Die for liquid silica gel O-shaped ring

Abstract

The utility model relates to a liquid silica gel O-shaped ring mold, and relates to the field of silica gel piece production molds, the liquid silica gel O-shaped ring mold comprises an upper mold plate and a lower mold plate, the upper mold plate is provided with a first containing groove, the lower mold plate is provided with a second containing groove, the first containing groove and the second containing groove are jointly spliced to form a space for silica gel forming, and the upper mold plate is provided with a gel injection hole; the second containing groove comprises a connecting groove, a guide groove and a plurality of forming grooves, one end of the connecting groove is communicated with the glue injection hole, the other end of the connecting groove is communicated with the forming grooves, the two ends of the guide groove are communicated with the two forming grooves respectively, glue hiding grooves are formed in the positions, in and out of the liquid silica gel, of the forming grooves, the cross section of each glue hiding groove is triangular, and the glue hiding grooves are communicated with the forming grooves. The O-shaped ring forming device has the effect of improving the forming quality of the O-shaped ring.

Description

TECHNICAL FIELD

[0001] The application relates to the field of silica gel part production molds, in particular to a mold for liquid silicone O-rings. BACKGROUND

[0002] O-rings are widely used mechanical parts made of rubber materials such as silica gel, and have good waterproof sealing performance. The production of O-rings is formed by a mold, and liquid silica gel is injected into the mold to solidify and form in the mold.

[0003] The existing O-ring forming mold includes an upper mold plate and a lower mold plate, and a circular annular forming groove is formed on each of the upper mold plate and the lower mold plate. When the upper mold plate is placed on the lower mold plate, the forming grooves form a space for accommodating liquid silica gel. The forming grooves can be formed in multiple numbers, and the multiple forming grooves are connected by connecting grooves, so that the mold can produce multiple O-rings at the same time. An injection hole is formed on the upper mold plate and is in communication with the forming grooves. The user can inject liquid silica gel into the forming grooves through the injection hole to achieve the production purpose.

[0004] The related technical solutions in the above have the following defects: After the silica gel in the mold solidifies, a water gap is formed on the O-ring, which needs to be manually cut and shaped. The forming quality at the water gap is poor, and the size accuracy of the O-ring after cutting is poor, resulting in low production quality. Practical new type content

[0005] In order to improve the forming quality of the O-ring, the application provides a mold for liquid silicone O-rings.

[0006] The mold for liquid silicone O-rings provided by the application adopts the following technical solutions:

[0007] A mold for liquid silicone O-rings includes an upper mold plate and a lower mold plate. An accommodating groove one is formed on the upper mold plate, and an accommodating groove two is formed on the lower mold plate. The accommodating groove one and the accommodating groove two together form a space for silica gel forming. An injection hole is formed on the upper mold plate. The accommodating groove two includes a connecting groove, a guide groove, and multiple forming grooves. One end of the connecting groove is in communication with the injection hole, and the other end is in communication with the forming grooves. The guide grooves are in communication with the two forming grooves at both ends. The forming grooves are provided with a glue hiding groove at the inlet and outlet of the liquid silica gel. The cross section of the glue hiding groove is triangular. The glue hiding groove is in communication with the forming groove.

[0008] By adopting the technical scheme, the accommodating grooves one and two are corresponded in shape, liquid silicone can be formed in the accommodating grooves, a plurality of forming grooves are communicated through the guide grooves, and then liquid silicone can flow into the plurality of forming grooves in sequence when injecting glue, so that an O-shaped ring is produced in each forming groove, glue hiding grooves are arranged at the inlet and outlet ends of the forming grooves, liquid silicone can solidify to form a water gap in the glue hiding grooves, the size of the water gap is large, the edge is neat, and it is convenient for the user to cut, the surface of the O-shaped ring is smooth after cutting, and the forming quality is better.

[0009] Optionally, a fan-shaped groove is arranged between the connecting groove and the forming groove, and the arc region of the fan-shaped groove is communicated with the plurality of forming grooves.

[0010] By adopting the technical scheme, when liquid silicone flows into the accommodating groove two through the glue injection hole, the liquid silicone can flow into the fan-shaped groove through the connecting groove, and then the liquid silicone can uniformly flow into the plurality of forming grooves, so that the O-shaped ring formed in each forming groove has better forming quality.

[0011] Optionally, a material distribution groove is arranged on the lower die plate, the material distribution groove is communicated with the plurality of connecting grooves, and the position of the material distribution groove corresponds to the glue injection hole.

[0012] By adopting the technical scheme, the position of the glue injection hole corresponds to the material distribution groove by arranging the material distribution groove on the lower die plate, when liquid silicone flows into the material distribution groove through the glue injection hole, the liquid silicone can flow into the plurality of connecting grooves through the material distribution groove, the number of glue injection holes arranged on the upper die plate is reduced, and the forming quality of the plurality of O-shaped rings is better.

[0013] Optionally, the glue injection hole comprises a tapered groove, an inlet hole and an outlet hole, the tapered groove is communicated with the inlet hole and the outlet hole, the inlet hole is arranged on the upper die plate away from the lower die plate, the outlet hole is communicated with the material distribution groove, and the diameter of the inlet hole is greater than the diameter of the outlet hole.

[0014] By adopting the technical scheme, the diameters of the two ends of the glue injection hole are different, liquid silicone flows into the accommodating groove two through the outlet hole, the diameter of the outlet hole is small, the hydraulic pressure is large when the liquid silicone flows through, the liquid silicone can completely fill the glue injection hole, so that the air in the accommodating groove two is uniformly extruded, and the probability of residual air in the accommodating groove is reduced.

[0015] Optionally, a counterbore is arranged in the material distribution groove, and the counterbore is coaxially arranged with the glue injection hole.

[0016] By adopting the technical scheme, when liquid silicone is injected into the glue injection hole, air is easily left in the distribution groove, the air is accumulated in the counterbore by the counterbore, air bubbles are easily left in the silicone in the counterbore after the liquid silicone is formed and solidified, and the silicone can flow uniformly to the forming grooves at different positions through the distribution groove, so that a high-quality O-ring can be produced in each forming groove.

[0017] Optionally, a circular hole is formed in the lower mold plate, the circular hole is coaxial with the glue injection hole, and the circular hole is sleeved outside the accommodating groove two.

[0018] By adopting the technical scheme, when more liquid silicone is injected into the glue injection hole, the excess liquid silicone can flow into the circular hole through the guide groove, so that the forming groove can be completely filled with liquid silicone, and air in the forming groove can be squeezed into the circular hole, thereby reducing the probability of air bubbles in the forming groove.

[0019] Optionally, a plurality of overflow grooves are formed in the lower mold plate, one end of the overflow groove is communicated with the circular hole, and the other end is communicated with the outer side wall of the lower mold plate.

[0020] By adopting the technical scheme, when liquid silicone is injected into the glue injection hole, air in the accommodating groove can be discharged through the overflow groove, and after the liquid silicone fills the forming groove and the circular hole, the liquid silicone flows into the overflow groove, thereby improving the production quality of the O-ring.

[0021] Optionally, a gap is formed in the lower mold plate when the upper mold plate and the lower mold plate are connected.

[0022] By adopting the technical scheme, a gap is formed in the lower mold plate, and the user can lift or pry the upper mold plate through the gap, thereby facilitating the user to disassemble the upper mold plate from the lower mold plate and facilitate the user to take out the formed O-ring.

[0023] In summary, the beneficial technical effects of the present application are:

[0024] 1. By forming the accommodating grooves in the upper mold plate and the lower mold plate, the shapes of the accommodating groove one and the accommodating groove two correspond, so that the liquid silicone can be formed in the accommodating groove, a plurality of forming grooves are formed, the plurality of forming grooves are communicated through the guide groove, so that the liquid silicone can flow into the plurality of forming grooves in sequence when injecting glue, an O-ring is produced in each forming groove, a glue storage groove is formed at the inlet and outlet of the forming groove, so that the liquid silicone can be solidified to form a water gap in the glue storage groove, the size of the water gap is large, the edge is neat, the user can cut conveniently, the surface of the O-ring is flat after cutting, and the forming quality is good.

[0025] 2. By opening the distribution groove on the lower die plate, the glue injection hole position corresponds to the distribution groove, when the liquid silicone flows into the distribution groove through the glue injection hole, the liquid silicone can flow into the plurality of connecting grooves through the distribution groove, reducing the number of glue injection holes opened on the upper die plate, and the molding quality of the plurality of O-rings is better;

[0026] 3. By opening the circular hole on the lower die plate, when the glue injection hole is filled with too much glue, the excess liquid silicone can flow into the circular hole through the guide groove, and then the molding groove can be completely filled with liquid silicone, and the air in the molding groove can be squeezed into the circular hole, thereby reducing the probability of air bubbles in the molding groove. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 is the overall structure schematic diagram of the embodiment of the application.

[0028] Figure 2 is the structure schematic diagram of the upper die plate of the embodiment of the application.

[0029] Figure 3 is the structure schematic diagram of the lower die plate of the embodiment of the application.

[0030] Figure 4 is the cross-sectional schematic diagram of the embodiment of the application.

[0031] Reference signs: 1, upper die plate; 11, accommodating groove one; 12, glue injection hole; 121, tapered groove; 122, feeding hole; 123, discharging hole; 2, lower die plate; 21, accommodating groove two; 211, connecting groove; 212, fan-shaped groove; 213, guide groove; 214, molding groove; 215, glue hiding groove; 22, distribution groove; 221, counterbore; 23, circular hole; 24, overflow groove; 25, accommodation groove. DETAILED DESCRIPTION

[0032] The application will be further described in detail below with reference to the drawings.

[0033] The embodiment of the application discloses a liquid silicone O-ring mold, referring to Figure 1 , Figure 2 and Figure 3 , comprising an upper die plate 1 and a lower die plate 2, the upper die plate 1 is provided with an accommodating groove one 11, and the lower die plate 2 is provided with an accommodating groove two 21, the upper die plate 1 is used for covering the lower die plate 2, and the accommodating groove one 11 and the accommodating groove two 21 are spliced to form a closed space for molding a silicone ring. The upper die plate 1 is vertically provided with a glue injection hole 12, and the user injects liquid silicone into the glue injection hole 12, so that the liquid silicone can flow into the accommodating groove one 11 and the accommodating groove two 21, and then the liquid silicone can form an O-ring in the accommodating groove one 11.

[0034] Referring to Figure 3, the lower die plate 2 is provided with a distribution groove 22, the position of the distribution groove 22 corresponds to the glue injection hole 12, the accommodating groove two 21 is provided with a plurality of, the plurality of accommodating grooves two 21 are arranged equidistantly along the circumferential direction of the glue injection hole 12, the distribution groove 22 is communicated with the plurality of accommodating grooves two 21. When the liquid silicone enters the glue injection hole 12, the liquid silicone fills the distribution groove 22 and flows into the plurality of accommodating grooves two 21 evenly, so that the plurality of accommodating grooves two 21 can form O-rings, and the production efficiency is improved.

[0035] Referring to Figure 3 , the accommodating groove two 21 includes a connecting groove 211, a fan-shaped groove 212, a guide groove 213 and a plurality of forming grooves 214, the connecting groove 211 and the guide groove 213 are linear grooves, one end of the connecting groove 211 is communicated with the distribution groove 22, the other end is communicated with the fan-shaped groove 212, the cross section of the fan-shaped groove 212 is a fan-shaped pattern, the connecting groove 211 is communicated with the fan-shaped groove 212 at the center, one end of the guide groove 213 is communicated with the arc region of the fan-shaped groove 212, the other end is communicated with the forming groove 214, the forming groove 214 is a circular ring groove, and the O-ring is solidified and formed in the forming groove 214. The arc region of the fan-shaped groove 212 is communicated with a plurality of guide grooves 213, and each guide groove 213 is communicated with a forming groove 214. When the liquid silicone is injected into the distribution groove 22, the liquid silicone flows into the plurality of fan-shaped grooves 212 and flows into the guide grooves 213 evenly, so that each forming groove 214 is injected with sufficient liquid silicone, and the O-ring after forming has fewer bubbles.

[0036] Referring to Figure 3 , the forming groove 214 is provided with a glue storage groove 215 on both sides of the silicone, the glue storage groove 215 is a fan-shaped or triangular groove, and the connection region of the glue storage groove 215 and the forming groove 214 is arc-shaped. After the O-ring is solidified in the forming groove 214, the user can cut off the triangular corner scraps formed in the glue storage groove 215 along the edge of the O-ring, so as to conveniently trim the O-ring, make the O-ring forming quality better, and make the feeding sufficient and the O-ring trimming more convenient.

[0037] Referring to Figure 4 , the glue injection hole 12 includes a tapered groove 121, a feeding hole 122 and a discharging hole 123, the tapered hole is communicated with the feeding hole 122 and the discharging hole 123, the diameter of the feeding hole 122 is larger, and the diameter of the discharging hole 123 is smaller. The feeding hole 122 is located on the side of the upper die plate 1 away from the lower die plate 2, and the discharging hole 123 is located on the side of the upper die plate 1 close to the lower die plate 2. The glue injection equipment injects liquid silicone into the glue injection hole 12 through the feeding hole 122, and the liquid silicone flows into the space between the upper die plate 1 and the lower die plate 2 through the discharging hole 123. The liquid silicone flows in small streams, which can sufficiently extrude the air between the upper die plate 1 and the lower die plate 2, and reduce the probability of bubbles existing in the O-ring after forming.

[0038] Referring to Figure 3The distribution groove 22 is provided with a counterbore 221, and the counterbore 221 is located at a position corresponding to the glue injection hole 12. When the liquid silicone is injected into the glue injection hole 12, the liquid silicone fills the counterbore 221 and fills the distribution groove 22. When the liquid silicone has poor flowability, air is easily accumulated in the distribution groove 22 when the liquid silicone enters the distribution groove 22 through the glue injection hole 12, so that the air is difficult to be fully extruded, and then the solidified silicone in the distribution groove 22 is scattered, so that the production quality of the O-rings in the plurality of forming grooves 214 is not uniform. By providing the counterbore 221, when there is residual air in the distribution groove 22, the air is located in the counterbore 221, so that the bubble generation position of the solidified silicone is located in the counterbore 221, and then the O-ring forming quality is better.

[0039] With reference to Figure 3 The lower die plate 2 is provided with a circular ring hole 23, the circular ring hole 23 is coaxial with the glue injection hole 12, and the circular ring hole 23 is sleeved outside the accommodating groove two 21. The circular ring hole 23 is in communication with the accommodating groove two 21. When the liquid silicone continuously flows into the glue injection hole 12, the liquid silicone can fill the accommodating groove two 21 and flow into the circular ring hole 23, so that the accommodating groove two 21 can be filled with silicone, the O-ring forming quality is higher, the silicone scattered flow is reduced, the upper die plate 1 and the lower die plate 2 are convenient to clean, and the O-ring is more convenient to repair.

[0040] With reference to Figure 3 The lower die plate 2 is provided with a plurality of overflow grooves 24, one end of the overflow groove 24 is in communication with the circular ring hole 23, and the other end is in communication with the outer side wall of the lower die plate 2. When the upper die plate 1 is connected with the lower die plate 2, the liquid silicone is injected into the glue injection hole 12, and after the liquid silicone fills the accommodating groove two 21 and the circular ring hole 23, the air in the accommodating groove two 21 and the circular ring hole 23 can be discharged through the overflow groove 24. The user can continue to inject the liquid silicone, so that the liquid silicone flows out of the overflow groove 24. At this time, the accommodating groove two 21 is completely filled with liquid silicone, and the O-ring forming quality is better.

[0041] With reference to Figure 3 The lower die plate 2 is provided with a plurality of overflow grooves 24, one end of the overflow groove 24 is in communication with the circular ring hole 23, and the other end is in communication with the outer side wall of the lower die plate 2. When the upper die plate 1 is connected with the lower die plate 2, the liquid silicone is injected into the glue injection hole 12, and after the liquid silicone fills the accommodating groove two 21 and the circular ring hole 23, the air in the accommodating groove two 21 and the circular ring hole 23 can be discharged through the overflow groove 24. The user can continue to inject the liquid silicone, so that the liquid silicone flows out of the overflow groove 24. At this time, the accommodating groove two 21 is completely filled with liquid silicone, and the O-ring forming quality is better.

[0042] The principle of the embodiment of the present application is that the accommodating groove one 11 is provided on the upper die plate 1, the accommodating groove two 21 is provided on the lower die plate 2, so that the liquid silicone can be solidified and formed in the accommodating groove one 11 and the accommodating groove two 21. The glue hiding groove 215 is provided on both sides of the forming groove 214, so that the size of the waste to be cut after the O-ring is formed is larger, the cutting is more convenient, the cut is smooth after cutting, and the O-ring production quality is higher.

[0043] The above are all preferred embodiments of the present application, and do not limit the protection scope of the present application, so that: all equivalent changes made according to the structure, shape, principle of the present application should be covered in the protection scope of the present application.

Claims

1. A mold for liquid silicone O-ring, characterized by: The utility model relates to a silica gel forming device, including upper die plate (1) and lower die plate (2), be equipped with accommodating groove one (11) on upper die plate (1), be equipped with accommodating groove two (21) on lower die plate (2), accommodating groove one (11) and accommodating groove two (21) jointly make the space for silica gel forming, be equipped with injection hole (12) on upper die plate (1), accommodating groove two (21) include connecting groove (211), guide groove (213) and a plurality of forming groove (214), connecting groove (211) one end with injection hole (12) intercommunication, the other end with forming groove (214) intercommunication, the both ends of guide groove (213) are communicated with two forming groove (214) respectively, and the liquid silica gel is equipped with hide glue groove (215) at forming groove (214) entrance and exit, and the graph that hide glue groove (215) cross section presents is triangle, and hide glue groove (215) is communicated with forming groove (214).

2. The mold for liquid silicone O-ring of claim 1, wherein: The utility model relates to a silica gel forming device, including upper die plate (1) and lower die plate (2), be equipped with accommodating groove one (11) on upper die plate (1), be equipped with accommodating groove two (21) on lower die plate (2), accommodating groove one (11) and accommodating groove two (21) jointly make the space for silica gel forming, be equipped with injection hole (12) on upper die plate (1), accommodating groove two (21) include connecting groove (211), guide groove (213) and a plurality of forming groove (214), connecting groove (211) one end with injection hole (12) intercommunication, the other end with forming groove (214) intercommunication, the both ends of guide groove (213) are communicated with two forming groove (214) respectively, and the liquid silica gel is equipped with hide glue groove (215) at forming groove (214) entrance and exit, and the graph that hide glue groove (215) cross section presents is triangle, and hide glue groove (215) is communicated with forming groove (214).

3. The mold for liquid silicone O-ring of claim 2, wherein: The utility model relates to a silica gel forming device, including upper die plate (1) and lower die plate (2), be equipped with accommodating groove one (11) on upper die plate (1), be equipped with accommodating groove two (21) on lower die plate (2), accommodating groove one (11) and accommodating groove two (21) jointly make the space for silica gel forming, be equipped with injection hole (12) on upper die plate (1), accommodating groove two (21) include connecting groove (211), guide groove (213) and a plurality of forming groove (214), connecting groove (211) one end with injection hole (12) intercommunication, the other end with forming groove (214) intercommunication, the both ends of guide groove (213) are communicated with two forming groove (214) respectively, and the liquid silica gel is equipped with hide glue groove (215) at forming groove (214) entrance and exit, and the graph that hide glue groove (215) cross section presents is triangle, and hide glue groove (215) is communicated with forming groove (214).

4. The mold for liquid silicone O-ring of claim 3, wherein: The utility model relates to a silica gel forming device, including upper die plate (1) and lower die plate (2), be equipped with accommodating groove one (11) on upper die plate (1), be equipped with accommodating groove two (21) on lower die plate (2), accommodating groove one (11) and accommodating groove two (21) jointly make the space for silica gel forming, be equipped with injection hole (12) on upper die plate (1), accommodating groove two (21) include connecting groove (211), guide groove (213) and a plurality of forming groove (214), connecting groove (211) one end with injection hole (12) intercommunication, the other end with forming groove (214) intercommunication, the both ends of guide groove (213) are communicated with two forming groove (214) respectively, and the liquid silica gel is equipped with hide glue groove (215) at forming groove (214) entrance and exit, and the graph that hide glue groove (215) cross section presents is triangle, and hide glue groove (215) is communicated with forming groove (214).

5. The mold for liquid silicone O-ring of claim 3, wherein: The utility model relates to a silica gel forming device, including upper die plate (1) and lower die plate (2), be equipped with accommodating groove one (11) on upper die plate (1), be equipped with accommodating groove two (21) on lower die plate (2), accommodating groove one (11) and accommodating groove two (21) jointly make the space for silica gel forming, be equipped with injection hole (12) on upper die plate (1), accommodating groove two (21) include connecting groove (211), guide groove (213) and a plurality of forming groove (214), connecting groove (211) one end with injection hole (12) intercommunication, the other end with forming groove (214) intercommunication, the both ends of guide groove (213) are communicated with two forming groove (214) respectively, and the liquid silica gel is equipped with hide glue groove (215) at forming groove (214) entrance and exit, and the graph that hide glue groove (215) cross section presents is triangle, and hide glue groove (215) is communicated with forming groove (214).

6. The mold for liquid silicone O-ring of claim 1, wherein: ​ 7. The mold for liquid silicone O-ring of claim 6, wherein: ​ 8. The mold for liquid silicone O-ring of claim 1, wherein: ​

Images