Optical communication device and optical communication apparatus

Abstract

The utility model discloses an optical communication device and optical communication equipment, and belongs to the technical field of optical communication. The optical communication device comprises a circuit board, a cover body, a driving chip and a bidirectional optical assembly, the circuit board comprises a board body, a first metal layer and a heat dissipation channel, the first metal layer is located on the first surface of the board body and comprises an annular structure and a first block-shaped structure, and the first block-shaped structure is located in the annular structure and connected with the annular structure; one end of the heat dissipation channel is located on the first surface of the plate body and connected with the first block-shaped structure, and the other end of the heat dissipation channel is located on the second surface of the plate body. The driving chip and the bidirectional optical assembly are both located on the first surface of the board body, the driving chip is electrically connected with the bidirectional optical assembly, and the driving chip is connected with the first block-shaped structure; the cover body is located on the first surface and connected with the annular structure, and the cover body covers the driving chip and the bidirectional optical assembly. The heat dissipation efficiency of the driving chip can be improved, and the electromagnetic shielding capability of the optical communication device can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical communication technology, and in particular to an optical communication device and an optical communication equipment. BACKGROUND

[0002] In an optical communication system, an optical communication device usually adopts a high-performance bi-direction optical subassembly (BOSA) to transmit optical signals.

[0003] In the related art, an optical communication device includes a circuit board, a driving chip, a BOSA, and a cover. The driving chip, the BOSA, and the cover are all located on a first surface of the circuit board, and the cover is arranged outside the driving chip and the BOSA. The driving chip is electrically connected to the BOSA to drive the BOSA to emit light. During the operation of the driving chip, a large amount of heat is generated. If the heat is not dissipated in time, the performance of the BOSA will be affected, and the BOSA may even fail to work normally.

[0004] In the related art, a heat-conducting pad is usually arranged between the inner wall of the cover and the driving chip, so as to transmit the heat generated by the driving chip to the cover through the heat-conducting pad, and then dissipate the heat from the cover to the outside of the optical communication device. However, the heat dissipation effect of this heat dissipation mode is limited, and cannot meet the heat dissipation requirement of a high-speed optical communication device. UTILITY MODEL CONTENT

[0005] The present application provides an optical communication device and an optical communication equipment, which can quickly dissipate heat while avoiding electromagnetic leakage caused by a heat dissipation structure.

[0006] In a first aspect, the present application provides an optical communication device. The optical communication device includes a circuit board, a cover, a driving chip, and a BOSA. The circuit board includes a board body, a first metal layer, and a heat dissipation channel. The first metal layer is located on a first surface of the board body and includes an annular structure and a first block structure. The first block structure is located in the annular structure and connected to the annular structure. One end of the heat dissipation channel is located on the first surface of the board body, and the one end of the heat dissipation channel is connected to the first block structure. The other end of the heat dissipation channel is located on a second surface of the board body. The driving chip and the BOSA are both located on the first surface of the board body and in the annular structure. The driving chip is electrically connected to the BOSA, and the driving chip is connected to the first block structure. The cover is located on the first surface, and the cover is arranged outside the driving chip and the BOSA and connected to the annular structure.

[0007] By arranging the heat dissipation channel in the circuit board, and one end of the heat dissipation channel is connected with the first block structure, the first block structure is connected with the driving chip, the heat generated by the driving chip can be quickly dissipated from the side where the circuit board is located through the first block structure and the heat dissipation channel, and the heat dissipation effect is better. Moreover, the first block structure is connected with the annular structure, so that the first block structure can be grounded, and the electromagnetic shielding effect is achieved, and the electromagnetic leakage problem caused by the arrangement of the heat dissipation channel is avoided.

[0008] Optionally, the chip body of the driving chip is located in the first block structure in the orthographic projection of the first surface, and the surface of the chip body facing the circuit board is attached to the first block structure. In this way, the contact area of the driving chip and the first block structure is larger, which is beneficial to further improve the heat dissipation efficiency.

[0009] Optionally, the circuit board further comprises a second metal layer, the second metal layer is located on the second surface, and the second metal layer comprises a second block structure connected with the other end of the heat dissipation channel. The heat dissipation effect of metal is better, and the second block structure formed by the metal material can further improve the heat dissipation effect.

[0010] Optionally, the orthographic projection of the first block structure on the first surface is located in the orthographic projection of the second block structure on the first surface. The area of the second block structure is larger, which can cover the entire area where the heat dissipation channel is located, increase the heat dissipation area, and further improve the heat dissipation effect.

[0011] Optionally, the heat dissipation channel is a metallized via. The heat dissipation channel is conductive, which can electrically connect the first block structure with the second block structure, thereby electrically connecting the second block structure with the annular structure, and further achieving the electromagnetic shielding effect. Moreover, the metallized via is formed in the board body as the heat dissipation channel, which is mature in process and easy to implement.

[0012] Optionally, the optical communication device further comprises a shielding piece connected with the first surface. The side wall of the cover body has a gap, the shielding piece shields part of the gap, and the shielding piece and the gap jointly form a channel for the optical fiber of the BOSA to pass through. The shielding piece is connected with the first surface, and a through hole does not need to be arranged on the circuit board, so that the sealing property of the circuit board can be improved, thereby reducing the electromagnetic leakage of the optical communication device. Moreover, the shielding piece shields part of the gap, and the part of the gap not shielded by the shielding piece is the channel for the optical fiber of the BOSA to pass through, so that the sealing property between the cover body and the circuit board can be improved, and the electromagnetic shielding capability of the optical communication device can be improved.

[0013] Optionally, the shielding member comprises a baffle, the baffle has an opening on a side of the baffle away from the first surface, and the opening and the part of the gap form the channel. That is, the part of the opening coinciding with the gap forms the channel for the optical fiber to pass through. In this way, the baffle has a larger size in the arrangement direction of the cover and the circuit board, and can shield more of the gap. The cross-sectional area of the channel only needs to ensure that the optical fiber can pass through. The smaller the cross-sectional area of the channel, the better the sealing between the cover and the circuit board, which is conducive to improving the electromagnetic shielding capability of the optical communication device.

[0014] Optionally, the baffle is located in the cover and is attached to the inner wall of the cover, or the baffle is located outside the cover and is attached to the outer wall of the cover. Since the shielding member is connected to the first surface of the board, the baffle of the shielding member can be arranged inside or outside the cover as needed.

[0015] Optionally, the shielding member further comprises a boss, the boss is located on a side of the baffle facing the gap, and at least part of the boss is located in the gap. The boss can be used to carry the optical fiber of the BOSA, and the boss can further shield part of the gap, together with the baffle, to maximize the shielding of the gap, which is conducive to reducing the gap between the cover and the baffle, thereby improving the electromagnetic shielding capability of the optical device.

[0016] Optionally, the attachment surface of the cover to the circuit board has an annular groove, and the optical communication device further comprises a sealing member for shielding electromagnetic signals, the sealing member is filled in the groove and connects the cover and the circuit board. The sealing member is arranged at the connection between the cover and the circuit board to perform sealing treatment, which reduces the gap between the cover and the circuit board and can play a role in electromagnetic shielding.

[0017] Optionally, the sealing member is connected to the annular structure, and the overlapping area of the projection of the sealing member on the first surface and the projection of the annular structure on the first surface surrounds the driving chip and the BOSA. With this arrangement, the sealing member can be in full contact with the annular structure and better play a role in electromagnetic shielding.

[0018] Optionally, the inner wall of the cover body has a blind hole. The optical communication device further comprises a positioning member, which is located on the first surface, one end of the positioning member being connected to the first surface, and the other end of the positioning member being located in the blind hole. The positioning member is connected to the first surface, and a through hole does not need to be formed on the circuit board, which is conducive to improving the sealing performance of the circuit board. Moreover, the other end of the positioning member is located in the blind hole of the cover body, and an opening matched with the positioning member does not need to be formed on the cover body, which is conducive to improving the sealing performance of the cover body. The sealing performance of the circuit board and the sealing performance of the cover body are improved, thereby being conducive to improving the electromagnetic compatibility (EMC) performance of the optical communication device.

[0019] Optionally, the ring-shaped structure has a wire gap, and the first metal layer further comprises a signal wire, which is connected to the driving chip and passes through the wire gap. The ring-shaped structure only has the wire gap for the signal wire connected to the driving chip to pass through, and does not have a gap for a signal wire connected to the receiver in the BOSA to pass through, so that the number of gaps in the ring-shaped structure is small, which is conducive to improving the EMC performance of the optical communication device.

[0020] In a second aspect, the present application provides an optical communication device, for example, an optical network unit (ONU), an optical line terminal (OLT), or a master device or a slave device in a fiber to the room (FTTR) network.

[0021] Optionally, the optical communication device comprises a housing and any of the optical communication devices described above, and the optical communication device is located in the housing. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a structural schematic diagram of an optical communication device provided by an embodiment of the present application;

[0023] Figure 2 is Figure 1 is a top view structural schematic diagram of a first metal layer of a circuit board in

[0024] Figure 3 is Figure 1 is a partial cross-sectional structural schematic diagram of a circuit board;

[0025] Figure 4 is a bottom view structural schematic diagram of a cover body provided by an embodiment of the present application;

[0026] Figure 5 is a combined structural schematic diagram of a circuit board, a driving chip and a BOSA provided by an embodiment of the present application;

[0027] Figure 6 is a schematic diagram of a three-dimensional structure of a shielding piece provided by an embodiment of the present application;

[0028] Figure 7 is a schematic diagram of a cooperation relationship between another shielding piece and a cover provided by an embodiment of the present application;

[0029] Figure 8 is a schematic diagram of a cooperation relationship between still another shielding piece and a cover provided by an embodiment of the present application;

[0030] Figure 9 is a schematic diagram of a cooperation relationship between yet another shielding piece and a cover provided by an embodiment of the present application. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0032] Figure 1 is a schematic diagram of a structure of an optical communication device provided by an embodiment of the present application. As shown in Figure 1 , the optical communication device comprises a circuit board 10, a cover 20, a driving chip 30 and a BOSA 40. The circuit board 10 comprises a board body 11. The board body 11 has a first surface 11a, and the cover 20, the driving chip 30 and the BOSA 40 are all located on the first surface 11a of the board body 11. The driving chip 30 is electrically connected with the BOSA 40 to drive the BOSA 40 to emit light. The cover 20 is arranged outside the driving chip 30 and the BOSA 40.

[0033] The cover 20 is arranged outside the driving chip 30 and the BOSA 40, and can play a role of electromagnetic shielding. In the embodiment of the present application, the cover 20, the driving chip 30 and the BOSA 40 are all located on the first surface 11a of the board body 11. This structure can be called a single-sided shielding structure. Compared with a double-sided shielding structure, the single-sided shielding structure can reduce the cover on the other side of the circuit board, which is conducive to reducing the cost and simplifying the assembly process of the optical communication device.

[0034] Figure 2 is a schematic diagram of a top structure of a first metal layer of the circuit board in Figure 1 . As shown in Figure 2 , the circuit board 10 further comprises a first metal layer 12. The first metal layer 12 is located on the first surface 11a of the board body 11. The first metal layer 12 comprises an annular structure 12a and a first block structure 12b, and the first block structure 12b is located in the annular structure 12a and connected with the annular structure 12a. The driving chip 30 and the BOSA 40 are both located in the annular structure 12a. The annular structure 12a is connected with the cover 20.

[0035] Figure 3 is Figure 1 Fig. 2 is a schematic diagram of a partial cross-sectional structure of the circuit board, showing the cross-sectional structure at the driving chip 30. As shown in Fig. 2, the driving chip 30 is connected with the first block structure 12b. The circuit board 10 further comprises a heat dissipation channel 13, one end of which is located at the first surface 11a of the board body 11 and connected with the first block structure 12b, and the other end of which is located at the second surface 11b of the board body 11. Figure 3

[0036] By arranging the heat dissipation channel 13 in the circuit board 10 and connecting one end of the heat dissipation channel 13 with the first block structure 12b, which is connected with the driving chip 30, the heat generated by the driving chip 30 can be quickly dissipated from the side where the circuit board 10 is located through the first block structure 12b and the heat dissipation channel 13, and the heat dissipation effect is good. Moreover, the first block structure 12b is connected with the annular structure 12a, so that the first block structure 12b can be grounded and play a role of electromagnetic shielding, avoiding the problem of electromagnetic leakage caused by the arrangement of the heat dissipation channel 13.

[0037] In the embodiment of the present application, the first metal layer 11 can be copper, iron or nickel, etc. The area of the annular structure 11a can be arranged according to the area of the joint surface of the cover body 20 and the board body 11, for example, the area of the annular structure 11a can be equal to the area of the joint surface of the cover body 20 and the board body 11. Arranging the annular structure 11a at the joint of the cover body 20 and the circuit board 10 can enhance the reflection and absorption of electromagnetic waves and improve the shielding effect.

[0038] In the embodiment of the present application, the driving chip 30 comprises a chip body and a chip pin (not shown in the figure), one end of the chip pin is connected with the chip body, and the other end is located at the periphery of the chip pin and connected with the circuit board 10.

[0039] In a possible embodiment, as shown in Fig. 2, the orthographic projection of the chip body of the driving chip 30 on the first surface 11a is located within the orthographic projection of the first block structure 12b on the first surface 11a, and the surface of the chip body facing the circuit board 10 is attached to the first block structure 12b. Here, the attachment means that the surface of the chip body facing the circuit board 10 is in contact with or connected to the surface of the first block structure 12b. In this way, the contact area between the driving chip and the first block structure is large, which is conducive to improving the heat dissipation efficiency. Figure 3

[0040] Optionally, the heat dissipation channel 13 is a metallized via. In this case, the heat dissipation channel 13 is conductive, which can electrically connect the first block structure with the second block structure, thereby electrically connecting the second block structure with the annular structure, and further playing a role of electromagnetic shielding. Moreover, the metallized via is formed in the board body 11 as the heat dissipation channel, which is mature in process and easy to implement.​​

[0041] In the embodiments of the present application, the number of heat dissipation channels 13 in the circuit board 10 can be set according to actual heat dissipation requirements, and can include one or more heat dissipation channels 13. In order to improve the heat dissipation effect, the circuit board 10 can include a plurality of heat dissipation channels 13, and the plurality of heat dissipation channels 13 are arranged in an array.

[0042] In a possible implementation, as shown in Figure 3 The plate body 11 has a plurality of first through holes, and the first block structure 12b has a plurality of second through holes, the plurality of second through holes and the plurality of first through holes are arranged one by one, and each second through hole is in communication with the corresponding first through hole. When the driving chip 30 is welded to the circuit board 10, the solder is arranged on the circuit board 10 first, and after the solder is heated and melted, it flows into the first through hole and the second through hole, and fills the connected first through hole and second through hole, thereby forming a metallized via hole.

[0043] In another possible implementation, a plurality of metallized via holes can be formed in the plate body 11 in advance, and then the first metal layer 12 is formed on the first surface 11a of the plate body 11. The first block structure 12b of the first metal layer 12 covers the area where the plurality of metallized via holes are located, and is connected to one end of each metallized via hole.

[0044] In combination with Figure 2 and Figure 3 The circuit board 10 further includes a second metal layer 14, and the second metal layer 14 is located on the second surface 11b. The second metal layer 14 includes a second block structure 14a, and the second block structure 14a is connected to the other end of the heat dissipation channel 13. The metal has good heat conduction effect, and by arranging the second block structure 14a of the metal, the heat dissipation effect can be further improved.

[0045] As shown in Figure 2 The orthographic projection of the first block structure 12b on the first surface 11a is within the orthographic projection of the second block structure 14a on the first surface 11a (as shown by the dashed box in the figure). The second block structure 14a has a large area and can cover the entire area where the heat dissipation channel 13 is located, thereby increasing the heat dissipation area and further improving the heat dissipation effect.

[0046] It should be noted that, Figure 2 In the embodiments, the orthographic projection of the first block structure 12b on the first surface 11a is inside the orthographic projection of the second block structure 14a on the first surface 11a, and in other embodiments, the orthographic projection of the first block structure 12b on the first surface 11a can coincide with the orthographic projection of the second block structure 14a on the first surface 11a.

[0047] Again referring to Figure 2The first annular structure 12a has a wire gap 121. The first metal layer 12 further includes a signal wire (not shown in the figure) connected with the driving chip 30 and passing through the wire gap 121 to connect the driving chip 30 with an external control circuit. It should be noted that the first surface 11a of the board body 11 is provided with an insulating protective layer (for example, green oil) in addition to the first metal layer 11, which covers the part of the first metal layer 12 except the annular structure 12a and the first block structure 12b, that is, the insulating protective layer covers the signal wire in the wire gap 121, and thus the signal wire is not shown in the figure.

[0048] In the embodiment of the present application, the signal wire connected with the driving chip 30 is located in the first metal layer 12, and the signal wire connected with the receiving light assembly in the BOSA 40 is located inside the circuit board 10, that is, not in the first metal layer 12, so that the annular structure 12a does not need to be provided with a wire gap for the signal wire to pass through, which is beneficial to improve the electromagnetic shielding performance of the optical communication device.

[0049] Figure 4 is a bottom structure schematic diagram of a cover body provided by an embodiment of the present application. In combination with Figure 1 and Figure 4 , the abutting surface of the cover body 20 to the circuit board 10 has an annular groove 21, and the optical communication device further includes a sealing member 50 for shielding electromagnetic signals, the sealing member 50 is filled in the groove 21 and connects the cover body 20 and the circuit board 10. The sealing member 50 is arranged at the connection between the cover body 20 and the circuit board 10 to perform sealing treatment, which reduces the gap between the cover body 20 and the circuit board 10 and is beneficial to improve the EMC performance of the optical communication device.

[0050] The sealing member 50 can be made of an elastic compressible conductive material. The compressible conductive material includes but is not limited to conductive foam, conductive colloid, etc. The sealing member 50 is made of an elastic compressible material, which can improve the sealing effect between the cover body 20 and the circuit board 10 and further improve the EMC performance of the optical communication device.

[0051] In some examples, the sealing member 50 is a formed in place (FIP) adhesive. The FIP adhesive is a composite conductive shielding material mainly composed of a base liquid silicone, a conductive powder, a solvent and an additive. The conductive powder can be pure silver, silver-aluminum, silver-nickel or other silver-based conductive powder with high conductivity, or nickel-coated graphite powder with high conductivity and high magnetic permeability. After the FIP conductive adhesive is cured, a conductive sealing gasket structure required is formed, which plays a role in electromagnetic shielding by maintaining a certain compression amount.

[0052] Figure 5 is a combination structure schematic diagram of a circuit board, a driving chip and a BOSA provided by an embodiment of the present application. As shown inFigure 5 As shown, the sealing member 50 is connected with the annular structure 12a, and the overlapping area of the projection of the sealing member 50 on the first surface 11a and the projection of the annular structure 12a on the first surface 11a surrounds the driving chip 30 and the BOSA 40. With this arrangement, the sealing member 50 can be in full contact with the annular structure 12a, and better play the role of electromagnetic shielding.

[0053] In the embodiment of the present application, the annular structure 12a has a wiring gap 121, and the sealing member 50 is a closed annular structure or an annular structure with a gap for accommodating a blocking member as described below, so that the overlapping area of the projection of the annular structure 12a on the first surface 11a and the projection of the sealing member 50 on the first surface 11a is an annular structure with a gap.

[0054] As shown, Figure 5 The BOSA 40 includes a transmitting optical sub-assembly (TOSA) 42 and a receiving optical sub-assembly (ROSA) 43 and an optical fiber 41. The transmitting optical sub-assembly 42 and the receiving optical sub-assembly 43 are both accommodated in the accommodation space formed by the cover 20 and the circuit board 10. The optical fiber 41 extends out of the cover 20. Among them, the role of the transmitting optical sub-assembly 42 is to convert the electrical signal from the outside into an optical signal, and send the optical signal through the optical fiber 41. The role of the receiving optical sub-assembly 43 is to receive the optical signal transmitted by the optical fiber 41, and convert the optical signal into an electrical signal.

[0055] In combination with Figure 4 and Figure 5 , the board 11 also has a first connecting hole 15, and the cover 20 has a second connecting hole 22. The first connecting hole 15 and the second connecting hole 22 are arranged one by one. The corresponding first connecting hole 15 and the second connecting hole 22 are provided with fasteners, so as to connect the board 11 and the cover 20 together. The fasteners include but are not limited to bolts or screws and the like.

[0056] Exemplarily, in the embodiment of the present application, the projection of the cover 20 on the first surface 11a is substantially rectangular, and one second connecting hole 22 is arranged at each of the four corners of the rectangle, so as to facilitate the connection of the circuit board 10 and the cover 20 together.

[0057] In order to facilitate the alignment and connection of the cover 20 and the circuit board 10, the inner wall of the cover 20 has a blind hole 23. The optical communication device further comprises a positioning member 60, which is located on the first surface 11a, one end of the positioning member 60 is connected with the first surface 11a, and the other end of the positioning member 60 is located in the blind hole 23. Optionally, the positioning member 60 can be a positioning pin or the like.

[0058] The positioning member 60 is connected with the first surface 11a, and no through hole needs to be formed in the circuit board 10, which is beneficial to improve the sealing performance of the circuit board 10. In addition, the other end of the positioning member 60 is located in the blind hole 23 of the cover 20, and no opening needs to be formed on the cover 20 to cooperate with the positioning member 60, which is beneficial to improve the sealing performance of the cover 20. The sealing performance of the circuit board 10 and the sealing performance of the cover 20 are improved, thereby being beneficial to provide the EMC performance of the optical communication device.

[0059] In the embodiment of the present application, the positioning member 60 and the fastener are both connected with the annular structure 12a.

[0060] Again referring to Figure 1 , in order to improve the electromagnetic shielding effect of the optical communication device, the optical communication device further comprises a shielding member 70, and the shielding member 70 is connected with the first surface 11a. The side wall of the cover 20 has a gap 20a, and the shielding member 70 shields at least part of the gap 20a, and the shielding member 70 and the gap 20a jointly form a channel for the optical fiber 41 of the BOSA 40 to pass through. The shielding member 70 is connected with the first surface 11a, and no through hole needs to be formed in the circuit board 10, which is beneficial to improve the sealing performance of the circuit board 10, thereby reducing the electromagnetic leakage of the optical communication device. In addition, the shielding member 70 shields part of the gap 20a, and the part of the gap 20a that is not shielded is the channel for the optical fiber 41 of the BOSA 40 to pass through, so that the sealing performance between the cover 20 and the circuit board 10 is improved, and the electromagnetic shielding capability of the optical communication device is improved.

[0061] Optionally, as shown in Figure 6 , the shielding member 70 comprises a baffle 71 and a boss 72, the baffle 71 has an opening 71a, and the opening 71a is located on the side of the baffle 71 away from the first surface 11a. In combination with Figure 1 , the opening 71a and part of the gap 20a form a channel. The baffle 71 is located in the cover 20 and is attached to the inner wall of the cover 20. The boss 72 is located on the side of the baffle 71 facing the gap 20a, and at least part of the boss 72 is located in the gap 20a.

[0062] That is, the part of the opening 71a coinciding with the gap 20a forms a channel for the optical fiber to pass through. In this way, the size of the baffle 71 in the arrangement direction of the cover 20 and the circuit board 10 is larger, which can shield more of the gap 20a, and the cross-sectional area of the channel only needs to ensure that the optical fiber can pass through, so the cross-sectional area of the channel is smaller. The smaller the cross-sectional area of the channel, the better the sealing performance between the cover 20 and the circuit board 10, which is beneficial to improve the electromagnetic shielding capability of the optical communication device. In addition, the boss 72 can be used to carry the optical fiber 41 of the BOSA 40, and the boss 72 can further shield part of the gap 20a, together with the baffle 71 to maximize the shielding of the gap 20a, which is beneficial to reduce the gap between the cover 20 and the baffle 71, thereby improving the electromagnetic shielding capability of the optical device.

[0063] In implementation, the baffle 71 and the boss 72 can be formed by an integral molding process or connected by welding or the like.

[0064] Figure 7 is another schematic diagram of the cooperation relationship between the shielding member and the cover provided by the embodiment of the present application. Compared with Figure 1 , the difference lies in that Figure 7 the baffle 71 is located outside the cover 20 and attached to the outer wall of the cover 20. Figure 8 is still another schematic diagram of the cooperation relationship between the shielding member and the cover provided by the embodiment of the present application. As shown in Figure 8 , compared with Figure 1 , the difference lies in that the shielding member 70 includes the baffle 71 but does not include the boss 72. Figure 9 is still another schematic diagram of the cooperation relationship between the shielding member and the cover provided by the embodiment of the present application. As shown in Figure 9 , compared with Figure 7 , the difference lies in that the shielding member 70 includes the baffle 71 but does not include the boss 72. In implementation, the baffle 71 of the shielding member 70 can be arranged inside or outside the cover 20 according to requirements. In addition, in Figure 8 and Figure 9 , the structure of the shielding member 70 is simpler and easier to process and manufacture.

[0065] Optionally, the shielding member 70 can be made of a metal material, such as copper, nickel, iron or the like.

[0066] In some embodiments, the optical communication device can be an optical module.

[0067] The embodiment of the present application further provides an optical communication equipment, which can convert a data signal into an optical signal and send the optical signal to a peer equipment through an optical fiber; receive an optical signal sent by the peer equipment through the optical fiber and convert the optical signal into an electrical signal, and recover a received data signal from the electrical signal.

[0068] Optionally, the optical communication equipment includes a housing and the optical communication device described above, and the optical communication device is located in the housing.

[0069] In implementation, the optical communication equipment can further include other structures, such as a media access control (MAC) chip or other control chips.

[0070] Optionally, the optical communication equipment can be a master device or a slave device in an ONU, an OLT or an FTTR network. The master device in the FTTR network can also be referred to as a master gateway or a master optical modem, and correspondingly, the slave device in the FTTR network can also be referred to as a slave gateway or a slave optical modem.

[0071] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains. The terms “first,” “second,” “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar terms mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, and do not exclude other elements or objects. The “multiple” mentioned in the embodiments of this application refers to two or more. A and / or B indicate three possibilities: A; B; and A and B.

[0072] The above is merely one embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An optical communication device, characterized by, The optical communication device comprises a circuit board, a cover, a driving chip and a bidirectional optical assembly, The circuit board comprises a board body, a first metal layer and a heat dissipation channel, the first metal layer is located on a first surface of the board body, and comprises an annular structure and a first block structure, the first block structure is located in the annular structure and connected with the annular structure, one end of the heat dissipation channel is located on the first surface of the board body, and the one end of the heat dissipation channel is connected with the first block structure, the other end of the heat dissipation channel is located on a second surface of the board body; The driving chip and the bidirectional optical assembly are both located on the first surface of the board body, the driving chip is electrically connected with the bidirectional optical assembly, and the driving chip is connected with the first block structure; The cover is located on the first surface, the cover covers the driving chip and the bidirectional optical assembly, and the cover is connected with the annular structure.

2. The optical communication device of claim 1, wherein, A normal projection of a chip body of the driving chip on the first surface is located in a normal projection of the first block structure on the first surface, and a surface of the chip body facing the circuit board is attached to the first block structure.

3. The optical communication device of claim 1, wherein, The circuit board further comprises a second metal layer, the second metal layer is located on the second surface, and the second metal layer comprises a second block structure, the second block structure is connected with the other end of the heat dissipation channel.

4. The optical communication device of claim 3, wherein, The normal projection of the first block structure on the first surface is in the normal projection of the second block structure on the first surface.

5. The optical communication device of any one of claims 1 to 4, wherein, The heat dissipation channel is a metallized via hole.

6. The optical communication device of claim 5, wherein, A side wall of the cover has a gap, the optical communication device further comprises a shielding piece connected with the first surface, The shielding piece shields part of the gap, and the shielding piece and the gap jointly form a channel for an optical fiber of the bidirectional optical assembly to pass through.

7. The optical communication device of claim 6, wherein, The shielding piece comprises a baffle, the baffle has an opening located on a side of the baffle away from the first surface, and the opening and part of the gap form the channel.

8. The optical communication device of claim 7, wherein, The baffle is located in the cover and attached to an inner wall of the cover, or the baffle is located outside the cover and attached to an outer wall of the cover.

9. The optical communication device of claim 8, wherein, The shielding piece further comprises a boss, the boss is located on a side of the baffle facing the gap, and at least part of the boss is located in the gap.

10. The optical communication device of any of claims 1-4 and 6-9, wherein, A bonding surface of the cover to the circuit board has an annular groove, the optical communication device further comprises a sealing piece for shielding electromagnetic signals, the sealing piece is filled in the groove and connects the cover and the circuit board.

11. The optical communication device of claim 10, wherein, The sealing piece is connected with the annular structure, and a normal projection of the sealing piece on the first surface surrounds a coincident area of a normal projection of the annular structure on the first surface around the driving chip and the bidirectional optical assembly.

12. The optical communication device of any of claims 1-4, 6-9, and 11, wherein, An inner wall of the cover has a blind hole, The optical communication device further comprises a positioning piece located on the first surface, one end of the positioning piece is connected with the first surface, and the other end of the positioning piece is located in the blind hole.

13. The optical communication device of any of claims 1-4, 6-9, and 11, wherein, The ring-shaped structure has a trace gap, and the first metal layer further comprises a signal trace, which is connected with the driving chip and passes through the trace gap.

14. An optical communication device, comprising: The optical communication device as claimed in any one of claims 1 to 13, wherein the optical communication device is located in a housing.

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