Electronic device
By using an independent voltage detection circuit to detect the connection status of the antenna bracket, the problem of high cost and space occupation caused by a large number of air interface detection circuits is solved, and a more economical status judgment is achieved.
Patent Information
- Application Number
- CN202423222649.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2034-12-25
AI Technical Summary
The numerous air interface detection circuits in existing electronic devices increase the number of components and the area occupied by the motherboard, resulting in high costs.
An independent voltage detection circuit is used to determine whether the electronic device is in a conducted test state or a complete system state by detecting whether the conductive parts on the antenna bracket are connected, thus reducing the dependence on each radio frequency circuit.
It reduces circuit costs, decreases motherboard footprint, and enables accurate judgment of conduction test status and overall system status.
Smart Images
Figure CN223809245U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electronic circuit technical field especially relates to an electronic device. BACKGROUND
[0002] For wireless communication electronic equipment such as mobile phone, need carries out specific absorption ratio (Specific Absorption Ratio, SAR) value test to assess the influence of electronic equipment electromagnetic radiation, SAR value test is carried out under the complete whole machine state (need to install the complete antenna of electronic equipment). Through the coupling mode test SAR related index, in order to satisfy the relevant regulations of SAR, the whole machine state needs to make corresponding power backoff to the emission antenna that does not satisfy SAR specification. In the conduction test, because to satisfy the relevant regulations of conduction, power can not make corresponding backoff, and the conduction test is realized through the test line connection radio frequency test seat test, and does not need to install the antenna of electronic equipment. Therefore, the air interface detection circuit is needed to detect whether electronic equipment is in the conduction test state or the whole machine state.
[0003] At present, the air interface detection circuit detects whether the radio frequency test seat on each radio frequency path is connected with the radio frequency test line, to determine whether the electronic equipment is in the conduction test state or the whole machine state. But the emission antenna of electronic equipment is more, and the corresponding radio frequency test seat on the mainboard of electronic equipment is also more, each radio frequency test seat corresponds an air interface detection circuit, and more air interface detection circuits will increase the number of air interface circuit components, the cost is higher, and a large area on the mainboard will be occupied. UTILITARY MODEL CONTENTS
[0004] The utility model provides an electronic equipment to solve the problem that more air interface detection circuits in prior art electronic equipment will increase the number of air interface circuit components, the cost is higher, and a large area on the mainboard is occupied.
[0005] The utility model provides an electronic equipment, which comprises a mainboard, the mainboard comprises one or more radio frequency circuits and an independent voltage detection circuit separate from the one or more radio frequency circuits.
[0006] An antenna support comprises one or more antennas and a conductive part, the one or more antennas are coupled to the one or more radio frequency circuits in an on-off manner, and the conductive part is coupled to the independent voltage detection circuit in an on-off manner.
[0007] The coupling state of the one or more antennas and the one conductive part is the same, and the independent voltage detection circuit is configured to detect the coupling state of the independent voltage detection circuit and the one conductive part.
[0008] The independent voltage detection circuit comprises a power management chip, the power management chip and a first output end are coupled, and the power management chip is configured to output a high level signal.
[0009] A first voltage detection end is coupled between the first output end and a second output end.
[0010] A third output end is coupled to the second output end and a first contact of the one conductive part.
[0011] A first ground end is coupled to a second contact of the one conductive part.
[0012] A first resistance is coupled between the first output end and the first voltage detection end.
[0013] The independent voltage detection circuit further comprises a processor, a general input and output interface of the processor is coupled to the first voltage detection end, the general input and output interface is configured to receive a level signal of the first voltage detection end, a control interface of the processor is coupled to the power management chip and a SAR sensor respectively, the control interface is configured to output a control signal to the power management chip and output an opening or closing signal to the SAR sensor.
[0014] The independent voltage detection circuit further comprises a first capacitor, and the first capacitor is coupled between the first output end and a second ground end.
[0015] The independent voltage detection circuit further comprises a first inductor, and the first inductor is coupled between the general input and output interface and the first voltage detection end.
[0016] A first diode is coupled between the first voltage detection end and the second output end, an anode of the first diode is connected to the first voltage detection end, and a cathode of the first diode is connected to the second output end.
[0017] The independent voltage detection circuit comprises a fourth output end, the fourth output end is coupled to a fifth output end, and the fifth output end is coupled to a second contact of the one conductive part.
[0018] A sixth output end is coupled to a first contact of the one conductive part.
[0019] A power management chip is coupled to the fourth output terminal and configured to output a high level signal.
[0020] A second voltage detection terminal is coupled between a seventh output terminal and a third ground terminal, and the seventh output terminal is coupled to the sixth output terminal.
[0021] A second resistor is coupled between the second voltage detection terminal and the third ground terminal.
[0022] According to the electronic device, the independent voltage detection circuit further comprises a processor, a general input and output interface of the processor is coupled to the second voltage detection terminal, the general input and output interface is configured to receive a level signal of the second voltage detection terminal, and a control interface of the processor is coupled to the power management chip and the SAR sensor respectively, the control interface is configured to output a control signal to the power management chip and output an opening or closing signal to the SAR sensor.
[0023] According to the electronic device, the independent voltage detection circuit further comprises a second capacitor, and the second capacitor is coupled between the fourth output terminal and a fourth ground terminal.
[0024] According to the electronic device, the independent voltage detection circuit further comprises a second inductor, and the second inductor is coupled between the general input and output interface and the second voltage detection terminal.
[0025] A second diode is coupled between the seventh output terminal and the second voltage detection terminal, an anode of the second diode is connected to the seventh output terminal, and a cathode of the second diode is connected to the second voltage detection terminal.
[0026] According to the electronic device, the one or more radio frequency circuits comprise a radio frequency channel, the radio frequency channel is coupled to a radio frequency test seat and configured to output a radio frequency signal, the radio frequency test seat comprises a radio frequency signal inlet, a conduction state interface and a coupling state interface, and the radio frequency signal inlet is coupled to the conduction state interface or the coupling state interface.
[0027] An eighth output terminal is coupled between the coupling state interface and a third contact of an antenna.
[0028] A tuning circuit is coupled between the coupling state interface and the eighth output terminal.
[0029] A fifth ground terminal, the fourth contact of the one antenna is coupled to the fifth ground terminal.
[0030] The electronic device provided by the utility model determines whether the antenna support is installed on the mainboard by detecting whether the conductive part on the antenna support is in a connected state or a disconnected state through the independent voltage detection circuit, so that the determination of whether the electronic device is in a conduction test state or a whole machine state is realized, and each radio frequency circuit does not need to correspond to an independent voltage detection circuit, that is, only one independent voltage detection circuit can realize the determination of whether the electronic device is in a conduction test state or a whole machine state, compared with a traditional air interface detection circuit, the number of circuit components is reduced, the circuit cost is reduced, and the mainboard area is reduced. BRIEF DESCRIPTION OF DRAWINGS
[0031] In order to more clearly illustrate the technical scheme in the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.
[0032] Figure 1 It is an internal circuit structure schematic view of an electronic device in the related art.
[0033] Figure 2 It is one of the connection structure schematic views of the mainboard and the antenna support of the electronic device provided by the utility model.
[0034] Figure 3 It is the second connection structure schematic view of the mainboard and the antenna support of the electronic device provided by the utility model.
[0035] The signs are as follows.
[0036] 100: Mainboard; 200: Antenna bracket; 300: Independent voltage detection circuit; 400: RF circuit; 201: Antenna; 202: Conductive part; 203: First contact; 204: Second contact; 205: Third contact; 206: Fourth contact; 301: First output terminal; 302: Second output terminal; 303: Third output terminal; 304: Fourth output terminal; 305: Fifth output terminal; 306: Sixth output terminal; 307: Seventh output terminal; 308: First voltage detection terminal; 309: First ground terminal; 310: Power management chip; 311: Processor; 312: General purpose input / output terminal 313: Control interface; 314: SAR sensor; 315: Second ground terminal; 316: Second voltage detection terminal; 317: Third ground terminal; 318: Fourth ground terminal; 401: RF path; 402: RF test socket; 403: RF signal input; 404: Conducted state interface; 405: Coupled state interface; 406: Eighth output terminal; 407: Tuning circuit; 408: Fifth ground terminal; R1: First resistor; C1: First capacitor; D1: First diode; L1: First inductor; R2: Second resistor; C2: Second capacitor; D2: Second diode; L2: Second inductor. Detailed Implementation
[0037] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0038] In related technologies, such as Figure 1 As shown, in electronic devices (such as mobile phones), each RF path can be connected to an antenna. Since the RF performance of each RF path needs to be debugged and tested, each RF path has an RF test socket. When the RF path of the electronic device needs to meet transmission requirements, power back-off of the RF path cannot be performed; when the electronic device as a whole needs to meet SAR requirements, corresponding power back-off of transmission paths that do not meet SAR values is required. Therefore, related technologies connect an air interface detection circuit to the coupling state interface of the RF test socket to detect whether the electronic device is in conducted testing state or overall system state.
[0039] In the conduction test state, the antenna is not installed, the radio frequency test seat conduction state interface is pressed through the radio frequency line interface, the radio frequency signal inlet of the radio frequency test seat is connected through the conduction state interface and the radio frequency line interface, and the coupling state interface of the radio frequency test seat is suspended. Therefore, when the coupling state interface of the radio frequency test seat is detected by the air interface detection circuit, it is confirmed that the electronic equipment is in the conduction test state.
[0040] In the whole machine state, the antenna is installed, the conduction state interface of the radio frequency test seat is not connected with the radio frequency line interface, and the radio frequency signal inlet of the radio frequency test seat is in communication with the coupling state interface. Therefore, when the radio frequency signal inlet of the radio frequency test seat is in communication with the coupling state interface, it is confirmed that the electronic equipment is in the whole machine state.
[0041] After the mobile communication enters the 5G era, electronic equipment (for example: mobile phone) needs to be compatible with 2G, 3G and 4G, and also includes various types of near field communication antennas, which makes the electronic equipment more and more antennas, and the corresponding radio frequency test seat on the mainboard of the electronic equipment is more and more. Since each radio frequency test seat corresponds to an air interface detection circuit, more air interface detection circuits will increase the number of air interface circuit components, the cost is higher, and it will occupy a larger area on the mainboard.
[0042] The utility model embodiment provides a kind of electronic equipment, such as Figure 2 And 3 As shown in the figure, it includes: mainboard 100 and antenna support 200, and the electronic equipment can be mobile terminal equipment such as mobile phone, tablet computer, notebook computer or wearable, it can also be terminal equipment such as installed in drivable vehicle, autonomous vehicle or other transportation tools, such as car machine.
[0043] The mainboard 100 includes one or more radio frequency circuits 400 and an independent voltage detection circuit 300 separate from the one or more radio frequency circuits 400, that is, the independent voltage detection circuit 300 is not directly connected to any one of the radio frequency circuits 400 on the mainboard.
[0044] The antenna support 200 includes one or more antennas 201 and a conductive part 202, and the one or more antennas 201 are coupled to the one or more radio frequency circuits 400, and the conductive part 202 is coupled to the independent voltage detection circuit 300.
[0045] The coupling state of the one or more antennas 201 and the one conductive part 202 is the same, that is, the antenna support 200 is coupled to the mainboard 100, the antenna 201 is coupled to the corresponding radio frequency circuit 400, and the conductive part 202 is coupled to the independent voltage detection circuit 300; if the antenna support 200 is not coupled to the mainboard 100, the antenna 201 is disconnected from the corresponding radio frequency circuit 400, and the conductive part 202 is disconnected from the independent voltage detection circuit 300. The independent voltage detection circuit 300 is configured to detect the coupling state of the independent voltage detection circuit 300 and the one conductive part 202, that is, the independent voltage detection circuit 300 is used to detect whether the independent voltage detection circuit 300 and the conductive part 202 are in a connected state or a disconnected state. If it is detected that the independent voltage detection circuit 300 and the conductive part 202 are in a connected state, it indicates that the antenna support 200 and the mainboard 100 are coupled, and the antenna 201 and the corresponding radio frequency circuit 400 are also in a coupled state, so that it can be determined that the electronic device is in an overall state; if it is detected that the independent voltage detection circuit 300 and the conductive part 202 are in a disconnected state, it indicates that the antenna support 200 and the mainboard 100 are disconnected, and the antenna 201 and the corresponding radio frequency circuit 400 are also disconnected, so that it can be determined that the electronic device is in a conduction test state.
[0046] In the electronic device of the embodiment, the independent voltage detection circuit 300 is used to detect whether the independent voltage detection circuit 300 and the conductive part 202 on the antenna support 200 are in a connected state or a disconnected state, so as to determine the coupling state of the antenna support 200 and the mainboard 100 (that is, to determine the coupling state of the antenna 201 and the radio frequency circuit 400), thereby realizing the judgment of whether the electronic device is in a conduction test state or an overall state. Each radio frequency circuit 400 does not need to correspond to an independent voltage detection circuit 300, that is, even if there are multiple radio frequency circuits 400 on the mainboard, only one independent voltage detection circuit 300 can realize the judgment of whether the electronic device is in a conduction test state or an overall state, compared with the traditional air interface detection circuit, the number of circuit components is reduced, the circuit cost is reduced, and the mainboard area is occupied.
[0047] It should be noted that, Figure 2 Or Figure 3 The positional relationship of the one or more radio frequency circuits 400, the independent voltage detection circuit 300, and the antenna support 200 described is exemplary and does not represent actual limitation. For example, when the electronic device is a mobile phone, the mainboard 100 can also be referred to as a PCB board, the antenna support 200 can be installed between the mainboard 100 and the display unit of the mobile phone in the thickness direction of the mobile phone, for example, in the accommodating cavity formed by the mainboard and the frame; or the antenna support 200 can also be installed between the mainboard 100 and the back cover of the mobile phone in the thickness direction of the mobile phone, for example, a part of the antenna support 200 can also be provided with a hole for the camera to protrude out of the back cover.
[0048] It can be understood that,Figure 2 And Figure 3 Only one radio frequency circuit 400 and one corresponding antenna 201 are described as an example, and multiple radio frequency circuits (not shown in the figure) and multiple corresponding antennas can also exist on the mainboard 100. The circuit structure of the multiple radio frequency circuits can be the same as that of the radio frequency circuit 400, and the multiple antennas can be arranged at appropriate positions of the antenna support 200.
[0049] As shown in Figure 2 In an embodiment, the independent voltage detection circuit 300 includes a power management chip (PMIC) 310, a first output end 301, a second output end 302, a third output end 303, a first voltage detection end 308, a first ground end 309, and a first resistor R1.
[0050] The power management chip 310 and the first output end 301 are coupled and configured to output a high-level signal.
[0051] The first voltage detection end 308 is coupled between the first output end 301 and the second output end 302.
[0052] The third output end 303 is coupled to the second output end 302 and a first contact 203 of a conductive part 202, respectively. The third output end 303 can be a detection spring.
[0053] The first ground end 309 is coupled to a second contact 204 of the conductive part 202. The first ground end 309 can be a ground spring.
[0054] The first resistor R1 is coupled between the first output end 301 and the first voltage detection end 308. The resistance value of the first resistor R1 can be 10kΩ or other appropriate resistance values. The first resistor R1 functions to limit current and voltage division, reduces the leakage current from the power management chip 310 to the ground, and reduces the leakage power consumption.
[0055] In this embodiment, the power management chip 310 is configured to output a high level, for example, 1.8V. When the antenna support 200 and the mainboard 100 are coupled, a direct current path in the direction of the dashed arrow in Figure 2 will be formed. At this time, the voltage of the first voltage detection end 308 is the ground voltage (i.e., low voltage). That is, when the first voltage detection end 308 detects a low level, it is determined that the antenna support 200 and the mainboard 100 are coupled (i.e., it is also determined that the antenna 201 and the radio frequency circuit 400 are coupled), and the electronic device is in an overall state. When the antenna support 200 and the mainboard 100 are not coupled (i.e., the radio frequency circuit 400 does not need to be coupled to the antenna 201), the direct current path in the direction of the dashed arrow in Figure 2The DC path of the dotted arrow, at this time, the voltage of the first voltage detection end 308 is high voltage, that is, when the first voltage detection end 308 detects high level, it is determined that the antenna support 200 is not coupled to the mainboard 100, and the electronic device is in a conduction test state.
[0056] In this embodiment, the independent voltage detection circuit 300 further comprises a processor 311, a general input and output interface (GPIO) 312 of the processor 311 is coupled to the first voltage detection end 308, and the general input and output interface 312 is configured to receive the level signal of the first voltage detection end 308. The control interface 313 of the processor 311 is coupled to the power management chip 310 and the SAR sensor 314 respectively, and the control interface 313 is configured to output a control signal to the power management chip 310 and output an on or off signal to the SAR sensor 314.
[0057] Specifically, after the electronic device is powered on, the processor 311 outputs a control signal to the power management chip 310 through the control interface 313, and the power management chip 310 outputs a high level after receiving the control signal. When the general input and output interface 312 detects that the level of the first voltage detection end 308 is high, it means that the electronic device is in a conduction test state, triggering the processor 311 to output a shutdown signal to the SAR sensor 314, and the SAR sensor 314 shuts down the SAR power backoff function after receiving the shutdown signal, so that the radio frequency power of the radio frequency path 401 meets the conduction requirements. When the general input and output interface 312 detects that the level of the first voltage detection end 308 is low, it means that the electronic device is in a whole machine state, triggering the processor 311 to output an on signal to the SAR sensor 314, and the SAR sensor 314 turns on the SAR power backoff function after receiving the on signal, so that the electromagnetic radiation generated by the whole machine transmitting radio frequency signal meets the SAR related regulations, avoiding the related radiation exceeding the standard for human body.
[0058] It should be noted that the processor 311 can share the processor in the electronic device, and does not need to be configured separately for the independent voltage detection circuit 300, or the processor 311 can be a dedicated processor, which is not limited by the present application.
[0059] As shown in Figure 2 The independent voltage detection circuit 300 further comprises a first capacitor C1 coupled between the first output end 301 and the second ground end 315, and the first capacitor C1 can be 100PF, which can be set according to actual conditions. The first capacitor C1 is used to filter out the high frequency interference signals that may exist in the voltage signal output by the power management chip 310, to prevent the interference signals from being radiated outward through the contacts and other metals on the conductive part 202, and to affect the transceiving effect of the antenna 201.
[0060] In the embodiment, the independent voltage detection circuit 300 further comprises a first inductor L1 and a first diode D1.
[0061] The first inductor L1 is coupled between the general input-output interface 312 and the first voltage detection terminal 308, and is used to isolate high-frequency alternating current signals and conduct direct current signals, so that the detection voltage is not affected by high-frequency signals and the detection is more accurate.
[0062] The first diode D1 is coupled between the first voltage detection terminal 308 and the second output terminal 302, and the anode of the first diode D1 is connected to the first voltage detection terminal 308, and the cathode of the first diode D1 is connected to the second output terminal 302. In the embodiment, the reverse non-conducting characteristic of the diode is used to prevent the instantaneous high voltage of static electricity at the second output terminal 302 from passing through the independent voltage detection circuit 300 and causing damage to related devices. The first diode D1 can be a germanium tube, and the normal conduction voltage V D1 is 0.2V-0.3V.
[0063] In the embodiment, the one or more radio frequency circuits 400 comprise a radio frequency path 401, a radio frequency test seat 402, an eighth output terminal 406, a tuning circuit 407, and a fifth ground terminal 408.
[0064] The radio frequency path 401 is coupled to the radio frequency test seat 402 and is configured to output a radio frequency signal. The radio frequency test seat 402 comprises a radio frequency signal inlet 403, a conduction state interface 404, and a coupling state interface 405, and the radio frequency signal inlet 403 is coupled to the conduction state interface 404 or the coupling state interface 405. Specifically, when the electronic device is in a conduction test state, the radio frequency signal inlet 403 is coupled to the conduction state interface 404, and the conduction state interface 404 is connected to a radio frequency line interface to realize conduction testing.
[0065] The eighth output terminal 406 is coupled between the coupling state interface 405 and a third contact 205 of one antenna 201, and the eighth output terminal 406 can be an antenna feed tab.
[0066] The tuning circuit 407 is coupled between the coupling state interface 405 and the eighth output terminal 406.
[0067] The fifth ground terminal 408 is coupled to a fourth contact 206 of one antenna 201, and the fifth ground terminal 408 can be a ground tab.
[0068] The following will be described in detail Figure 2 with the power management chip 310 outputting 1.8V as an example, the process and principle of the independent voltage detection circuit 300 detecting whether the electronic device is in a conduction test state or a whole machine state in the electronic device of the embodiment will be described in detail.
[0069] When the electronic device is in the conduction test state, the mainboard 100 and the antenna support 200 are not coupled (for example, which can be referred to as "not installing the antenna support 200" herein), that is, the eighth output end 406 and the third contact 205 of the antenna 201 are not in contact, the fifth ground end 408 and the fourth contact 206 of the antenna 201 are not in contact, the third output end 303 and the first contact 203 of the conductive part 202 are not in contact, and the first ground end 309 and the second contact 204 of the conductive part 202 are not in contact, so that the direct current to ground path shown by the dashed arrow cannot be formed, and the first voltage detection end 308 has no current, and the voltages at the three points of the first voltage detection end 308, the first output end 301 and the second output end 302 are equal. The general input and output interface 312 of the processor 311 detects that the voltage at the first voltage detection end 308 is high (for example, 1.8 V), and determines that the electronic device is in the conduction test state. The processor 311 controls the SAR sensor 314 to close the SAR power backoff function through the control interface 313, so that the radio frequency conduction test index meets the corresponding conduction regulations. Figure 2
[0070] When the electronic device is in the whole machine state, the mainboard 100 and the antenna support 200 are coupled (for example, which can be referred to as "installing the antenna support 200" herein), for example, the antenna support 200 is installed on the mainboard 100 at this time, and is coupled with the radio frequency circuit 400 and the independent voltage detection circuit 300, that is, the eighth output end 406 and the third contact 205 of the antenna 201 are in contact, the fifth ground end 408 and the fourth contact 206 of the antenna 201 are in contact, the third output end 303 and the first contact 203 of the conductive part 202 are in contact, and the first ground end 309 and the second contact 204 of the conductive part 202 are in contact, so that the direct current to ground path shown by the dashed arrow can be formed. Figure 2 For the direct current, the independent voltage detection circuit 300 is grounded through the conductive part 202, which is equivalent to that the second output end 302 is grounded. At this time, the first diode D1 is turned on, and the voltage difference between the first voltage detection end 308 and the second output end 302 is the turn-on voltage V D1 of the first diode D1. The voltage at the second output end 302 is 0 V, and the voltage at the first voltage detection end 308 is equal to V D1 =0.2 V, that is, a low level. The general input and output interface 312 of the processor 311 detects that the voltage at the first voltage detection end 308 is low, and determines that the electronic device is in the whole machine state. The processor 311 controls the SAR sensor 314 to open the SAR power backoff function through the control interface 313, so that the whole machine meets the SAR related regulations and avoids exceeding the related radiation to the human body.
[0071] As Figure 3 As shown, in another embodiment, the independent voltage detection circuit 300 comprises a fourth output end 304, a fifth output end 305, a sixth output end 306, a seventh output end 307, a power management chip 310, a second voltage detection end 316 and a second resistor R2.
[0072] The fourth output end 304 is coupled to the fifth output end 305, and the fifth output end 305 is coupled to the second contact 204 of the conductive part 202. The fifth output end 305 can be a detection spring.
[0073] The sixth output end 306 is coupled to the first contact 203 of the conductive part 202. The sixth output end 306 can be a detection spring.
[0074] The power management chip 310 is coupled to the fourth output end 304 and configured to output a high-level signal.
[0075] The second voltage detection end 316 is coupled between the seventh output end 307 and a third ground end 317, and the seventh output end 307 is coupled to the sixth output end 306.
[0076] The second resistor R2 is coupled between the second voltage detection end 316 and the third ground end 317. The resistance value of the second resistor R2 can be 10kΩ or other suitable resistance values. The second resistor R2 functions as a current-limiting voltage divider, reduces the leakage current of the power management chip 310 to the ground, and reduces the leakage power consumption.
[0077] In this embodiment, the power management chip 310 is configured to output a high level, for example, 1.8V. When the antenna support 200 and the mainboard 100 are coupled, a direct current path in the direction of the dashed arrow is formed. At this time, the voltage of the second voltage detection end 316 is a high voltage, which determines that the antenna support 200 and the mainboard 100 are coupled (i.e., it is also determined that the antenna 201 is coupled to the radio frequency circuit 400), and the electronic device is in an entire machine state. Figure 3 Figure 3 When the antenna support 200 and the mainboard 100 are not coupled (i.e., the radio frequency circuit 400 does not need to be coupled to the antenna 201), the direct current path in the direction of the dashed arrow is not formed. At this time, the voltage of the second voltage detection end 316 is a ground voltage (i.e., a low voltage), which means that when the second voltage detection end 316 detects a low level, it is determined that the antenna support 200 and the mainboard 100 are not coupled, and the electronic device is in a conduction test state.
[0078] In this embodiment, the independent voltage detection circuit 300 further includes a processor 311. A general-purpose input / output (GPIO) interface 312 of the processor 311 is coupled to a second voltage detection terminal 316. The GPIO interface 312 is configured to receive a level signal from the second voltage detection terminal 316. A control interface 313 of the processor 311 is coupled to a power management chip 310 and a SAR sensor 314. The control interface 313 is configured to output a control signal to the power management chip 310 and an on / off signal to the SAR sensor 314.
[0079] Specifically, after the electronic device is powered on, the processor 311 outputs a control signal to the power management chip 310 through the control interface 313. Upon receiving the control signal, the power management chip 310 outputs a high-level signal. When the general-purpose input / output interface 312 detects a high level at the second voltage detection terminal 316, it indicates that the electronic device is in a fully functional state, triggering the processor 311 to output an enable signal to the SAR sensor 314. Upon receiving the enable signal, the SAR sensor 314 activates the SAR power back-off function, ensuring that the electromagnetic radiation generated by the emitted radio frequency signal meets SAR regulations and preventing excessive radiation exposure to the human body. When the general-purpose input / output interface 312 detects a low level at the second voltage detection terminal 316, it indicates that the electronic device is in a conducted test state, triggering the processor 311 to output a disable signal to the SAR sensor 314. Upon receiving the disable signal, the SAR sensor 314 disables the SAR power back-off function, ensuring that the radio frequency power of the radio frequency path 401 meets the conducted requirements.
[0080] like Figure 3 As shown, the independent voltage detection circuit 300 also includes a second capacitor C2, which is coupled between the fourth output terminal 304 and the fourth ground terminal 318. The second capacitor C2 can be 100pF and can be set according to actual conditions. The second capacitor C2 is used to filter out high-frequency interference signals that may exist on the voltage signal output by the power management chip 310, and to prevent interference signals from radiating outward through the contacts and other metals on the conductive part 202, thus affecting the transmission and reception performance of the antenna 201.
[0081] In this embodiment, the independent voltage detection circuit 300 further includes: a second inductor L2 and a second diode D2.
[0082] The second inductor L2 is coupled between the general-purpose input / output interface 312 and the second voltage detection terminal 316. It is used to isolate high-frequency AC signals and conduct DC signals, so that the detected voltage is not affected by high-frequency signals, and the detection is more accurate.
[0083] The second diode D2 is coupled between the seventh output terminal 307 and the second voltage detection terminal 316, and the anode of the second diode D2 is connected to the seventh output terminal 307, and the cathode of the second diode D2 is connected to the second voltage detection terminal 316. The second diode D2 can be a germanium diode, and the normal conduction voltage V D2 is 0.2V-0.3V.
[0084] In the embodiment, the one or more radio frequency circuits 400 include a radio frequency path 401, a radio frequency test seat 402, an eighth output terminal 406, a tuning circuit 407, and a fifth ground terminal 408.
[0085] The radio frequency path 401 is coupled to the radio frequency test seat 402 and is configured to output a radio frequency signal. The radio frequency test seat 402 includes a radio frequency signal inlet 403, a conduction state interface 404, and a coupling state interface 405, and the radio frequency signal inlet 403 is coupled to the conduction state interface 404 or the coupling state interface 405. Specifically, when the electronic device is in a conduction test state, the radio frequency signal inlet 403 is coupled to the conduction state interface 404, and the conduction state interface 404 is connected to a radio frequency line interface to realize conduction testing.
[0086] The eighth output terminal 406 is coupled between the coupling state interface 405 and the third contact 205 of one antenna 201, and the eighth output terminal 406 can be an antenna feed patch.
[0087] The tuning circuit 407 is coupled between the coupling state interface 405 and the eighth output terminal 406.
[0088] The fifth ground terminal 408 is coupled to the fourth contact 206 of one antenna 201, and the fifth ground terminal 408 can be a ground patch.
[0089] The following will be described in detail Figure 3 with the power management chip 310 outputting 1.8V as an example, the process and principle of the independent voltage detection circuit 300 detecting whether the electronic device is in a conduction test state or a whole machine state in the electronic device of the embodiment will be described in detail.
[0090] When the electronic device is in a conduction test state, the mainboard 100 and the antenna support 200 are not coupled (for example, which can be referred to as "not installing the antenna support 200" in this paper), that is, the eighth output terminal 406 and the third contact 205 of the antenna 201 are not in contact, the fifth ground terminal 408 and the fourth contact 206 of the antenna 201 are not in contact, the fifth output terminal 305 and the second contact 204 of the conductive part 202 are not in contact, the sixth output terminal 306 and the first contact 203 of the conductive part 202 are not in contact, and the first contact 203 of the conductive part 202 cannot form a loop with the second contact 204 of the conductive part 202, the third contact 205 of the antenna 201, the fourth contact 206 of the antenna 201, and the fifth ground terminal 408, and the first contact 203 of the conductive part 202 cannot form a loop with the second contact 204 of the conductive part 202, the third contact 205 of the antenna 201, the fourth contact 206 of the antenna 201, and the fifth ground terminal 408. Figure 3The DC to ground path is indicated by the dotted arrow, so no current flows through the second voltage detection terminal 316, and because the second resistor R2 is directly connected to ground, the voltage at the second voltage detection terminal 316 is equal to the voltage at the seventh output terminal 307, which is low. The general input / output interface 312 of the processor 311 detects that the voltage at the second voltage detection terminal 316 is low (ground level), and determines that the electronic device is in a conducted test state. The processor 311 controls the SAR sensor 314 to turn off the SAR power backoff function through the control interface 313, so that the radio frequency conducted test index meets the corresponding conducted regulations.
[0091] When the electronic device is in an assembled state, the mainboard 100 and the antenna support 200 are coupled (for example, the antenna support 200 can be referred to as “mounted” on the mainboard 100 in this document), for example, the antenna support 200 is mounted on the mainboard 100 at this time, and is coupled with the radio frequency circuit 400 and the independent voltage detection circuit 300, that is, the eighth output terminal 406 is in contact with the third contact 205 of the antenna 201, the fifth ground terminal 408 is in contact with the fourth contact 206 of the antenna 201, the fifth output terminal 305 is in contact with the second contact 204 of the conductive part 202, and the sixth output terminal 306 is in contact with the first contact 203 of the conductive part 202, so that the DC to ground path is formed. Figure 3 For DC, the fourth output terminal 304 and the seventh output terminal 307 are directly connected, and the voltage at the seventh output terminal 307 is about the voltage at the fourth output terminal 304, that is, 1.8V. At this time, the second diode D2 is turned on, and the voltage difference between the second voltage detection terminal 316 and the seventh output terminal 307 is equal to the turn-on voltage V D2 of the second diode D2, that is, 0.2V-0.3V. Therefore, the voltage at the second voltage detection terminal 316 is 1.8-0.2=1.6V, which is still high. The general input / output interface 312 of the processor 311 detects that the voltage at the second voltage detection terminal 316 is high, and determines that the electronic device is in an assembled state. The processor 311 controls the SAR sensor 314 to turn on the SAR power backoff function through the control interface 313, so that the assembled device meets the SAR related regulations and avoids exceeding the relevant radiation to the human body.
[0092] The device embodiments described above are only schematic, and the units described as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, that is, they can be located in one place, or distributed on multiple network units. Part or all of the modules can be selected to achieve the purpose of the embodiment scheme according to actual needs. Those skilled in the art can understand and implement it without creative labor.
[0093] Those skilled in the art can clearly understand the implementation of the various embodiments by means of software and necessary general hardware platforms through the description of the above embodiments, and of course, the various embodiments can also be implemented by hardware. Based on such understanding, the above technical solutions can be embodied in the form of a software product, and the computer software product can be stored in a computer readable storage medium, such as a ROM / RAM, a magnetic disk, an optical disk, etc., and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the method described in each embodiment or some parts of the embodiment.
[0094] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application, but not to limit it; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. An electronic device, comprising: The application relates to a mainboard, an antenna support and an independent voltage detection circuit. The mainboard comprises one or more radio frequency circuits and an independent voltage detection circuit separated from the one or more radio frequency circuits. The antenna support comprises one or more antennas and a conductive part, the one or more antennas are connected to the one or more radio frequency circuits in an on-off mode, and the conductive part is connected to the independent voltage detection circuit in an on-off mode. The coupling state of the one or more antennas and the one conductive part is the same, and the independent voltage detection circuit is configured to detect the coupling state of the independent voltage detection circuit and the one conductive part.
2. The electronic device of claim 1, wherein, The independent voltage detection circuit comprises: A power management chip coupled to a first output terminal and configured to output a high-level signal; A first voltage detection terminal coupled between the first output terminal and a second output terminal; A third output terminal coupled to the second output terminal and a first contact of the one conductive part respectively; A first ground terminal, a second contact of the one conductive part is coupled to the first ground terminal; A first resistor coupled between the first output terminal and the first voltage detection terminal.
3. The electronic device of claim 2, wherein, The independent voltage detection circuit further comprises: A processor, a general input-output interface of the processor is coupled to the first voltage detection terminal, the general input-output interface is configured to receive a level signal of the first voltage detection terminal, and a control interface of the processor is coupled to the power management chip and a SAR sensor respectively, the control interface is configured to output a control signal to the power management chip and an on-off signal to the SAR sensor.
4. The electronic device of claim 3, wherein, The independent voltage detection circuit further comprises: A first capacitor coupled between the first output terminal and a second ground terminal.
5. The electronic device of claim 3, wherein, The independent voltage detection circuit further comprises: A first inductor coupled between the general input-output interface and the first voltage detection terminal; A first diode coupled between the first voltage detection terminal and the second output terminal, an anode of the first diode is connected to the first voltage detection terminal, and a cathode of the first diode is connected to the second output terminal.
6. The electronic device of claim 1, wherein, The independent voltage detection circuit comprises: A fourth output terminal coupled to a fifth output terminal, the fifth output terminal is coupled to a second contact of the one conductive part; A sixth output terminal coupled to a first contact of the one conductive part; A power management chip coupled to the fourth output terminal and configured to output a high-level signal; A second voltage detection terminal coupled between a seventh output terminal and a third ground terminal, the seventh output terminal is coupled to the sixth output terminal; A second resistor coupled between the second voltage detection terminal and the third ground terminal.
7. The electronic device of claim 6, wherein, The independent voltage detection circuit further comprises: A processor, a general input / output interface of the processor is coupled to the second voltage detection terminal, the general input / output interface is configured to receive a level signal of the second voltage detection terminal, a control interface of the processor is coupled to the power management chip and the SAR sensor respectively, the control interface is configured to output a control signal to the power management chip and output an on or off signal to the SAR sensor.
8. The electronic device of claim 7, wherein, The independent voltage detection circuit further comprises: A second capacitor, which is coupled between the fourth output terminal and a fourth ground terminal.
9. The electronic device of claim 7, wherein, The independent voltage detection circuit further comprises: A second inductor, which is coupled between the general input / output interface and the second voltage detection terminal; A second diode, which is coupled between the seventh output terminal and the second voltage detection terminal, and an anode of the second diode is connected to the seventh output terminal, a cathode of the second diode is connected to the second voltage detection terminal.
10. The electronic device of any of claims 1-9, wherein, The one or more radio frequency circuits comprise: A radio frequency channel, which is coupled to a radio frequency test seat and is configured to output a radio frequency signal, the radio frequency test seat comprises a radio frequency signal inlet, a conduction state interface and a coupling state interface, the radio frequency signal inlet is coupled to the conduction state interface or the coupling state interface; An eighth output terminal, which is coupled between the coupling state interface and a third contact of one antenna; A tuning circuit, which is coupled between the coupling state interface and the eighth output terminal; A fifth ground terminal, a fourth contact of the one antenna is coupled to the fifth ground terminal.