Release film

Abstract

There is provided a release film including: a protective film on a rear surface of a display device in a periphery of a first hole defined in the display device; and a hole film adjacent to the protective film on the rear surface of the display device and overlapping the first hole. The aperture film may include: a first aperture film on a rear surface of the display device; and a second porous film including a first portion on an upper surface of the protective film and an upper surface of the first porous film, and an adhesive strength between a rear surface of the display device and a lower surface of the first porous film is less than an adhesive strength between a lower surface of the first portion and the upper surface of the protective film.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0000332, filed on January 2, 2024, with the Korean Intellectual Property Office, the contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of this disclosure herein relate to a release film. Background Technology

[0004] Typically, a display device includes a display module for displaying images and a support member for supporting the display module. The display module includes a display panel for displaying images, a window on the display panel that protects it from external scratches and impacts, and a cover layer below the display panel that also protects it from external impacts. The support member has greater rigidity than the display module and supports the display module. The support member includes a support plate, which may be, for example, made of metal.

[0005] Recently, with the development of display device technology, display devices including flexible display modules are being developed. In a flexible display module, the support component below the display module, which is folded relative to the folding axis, has a structure that folds together with the display module. Utility Model Content

[0006] Embodiments of this disclosure provide a release film that can be easily separated from a display device.

[0007] One embodiment of this disclosure provides a release film comprising: a protective film on the rear surface of a display device and at the periphery of a first hole defined in the display device; and a perforated film adjacent to the protective film on the rear surface of the display device and overlapping the first hole, wherein the perforated film comprises: a first perforated film on the rear surface of the display device; and a second perforated film comprising a first portion on the upper surface of the protective film and the upper surface of the first perforated film, and wherein the adhesive strength between the rear surface of the display device and the lower surface of the first perforated film is less than the adhesive strength between the lower surface of the first portion and the upper surface of the protective film.

[0008] In one embodiment of this disclosure, a release film includes: a protective film on the rear surface of a display device and at the periphery of a first hole defined in the display device; and a perforated film on the rear surface of the display device adjacent to the protective film and overlapping the first hole, wherein the perforated film includes: a first perforated film on the rear surface of the display device, and a second perforated film bonded to the first perforated film, the adhesive strength between the rear surface of the display device and the lower surface of the first perforated film being 0 gf / in, and the boundary of the second perforated film protruding further outward than the boundary of the first perforated film and bonded to the upper surface of the protective film. BRIEF DESCRIPTION OF DRAWINGS

[0009] The accompanying drawings are included to provide a further understanding of the subject disclosure and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure. In the drawings:

[0010] Figure 1 A perspective view of an electronic device including a display device protected by a release film according to an embodiment of the present disclosure;

[0011] Figure 2 To illustrate Figure 1 A perspective view of an electronic device illustrated in FIG. 1 in a folded state;

[0012] Figure 3 To illustrate Figure 1 An exploded perspective view of the electronic device illustrated in FIG. 1;

[0013] Figure 4 To illustrate Figure 3 A block diagram of the electronic device illustrated in FIG. 1;

[0014] Figure 5 To illustrate Figure 3 A schematic cross-sectional view of a display module illustrated in FIG. 1;

[0015] Figure 6 To illustrate Figure 5 A cross-sectional view of an example of a display panel illustrated in FIG. 1;

[0016] Figure 7 To illustrate Figure 6 A plan view of a display panel illustrated in FIG. 1;

[0017] Figure 8A To illustrate Figure 7 A cross-sectional view taken along line I-I' illustrated in FIG. 1;

[0018] Figure 8B To illustrate Figure 8A A cross-sectional view of a state in which the bending area illustrated in FIG. 1 is bent;

[0019] Figure 9 To illustrate

[0020] Figure 10A To illustrate Figure 9 A cross-sectional view taken along line II-II' illustrated in FIG. 1;

[0021] Figure 10B To illustrate Figure 9 A cross-sectional view taken along line III-III' illustrated in FIG. 1;

[0022] Figures 11A-11B To illustrateFigure 9 The display device shows a view of the membrane with separate apertures; and

[0023] Figures 12A-12B The figures shown are a plan view and a cross-sectional view of a release film according to an embodiment of the present disclosure. Detailed Implementation

[0024] According to one embodiment of this disclosure, the features and methods for implementing the subject matter of this disclosure will become clear with reference to the embodiments described in more detail herein with reference to the accompanying drawings. However, it should be understood that the embodiments of this disclosure disclosed below are not limited, but may be implemented in various suitable forms, different from each other. Furthermore, embodiments are provided only to provide a complete disclosure of the subject matter of this disclosure and to fully inform those skilled in the art of the technical scope of this disclosure. The technical scope of this disclosure should be determined by the appended claims and their equivalents.

[0025] It will be understood that when an element or layer is referred to as "on top of" or "on" another element or layer, it includes not only the case where it is directly on the other element or layer, but also the case where an intervening element is located therein. Conversely, when an element is referred to as "directly on" or "on top of," it means that there is no intervening layer or element in between. The term "and / or" includes all combinations of one or more of the related listed items.

[0026] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” and “up” may be used herein to describe the relationship between one element or feature and another, as illustrated in the accompanying drawings. It will be understood that spatial relative terms are intended to cover different orientations of the apparatus in use or operation other than those depicted in the accompanying drawings. The same reference numerals or symbols refer to the same elements throughout the document.

[0027] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, components, and / or sections, these elements, components, and / or sections should not be limited by these terms. These terms are used only to distinguish one element, component, or section from another. Therefore, the first element, component, or section discussed below may be referred to as the second element, component, or section without departing from the spirit or scope of this disclosure.

[0028] The embodiments described herein will be explained in view of ideal (or schematic) plan views, perspective views, and cross-sectional views of embodiments according to the present disclosure. Accordingly, the shapes of the illustrative drawings can be modified according to manufacturing techniques and / or tolerances. Thus, the embodiments of the present disclosure are not limited to the specific shapes illustrated in the drawings, but also include shape variations caused, for example, by manufacturing processes. Accordingly, the regions illustrated in the drawings of the devices can be schematic and the specific shapes of the regions illustrated in the drawings are not intended to limit the scope of the present disclosure.

[0029] In the following, example embodiments of the present disclosure will be described in more detail with reference to the appended drawings.

[0030] Figure 1 A perspective view of an electronic device including a display device protected by a release film according to an embodiment of the present disclosure. Figure 2 To illustrate Figure 1 A perspective view of the electronic device illustrated in FIG. 1A in a folded state.

[0031] With reference to Figure 1 The electronic device ED according to an embodiment of the present disclosure can have a rectangular shape in a plane having a long side extending in a first direction DR1 and a short side extending in a second direction DR2 intersecting the first direction DR1. However, embodiments of the present disclosure are not limited thereto, and the electronic device ED can have various suitable shapes such as, for example, a circular (e.g., substantially circular) shape or a polygonal shape. The electronic device ED can be a flexible display device.

[0032] In the following, a direction substantially perpendicular to a plane defined by the first direction DR1 and the second direction DR2 is defined as a third direction DR3. Further, in the present specification, the wording "when viewed in a plane" can be defined as a state of being viewed in the third direction DR3.

[0033] The electronic device ED can include a folded area FA and a plurality of non-folded areas NFA1, NFA2. The non-folded areas NFA1, NFA2 can include a first non-folded area NFA1 and a second non-folded area NFA2. The folded area FA can be between the first non-folded area NFA1 and the second non-folded area NFA2. The folded area FA, the first non-folded area NFA1, and the second non-folded area NFA2 can be provided in the second direction DR2.

[0034] One folded area FA and two non-folded areas NFA1, NFA2 can be illustrated as an example, but the number of folded areas FA and the number of non-folded areas NFA1, NFA2 are not limited thereto. For example, the electronic device ED can include more than two non-folded areas and a plurality of folded areas having non-folded areas provided therebetween.

[0035] A top surface of the electronic device ED can be defined as a display surface DS, and the display surface DS can have a flat surface defined by a first direction DR1 and a second direction DR2. An image IM generated from the electronic device ED through the display surface DS can be provided to a user.

[0036] The display surface DS can include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA can display an image, and the non-display area NDA can not display an image (or can not be designed to actively display an image). The non-display area NDA can surround the display area DA and define a boundary of the electronic device ED printed in a set color or a predetermined color.

[0037] The electronic device ED can include at least one sensor SN and at least one camera CA. The sensor SN and the camera CA can be adjacent to the boundary of the electronic device ED. The sensor SN and the camera CA can be in the display area DA adjacent to the non-display area NDA. The sensor SN and the camera CA can be in the second non-fold area NFA2, but are not limited thereto. The sensor SN and the camera CA can be in the first non-fold area NFA1. By way of example, the sensor SN and the camera CA are shown in dotted lines in the drawings.

[0038] Light can pass through a portion of the electronic device ED providing the sensor SN and the camera CA, and can be provided to the camera CA and the sensor SN. For example, the sensor SN can be a proximity sensor, but the type (or kind) of the sensor SN is not limited thereto. The camera CA can capture an external image. The sensor SN and the camera CA can each be provided as a plurality.

[0039] Referring to Figure 2 , the electronic device ED can be a folded or unfolded foldable electronic device ED. For example, the electronic device ED can be folded such that the folding area FA is bent with respect to a folding axis FX parallel to the first direction DR1. The folding axis FX can be defined as parallel (e.g., substantially parallel) to a long axis of the long side of the electronic device ED.

[0040] When the electronic device ED is folded, the electronic device ED can be folded inwardly such that the first non-fold area NFA1 and the second non-fold area NFA2 can face each other and the display surface DS is not exposed to the outside. However, embodiments of the present disclosure are not limited thereto. For example, the electronic device ED can be folded outwardly with respect to the folding axis FX such that the display surface DS is exposed to the outside.

[0041] For example, a distance between the first non-fold area NFA1 and the second non-fold area NFA2 can be less than the radius of curvature R1. However, the distance between the first non-fold area NFA1 and the second non-fold area NFA2 can be substantially the same as the radius of curvature R1.

[0042] Figure 3 To Figure 1 An exploded perspective view of an electronic device exemplified in the middle.

[0043] Referring to Figure 3 , the electronic device ED can include a display device DD, a camera CA, a sensor SN, an electronic module EM, a power supply module PSM, and a housing EDC. In an embodiment, the electronic device ED can further include a mechanical structure (e.g., a hinge) for controlling a folding operation of the display device DD.

[0044] The display device DD can generate an image and detect an external input. The display device DD can include a window module WM and a display module DM. The window module WM can provide a front surface of the electronic device ED. The window module WM can be on the display module DM and protect the display module DM. The window module WM can transmit light generated from the display module DM and provide the light to a user.

[0045] The display module DM can include at least a display panel DP. Figure 3 Only the display panel DP among the stacked structures of the display module DM is exemplified, but basically, the display module DM can further include a plurality of components provided above and / or below the display panel DP. The detailed stacked structure of the display module DM will be described in more detail below.

[0046] The display panel DP can include a display area DA and a non-display area NDA corresponding to a display area DA (see Figure 1 ) and a non-display area NDA (see Figure 1 ) of the electronic device ED, respectively. In this specification, the wording "an area / part corresponds to an area / part" can mean "overlap each other", and is not limited to having the same area.

[0047] The display panel DP can have a first hole area HA1 and a second hole area HA2 defined therein. The first hole area HA1 and the second hole area HA2 can have a light transmittance higher than that of a surrounding environment (e.g., than that of an area surrounding the first hole area HA1 and the second hole area HA2). The camera CA can be under the first hole area HA1, and the sensor SN can be under the second hole area HA2. Light passing through the first hole area HA1 and the second hole area HA2 can be provided to the camera CA and the sensor SN.

[0048] The display module DM can include a data driver DDV in the non-display area NDA of the display panel DP. The data driver DDV can be manufactured in the form of an integrated circuit chip and mounted in the non-display area NDA. However, embodiments of the present disclosure are not limited thereto, and the data driver DDV can be mounted on a flexible circuit board connected or coupled to the display panel DP.

[0049] The electronic module EM and the power supply module PSM can be under the display device DD. In an embodiment, the electronic module EM and the power supply module PSM can be connected or coupled to each other via an additional flexible circuit board. The electronic module EM can control the operation of the display device DD. The power supply module PSM can supply power to the electronic module EM.

[0050] The housing EDC can accommodate the display device DD, the electronic module EM, and the power supply module PSM. The housing EDC can include two first and second housings EDC1 and EDC2 (e.g., can include a first housing EDC1 and a second housing EDC2) so as to allow the display device DD to be folded. The first and second housings EDC1 and EDC2 can extend in a first direction DR1 and be provided in a second direction DR2.

[0051] In an embodiment, the electronic device ED can further include a hinge structure connecting or coupling the first and second housings EDC1 and EDC2. The housing EDC can be coupled to the window module WM. The housing EDC can contain the display device DD, the electronic module EM, and the power supply module PSM.

[0052] Figure 4 For Figure 3 a block diagram of an electronic device illustrated in an embodiment.

[0053] Referring to Figure 4 , the electronic device ED can include an electronic module EM, a power supply module PSM, a display device DD, and an electro-optical module ELM. The electronic module EM can include a control module 10, a wireless communication module 20, an image input module 30, a sound input module 40, a sound output module 50, a memory 60, and / or an external interface module 70, etc. The modules can be mounted on a circuit board or electrically connected or coupled via a flexible circuit board. The electronic module EM can be electrically connected or coupled to the power supply module PSM.

[0054] The control module 10 can control the overall operation of the electronic device ED. For example, the control module 10 can activate or deactivate the display device DD according to a user's input. The control module 10 can control the image input module 30, the sound input module 40, and / or the sound output module 50, etc. according to a user's input. The control module 10 can include at least one microprocessor.

[0055] The wireless communication module 20 can transmit / receive a wireless signal to / from another terminal through a Bluetooth and / or Wi-Fi line. The wireless communication module 20 can transmit / receive a voice signal through any suitable, commonly used communication line. The wireless communication module 20 can include a transmission circuit 22 that modulates and transmits a signal to be transmitted and a reception circuit 24 that demodulates a received signal.

[0056] The image input module 30 can process image signals and convert them into image data that can be displayed on the display device DD. The sound input module 40 can receive external sound signals via a microphone in recording mode and / or voice recognition mode, and convert the signals into electronic voice data. The sound output module 50 can convert sound data received from the wireless communication module 20 and / or sound data stored in the memory 60, and output the conversion result to the outside.

[0057] The external interface module 70 can be used as an interface for connecting or coupling to an external charger, wired / wireless data port and / or card slot (e.g., memory card, SIM / UIM card), etc.

[0058] A power supply module (PSM) can provide power for the overall operation of an electronic device (ED). A PSM can include any suitable, commonly used battery device.

[0059] An electro-optical module (ELM) can be an electronic component that outputs and / or receives optical signals. The ELM can transmit and / or receive optical signals via some areas of a display device (DD). In an embodiment, the ELM may include a camera module (CAM) and a sensor module (SNM). The camera module (CAM) may include... Figure 3 The camera CA is illustrated in the example. The sensor module SNM may include... Figure 3 The sensor SN is shown in the example.

[0060] Figure 5 for Figure 3 The diagram shows a schematic cross-sectional view of the display module.

[0061] See Figure 5 The display module DM may include a display panel DP, an input sensing unit ISP on the display panel DP, an anti-reflective layer RPL on the input sensing unit ISP, and a panel protective layer PPL beneath the display panel DP. The display panel DP may be a flexible display panel. For example, the display panel DP may include a flexible plate and multiple elements on the flexible plate.

[0062] The display panel DP can be a light-emitting display panel, but is not particularly limited thereto. For example, the display panel DP can be an organic light-emitting display panel and / or an inorganic light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include organic light-emitting materials. The light-emitting layer of an inorganic light-emitting display panel may include quantum dots and / or quantum rods, etc. Hereinafter, the display panel DP is described as an organic light-emitting display panel, but this disclosure is not limited thereto.

[0063] The input sensing unit ISP can include a plurality of sensor units for capacitively sensing an external input. The input sensing unit ISP can be directly on (e.g., directly formed on) the display panel DP when the display module DM is manufactured.

[0064] The anti-reflection layer RPL can be on the input sensing unit ISP. The anti-reflection layer RPL can be directly on (e.g., directly formed on) the input sensing unit ISP when the display module DM is manufactured. The anti-reflection layer RPL can be defined as an external light anti-reflection film. The anti-reflection layer RPL can reduce reflectance of external light entering the display panel DP from above the display device DD.

[0065] For example, the input sensing unit ISP can be directly on (e.g., directly formed on) the display panel DP, and the anti-reflection layer RPL can be directly on (e.g., directly formed on) the input sensing unit ISP. However, embodiments of the present disclosure are not limited thereto. For example, the input sensing unit ISP can be separately manufactured, and attached to the display panel DP via an adhesive layer.

[0066] The anti-reflection layer RPL can be separately manufactured, and attached to the input sensing unit ISP via an adhesive layer.

[0067] The display panel DP, the input sensing unit ISP, and the anti-reflection layer RPL can be defined as an electronic panel EP.

[0068] The panel protection layer PPL can be under the display panel DP. The panel protection layer PPL can protect a lower portion of the display panel DP. The panel protection layer PPL can include a flexible plastic material. For example, the panel protection layer PPL can include polyethylene terephthalate (PET).

[0069] Figure 6 For example, Figure 5 A cross-sectional view of an example of the display panel illustrated in

[0070] For example, Figure 6 A cross-section of the display panel DP is illustrated when viewed in the second direction DR2.

[0071] Referring to Figure 6 The display panel DP can include a substrate SUB, a circuit element layer DP-CL on the substrate SUB, a display element layer DP-OLED on the circuit element layer DP-CL, and a thin film encapsulation layer TFE on the display element layer DP-OLED.

[0072] The substrate SUB can include a display area DA and a non-display area NDA surrounding the display area DA. The substrate SUB can include glass and / or a flexible plastic material such as polyimide (PI). The display element layer DP-OLED can be in the display area DA.

[0073] A plurality of pixels can be on the circuit element layer DP-CL and the display element layer DP-OLED. The pixels can each include a transistor on the circuit element layer DP-CL and a light emitting element on the display element layer DP-OLED and connected or coupled to the transistor.

[0074] A thin film encapsulation layer TFE can be on the circuit element layer DP-CL so as to cover the display element layer DP-OLED. The thin film encapsulation layer TFE can protect the pixels from moisture, oxygen, and / or external exogenous substances.

[0075] Figure 7 For Figure 6 A plan view of a display panel is exemplified.

[0076] Referring to Figure 7 The display module DM can include a display panel DP, a scan driver SDV, a data driver DDV, and an emission driver EDV.

[0077] The display panel DP can include a first area AA1, a second area AA2, and a bending area BA between the first area AA1 and the second area AA2. The bending area BA can extend in a first direction DR1, and the first area AA1, the bending area BA, and the second area AA2 can be provided in a second direction DR2.

[0078] The first area AA1 can include a display area DA and a non-display area NDA surrounding the display area DA. The non-display area NDA can surround the display area DA. The display area DA can display an image, and the non-display area NDA can not display an image. The second area AA2 and the bending area BA can not display an image. The first hole area HA1 and the second hole area HA2 described above can be defined in the display area DA. The image can be displayed while overlapping the first hole area HA1 and the second hole area HA2.

[0079] The first area AA1 can include a first non-folded area NFA1, a second non-folded area NFA2, and a folded area FA between the first non-folded area NFA1 and the second non-folded area NFA2 when viewed in the first direction DR1. The first hole area HA1 and the second hole area HA2 described above can be defined in the second non-folded area NFA2.

[0080] The display panel DP can include a plurality of pixels PX, a plurality of scan lines SL1 to SLm, a plurality of data lines DL1 to DLn, a plurality of emission lines EL1 to ELm, a first control line CSL1 and a second control line CSL2, a power line PL, a connection line CNL, and a plurality of pads PD. As described herein, m and n are positive integers. The pixels PX can be in a display area DA and connected or coupled to the scan lines SL1 to SLm, the data lines DL1 to DLn, and the emission lines EL1 to ELm.

[0081] The scan driver SDV and the emission driver EDV can be in the non-display area NDA. The scan driver SDV and the emission driver EDV can be in the non-display area NDA adjacent to each of two sides (e.g., two opposite sides) of the first area AA1 opposite each other in the first direction DR1. The data driver DDV can be in the second area AA2. The data driver DDV can be manufactured in the form of an integrated circuit chip and mounted in the second area AA2.

[0082] The scan lines SL1 to SLm can extend in the first direction DR1 to be connected or coupled to the scan driver SDV. The data lines DL1 to DLn can extend in the second direction DR2 to be connected or coupled to the data driver DDV via the bending area BA. The emission lines EL1 to ELm can extend in the first direction DR1 to be connected or coupled to the emission driver EDV.

[0083] The power line PL can extend in the second direction DR2 and in the non-display area NDA. The power line PL can be between the display area DA and the emission driver EDV, but is not limited thereto. The power line PL can be between the display area DA and the scan driver SDV.

[0084] The power line PL can extend to the second area AA2 via the bending area BA. When viewed on a plane, the power line PL can extend toward a lower end of the second area AA2. The power line PL can receive a driving voltage.

[0085] The connection line CNL can extend in the first direction DR1 and be arranged on the second direction DR2. The connection line CNL can be connected or coupled to the power line PL and the pixel PX. The driving voltage can be applied to the pixel PX via the power line PL and the connection line CNL connected or coupled to each other.

[0086] The first control line CSL1 can be connected or coupled to the scan driver SDV and extend toward the lower end of the second area AA2 via the bending area BA. The second control line CSL2 can be connected or coupled to the emission driver EDV and extend toward the lower end of the second area AA2 via the bending area BA. The data driver DDV can be between the first control line CSL1 and the second control line CSL2.

[0087] The pad PD can be adjacent to a lower end of the second area AA2 when viewed on a plane. The data driver DDV, the power line PL, the first control line CSL1, and the second control line CSL2 can be connected or coupled to the pad PD.

[0088] The data lines DL1~DLn can be connected or coupled to the corresponding pads PD via the data driver DDV. For example, the data lines DL1~DLn can be connected or coupled to the data driver DDV, and the data driver DDV can be connected or coupled to the pads PD corresponding to the data lines DL1~DLn, respectively.

[0089] In an embodiment, a printed circuit board can be connected or coupled to the pad PD, and the timing controller and the voltage generator can be on the printed circuit board. The timing controller can be manufactured as an integrated circuit chip and mounted on the printed circuit board. The timing controller and the voltage generator can be connected or coupled to the pad PD via the printed circuit board.

[0090] The timing controller can control operations of the scan driver SDV, the data driver DDV, and the emission driver EDV. The timing controller can generate a scan control signal, a data control signal, and an emission control signal in response to a control signal received from the outside. The voltage generator can generate a driving voltage.

[0091] The scan control signal can be provided to the scan driver SDV via the first control line CSL1. The emission control signal can be provided to the emission driver EDV via the second control line CSL2. The data control signal can be provided to the data driver DDV. The timing controller can receive an image signal from the outside, convert a data format of the image signal so as to satisfy an interface specification of the data driver DDV, and provide the converted signal to the data driver DDV.

[0092] The scan driver SDV can generate a plurality of scan signals in response to the scan control signal. The scan signals can be applied to the pixels PX via the scan lines SL1~SLm. The scan signals can be sequentially applied to the pixels PX.

[0093] The data driver DDV can generate a plurality of data voltages corresponding to the image signal in response to the data control signal. The data voltages can be applied to the pixels PX via the data lines DL1~DLn. The emission driver EDV can generate a plurality of emission signals in response to the emission control signal. The emission signals can be applied to the pixels PX via the emission lines EL1~ELm.

[0094] The pixels PX can receive the data voltages in response to the scan signals. The pixels PX can display an image by emitting light having luminance corresponding to the data voltages in response to the emission signals. An emission time of the pixels PX can be controlled by the emission signals.

[0095] Figure 8A is bent along the folding area FA. Figure 7 is a cross-sectional view taken along the line I-I' illustrated in FIG. 1. Figure 8B is a cross-sectional view illustrating a state in which the folding area FA illustrated in Figure 8A is bent.

[0096] For example, Figure 8A illustrates both a cross-section of the display module DM and a cross-section of the window module WM taken along the line I-I'.

[0097] Referring to Figure 8A , the display device DD can include a display module DM and a window module WM on the display module DM. The display module DM can be a flexible display module. The display module DM can include a first non-folding area NFA1, a folding area FA, and a second non-folding area NFA2.

[0098] The display module DM can include a display part DSP and a support part SUP. The support part SUP can be under the display part DSP and support the display part DSP.

[0099] The window module WM can include a window WIN, a window protection layer WP, a hard coat layer HC, and first and second adhesive layers AL1 and AL2. The display part DSP can include an electronic panel EP, an impact absorbing layer ISL, a panel protection layer PPL, a barrier layer BRL, and third through sixth adhesive layers AL3 through AL6. The components of the electronic panel EP and the panel protection layer PPL have been described above and their descriptions can not be repeated here. Figure 5 The components of the electronic panel EP and the panel protection layer PPL are described in detail, and their descriptions can not be repeated here.

[0100] The impact absorbing layer ISL can be on the electronic panel EP. The impact absorbing layer ISL absorbs an external impact applied from above the display device DD toward the electronic panel EP, and thus can protect the electronic panel EP. The impact absorbing layer ISL can be manufactured in the form of a stretched film.

[0101] The impact absorbing layer ISL can include a flexible plastic material. The flexible plastic material can be defined as a synthetic resin film. For example, the impact absorbing layer ISL can include a flexible plastic material such as polyimide (PI) and / or polyethylene terephthalate (PET).

[0102] The window WIN can be on the impact absorbing layer ISL. The window WIN can protect the electronic panel EP from external scratches. The window WIN can have optical transparency properties. The window WIN can include glass. However, embodiments of the present disclosure are not limited thereto, and the window WIN can include a synthetic resin film.

[0103] The window WIN can have a single layer or a multi-layer structure. For example, the window WIN can include a plurality of synthetic resin films combined with an adhesive, or can include a glass substrate and a synthetic resin film combined with an adhesive.

[0104] The window protection layer WP can be on the window WIN. The window protection layer WP can include a flexible plastic material such as polyimide and / or polyethylene terephthalate. The hard coat layer HC can be on an upper surface of the window protection layer WP.

[0105] The printed layer PIT can be on a lower surface of the window protection layer WP. The printed layer PIT can be black, but the color of the printed layer PIT is not limited thereto. The printed layer PIT can be adjacent to a boundary of the window protection layer WP.

[0106] The barrier layer BRL can be under the panel protection layer PPL. The barrier layer BRL can enhance resistance to a compression force caused by external pressure. Accordingly, the barrier layer BRL can be used to prevent or reduce deformation of the electronic panel EP. The barrier layer BRL can include a flexible plastic material such as polyimide and / or polyethylene terephthalate.

[0107] The barrier layer BRL can have a color that absorbs light. For example, the barrier layer BRL can be black. In this case, components under the barrier layer BRL can be invisible when the display module DM is viewed from above.

[0108] The first adhesive layer AL1 can be between the window protection layer WP and the window WIN. The window protection layer WP and the window WIN can be combined with each other via the first adhesive layer AL1. The first adhesive layer AL1 can cover the printed layer PIT.

[0109] The second adhesive layer AL2 can be between the window WIN and the impact absorbing layer ISL. The window WIN and the impact absorbing layer ISL can be combined with each other via the second adhesive layer AL2.

[0110] The third adhesive layer AL3 can be between the impact absorbing layer ISL and the electronic panel EP. The impact absorbing layer ISL and the electronic panel EP can be combined with each other via the third adhesive layer AL3.

[0111] The fourth adhesive layer AL4 can be between the electronic panel EP and the panel protection layer PPL. The electronic panel EP and the panel protection layer PPL can be combined with each other via the fourth adhesive layer AL4.

[0112] The fifth adhesive layer AL5 can be between the panel protection layer PPL and the barrier layer BRL. The panel protection layer PPL and the barrier layer BRL can be combined with each other via the fifth adhesive layer AL5.

[0113] The sixth adhesive layer AL6 can be between the barrier layer BRL and the support member SUP. In an embodiment, the first support plate PLT1 of the support member SUP can be under the barrier layer BRL, and the sixth adhesive layer AL6 can be between the barrier layer BRL and the first support plate PLT1. The barrier layer BRL and the first support plate PLT1 can be bonded to each other via the sixth adhesive layer AL6.

[0114] Hereinafter, in the present specification, the term "thickness" can mean a value measured in the third direction DR3, and the term "width" can mean a value measured in the first direction DR1 or the second direction DR2 which are horizontal directions.

[0115] The sixth adhesive layer AL6 can overlap the first non-folded area NFA1 and the second non-folded area NFA2, and can not overlap the folded area FA. For example, the sixth adhesive layer AL6 can not be provided in the folded area FA.

[0116] The first to sixth adhesive layers AL1-AL6 can include a transparent adhesive such as a pressure sensitive adhesive (PSA) and / or an optically clear adhesive (OCA), but the type (or kind) of the adhesive is not limited thereto.

[0117] The thickness of the panel protection layer PPL can be less than the thickness of the window protection layer WP, and the thickness of the barrier layer BRL can be less than the thickness of the panel protection layer PPL. The thickness of the electronic panel EP can be less than the thickness of the barrier layer BRL, and can be the same as the thickness of the window WIN. The thickness of the impact absorbing layer ISL can be less than the thickness of the electronic panel EP.

[0118] The thickness of the first adhesive layer AL1 can be the same as the thickness of the barrier layer BRL, and the thickness of each of the second and third adhesive layers AL2 and AL3 can be equal to the thickness of the panel protection layer PPL. The thickness of the fourth adhesive layer AL4 can be the same as the thickness of the fifth adhesive layer AL5.

[0119] The thickness of each of the fourth and fifth adhesive layers AL4 and AL5 can be less than the thickness of the electronic panel EP, and can be greater than the thickness of the impact absorbing layer ISL. The sixth adhesive layer AL6 can have a thickness less than the thickness of the impact absorbing layer ISL. The thickness of the hard coat layer HC can be less than the thickness of the sixth adhesive layer AL6.

[0120] The impact absorbing layer ISL, the panel protection layer PPL, and the third and fourth adhesive layers AL3 and AL4 can have the same width. The window protection layer WP and the first adhesive layer AL1 can have the same width. The barrier layer BRL and the fifth and sixth adhesive layers AL5 and AL6 can have the same width.

[0121] The width of the electronic panel EP, the impact absorbing layer ISL, the panel protection layer PPL, and the third and fourth adhesive layers AL3 and AL4 can be greater than the width of the window protection layer WP and the first adhesive layer AL1. The boundaries of the electronic panel EP, the impact absorbing layer ISL, the panel protection layer PPL, and the third and fourth adhesive layers AL3 and AL4 can be provided further outward than the boundaries of the window protection layer WP and the first adhesive layer AL1.

[0122] The width of the window WIN and the second adhesive layer AL2 can be less than the width of the window protection layer WP and the first adhesive layer AL1. The width of the second adhesive layer AL2 can be less than the width of the window WIN. The boundaries of the window WIN can be provided further inward than the boundaries of the window protection layer WP and the first adhesive layer AL1. The boundaries of the second adhesive layer AL2 can be provided further inward than the boundaries of the window WIN.

[0123] The width of the barrier layer BRL and the fifth and sixth adhesive layers AL5 and AL6 can be less than the width of the window protection layer WP and the first adhesive layer AL1. The boundaries of the barrier layer BRL and the fifth and sixth adhesive layers AL5 and AL6 can be provided further inward than the boundaries of the window protection layer WP and the first adhesive layer AL1.

[0124] The support member SUP can include a first support plate PLT1, a second support plate PLT2, a cover layer COV, a digital converter DGT, a shield layer SHL, a heat dissipation layer RHL, a seventh and eighth adhesive layers AL7 and AL8, and a plurality of first to fourth insulating tapes ITP1 to ITP4.

[0125] The first support plate PLT1 can be under the electronic panel EP and support the electronic panel EP. The first support plate PLT1 can have a rigidity greater than that of the display member DSP. The first support plate PLT1 can include a non-metallic material. For example, the first support plate PLT1 can include a reinforced fiber composite material. The reinforced fiber composite material can be carbon fiber reinforced plastic (CFRP) and / or glass fiber reinforced plastic (GFRP).

[0126] The first support plate PLT1 can include a reinforced fiber composite material, thereby achieving light weight (e.g., can be relatively lighter than a metal support plate made of a metallic material). The first support plate PLT1 according to an embodiment includes a reinforced fiber composite material, and thus can not only have a weight lighter than a metal support plate made of a metallic material, but also have a modulus and a strength similar to those of the metal support plate.

[0127] In an embodiment, the first support plate PLT1 includes a reinforced fiber composite material, and thus, shape processing (e.g., forming) of the first support plate PLT1 can be easily performed compared to a metal support plate. For example, the first support plate PLT1 including the reinforced fiber composite material can be easily processed by a laser process and / or a micro-blasting process than a metal support plate made of a metal material.

[0128] A plurality of openings OP can be defined in a portion of the first support plate PLT1 overlapping the folding area FA. The openings OP can be formed through a portion of the first support plate PLT1 in the third direction DR3. The openings OP can be formed by the above-described laser process and / or micro-blasting process.

[0129] The openings OP are defined in the portion of the first support plate PLT1 overlapping the folding area FA, and thus, flexibility of the portion of the first support plate PLT1 overlapping the folding area FA can be enhanced. Accordingly, the first support plate PLT1 can be easily folded with respect to the folding area FA. A width of a portion in which the openings OP are formed can be less than a width of a portion in which the sixth adhesive layer AL6 is opened.

[0130] A cover layer COV can be under the first support plate PLT1. The cover layer COV can cover the openings OP defined in the first support plate PLT1 under the first support plate PLT1. The cover layer COV can overlap the folding area FA and can not overlap the first non-folding area NFA1 and the second non-folding area NFA2. In an embodiment, the cover layer COV can not be in the first non-folding area NFA1 and the second non-folding area NFA2. The cover layer COV can be in contact with a lower surface of a portion of the first support plate PLT1 in which the openings OP are formed.

[0131] The cover layer COV can have an elastic modulus lower than an elastic modulus of the first support plate PLT1. For example, the cover layer COV can include a thermoplastic polyurethane and / or a rubber, but a material of the cover layer COV is not limited thereto. The cover layer COV can be manufactured in the form of a sheet and attached to the first support plate PLT1.

[0132] A digitizer DGT can be under the first support plate PLT1. The cover layer COV can be between the first support plate PLT1 and the digitizer DGT. The cover layer COV can be spaced apart from an upper surface of the digitizer DGT.

[0133] The digitizer DGT is a device that can receive information about a position of a user's indication on a display surface. The digitizer DGT can be implemented in an electromagnetic (or electromagnetic resonance) manner. For example, the digitizer DGT can include a digitizer sensor substrate including a plurality of coils. However, embodiments of the present disclosure are not limited thereto, and the digitizer DGT can also be implemented in an active electrostatic manner.

[0134] When the user moves the pen on the display device DD, the pen is driven by an alternating current signal to cause a vibrating magnetic field, and thus the vibrating magnetic field can induce a signal to the coil. The position of the pen can be detected by the signal induced to the coil. The digitizer DGT can determine the position of the pen by detecting electromagnetic changes caused by the proximity of the pen.

[0135] When the first support plate PLT1 on and adjacent to the digitizer DGT includes metal, the sensitivity of the digitizer DGT can be reduced due to the metal. For example, when a signal transmitted on the display device DD is blocked or reduced by signal interference caused by the metal support plate, the digitizer DGT can not operate properly. However, in embodiments of the present disclosure, the first support plate PLT1 on the digitizer DGT includes a non-metallic fiber-reinforced composite material, and thus the digitizer DGT can operate properly or normally.

[0136] The digitizer DGT can be separated into two parts in the folding area FA. The separated parts of the digitizer DGT can each be connected or coupled to the digitizer driver via a flexible circuit board.

[0137] A shielding layer SHL can be under the digitizer DGT. The shielding layer SHL can include metal. For example, the shielding layer SHL can include copper, but the metal material of the shielding layer SHL is not limited thereto. The shielding layer SHL can be separated into two parts in the folding area FA. The separated parts of the shielding layer SHL can each be under the parts of the digitizer DGT that are separated from each other.

[0138] The shielding layer SHL can shield electromagnetic applied to the digitizer DGT under the first support plate PLT1. The shielding layer SHL can also be defined as an electromagnetic shielding layer. The shielding layer SHL including metal can function as a heat dissipation layer.

[0139] A second support plate PLT2 can be under the shielding layer SHL. The second support plate PLT2 can have a rigidity greater than that of the display member DSP. The second support plate PLT2 can include a metal material such as stainless steel (e.g., SUS 316), but the metal material of the second support plate PLT2 is not limited thereto. Furthermore, embodiments of the present disclosure are not limited thereto, and the second support plate PLT2 can include a non-metallic material such as plastic.

[0140] The second support plate PLT2 can be divided into two parts in the folding area FA. For example, the second support plate PLT2 can include a first (2_1) support plate PLT2_1 overlapping the first non-folding area NFA1 and a second (2_2) support plate PLT2_2 overlapping the second non-folding area NFA2.

[0141] The first (2_1) support plate PLT2_1 can be in the first non-folding area NFA1. The second (2_2) support plate PLT2_2 can be in the second non-folding area NFA2. The first (2_1) support plate PLT2_1 and the second (2_2) support plate PLT2_2 can extend to the folding area FA and be adjacent to each other in the folding area FA.

[0142] The first (2_1) support plate PLT2_1 and the second (2_2) support plate PLT2_2 can be spaced apart from each other in the folding area FA. The first (2_1) support plate PLT2_1 and the second (2_2) support plate PLT2_2 can support a part of the opening OP defined by the first support plate PLT1 in the folding area FA. When pressure is applied to the first support plate PLT1 from above, the first (2_1) support plate PLT2_1 and the second (2_2) support plate PLT2_2 can prevent or reduce deformation of the part of the opening OP defined by the first support plate PLT1. In an embodiment, the first (2_1) support plate PLT2_1 and the second (2_2) support plate PLT2_2 can perform a heat dissipation function.

[0143] The heat dissipation layer RHL can be under the second support plate PLT2. The heat dissipation layer RHL can be divided into two parts in the folding area FA. The divided parts of the heat dissipation layer RHL can be under the first (2_1) support plate PLT2_1 and the second (2_2) support plate PLT2_2, respectively.

[0144] The heat dissipation layer RHL can perform a heat dissipation function. For example, the heat dissipation layer RHL can include graphite, but the material of the heat dissipation layer RHL is not limited thereto. The heat dissipation layer RHL performs a heat dissipation function together with the second support plate PLT2 and the shielding layer SHL, and thus the heat dissipation performance of the display device DD can be improved.

[0145] The first to fourth insulating tapes ITP1-ITP4 can be under the digital converter DGT and the second support plate PLT2. The first to fourth insulating tapes ITP1-ITP4 can include an insulating material (e.g., an electrically insulating material).

[0146] The two first insulating tapes ITP1 can be adjacent to face each other one side of the first (2_1) support plate PLT2_1 and one side of the second (2_2) support plate PLT2_2 and be under the first (2_1) support plate PLT2_1 and the second (2_2) support plate PLT2_2, respectively.

[0147] The second insulating tape ITP2 and the third insulating tape ITP3 can be adjacent to respective two sides (e.g., two opposite sides) of the digital converter DGT and under the digital converter DGT. The second insulating tape ITP2 can be adjacent to a boundary of the first (2_1) support plate PLT2_1, and the third insulating tape ITP3 can be adjacent to a boundary of the first (2_2) support plate PLT2_2.

[0148] The fourth insulating tape ITP4 can be adjacent to another side of the first (2_2) support plate PLT2_2 opposite to one side of the first (2_2) support plate PLT2_2. The fourth insulating tape ITP4 can be under the first (2_2) support plate PLT2_2.

[0149] The shielding layer SHL, the second support plate PLT2, the heat dissipation layer RHL, the first insulating tape ITP1, and the fourth insulating tape ITP4 can be between the second insulating tape ITP2 and the third insulating tape ITP3. One of the heat dissipation layers RHL separated from each other can be between the first insulating tape ITP1 and the fourth insulating tape ITP4 under the first (2_2) support plate PLT2_2. The other of the heat dissipation layers RHL separated from each other can be between the first insulating tape ITP1 under the first (2_1) support plate PLT2_1 and the second insulating tape ITP2 under the digital converter DGT.

[0150] In an embodiment, the magnet can be under the display module DM to maintain a folded state when the electronic device ED is folded. The magnet can be adjacent to a boundary of the electronic device ED. Due to the magnetic force of the magnet, the folded state of the electronic device ED can be maintained.

[0151] When the magnetic property of the magnet is transmitted to the digital converter DGT, the digital converter DGT can not normally work. The first to fourth insulating tapes ITP1-ITP4 can block or reduce the magnetic property of the magnet on the boundary of the electronic device ED from being transmitted to the digital converter DGT. The first to fourth insulating tapes ITP1-ITP4 can be defined as a magnetic property blocking tape.

[0152] The seventh adhesive layer AL7 can be between the first support plate PLT1 and the digital converter DGT. The first support plate PLT1 and the digital converter DGT can be combined with each other via the seventh adhesive layer AL7. The seventh adhesive layer AL7 can not be in the folding area FA. In an embodiment, the seventh adhesive layer AL7 can be opened in the folding area FA. The cover layer COV described above can be in the opening of the seventh adhesive layer AL7. The seventh adhesive layer AL7 is not in the folding area FA, and thus a folding operation of the support part SUP can be more easily performed.

[0153] An eighth adhesive layer AL8 can be between the shield layer SHL and the second support plate PLT2. The shield layer SHL and the second support plate PLT2 can be bonded to each other via the eighth adhesive layer AL8. Portions of the eighth adhesive layer AL8 can be separated from each other in the folding area FA. The separated portions of the eighth adhesive layer AL8 can be between the separated portions of the shield layer SHL and the (2_1)th support plate PLT2_1 and the (2_2)th support plate PLT2_2, respectively. The eighth adhesive layer AL8 can be between the second insulating tape ITP2 and the third insulating tape ITP3.

[0154] A width of the first support plate PLT1 can be substantially the same as a width of the first area AA1 of the electronic panel EP. Widths of the digital converter DGT and the seventh adhesive layer AL7 can be less than the width of the first support plate PLT1. Boundaries of the digital converter DGT and the seventh adhesive layer AL7 can be provided further inward than boundaries of the first support plate PLT1.

[0155] Widths of the shield layer SHL, the eighth adhesive layer AL8, and the second support plate PLT2 can be less than a width of the digital converter DGT. Boundaries of the shield layer SHL, the eighth adhesive layer AL8, and the second support plate PLT2 can be provided further inward than boundaries of the digital converter DGT.

[0156] A thickness of the first support plate PLT1 can be greater than a thickness of the digital converter DGT, and the thickness of the digital converter DGT can be greater than a thickness of the second support plate PLT2. The thickness of the second support plate PLT2 can be greater than a thickness of the heat dissipation layer RHL, and the thickness of the heat dissipation layer RHL can be greater than a thickness of each of the seventh adhesive layer AL7 and the eighth adhesive layer AL8.

[0157] The thickness of each of the seventh adhesive layer AL7 and the eighth adhesive layer AL8 can be greater than a thickness of the shield layer SHL, and the thickness of the shield layer SHL can be greater than a thickness of the cover layer COV. The thickness of the cover layer COV can be the same as a thickness of the sixth adhesive layer AL6.

[0158] A thickness of each of the first insulating tapes ITP1 can be less than the thickness of the first support plate PLT1, and can be greater than the thickness of the digital converter DGT. A thickness of the third insulating tape ITP3 can be greater than the thickness of the first support plate PLT1. A thickness of the fourth insulating tape ITP4 can be less than the thickness of each of the first insulating tapes ITP1. A thickness of the second insulating tape ITP2 can be less than the thickness of the fourth insulating tape ITP4.

[0159] The seventh adhesive layer AL7 and the eighth adhesive layer AL8 can include a pressure sensitive adhesive (PSA) and / or an optically clear adhesive (OCA), but the type (or kind) of the adhesive is not limited thereto.

[0160] The first hole H1 can be defined in a portion of the display module DM overlapping the first hole area HA1. The first hole H1 can be defined in an area from the heat dissipation layer RHL to a portion before the panel protection layer PPL. For example, the first hole H1 can be integrally defined in the barrier layer BRL, the first support plate PLT1, the digital converter DGT, the shield layer SHL, the second support plate PLT2, the heat dissipation layer RHL, and the fifth adhesive layer AL5 to the eighth adhesive layer AL8.

[0161] In an embodiment, the second hole can be defined in a portion of the display module DM overlapping the second hole area HA2, and the second hole can also be defined in an area from the heat dissipation layer RHL to a portion before the panel protection layer PPL, similarly to the first hole H1. The above-described camera CA can be disposed in the first hole H1, and the above-described sensor SN can be disposed in the second hole.

[0162] Referring to Figure 8B , the panel protection layer PPL and the fourth adhesive layer AL4 can not be in the bending area BA. The panel protection layer PPL and the fourth adhesive layer AL4 can be in the first area AA1 of the electronic panel EP. The data driver DDV can be in the second area AA2 of the electronic panel EP.

[0163] The printed circuit board PCB can be connected or coupled to the second area AA2 of the electronic panel EP. The printed circuit board PCB can be connected or coupled to one side of the second area AA2. When the bending area BA is bent, the second area AA2 can be under the first area AA1. In an embodiment, the data driver DDV and the printed circuit board PCB can be under the first area AA1.

[0164] Figure 9 A view to illustrate a release film according to an embodiment of the disclosure. Figure 10A A cross-sectional view taken along Figure 9 illustrated in FIG. 1B. Figure 10B A cross-sectional view taken along Figure 9 illustrated in FIG. 1C. Figures 11A-11B A view to illustrate a hole film separate from a display device of Figure 9 .

[0165] For example, Figure 9 and Figure 11A A plan view to illustrate a rear surface of a display device DD.

[0166] For example, Figure 11B A cross-sectional view taken along Figure 11A illustrated in FIG. 1D.

[0167] For example, Figure 9 and Figure 11ATo illustrate a state in which the bending area BA (see Figure 7 ) of the display panel DP (see Figure 7 ) is bent and the second area AA2 is on the rear surface of the display device DD, a plan view is shown.

[0168] For example, in Figure 9 and Figure 11A , the first hole H1, the second hole H2, the second area AA2, the first hole film HFL1, the printed circuit board PCB, and the data driver DDV are shown as dotted lines.

[0169] For example, in Figures 10A-10B , the display module DM and the window module WM are each briefly illustrated as a single layer.

[0170] Figures 9-10B The display device DD of Figures 8A-8B is the same as or similar to the display device DD of , and thus a description thereof can not be repeated here or can be simplified.

[0171] Referring to Figure 9 , Figure 10A , and Figure 10B , the release film RF can protect the rear surface DD-LP of the display device DD from external impact and / or scratches when the display device DD is transferred to another process. The release film RF can be on the rear surface DD-LP of the display device DD. For example, the rear surface DD-LP of the display device DD can be defined as the rear surface of the display module DM.

[0172] The release film RF can include a protective film CTF and a hole film HFL. The protective film CTF can be on the rear surface DD-LP of the display device DD and be defined in the periphery of the first hole H1 and the second hole H2 in the display device DD. The protective film CTF can not overlap the first hole H1 and the second hole H2.

[0173] The protective film CTF can include a first protective film LY1, a second protective film LY2, and a third protective film LY3. As illustrated in Figures 10A-10B , the first protective film LY1, the second protective film LY2, and the third protective film LY3 can be stacked on the rear surface DD-LP of the display device DD in the third direction DR3 in order. In an embodiment, the first protective film LY1 can be on the rear surface DD-LP of the display device DD. The second protective film LY2 can be on the upper surface of the first protective film LY1. The third protective film LY3 can be on the upper surface of the second protective film LY2. The upper surface of the first protective film LY1 and the upper surface of the second protective film LY2 can be defined as surfaces opposite the lower surface facing the rear surface DD-LP of the display device DD.

[0174] For example, the first protective film LY1, the second protective film LY2, and the third protective film LY3 can have the same thickness in the third direction DR3, but are not limited thereto. The thickness of one film among the first protective film LY1, the second protective film LY2, and the third protective film LY3 can be different from the thickness of another film.

[0175] In an embodiment, the lower surface of the first protective film LY1 can be adhered to the rear surface DD-LP of the display device DD via an adhesive. For example, the adhesive strength of the adhesive can be about 10 gf / in to about 20 gf / in.

[0176] In an embodiment, because the adhesive is between the first protective film LY1 and the second protective film LY2 and between the second protective film LY2 and the third protective film LY3, the first protective film LY1 and the second protective film LY2 can be adhered to each other, and the second protective film layer LY2 and the third protective film LY3 can be adhered to each other.

[0177] The boundary of the first protective film LY1 can overlap the boundary of the second protective film LY2 in the third direction DR3 when viewed in a plane. The area of the first protective film LY1 and the area of the second protective film LY2 can be greater than the area of the third protective film LY3 when viewed in a plane. The boundary of the second protective film LY2 can be exposed to the outside from the third protective film LY3. The boundary of the first protective film LY1 and the boundary of the second protective film LY2 can be adjacent (e.g., close) to the first hole H1 than the boundary of the third protective film LY3.

[0178] The hole film HFL can be on the rear surface DD-LP of the display device DD. The hole film HFL can be adjacent to the protective film CTF when viewed in a plane. The boundary of the hole film HFL can have a shape corresponding to the boundary of the protective film CTF facing the boundary of the hole film HFL when viewed in a plane.

[0179] The hole film HFL can overlap the first hole H1 and the second hole H2. A portion of the hole film HFL can be on the second protective film LY2. Another portion of the hole film HFL can extend further outward than the boundary of the display device DD.

[0180] The hole film HFL can include a first hole film HFL1 and a second hole film HFL2. The first hole film HFL1 can overlap the first hole H1 and the second hole H2. The first hole film HFL1 can be on the rear surface DD-LP of the display device DD. The first hole film HFL1 can cover the first hole H1 and the second hole H2 defined in the display device DD. The first hole film HFL1 can prevent or reduce the introduction of exogenous substances into the first hole H1 and the second hole H2.

[0181] The adhesive can not be between the lower surface of the first hole film HFL1 and the rear surface DD-LP of the display device DD. The lower surface of the first hole film HFL1 can not be adhered to the rear surface DD-LP of the display device DD. The adhesive strength between the lower surface of the first hole film HFL1 and the rear surface DD-LP of the display device DD can be 0 gf / in. The lower surface of the first hole film HFL1 can be defined as a surface facing the rear surface DD-LP of the display device DD, and the upper surface of the first hole film HFL1 can be defined as a surface opposite the lower surface of the first hole film HFL1.

[0182] For example, the thickness of the first hole film HFL1 in the third direction DR3 can be the same as the sum of the thickness of the first protective film LY1 and the thickness of the second protective film LY2. The height of the upper surface of the first hole film HFL1 can be the same as the height of the upper surface of the second protective film LY2.

[0183] The second hole film HFL2 can be on the upper surface of the first hole film HFL1. One of the two sides (for example, two opposite sides) of the second hole film HFL2 opposite each other in the first direction DR1 can be on the upper surface of the second protective film LY2 when viewed in the second direction DR2. One of the two sides of the second hole film HFL2 opposite each other in the first direction DR1 can be defined as a side opposite the other side adjacent to the boundary of the display device DD.

[0184] For example, the thickness of the first hole film HFL1 in the third direction DR3 can be greater than the thickness of the second hole film HFL2 in the third direction DR3. However, the thickness of the first hole film HFL1 and the thickness of the second hole film HFL2 can not be limited thereto.

[0185] The second hole film HFL2 can include a first portion PT1 and a second portion PT2. The first portion PT1 can be on the upper surface of the first hole film HFL1. The area of the first portion PT1 can be greater than the area of the first hole film HFL1 when viewed on a plane. The boundary of the first portion PT1 facing the protective film CTF can be further outwardly protruded than the boundary of the first hole film HFL1.

[0186] The boundary of the first portion PT1 facing the protective film CTF can be on the upper surface of the second protective film LY2 exposed to the outside from the third protective film LY3. That is, the lower surface of the first portion PT1 can be on the upper surface of the portion of the second protective film LY2 exposed from the third protective film LY3. The boundary of the third protective film LY3 can overlap the boundary of the second protective film LY2.

[0187] In an embodiment, an adhesive can be between the upper surface of the second protective film LY2 and the lower surface of the first portion PT1. The second protective film LY2 and the first portion PT1 can be adhered to each other via the adhesive. For example, the adhesive strength of the adhesive can be about 10 gf / in ~ about 20 gf / in.

[0188] The first hole film HFL1 can be fixed on the rear surface DD-LP of the display device DD by being adhered to the second hole film HFL2 of the protective film CTF. In an embodiment, the first hole film HFL1 can cover the first hole H1 and the second hole H2 regardless of the surface roughness of the rear surface DD-LP of the display device DD.

[0189] Referring to Figures 11A-11B During the inspection of the first hole area HA1 and the second hole area HA2 of the display device DD, the hole film HFL can be separated from the display device DD. In this case, when an adhesive is between the lower surface of the first hole film HFL1 and the rear surface DD-LP of the display device DD, the first hole film HFL1 can not be easily separated depending on the material of the rear surface DD-LP of the display device DD. In the case where the first hole film HFL1 is not easily separated, when the first hole film HFL1 is separated, the rear surface DD-LP of the display device DD can be damaged. For example, a phenomenon in which the rear surface DD-LP of the display device DD is lifted can occur.

[0190] However, in the case of the release film RF according to an embodiment of the disclosure, the lower surface of the first hole film HFL1 can not be adhered to the rear surface DD-LP of the display device DD. The adhesive strength between the lower surface of the first hole film HFL1 and the rear surface DD-LP of the display device DD can be 0 gf / in. Accordingly, the hole film HFL can be easily separated from the display device DD. Thus, damage to the rear surface DD-LP of the display device DD can be prevented or reduced.

[0191] Referring to Figure 9 , Figure 10B and Figure 11B The second portion PT2 can extend from the first portion PT1 in the first direction DR1. The second portion PT2 can extend from the first portion PT1 and further protrude outward than the boundary of the display device DD. In an embodiment, the second portion PT2 can be easily gripped when the hole film HFL is separated from the display device DD.

[0192] For example, when viewed on a plane, the area of the second portion PT2 can be less than the area of the first portion PT1.

[0193] Figures 12A-12B A view for illustrating a release film according to an embodiment of the disclosure.

[0194] For example,Figure 12A A plan view of the rear surface of the display device DD is illustrated, and Figure 12B A plan view of the rear surface of the display device DD is illustrated, and Figure 12A A cross-sectional view taken along the line V-V’ in

[0195] For example, Figure 12A A plan view of the state in which the bending area BA (see Figure 7 ) of the display panel DP (see Figure 7 ) is bent and the second area AA2 is on the rear surface DD-LP of the display device DD is illustrated.

[0196] For example, in Figure 12A , the first hole H1, the second hole H2, the second area AA2, the printed circuit board PCB, and the data driver DDV are shown as dotted lines.

[0197] For example, in Figure 12B , the display module DM and the window module WM are each briefly illustrated as a single layer.

[0198] Figures 12A-12B The display device DD and the protective film CTF of Figures 8A-8B are the same as or similar to the display device DD and the protective film CTF of

[0199] Referring to Figure 11B , Figure 12A , and Figure 12B , as illustrated in Figure 11B , the hole film HFL can be removed to inspect the first hole area HA1 and the second hole area HA2. After the inspection of the first hole area HA1 and the second hole area HA2 is completed, the cover film CVF can be on the rear surface DD-LP of the display device DD.

[0200] The structure of the cover film CVF can be substantially the same as that of the hole film HFL. In an embodiment, the cover film CVF can include a first cover film CVF1 and a second cover film CVF2. The first cover film CVF1 can be on the rear surface DD-LP of the display device DD. The first cover film CVF1 can overlap the first hole H1 and the second hole H2. The first cover film CVF1 can cover the first hole H1 and the second hole H2, thus blocking or reducing the introduction of exogenous substances into the first hole H1 and the second hole H2.

[0201] The lower surface of the first cover film CVF1 can not be adhered to the rear surface DD-LP of the display device DD. The adhesion strength between the lower surface of the first cover film CVF1 and the rear surface DD-LP of the display device DD can be 0 gf / in.

[0202] In an embodiment, when the display device DD is conveyed and then housed in Figure 3The first cover film CVF1 can be separated from the display device DD when the display device DD is in the housing EDC. The lower surface of the first cover film CVF1 is not adhered to the rear surface DD-LP of the display device DD, and thus the first cover film CVF1 can be easily separated. Accordingly, the first cover film CVF1 can be removed without (or substantially without) damaging the display device DD.

[0203] The thickness of the first cover film CVF1 in the third direction DR3 can be the same as the sum of the thickness of the first protective film LY1 and the thickness of the second protective film LY2.

[0204] The second cover film CVF2 can be on the upper surface of the first cover film CVF1. The boundary of the second cover film CVF2 can overlap the boundary of the first cover film CVF1. The boundary of the second cover film CVF2 can be on the upper surface of the second protective film LY2. The adhesive strength between the lower surface of the second cover film CVF2 and the upper surface of the second protective film LY2 can be about 10 gf / in to about 20 gf / in.

[0205] The first cover film CVF1 can be fixed on the rear surface DD-LP of the display device DD by the second cover film CVF2 adhered to the protective film CTF. In an embodiment, the first cover film CVF1 can cover the first hole H1 and the second hole H2 regardless of the surface roughness of the rear surface DD-LP of the display device DD.

[0206] A portion of the second cover film CVF2 can extend further outward than the boundary of the display device DD when viewed in a plan view. Accordingly, the cover film CVF can be easily gripped when separated from the display device DD.

[0207] According to an embodiment of the disclosure, a protective film can be on a rear surface of a display device and in a periphery of a first hole defined in the display device. On the rear surface of the display device, a hole film can overlap the first hole. The adhesive strength between the lower surface of the hole film and the rear surface of the display device can be less than the adhesive strength between the lower surface of the hole film and the upper surface of the protective film. The adhesive strength between the lower surface of the hole film and the rear surface of the display device can be 0 gf / in. Accordingly, the hole film can be easily separated from the display device. Thus, damage to the display device can be prevented or reduced when the release film is separated from the display device.

[0208] According to an embodiment of the disclosure, the first hole film can be fixed on the rear surface of the display device through the second hole film adhered to the protection film. Accordingly, the first hole film can cover the first hole area and the second hole area defined in the display device regardless of the surface roughness of the rear surface of the display device DD. In the above, it has been described with reference to the example embodiments of the disclosure, but those skilled in the art or those of ordinary skill in the related art can understand that various appropriate modifications and changes can be made to the subject matter of the disclosure without departing from the spirit and technical scope of the disclosure as described in the claims and the equivalents thereof. Furthermore, the embodiments disclosed in the disclosure are not intended to limit the technical spirit of the disclosure, and all technical ideas within the scope of the claims and the equivalents thereof should be interpreted as being included in the scope of the disclosure.

Claims

1. A release film characterized by, Comprising: a protective film on a rear surface of a display device and in a periphery of a first hole defined in the display device; and a hole film adjacent to the protective film on the rear surface of the display device and overlapping the first hole, wherein the hole film comprises: a first hole film on the rear surface of the display device, and a second hole film including a first portion on an upper surface of the protective film and an upper surface of the first hole film, and an adhesive strength between the rear surface of the display device and a lower surface of the first hole film is less than an adhesive strength between a lower surface of the first portion and the upper surface of the protective film. The adhesive strength between the lower surface of the first hole film and the rear surface of the display device is 0 gf / in.

2. The release film according to claim 1, wherein The adhesive strength between the lower surface of the first portion and the upper surface of the protective film is 10 gf / in to 20 gf / in.

3. The release film according to claim 2, wherein, An area of the first portion is greater than an area of the first hole film when viewed in a plane.

4. The release film according to claim 1, wherein The second hole film further includes a second portion extending from the first portion and further outward than a boundary of the display device.

5. The release film according to claim 4, wherein The protective film includes a first protective film, a second protective film, and a third protective film stacked in order from a lower portion to an upper portion.

6. The release film according to claim 4, wherein An area of the second protective film is greater than an area of the third protective film when viewed in a plane, and 7. The release film according to claim 6, wherein a portion of the second protective film is exposed from the third protective film. The lower surface of the first portion is on an upper surface of the portion of the second protective film exposed from the third protective film.

8. The release film according to claim 7, wherein In a direction from the lower portion to the upper portion, a sum of a thickness of the first protective film and a thickness of the second protective film is the same as a thickness of the first hole film.

9. The release film according to claim 7, wherein The thickness of the first hole film is greater than the thickness of the second hole film.

10. The release film according to claim 9, wherein ​

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