Novel inverter

Abstract

The utility model provides a novel inverter, and relates to the technical field of inverters. The novel inverter comprises an embedded PCB power module, a heat dissipation module, a capacitor integrated filter module, an input copper bar, a connecting copper bar and an output copper bar. Wherein the lower surface of the embedded PCB power module is connected with the upper surface of the heat dissipation module, and the capacitor integrated filter module is embedded into the heat dissipation module; the input copper bar penetrates through the heat dissipation module and then is connected with one end of the capacitor integrated filter module, the other end of the capacitor integrated filter module is connected with one end of the connecting copper bar, the other end of the connecting copper bar penetrates through the heat dissipation module and then is connected with one end of the embedded PCB power module, and the other end of the embedded PCB power module is connected with the output copper bar. By integrating the embedded PCB power module, the heat dissipation module and the capacitor integrated filter module together, the integration level of the whole novel inverter is greatly improved, and the size and the cost are reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of inverters, in particular to a novel inverter. BACKGROUND

[0002] The demand for power systems of new energy vehicles is gradually developing in the direction of energy saving, high efficiency and high integration. Therefore, the development of motor controllers also presents the trend of miniaturization, light weight and integration. As the core device of the motor controller, the inverter needs to have higher power density and lower thermal resistance, so as to reduce the volume of the motor controller, reduce the temperature rise of the whole module, and improve the reliability of the system. However, most of the current inverters are composed of discrete units, which have low integration, large volume and high cost. CONTENT OF THE UTILITY MODEL

[0003] The purpose of the present application is to provide a novel inverter to improve the integration of the inverter and reduce the volume and cost.

[0004] In order to achieve the above purpose, the technical scheme adopted by the present application is as follows:

[0005] The present application provides a novel inverter, which comprises an embedded PCB power module, a heat dissipation module, a capacitor integrated filter module, an input copper bar, a connecting copper bar and an output copper bar.

[0006] The lower surface of the embedded PCB power module is connected with the upper surface of the heat dissipation module, and the capacitor integrated filter module is embedded in the heat dissipation module. The input copper bar is connected with one end of the capacitor integrated filter module after penetrating through the heat dissipation module, the other end of the capacitor integrated filter module is connected with one end of the connecting copper bar, the other end of the connecting copper bar is connected with one end of the embedded PCB power module after penetrating through the heat dissipation module, and the other end of the embedded PCB power module is connected with the output copper bar.

[0007] Further, the embedded PCB power module comprises a PCB board, a power device unit, an on-board driving component and a current sampling circuit.

[0008] The power device unit is embedded in the PCB board, and the on-board driving component and the current sampling circuit are both arranged on the upper surface of the PCB board. One end of the power device unit is connected with the connecting copper bar, the other end of the power device unit is connected with the output copper bar, and the power device unit is further connected with the on-board driving component through a control signal line. One end of the on-board driving component is connected with the connecting copper bar, the other end of the on-board driving component is connected with one end of the current sampling circuit, and the other end of the current sampling circuit is connected with the output copper bar.

[0009] Further, the output copper bar is a three-phase alternating current output copper bar, the output copper bar comprises a first output copper bar, a second output copper bar and a third output copper bar, and the current sampling circuit comprises a first current sampling unit, a second current sampling unit and a third current sampling unit.

[0010] The first current sampling unit is connected with the on-board driving component and the first output copper bar respectively, the second current sampling unit is connected with the on-board driving component and the second output copper bar respectively, and the third current sampling unit is connected with the on-board driving component and the third output copper bar respectively.

[0011] Further, the power device unit comprises a peripheral copper bar, a first welding layer and a power chip.

[0012] The peripheral copper bar is covered on the surface of the power chip through the first welding layer, and the peripheral copper bar is connected with the connection copper bar and the output copper bar respectively; one end of the control signal line is connected with the power chip, and the other end of the control signal line penetrates through the first welding layer, the peripheral copper bar and the PCB board and is connected with the on-board driving component.

[0013] Further, the embedded PCB power module further comprises an insulating layer, the PCB board comprises a plurality of sub-PCB boards; the power device unit is arranged on the bottommost sub-PCB board, and the on-board driving component and the current sampling circuit are arranged on the topmost sub-PCB board, and adjacent two sub-PCB boards are connected through the insulating layer.

[0014] Further, the new inverter further comprises an active metal brazing (AMB) substrate, a heat dissipation copper sheet and a second welding layer.

[0015] The upper surface of the heat dissipation module is provided with a groove, the bottom of the groove is connected with the lower surface of the heat dissipation copper sheet through the second welding layer, the upper surface of the heat dissipation copper sheet is connected with the lower surface of the AMB substrate, and the upper surface of the AMB substrate is connected with the lower surface of the power device unit.

[0016] Further, the heat dissipation module comprises a heat radiator and a water channel; the water channel transversely penetrates through the heat radiator, and the water channel is located between the embedded PCB power module and the capacitor integrated filter module.

[0017] Further, the heat dissipation module further comprises a plurality of heat dissipation columns, and the plurality of heat dissipation columns are arranged at intervals on one side of the heat radiator close to the water channel.

[0018] Further, the capacitor integrated filter module comprises a film capacitor and a filter unit, the filter unit comprising a common mode inductor, a first Y capacitor and a second Y capacitor.

[0019] The input copper bar is connected to one end of the common mode inductor after penetrating through the heat dissipation module, and the other end of the common mode inductor is connected to one end of the first Y capacitor, the second Y capacitor and the film capacitor respectively, the other end of the film capacitor is connected to the connecting copper bar, and the two sides of the film capacitor are also connected to the first Y capacitor and the second Y capacitor respectively.

[0020] Further, the new inverter further comprises a first fixing hole, a second fixing hole, a first fixing member and a second fixing member.

[0021] The first fixing hole and the second fixing hole respectively extend downward from the upper surfaces of the two sides of the embedded PCB power module into the heat dissipation module, and the embedded PCB power module is connected with the heat dissipation module through the first fixing hole and the first fixing member, the second fixing hole and the second fixing member.

[0022] Compared with the prior art, the present application has the following beneficial effects:

[0023] The new inverter provided by the present application comprises an embedded PCB power module, a heat dissipation module, a capacitor integrated filter module, an input copper bar, a connecting copper bar and an output copper bar. The lower surface of the embedded PCB power module is connected with the upper surface of the heat dissipation module, and the capacitor integrated filter module is embedded in the heat dissipation module. The input copper bar is connected to one end of the capacitor integrated filter module after penetrating through the heat dissipation module, the other end of the capacitor integrated filter module is connected to one end of the connecting copper bar, the other end of the connecting copper bar is connected to one end of the embedded PCB power module after penetrating through the heat dissipation module, and the other end of the embedded PCB power module is connected to the output copper bar. Among them, the power device unit in the embedded PCB power module is crimped into the PCB board, which reduces the thermal resistance and stray parameters and improves the integration. The heat dissipation module can dissipate heat for the embedded PCB power module and the capacitor integrated filter module, preventing the damage of overheating devices. The capacitor integrated filter module integrates the capacitor and the filter together, greatly improving the integration of the entire new inverter, reducing the size and cost.

[0024] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to make the purposes, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0026] Figure 1 A cross-sectional side view of a novel inverter provided by an embodiment of the present application;

[0027] Figure 2 A cross-sectional side view of an embedded PCB power module provided by an embodiment of the present application;

[0028] Figure 3 A top view of an embedded PCB power module provided by an embodiment of the present application;

[0029] Figure 4 A bottom view of an embedded PCB power module provided by an embodiment of the present application;

[0030] Figure 5 A cross-sectional side view of a power device unit provided by an embodiment of the present application;

[0031] Figure 6 A cross-sectional side view of a novel inverter provided by an embodiment of the present application;

[0032] Figure 7 A cross-sectional side view of a novel inverter provided by an embodiment of the present application;

[0033] Icon: 10 - new inverter; 100 - embedded PCB power module; 110 - PCB board; 120 - power device unit; 121 - peripheral copper bar; 122 - first soldering layer; 123 - power chip; 130 - on-board driving component; 140 - current sampling circuit; 141 - first current sampling unit; 142 - second current sampling unit; 143 - third current sampling unit; 150 - control signal line; 160 - insulation layer; 200 - heat dissipation module; 210 - heat sink; 220 - water channel; 230 - heat dissipation column; 300 - capacitor integrated filter module; 310 - thin film capacitor; 320 - common mode inductor; 330 - first Y capacitor; 400 - input copper bar; 500 - connecting copper bar; 600 - output copper bar; 610 - first output copper bar; 620 - second output copper bar; 630 - third output copper bar; 710 - first fixing hole; 720 - second fixing hole; 810 - AMB substrate; 820 - heat dissipation copper sheet; 830 - second soldering layer; 900 - heat conduction layer. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0035] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0036] In the description of the present application, it should be noted that the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. The term "connection" should be interpreted broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be direct connection, or indirect connection through intermediate medium.

[0037] Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

[0038] As mentioned in the background, most of the inverters are currently composed of discrete units, with low integration, large volume and high cost.

[0039] In view of this, please refer to Figure 1 , Figure 1 A cross-sectional side view of a new inverter 10 provided by an embodiment of the present application. The new inverter 10 includes: an embedded PCB power module 100, a heat dissipation module 200, a capacitor integrated filter module 300, an input copper bar 400, a connecting copper bar 500 and an output copper bar 600.

[0040] The lower surface of the embedded PCB power module 100 is connected to the upper surface of the heat dissipation module 200, and the capacitor integrated filter module 300 is embedded in the heat dissipation module 200. The input copper bar 400 is connected to one end of the capacitor integrated filter module 300 after penetrating through the heat dissipation module 200, the other end of the capacitor integrated filter module 300 is connected to one end of the connecting copper bar 500, the other end of the connecting copper bar 500 is connected to one end of the embedded PCB power module 100 after penetrating through the heat dissipation module 200, and the other end of the embedded PCB power module 100 is connected to the output copper bar 600.

[0041] Based on the above design, the positive and negative DC bus voltages enter the new inverter 10 through the input copper bar 400, and the DC power is filtered by the capacitor integrated filter module 300 and then transmitted to the embedded PCB power module 100 through the connecting copper bar 500. The embedded PCB power module 100 is used to convert the input DC power into the required AC power through inversion and output through the output copper bar 600. The heat dissipation module 200 is used to dissipate heat for the embedded PCB power module 100 and the capacitor integrated filter module 300.

[0042] As an optional embodiment, please refer to Figure 2 , Figure 2 A cross-sectional side view of the embedded PCB power module 100. The embedded PCB power module 100 includes: a PCB board 110, a power device unit 120, an on-board drive component 130 and a current sampling circuit 140.

[0043] The power device unit 120 is embedded in the PCB 110, and the on-board driving component 130 and the current sampling circuit 140 are arranged on the upper surface of the PCB 110. One end of the power device unit 120 is connected with the connecting copper bar 500, and the other end of the power device unit 120 is connected with the output copper bar 600. The power device unit 120 is also connected with the on-board driving component 130 through the control signal line 150. One end of the on-board driving component 130 is connected with the connecting copper bar 500, and the other end of the on-board driving component 130 is connected with one end of the current sampling circuit 140. The other end of the current sampling circuit 140 is connected with the output copper bar 600.

[0044] The connecting copper bar 500 transmits the direct current processed by the capacitor integrated filter module 300 to the power device unit 120 and the on-board driving component 130. The on-board driving component 130 sends a driving control signal to the power device unit 120, so that the power device unit 120 works and converts the input direct current into alternating current output. The current sampling circuit 140 samples the alternating current at the output copper bar 600 and sends a sampling signal to the on-board driving component 130. The on-board driving component 130 adjusts the size of the driving control signal according to the received sampling signal, so as to ensure that the power device unit 120 can invert the direct current into the required alternating current.

[0045] The PCB 110 is also called a printed circuit board, which is an electrical carrier and support body of electronic components. By crimping the power device unit 120 into the PCB 110, the thermal resistance and stray inductance can be greatly reduced. The embedded PCB power module 100 provided in the application adopts a highly integrated arrangement, which greatly reduces the volume space and cost.

[0046] In an alternative embodiment, the input copper bar 400 and the connecting copper bar 500 are positive and negative direct current copper bars, and the output copper bar 600 is a three-phase alternating current copper bar. Specifically, please refer to Figure 3 and Figure 4 wherein, Figure 3 Fig. 1 shows a top view of the embedded PCB power module 100 provided in the application, Figure 4 Fig. 2 shows a bottom view of the embedded PCB power module 100 provided in the application.

[0047] As Figure 3 shown in the application, the output copper bar 600 includes a first output copper bar 610, a second output copper bar 620, and a third output copper bar 630. The current sampling circuit 140 includes a first current sampling unit 141, a second current sampling unit 142, and a third current sampling unit 143.

[0048] The first current sampling unit 141 is connected with the on-board driving component 130 and the first output copper bar 610 respectively, the second current sampling unit 142 is connected with the on-board driving component 130 and the second output copper bar 620 respectively, and the third current sampling unit 143 is connected with the on-board driving component 130 and the third output copper bar 630 respectively.

[0049] The UVW three-phase alternating current after the inverter processing of the power device unit 120 is output by the first output copper bar 610, the second output copper bar 620 and the third output copper bar 630.

[0050] Optionally, the first current sampling unit 141, the second current sampling unit 142 and the third current sampling unit 143 are high-precision sampling shunt resistors. The three current sampling units sample the currents at the three output copper bars respectively, so as to send the sampling information of the three-phase alternating current to the on-board driving component 130. In the application, the three-phase output copper bar and the shunt resistor sampling mode are used to collect the three-phase current on the PCB, which can suppress the high common-mode voltage of current sampling, thereby improving the current sampling precision.

[0051] Further, please refer to Figure 4 In the embodiment of the application, the number of the power device units 120 can be six. The six power device units 120 are connected by copper bars, and each two power device units 120 form a bridge arm. After the inverter processing of the six power device units 120, three-phase alternating current is finally output for use by other devices.

[0052] The specific structure of the power device unit 120 will be introduced below. Figure 5 The specific structure of the power device unit 120 will be introduced below.

[0053] In the embodiment of the application, the power device unit 120 includes a peripheral copper bar 121, a first welding layer 122 and a power chip 123. The peripheral copper bar 121 is covered on the surface of the power chip 123 through the first welding layer 122, and the peripheral copper bar 121 is connected with the connecting copper bar 500 and the output copper bar 600 respectively. One end of the control signal line 150 is connected with the power chip 123, and the other end of the control signal line 150 is connected with the on-board driving component 130 after penetrating through the first welding layer 122, the peripheral copper bar 121 and the PCB 110.

[0054] The control signal line 150 can be the gate pin, the source pin and the drain pin of the power chip 123. The power chip 123 can be an SIC or IGBT wafer (bare chip), which is processed from a wafer and further encapsulated into a chip.

[0055] It should be noted that the input copper bar 400, the connecting copper bar 500, the peripheral copper bar 121 and the output copper bar 600 in the embodiments of the present application are all copper sheet assemblies for transmitting current, and play the role of electrical connection and conduction.

[0056] Further, please refer to Figure 6 In the embodiments of the present application, the embedded PCB power module 100 further comprises an insulating layer 160, and the PCB board 110 comprises a plurality of sub-PCB boards.

[0057] Among them, the power device unit 120 is arranged on the bottommost sub-PCB board, the on-board driving component 130 and the current sampling circuit 140 are arranged on the topmost sub-PCB board, and the adjacent two sub-PCB boards are connected through the insulating layer 160. Optionally, the insulating layer 160 can be made of polypropylene (Polypropylene) insulating material.

[0058] In order to connect the embedded PCB power module 100 with the heat dissipation module 200, in the embodiments of the present application, the new inverter 10 further comprises: an active metal brazing (AMB) substrate 810, a heat dissipation copper sheet 820 and a second welding layer 830.

[0059] Among them, the upper surface of the heat dissipation module 200 is provided with a groove, the bottom of the groove is connected with the lower surface of the heat dissipation copper sheet 820 through the second welding layer 830, the upper surface of the heat dissipation copper sheet 820 is connected with the lower surface of the AMB substrate 810, and the upper surface of the AMB substrate 810 is connected with the lower surface of the power device unit 120.

[0060] The AMB substrate 810 is a substrate made by active metal brazing process. At a high temperature of about 800℃, AgCu solder containing active elements Ti and Zr wets and reacts at the interface of ceramic and metal, thereby realizing the heterogeneous bonding of ceramic and metal.

[0061] By arranging the heat dissipation copper sheet 820 between the AMB substrate 810 and the second welding layer 830, the welding effect can be enhanced, and the heat dissipation effect is also improved.

[0062] Optionally, the first welding layer 122 and the second welding layer 830 are both sintered from Cu / Ag / graphene material.

[0063] As a feasible implementation manner, please refer to Figure 7 The heat dissipation module 200 comprises: a heat sink 210 and a water channel 220. Among them, the water channel 220 transversely penetrates the heat sink 210, and the water channel 220 is located between the embedded PCB power module 100 and the capacitor integrated filter module 300.

[0064] It should be noted that in the embodiments of the present application, the water channel 220 is transversely (along the x-axis) through the heat sink 210, while the connecting copper bar 500 is longitudinally (along the y-axis) through the heat sink 210. Since Figure 7 is a cross-sectional side view of the new inverter 10, therefore, the water channel 220 can be seen as through the heat sink 210 along the direction perpendicular to the paper in the side view, and the water channel 220 can be seen as through the heat sink 210 along the direction from left to right (or from right to left) in the front view.

[0065] The heat can be taken away by the injected water flow, thereby cooling the embedded PCB power module 100 and the capacitor integrated filter module 300.

[0066] Further, in order to improve the cooling effect, in the embodiments of the present application, the cooling module 200 further comprises a plurality of cooling columns 230. The plurality of cooling columns 230 are arranged at intervals on the side of the heat sink 210 close to the water channel 220. By arranging the plurality of cooling columns 230, the contact area with the water flow is increased, thereby better cooling.

[0067] Optionally, the heat sink 210 and the cooling column 230 can be made of aluminum alloy material to enhance its heat conduction effect.

[0068] Further, in the embodiments of the present application, the capacitor integrated filter module 300 comprises a thin film capacitor 310 and a filter unit, the filter unit comprising a common mode inductor 320, a first Y capacitor 330 and a second Y capacitor (not shown in the figure).

[0069] Among them, the input copper bar 400 is connected with one end of the common mode inductor 320 after penetrating through the cooling module 200, the other end of the common mode inductor 320 is connected with one end of the first Y capacitor 330, the second Y capacitor and the thin film capacitor 310 respectively, the other end of the thin film capacitor 310 is connected with the connecting copper bar 500, and the two sides of the thin film capacitor 310 are also connected with the first Y capacitor 330 and the second Y capacitor respectively.

[0070] It should be noted that the Y capacitor is used for filtering between the positive and negative electrodes and the ground. The first Y capacitor 330 and the second Y capacitor in the embodiments of the present application are Y capacitor sheets composed of copper sheets, integrated on both sides of the thin film capacitor 310, and connected with the thin film capacitor 310 and the common mode inductor 320 through the copper bar.

[0071] Among them, the thin film capacitor 310 plays a role of storing energy. The first Y capacitor 330, the second Y capacitor and the common mode inductor 320 constitute a filter to filter the input direct current, suppress electromagnetic interference (EMC), improve signal quality and system stability.

[0072] In addition, by integrating the first Y capacitor 330 and the second Y capacitor on both sides of the thin film capacitor 310, the heat dissipation effect can be improved, and the volume and cost can be reduced.

[0073] To further enhance the heat dissipation effect of the capacitor integrated filter module 300, the new inverter 10 further comprises a heat conduction layer 900. The lower surface of the heat conduction layer 900 is connected to the upper surface of the thin film capacitor 310, and the upper surface of the heat conduction layer 900 is connected to the lower surface of the heat sink 210.

[0074] In addition, in order to better fix the embedded PCB power module 100 on the heat dissipation module 200, in the embodiment of the present application, the new inverter 10 further comprises a first fixing hole 710, a second fixing hole 720, a first fixing member and a second fixing member.

[0075] The first fixing hole 710 and the second fixing hole 720 are respectively extended downward from the upper surfaces on both sides of the embedded PCB power module 100 into the heat dissipation module 200. The first fixing member and the second fixing member can be screws, the first fixing member passes through the first fixing hole 710, and the second fixing member passes through the second fixing hole 720, so as to fixedly connect the embedded PCB power module 100 and the heat dissipation module 200.

[0076] Further, the entire new inverter 10 is fixed in the cavity by filling glue at the bottom of the thin film capacitor 310.

[0077] In summary, the new inverter provided in the embodiment of the present application comprises an embedded PCB power module, a heat dissipation module and a capacitor integrated filter module, and the three modules are electrically connected through copper bars. The power device unit in the embedded PCB power module is crimped to the PCB board, which reduces the thermal resistance and stray parameters, and the embedded PCB power module further integrates the on-board driving components and current sampling circuit, thereby reducing the volume of the new inverter. The heat dissipation module comprises a heat sink and a water channel, and the water flow in the water channel can carry away the heat generated by the embedded PCB power module and the capacitor integrated filter module during operation, thereby improving the heat dissipation effect. The capacitor integrated filter module integrates the thin film capacitor and the filter, which greatly reduces the volume of the entire new inverter and reduces the cost.

[0078] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Those skilled in the art can make various modifications and changes to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

[0079] It will be apparent to those skilled in the art that the application is not limited to the details of the above-exemplified embodiments and that the present application can be implemented in other particular forms without departing from the spirit or essential characteristics thereof. The embodiments should be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the above description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. No reference herein to any prior art is to be taken as an admission that the application is not entitled to antedate such prior art by virtue of prior application. Any reference to the use of a term in the singular herein shall also be taken to refer to the plural, and vice versa, unless otherwise indicated by context. Any reference to the use of a term in the present application shall be taken to refer to the use of the term in the context of the present application, and not to the use of the term in any other context. Any reference to the use of a term in the present application shall be taken to refer to the use of the term in the context of the present application, and not to the use of the term in any other context.

Claims

1. A novel inverter, characterized by, The novel inverter comprises an embedded PCB power module, a heat dissipation module, a capacitor integrated filter module, an input copper bar, a connecting copper bar and an output copper bar; The lower surface of the embedded PCB power module is connected with the upper surface of the heat dissipation module, and the capacitor integrated filter module is embedded in the heat dissipation module; the input copper bar is connected with one end of the capacitor integrated filter module after penetrating through the heat dissipation module, the other end of the capacitor integrated filter module is connected with one end of the connecting copper bar, the other end of the connecting copper bar is connected with one end of the embedded PCB power module after penetrating through the heat dissipation module, and the other end of the embedded PCB power module is connected with the output copper bar.

2. The novel inverter as claimed in claim 1, wherein, The embedded PCB power module comprises a PCB board, a power device unit, on-board driving components and a current sampling circuit; The power device unit is embedded in the PCB board, and the on-board driving components and the current sampling circuit are arranged on the upper surface of the PCB board; one end of the power device unit is connected with the connecting copper bar, the other end of the power device unit is connected with the output copper bar, and the power device unit is further connected with the on-board driving components through a control signal line; one end of the on-board driving components is connected with the connecting copper bar, the other end of the on-board driving components is connected with one end of the current sampling circuit, and the other end of the current sampling circuit is connected with the output copper bar.

3. The novel inverter as claimed in claim 2, wherein, The output copper bar is a three-phase alternating current output copper bar, the output copper bar comprises a first output copper bar, a second output copper bar and a third output copper bar, and the current sampling circuit comprises a first current sampling unit, a second current sampling unit and a third current sampling unit; The first current sampling unit is connected with the on-board driving components and the first output copper bar respectively, the second current sampling unit is connected with the on-board driving components and the second output copper bar respectively, and the third current sampling unit is connected with the on-board driving components and the third output copper bar respectively.

4. The novel inverter as claimed in claim 2, wherein, The power device unit comprises a peripheral copper bar, a first welding layer and a power chip; The peripheral copper bar is covered on the surface of the power chip through the first welding layer, and the peripheral copper bar is connected with the connecting copper bar and the output copper bar respectively; one end of the control signal line is connected with the power chip, and the other end of the control signal line is connected with the on-board driving components after penetrating through the first welding layer, the peripheral copper bar and the PCB board.

5. The novel inverter as claimed in claim 2, wherein, The embedded PCB power module further comprises an insulating layer, and the PCB board comprises a plurality of sub-PCB boards; the power device unit is arranged on the bottommost sub-PCB board, the on-board driving components and the current sampling circuit are arranged on the topmost sub-PCB board, and the adjacent two sub-PCB boards are connected through the insulating layer.

6. The novel inverter as claimed in claim 2, wherein, The novel inverter further comprises an active metal brazing (AMB) substrate, a heat dissipation copper sheet and a second welding layer. The upper surface of the heat dissipation module is provided with a groove, the bottom of the groove is connected with the lower surface of the heat dissipation copper sheet through the second welding layer, the upper surface of the heat dissipation copper sheet is connected with the lower surface of the AMB substrate, and the upper surface of the AMB substrate is connected with the lower surface of the power device unit.

7. The novel inverter as claimed in claim 1, wherein, The heat dissipation module comprises a heat sink and a water channel, the water channel transversely penetrates the heat sink, and the water channel is located between the embedded PCB power module and the capacitor integrated filter module.

8. The novel inverter as claimed in claim 7, wherein, The heat dissipation module further comprises a plurality of heat dissipation columns, and the plurality of heat dissipation columns are arranged at intervals on one side of the heat sink close to the water channel.

9. The novel inverter as claimed in claim 1, wherein, The capacitor integrated filter module comprises a thin film capacitor and a filter unit, and the filter unit comprises a common mode inductor, a first Y capacitor and a second Y capacitor. The input copper bar is connected with one end of the common mode inductor after penetrating the heat dissipation module, the other end of the common mode inductor is respectively connected with one end of the first Y capacitor, the second Y capacitor and the thin film capacitor, the other end of the thin film capacitor is connected with the connection copper bar, and the two sides of the thin film capacitor are respectively connected with the first Y capacitor and the second Y capacitor.

10. The novel inverter as claimed in claim 1, wherein, The novel inverter further comprises a first fixing hole, a second fixing hole, a first fixing member and a second fixing member. The first fixing hole and the second fixing hole respectively extend downward from the upper surfaces on both sides of the embedded PCB power module into the heat dissipation module, and the embedded PCB power module is connected with the heat dissipation module through the first fixing hole and the first fixing member, and the second fixing hole and the second fixing member.

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