigerator is located inside the waterproof air-permeable square tube, and the bottom end of the T-shaped column and the surface of the waterproof air-permeable square tube are provided with a heat conducting layer.
[0007] The outer wall of the pair of sealing guide sleeves is fixedly connected with a blowing pipe, and the inner wall of the blowing pipe is fixedly connected with a dust screen.
[0008] The inner wall of the pair of round holes is fixedly connected with a sealing ring, and the inner wall of the sealing ring tightly contacts with the outer wall of the T-shaped column.
[0009] The buffer stirring mechanism comprises a pair of L-shaped rack plates, one end of the pair of L-shaped rack plates is fixedly connected with one end of a pair of link plates, the inner wall of the liquid storage heat conducting frame is rotatably connected with a rotating long rod through a bearing, and the outer wall of the rotating long rod is fixedly connected with a plurality of stirring paddles, the outer wall of the rotating long rod is sleeved with a gear, and the gear is meshingly connected with the L-shaped rack plate, the top end of the workbench is drilled with a pair of through holes, and the through holes are located at the bottom of the L-shaped rack plate.
[0010] The outer wall of the two fixing rods is respectively sleeved with a circular ring and a spring, and the two ends of the spring are fixedly connected with the bottom end of the circular ring and the top end of the workbench, and the outer wall of the circular ring is fixedly connected with a link block between one end of the L-shaped rack plate.
[0011] One end of the liquid storage heat conducting frame is fixedly connected with a liquid inlet pipe, and the top of the liquid inlet pipe is sleeved with a sealing plug, and the outer wall of the sealing plug tightly contacts with the inner wall of the liquid inlet pipe.
[0012] Compared with the prior art, the mold with heat dissipation guide columns has the following beneficial effects:
[0013] The utility model discloses a guiding blowing mechanism is set, extrudes the cold gas flow of semiconductor refrigerator refrigeration end in the upper die and lower die die stamping process and adds the coolant in the heat conduction frame of liquid storage, so as to carry out the cooling treatment to the workpiece on the lower die, when the die is divided, extrudes the air of top and blows to the workpiece on the lower die, makes the heat on the workpiece quickly dissipate, enhances the heat dissipation cooling of workpiece, makes the guide pillar not only have the orientation positioning effect, also has the heat dissipation cooling effect.
[0014] The utility model discloses a buffering stirring mechanism is set, can buffer when the upper die is down stamping, reduces the scratch and deformation on the workpiece surface, improves the surface quality of workpiece, can also drive rotary long rod and multiple stirring paddle rotation simultaneously, stirs the coolant flow, makes the cold air with flow quickly diffuses everywhere in coolant, so as to subsequent cold and hot alternation and heat dissipation cooling effect.
[0015] The other advantages, objects and features of the utility model will be set forth in the subsequent description to some extent, and to some extent, it will be obvious to those skilled in the art based on the study of the following, or can be taught from the practice of the utility model. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is whole three -dimensional structure schematic diagram of the utility model;
[0017] Figure 2 It is local elevation structure schematic diagram of the utility model;
[0018] Figure 3 It is local cutaway structure schematic diagram of guiding blowing mechanism in the utility model;
[0019] Figure 4 It is the utility model Figure 3 Enlarged structure schematic diagram of A place in the utility model;
[0020] Figure 5 It is three -dimensional structure schematic diagram of buffering stirring mechanism in the utility model;
[0021] Figure 6 It is the utility model Figure 5 Enlarged structure schematic diagram of B place in the utility model.
[0022] As shown in the figure: 1, workbench; 2, liquid storage heat conduction frame; 3, lower mold; 4, top plate; 5, electric telescopic rod; 6, upper mold; 7, fixed rod; 8, adapter plate; 9, guiding blowing mechanism; 901, T-shaped column; 902, sealing guide sleeve; 903, semiconductor refrigerator; 904, waterproof air-permeable square tube; 905, blowing pipe; 906, dust screen; 907, sealing ring; 10, buffer stirring mechanism; 1001, L-shaped rack plate; 1002, gear; 1003, rotating long rod; 1004, stirring paddle; 1005, through port; 1006, circular ring; 1007, spring; 1008, adapter block; 11, liquid inlet pipe; 12, sealing plug. DETAILED DESCRIPTION
[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0024] As shown in the figure: Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 , the present application provides a technical solution: a mold with heat dissipation guide column, comprising a workbench 1, the top end of the workbench 1 is fixedly connected with a liquid storage heat conduction frame 2, and the top end of the liquid storage heat conduction frame 2 is fixedly connected with a lower mold 3, the top end of the workbench 1 is fixedly connected with two pairs of fixed rods 7, and the top end of the two pairs of fixed rods 7 is fixedly connected with a top plate 4, the top end of the top plate 4 is embeddedly connected with a plurality of electric telescopic rods 5, and the bottom end of the plurality of electric telescopic rods 5 is fixedly connected with an upper mold 6, both ends of the upper mold 6 are fixedly connected with an adapter plate 8, and the bottom end of the adapter plate 8 and the inside of the liquid storage heat conduction frame 2 are provided with a guiding blowing mechanism 9, and one end of the adapter plate 8 and the outer wall of the fixed rod 7 and the inside of the liquid storage heat conduction frame 2 are provided with a buffer stirring mechanism 10.
[0025] According to the overall structure of the device, the plurality of electric telescopic rods 5 drive the upper die 6 to move downward to stamp the workpiece on the lower die 3, and in this process, the guide air blowing mechanism 9 extrudes cold air into the cooling liquid added in the liquid storage heat conducting frame 2, and the buffer stirring mechanism 10 buffers the stamping and stirs the cooling liquid flow, drives the cold air to quickly spread in the cooling liquid everywhere, and then after the stamping is completed, the cooling liquid is heat-conducted by the liquid storage heat conducting frame 2, so that the cold air and the heat on the workpiece and the lower die 3 are alternately cooled and heated, achieving the effect of heat dissipation and cooling. Moreover, as the upper die 6 moves upward, the guide air blowing mechanism 9 also blows air towards the heat on the workpiece to quickly dissipate, enhancing the heat dissipation and cooling of the workpiece, so that the guide column not only has a guiding and positioning effect, but also has a heat dissipation and cooling effect.
[0026] As shown in Figure 1 , Figure 3 and Figure 4 , the guide air blowing mechanism 9 includes a pair of T-shaped columns 901, and the top end of the workbench 1 is fixedly connected with a sealing guide sleeve 902, and the pair of T-shaped columns 901 are located in the pair of sealing guide sleeves 902 respectively and tightly contact with the inner wall thereof. The inner top end of the pair of sealing guide sleeves 902 is drilled with a circular hole, and the top end of the pair of T-shaped columns 901 passes through the pair of circular holes respectively and is fixedly connected with the bottom end of the pair of link plates 8. The outer wall of the pair of sealing guide sleeves 902 is embeddedly connected with a semiconductor refrigerator 903, and the end close to each other of the pair of semiconductor refrigerators 903 is a refrigeration end, and the end far away from each other of the pair of semiconductor refrigerators 903 is a heat dissipation end. The outer wall of the pair of sealing guide sleeves 902 and the inside of the liquid storage heat conducting frame 2 are embeddedly connected with a waterproof and breathable square tube 904, and the end close to each other of the pair of semiconductor refrigerators 903 is located inside the waterproof and breathable square tube 904. The bottom end of the T-shaped column 901 and the surface of the waterproof and breathable square tube 904 are provided with a heat conducting layer. The outer wall of the pair of sealing guide sleeves 902 is fixedly connected with an air blowing pipe 905, and the inner wall of the air blowing pipe 905 is fixedly connected with a dust screen 906. The inner wall of the pair of circular holes is fixedly connected with a sealing ring 907, and the inner wall of the sealing ring 907 tightly contacts with the outer wall of the T-shaped column 901.
[0027] With the arrangement of the guiding blowing mechanism 9, the pair of T-shaped columns 901 extrude the cold air generated by the semiconductor refrigerator 903 in the sealing guide sleeve 902 to the waterproof and breathable square pipe 904 as the pair of connecting plates 8 and the upper die 6 move downward, the waterproof and breathable square pipe 904 is made of high-molecular waterproof material and has waterproof and breathable functions, which promotes the conduction of cold air to the cooling liquid, facilitates the subsequent cold and hot alternating work, enhances the heat dissipation and cooling effect, and after the stamping is completed, the pair of T-shaped columns 901 move upward again with the pair of connecting plates 8 and the upper die 6, and extrude the air between them and the sealing guide sleeve 902 to blow out through the blowing pipe 905, blow to the workpiece, accelerate the flow of hot air at the workpiece, enhance the heat dissipation effect, and in the scheme, the dust screen 906 can prevent dust from entering the blowing pipe 905, and at the same time, the sealing ring 907 can seal the gap between the T-shaped column 901 and the circular hole, reducing the entry of dust.
[0028] As shown in Figure 1 , Figure 5 and Figure 6 , the buffer stirring mechanism 10 includes a pair of L-shaped rack plates 1001, one end of the pair of L-shaped rack plates 1001 is fixedly connected with one end of the pair of connecting plates 8, a rotating long rod 1003 is rotatably connected between the inner walls of the liquid storage heat conduction frame 2 through bearings, a plurality of stirring paddles 1004 are fixedly connected to the outer wall of the rotating long rod 1003, a gear 1002 is sleeved on the outer wall of the rotating long rod 1003, and the gear 1002 is meshingly connected with the L-shaped rack plate 1001, a pair of through holes 1005 are opened at the top end of the workbench 1, and the through holes 1005 are located at the bottom of the L-shaped rack plate 1001, a circular ring 1006 and a spring 1007 are respectively sleeved on the outer walls of the two fixed rods 7, and the two ends of the spring 1007 are respectively fixedly connected with the bottom end of the circular ring 1006 and the top end of the workbench 1, and the outer wall of the circular ring 1006 is fixedly connected with the connecting block 1008 between one end of the L-shaped rack plate 1001.
[0029] Through the setting of the buffer stirring mechanism 10, the pair of L-shaped rack plates 1001 moves downward along with the pair of connecting plates 8 and the upper die 6, drives the circular ring 1006 to move downward along the fixed rod 7, compresses the spring 1007, buffers the stamping of the upper die 6 by using the elastic action of the spring 1007, reduces the scratches and deformation of the surface of the workpiece, improves the surface quality of the workpiece, and at the same time, the pair of L-shaped rack plates 1001 drives the meshed gear 1002 to rotate when moving downward, so as to drive the rotating long rod 1003 and the plurality of stirring paddles 1004 to rotate, stir the cooling liquid to flow, promote the cold air to quickly spread to all parts of the cooling liquid, and when the pair of L-shaped rack plates 1001 moves upward along with the pair of connecting plates 8 and the upper die 6, the rotating long rod 1003 and the plurality of stirring paddles 1004 are driven to rotate in the opposite direction again, and the cooling liquid is stirred again, so as to make the cold air and the heat on the workpiece and the lower die 3 fully perform cold and hot alternation, and enhance the heat dissipation and cooling effect.
[0030] As shown in Figure 1 , Figure 3 , and Figure 5 , one end of the liquid storage heat conduction frame 2 is fixedly connected with the liquid inlet pipe 11, and the top of the liquid inlet pipe 11 is sleeved with the sealing plug 12, and the outer wall of the sealing plug 12 is in close contact with the inner wall of the liquid inlet pipe 11.
[0031] Through the setting of the liquid inlet pipe 11 and the sealing plug 12, the cooling liquid can be added to the inside of the liquid storage heat conduction frame 2 through the liquid inlet pipe 11, and after the addition is completed, the sealing plug 12 is covered to seal.
[0032] Working principle: first, through the liquid inlet pipe 11 to the inside of the liquid storage heat conducting frame 2 adds cooling liquid, after adding, cover the sealing plug 12 sealing, then, a plurality of electric telescopic rod 5 drive the upper die 6 downward movement, at this moment a pair of link plates 8 and a pair of T-shaped column 901 with its synchronous downward movement, and drive a pair of L-shaped rack plate 1001 and the ring 1006 along the fixed rod 7 downward movement, compression spring 1007, a pair of T-shaped column 901 in the sealed guide sleeve 902 downward movement at the same time, also extrude the semiconductor refrigerator 903 refrigeration end generated by the cold air flow to the waterproof air pipe 904, and then transmitted to the cooling liquid, and a pair of L-shaped rack plate 1001 drive meshing gear 1002 rotation, make it drive rotating long rod 1003 and a plurality of stirring paddle 1004 rotation, stirring cooling liquid flow, make the cold air flow quickly spread to all parts of the cooling liquid, after the upper die 6 and the workpiece on the lower die 3 contact, continue to move, under the buffer of spring 1007 to the workpiece stamping, stamping forming, a plurality of electric telescopic rod 5 drive the upper die 6 upward movement, a pair of T-shaped column 901 and L-shaped rack plate 1001 also with synchronous upward movement, make L-shaped rack plate 1001 drive meshing gear 1002 reverse rotation, again drive rotating long rod 1003 and a plurality of stirring paddle 1004 reverse rotation, stirring the cooling liquid again, make the cold air and workpiece and the heat on the lower die 3 fully cold and hot alternation, and a pair of T-shaped column 901 upward extrusion between the air and the sealing guide sleeve 902 through the air pipe 905 to the outside, to the workpiece, accelerate the flow of hot air at the workpiece.
[0033] The wiring diagram of the electric telescopic rod 5 and the semiconductor refrigerator 903 in the scheme belongs to the common knowledge in the art, and its working principle is a known technology, and its model is selected according to actual use, so the control mode and wiring arrangement of the electric telescopic rod 5 and the semiconductor refrigerator 903 will not be explained in detail.
[0034] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.
Claims
1. A mould with heat-dissipating pillars, comprising a worktable (1), characterised in that: The top end of the workbench (1) is fixedly connected with a liquid storage heat conducting frame (2), and the top end of the liquid storage heat conducting frame (2) is fixedly connected with a lower mold (3). The top end of the workbench (1) is fixedly connected with two pairs of fixed rods (7), and the top ends of the two pairs of fixed rods (7) are fixedly connected with a top plate (4). The top end of the top plate (4) is embeddedly connected with a plurality of electric telescopic rods (5), and the bottom ends of the plurality of electric telescopic rods (5) are fixedly connected with an upper mold (6). The two ends of the upper mold (6) are fixedly connected with a connecting plate (8), and a guiding air blowing mechanism (9) is arranged between the bottom end of the connecting plate (8) and the inside of the liquid storage heat conducting frame (2). A buffer stirring mechanism (10) is arranged between one end of the connecting plate (8) and the outer wall of the fixed rod (7) and the inside of the liquid storage heat conducting frame (2).
2. The mold with heat dissipation guide posts according to claim 1, characterized in that: The guiding air blowing mechanism (9) comprises a pair of T-shaped columns (901), the top end of the workbench (1) is fixedly connected with a sealing guide sleeve (902), and the pair of T-shaped columns (901) are respectively located in the pair of sealing guide sleeves (902) and are in close contact with the inner walls thereof. The inner top ends of the pair of sealing guide sleeves (902) are each drilled with a circular hole, the top ends of the pair of T-shaped columns (901) are respectively passed through the pair of circular holes and are fixedly connected with the bottom ends of the pair of connecting plates (8), the outer walls of the pair of sealing guide sleeves (902) are embeddedly connected with semiconductor refrigerators (903), one end of the pair of semiconductor refrigerators (903) close to each other is a refrigeration end, and the other end of the pair of semiconductor refrigerators (903) away from each other is a heat dissipation end, the outer walls of the pair of sealing guide sleeves (902) and the inside of the liquid storage heat conducting frame (2) are embeddedly connected with waterproof and breathable square pipes (904), and the one end of the pair of semiconductor refrigerators (903) close to each other is located in the inside of the waterproof and breathable square pipe (904), and the bottom end of the T-shaped column (901) and the surface of the waterproof and breathable square pipe (904) are each provided with a heat conducting layer.
3. A mold with heat dissipation posts according to claim 2, characterized in that: The outer walls of the pair of sealing guide sleeves (902) are each fixedly connected with an air blowing pipe (905), and the inner wall of the air blowing pipe (905) is fixedly connected with a dust screen (906).
4. The mold with heat dissipation guide posts according to claim 2, characterized in that: The inner walls of the pair of circular holes are each fixedly connected with a sealing ring (907), and the inner wall of the sealing ring (907) is in close contact with the outer wall of the T-shaped column (901).
5. The mold with heat dissipation posts of claim 2, wherein: The buffer stirring mechanism (10) comprises a pair of L-shaped rack plates (1001), one end of the pair of L-shaped rack plates (1001) is respectively fixedly connected with one end of the pair of connecting plates (8), the inner wall of the liquid storage heat conducting frame (2) is rotatably connected with a rotating long rod (1003) through a bearing, the outer wall of the rotating long rod (1003) is fixedly connected with a plurality of stirring paddles (1004), the outer wall of the rotating long rod (1003) is sleeved with a gear (1002), and the gear (1002) is meshingly connected with the L-shaped rack plate (1001). The top end of the workbench (1) is drilled with a pair of through holes (1005), and the through holes (1005) are located at the bottom of the L-shaped rack plate (1001).
6. A mold with heat dissipation posts according to claim 5, characterized in that: The outer wall of each of the two fixing rods (7) is sleeved with a ring (1006) and a spring (1007), the two ends of the spring (1007) are fixedly connected with the bottom end of the ring (1006) and the top end of the workbench (1) respectively, and the outer wall of the ring (1006) is fixedly connected with a connecting block (1008) between one end of the L-shaped rack plate (1001).
7. The mold with heat dissipation posts of claim 1, wherein: One end of the liquid storage heat conducting frame (2) is fixedly connected with a liquid inlet pipe (11), the top of the liquid inlet pipe (11) is sleeved with a sealing plug (12), and the outer wall of the sealing plug (12) is in close contact with the inner wall of the liquid inlet pipe (11).