Multilayer alloy foil resistor

Abstract

The utility model discloses a multilayer alloy foil resistor which comprises an insulating substrate and a resistor body arranged below the insulating substrate in an attached mode, grooves are formed in the top sides of the two ends of the insulating substrate, copper plates are arranged on the bottom sides of the two ends of the resistor body, and the two ends of each copper plate are fixedly connected with copper columns. The multi-layer alloy foil resistor comprises a plurality of copper columns, the copper columns upwards sequentially penetrate through the resistor body and the insulating substrate and then extend into the grooves, inserting blocks are arranged at the upper ends of the copper columns, insulating locking strips are inserted into the grooves, inserting grooves in sliding fit with the inserting blocks are formed in the bottom sides of the insulating locking strips, and U-shaped electrodes are further arranged at the two ends of the multi-layer alloy foil resistor. One inner side wall of the U-shaped electrode is in contact with the upper side surface of the insulating substrate in an attached manner, and the other inner side wall is in contact with the lower side surface of the copper plate in an attached manner. The multi-layer alloy foil resistor has relatively high assembly precision for the assembly between the resistor body and the insulating substrate.

Description

TECHNICAL FIELD

[0001] The utility model relates to a resistance element, concretely, a kind of multilayer alloy foil resistance. BACKGROUND

[0002] Alloy foil resistor is a kind of precision resistor, mainly using alloy foil as resistance material, to provide very high precision and stability.

[0003] The big power alloy foil resistor of the disclosure number CN113113199B is disclosed, including substrate, resistance element that is attached with substrate, electrode that is connected at the both ends of resistance element, the resistance element includes one intermediate material piece and two resistance alloy pieces;The intermediate material piece is clamped between two resistance alloy pieces and simultaneously connected with two resistance alloy pieces, two resistance alloy pieces are connected with electrode at both ends respectively;Intermediate material piece is low-resistivity high-thermal-conductivity metal material.

[0004] For the big power alloy foil resistor, when assembling, resistance element and substrate are connected together by adhesive layer, lack auxiliary positioning structure, therefore, resistance element and substrate still need to be carried out complex alignment operation, and assembly precision is not easy to control, or need to be aligned with the aid of complex external equipment. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of multilayer alloy foil resistance, the multilayer alloy foil resistance has higher assembly precision for the assembly between resistance body and insulating substrate.

[0006] In order to realize the above-mentioned purpose, the utility model provides a kind of multilayer alloy foil resistance, including insulating substrate and resistance body that is attached and set under the insulating substrate, the both end top side of the insulating substrate is provided with groove, the both end bottom side of the resistance body is provided with copper plate, the both end of the copper plate is fixedly connected with copper column, the copper column is sequentially penetrated into the groove after the resistance body and insulating substrate are extended to the groove, the upper end of the copper column is provided with plug block, the insulating lock strip is inserted into the groove, the bottom side of the insulating lock strip is provided with the insertion slot that is slidably matched with the plug block, the both end of the multilayer alloy foil resistance is also provided with U-shaped electrode, one inner side wall of the U-shaped electrode is attached and contacted with the upper side of the insulating substrate, and the other inner side wall is attached and contacted with the lower side of the copper plate.

[0007] Preferably, the insulating substrate is ceramic substrate, the first through hole for the copper column to pass through is provided in the groove, and the second through hole for the copper column to pass through is provided on the resistance body.

[0008] Preferably, the upper surface of the insulating lock strip is flush with the upper surface of the insulating substrate.

[0009] Preferably, the bottom surface of the resistor is coated with an insulating coating between the two copper plates.

[0010] Preferably, the U-shaped electrode comprises, from inside to outside, a copper layer, a nickel layer and a tin layer.

[0011] Preferably, the two ends of the nickel layer are provided with first folds respectively abutting against the insulating substrate and the insulating coating.

[0012] Preferably, the two ends of the tin layer are provided with second folds respectively abutting against the insulating substrate and the insulating coating.

[0013] Preferably, the resistor is a copper-manganese alloy.

[0014] According to the above technical solution, the utility model provides a kind of multilayer alloy foil resistance, including insulating substrate and the resistance body of adhesion setting in the insulating substrate below, the top side of the two ends of the insulating substrate is provided with groove, the bottom side of the two ends of the resistance body is provided with copper plate, the two ends of the copper plate are fixedly connected with copper column, the copper column is sequentially penetrated upwards the resistance body and insulating substrate and then extends to the groove, the upper end of the copper column is provided with plug block, the groove is inserted with insulating lock strip, the bottom side of the insulating lock strip is provided with the insertion slot of the plug block sliding cooperation, the two ends of the multilayer alloy foil resistance are also provided with U-shaped electrode, one inner side wall of the U-shaped electrode and the upper side of the insulating substrate are adhesion contact, and the other inner side wall and the lower side of the copper plate are adhesion contact.

[0015] The multilayer alloy foil resistance has the following beneficial effects: after the resistance body is adhesion to the insulating substrate, the copper column on the two ends of copper plate is sequentially penetrated through the resistance body and insulating substrate, and then the insulating lock strip is inserted into the groove on the insulating substrate from side, so that the insertion slot under the insulating lock strip can be fitted on the plug block, the position of copper plate is locked, and the resistance body is fixed under the extrusion of copper plate, due to the limiting effect of copper column, the relative position between the insulating substrate and the resistance body is also fixed, so that the assembly between the resistance body and the insulating substrate has high assembly precision. In addition, due to the characteristics of the structure, the resistance body and the insulating substrate can also be connected without glue.

[0016] Other features and advantages of the utility model will be described in detail in the following specific implementation manner part. BRIEF DESCRIPTION OF DRAWINGS

[0017] The drawings are used to provide further understanding of the utility model, and constitute a part of the specification, and are used together with the following specific implementation to explain the utility model, but do not constitute the limitation to the utility model. In the drawings:

[0018] Figure 1is a schematic diagram of the overall structure of a preferred embodiment of a multilayer alloy foil resistor;

[0019] Figure 2 is a schematic diagram of the top view structure of a preferred embodiment of a multilayer alloy foil resistor;

[0020] Figure 3 is Figure 2 a schematic diagram of the A-A cross-sectional structure of

[0021] Figure 4 is a schematic diagram of the overall structure of a preferred embodiment of a resistor body;

[0022] Figure 5 is a schematic diagram of the overall structure of a preferred embodiment of an insulating substrate;

[0023] Figure 6 is a schematic diagram of the overall structure of a preferred embodiment of a copper plate and copper column connection.

[0024] Explanation of reference signs

[0025] 1-insulating substrate; 2-resistor body; 3-insulating coating; 4-copper plate; 5-copper layer; 6-nickel layer; 7-tin layer; 8-insulating lock strip; 9-insertion slot; 10-first fold; 11-second fold; 12-copper column; 13-second through hole; 14-groove; 15-first through hole; 16-insertion block. DETAILED DESCRIPTION

[0026] The specific embodiments described hereinbelow are intended to be illustrative only and are not intended to limit the scope of the present application. Changes can be made in the generic principles described hereinbelow within the scope of the present application.

[0027] In the present application, unless otherwise specified, the orientation words contained in the terms such as "up and down, left and right, front and back, inside and outside" only represent the orientation of the terms in the normal use state, or the common name understood by those skilled in the art, and should not be regarded as a limitation on the terms.

[0028] Referring to Figures 1-6The multilayer alloy foil resistor shown, including an insulating substrate 1 and a resistor body 2 attached to the insulating substrate 1, the two ends of the top side of the insulating substrate 1 are provided with grooves 14, the two ends of the bottom side of the resistor body 2 are provided with copper plates 4, the two ends of the copper plate 4 are fixedly connected with copper columns 12, the copper columns 12 sequentially penetrate the resistor body 2 and the insulating substrate 1 upwards and extend into the grooves 14, the upper end of the copper column 12 is provided with an insertion block 16, the grooves 14 are inserted with insulating lock strips 8, the bottom side of the insulating lock strip 8 is provided with an insertion slot 9 which is in sliding fit with the insertion block 16, and the two ends of the multilayer alloy foil resistor are also provided with U-shaped electrodes, one of the inner side walls of the U-shaped electrodes is in abutting contact with the upper side of the insulating substrate 1, and the other inner side wall is in abutting contact with the lower side of the copper plate 4.

[0029] Through the implementation of the above technical scheme, when the multilayer alloy foil resistor in the utility model is assembled, after the resistor body 2 is attached to the insulating substrate 1, the copper columns 12 on the two ends of the copper plate 4 sequentially penetrate the resistor body 2 and the insulating substrate 1, and then the insulating lock strips 8 are inserted into the grooves on the insulating substrate 1 from the side, so that the insertion slots 9 under the insulating lock strips 8 can be fitted on the insertion block 16, the position of the copper plate 4 is locked, and the resistor body 2 is tightly fixed under the extrusion of the copper plate 4, due to the limiting effect of the copper columns 12, the relative position between the insulating substrate 1 and the resistor body 2 is also fixed, so that the assembly between the resistor body 2 and the insulating substrate 1 has high assembly precision. In addition, due to the characteristics of the structure, the resistor body 2 and the insulating substrate 1 can also be connected without glue.

[0030] In this embodiment, the insulating substrate 1 is a ceramic substrate, the first through hole 15 for the copper column 12 to pass through is arranged in the groove 14, and the second through hole 13 for the copper column 12 to pass through is arranged on the resistor body 2. Figure 4 and Figure 5 The copper column 12 body is in the shape of a quadrangular prism, the shapes of the first through hole 15 and the second through hole 13 are matched with the copper column 12, so as to limit the relative position between the insulating substrate 1 and the resistor body 2.

[0031] In this embodiment, the upper surface of the insulating lock strip is flush with the upper surface of the insulating substrate 1. Through such a setting, the inner side wall of the U-shaped electrode can abut the upper surface of the insulating lock strip, so that the limiting strip is more stable. Of course, in order to make the insulating lock strip 8 have enough stability and not slide outwards, the quick-drying glue can be injected into the insertion slot 9 after the multilayer alloy foil resistor is completely assembled, so that the transverse position of the insulating lock strip 8 is fixed.

[0032] In this embodiment, the bottom surface of the resistor 2 is coated with an insulating coating 3 between the two copper plates 4. The insulating coating 3 serves the purpose of insulation protection. Of course, the insulating coating 3 can also be applied to other exposed positions as needed.

[0033] In this embodiment, the U-shaped electrode comprises, from the inside to the outside, a copper layer 5, a nickel layer 6 and a tin layer 7. The tin layer 7 on the outer surface facilitates the soldering of the terminal electrode assembly to the circuit board, the nickel layer 6 serves as an isolation layer, and the copper layer 5 can serve as a good conductor.

[0034] In this embodiment, the nickel layer 6 is provided with first folds 10 at both ends, which abut against the insulating substrate 1 and the insulating coating 3, respectively. The tin layer 7 is provided with second folds 11 at both ends, which abut against the insulating substrate 1 and the insulating coating 3, respectively. Through the above arrangement, the first folds 10 and the second folds 11 can block the ends of the copper layer 5, avoiding the exposure of the ends of the copper layer 5 and accelerating corrosion.

[0035] In this embodiment, in order to further provide a resistor, the resistor 2 is a copper-manganese alloy.

[0036] The preferred embodiments of the present application are described in detail above with reference to the accompanying drawings, but the present application is not limited to the specific details in the above embodiments. Within the technical concept of the present application, the technical solution of the present application can be subjected to various simple modifications, and these simple modifications all belong to the protection scope of the present application.

[0037] In addition, it should be noted that each specific technical feature described in the above specific embodiments can be combined in any appropriate manner without contradiction. In order to avoid unnecessary repetition, the present application will not further describe various possible combinations.

[0038] In addition, various different embodiments of the present application can also be combined in any manner, as long as they do not deviate from the technical concept of the present application, and they should also be considered as disclosed by the present application.

Claims

1. A multilayer alloy foil resistor characterized by, The multilayer alloy foil resistor comprises an insulating substrate (1) and a resistor body (2) attached to the insulating substrate (1); The insulating substrate (1) is provided with a groove (14) on the top side of the two ends, and the resistor body (2) is provided with a copper plate (4) on the bottom side of the two ends, and the copper plate (4) is fixedly connected with a copper column (12) at the two ends; The copper column (12) extends into the groove (14) after penetrating the resistor body (2) and the insulating substrate (1) in sequence, and the upper end of the copper column (12) is provided with an insertion block (16); The groove (14) is provided with an insulating lock strip (8) inserted therein, and the bottom side of the insulating lock strip (8) is provided with an insertion slot (9) in sliding fit with the insertion block (16); The multilayer alloy foil resistor is further provided with a U-shaped electrode, one of the inner side walls of the U-shaped electrode is in contact with the upper side of the insulating substrate (1), and the other inner side wall is in contact with the lower side of the copper plate (4).

2. The multi-layer alloy foil resistor of claim 1, wherein The insulating substrate (1) is a ceramic substrate; The groove (14) is provided with a first through hole (15) for the copper column (12) to pass through, and the resistor body (2) is provided with a second through hole (13) for the copper column (12) to pass through.

3. The multi-layer alloy foil resistor of claim 1, wherein, The upper surface of the insulating lock strip (8) is flush with the upper surface of the insulating substrate (1).

4. The multi-layer alloy foil resistor of claim 1, wherein The bottom surface of the resistor body (2) is coated with an insulating coating (3) between the two copper plates (4).

5. The multi-layer alloy foil resistor of claim 4, wherein The U-shaped electrode comprises a copper layer (5), a nickel layer (6) and a tin layer (7) from inside to outside.

6. The multi-layer alloy foil resistor of claim 5, wherein The two ends of the nickel layer (6) are provided with first folding parts (10) respectively abutting against the insulating substrate (1) and the insulating coating (3).

7. The multi-layer alloy foil resistor of claim 6, wherein The two ends of the tin layer (7) are provided with second folding parts (11) respectively abutting against the insulating substrate (1) and the insulating coating (3).

8. The multi-layer alloy foil resistor of claim 1, wherein, The resistor body (2) is a copper-manganese alloy.

Images