Printed circuit board (PCB) multilayer circuit board with scrap identification

Abstract

The utility model belongs to the technical field of circuit boards, and particularly relates to a PCB multilayer circuit board with a scrap mark, which comprises a board body, a concave cavity is arranged at the lower end of the board body, a transparent baffle is embedded in the concave cavity, and an accommodating cavity is arranged at the upper end of the transparent baffle; an external wire is connected with an internal circuit of the board body through the junction box, and when the board body is judged to be scrapped, an internal port of the junction box can be quickly disconnected with the internal circuit of the board body after the pins are pulled out of the electrodes of the board body, so that the board body is prevented from being connected with the external wire for use after being scrapped; the transparent baffle, the transparent marking card and the transparent heat insulation pad are also arranged to be in the transparent background color so that the recorded scrap information and the corresponding part of the plate body can present a visual visual effect, the information content recorded by the transparent marking card can be directly observed by observing the transparent baffle, and the corresponding scrap position of the plate body can be quickly found out according to the scrap information. The problem that an existing PCB multi-layer circuit board mark with a scrap mark is prone to being damaged is solved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of circuit board, especially relates to a PCB multilayer circuit board with scrap mark. BACKGROUND

[0002] Pcb is a kind of science and technology product, and the process flow and technology can be divided into single-sided, double-sided and multilayer printed board.Due to the miniaturization of electronic product volume, the complexity and diversity of circuit function, more circuits need to be integrated on the same PCB board to save assembly area, and more layers are needed to accommodate more circuits on smaller PCB boards, so more multilayer boards are on the market.A certain number of defective products on the production line cannot be repaired and scrapped, and these scrapped PCB boards need to be marked to avoid confusion with the remaining finished products.

[0003] At present, there is not enough space area on the PCB board surface to reserve the position of scrap mark at the initial design stage, and the common methods for marking the scrapped PCB board are as follows: 1. sticking a label on the PCB board, and writing the scrap information on the label;2. directly drawing a mark on the PCB board with a marker pen to indicate the position;3. opening a blind hole as a scrap mark.The above-mentioned scrap method of PCB board has a common problem, that is, lacking protection measures for the mark, the scrap mark is damaged by friction during the PCB board carrying process, the mark becomes unclear, the identification difficulty is increased in the later period, the PCB board is easily mistaken, and the structure for marking the scrap mark on the PCB board surface is unreasonable. UTILITY MODEL CONTENTS

[0004] The technical problem to be solved by the utility model is to overcome the defects of the prior art, and the problem of easy damage of the mark of the existing PCB multilayer circuit board with scrap mark is solved.

[0005] The utility model adopts the technical scheme that a PCB multilayer circuit board with scrap mark comprises a board body:

[0006] The lower end of the board body is provided with a concave cavity, the transparent baffle is embedded in the concave cavity, and the upper end of the transparent baffle is provided with a containing cavity.

[0007] The upper end of the board body is provided with a junction box, a plurality of pins are electrically connected around the junction box, the upper end of the board body is electrically connected with a conductive pole inserted with the pins, and the tail end of the pin is inserted with the circuit conductive pole of the board body.

[0008] In the preferred technical scheme of the utility model, the containing cavity is embedded with a transparent mark card.

[0009] In the preferred technical scheme of the utility model, the transparent heat insulation pad is bonded between the upper end of the transparent baffle and the inner top end of the concave cavity.

[0010] In the preferable technical scheme of the utility model, the transparent baffle lower end is provided with a frame body, and the plate body is tightly attached to the four corners of the frame body.

[0011] In the preferable technical scheme of the utility model, the plate body upper end is screw-connected with a screw, the screw lower end penetrates downwards to the transparent baffle upper end, the screw lower end is screw-connected with the transparent baffle upper end, and the screw upper end is fixed with a knob.

[0012] In the preferable technical scheme of the utility model, a plurality of wiring ports are mounted inside the junction box, and the wiring ports are electrically connected with the pins.

[0013] Compared with the prior art, the utility model realizes the beneficial effects that:

[0014] The junction box concentrates all the ports on the plate body surface in a same area to facilitate concentrated connection of electric wires, the pins connect the junction box internal ports with the plate body internal circuit, the external electric wires are connected with the plate body internal circuit by means of the junction box, when the plate body is determined to be scrapped, the pins are pulled out from the plate body electrode internal part, the junction box internal ports are quickly disconnected with the plate body internal circuit, so that the plate body is prevented from being used in connection with the external electric wires after being scrapped, and danger is avoided;

[0015] The accommodating cavity provides accommodating space for the transparent baffle at the plate body lower end, the accommodating cavity enables the transparent baffle to be stably mounted at the plate body lower end, the recess cavity provides accommodating space for the transparent marking card, the transparent marking card is used for recording information of the plate body scrapping, the screw can fasten the transparent baffle at the plate body lower end to avoid loss and damage of the transparent marking card, the transparent thermal insulation pad can insulate the heat source generated by the plate body from being transmitted to the transparent marking card, the transparent baffle, the transparent marking card and the transparent thermal insulation pad are also provided with a transparent background color, which can enable the recorded scrapping information and the corresponding part of the plate body to present a visual visual effect, and the information content recorded by the transparent marking card can be directly observed through the transparent baffle, so that the corresponding scrapping position of the plate body can be quickly found according to the scrapping information. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 It is an overall external structure schematic view of the utility model;

[0017] Fig. 2 It is an overall internal structure sectional view of the utility model;

[0018] Fig. 3 It is a bottom view of the utility model.

[0019] In the drawing: 1, plate body; 2, pin; 3, junction box; 4, screw; 5, knob; 6, accommodating cavity; 7, transparent baffle; 8, frame body; 9, transparent marking card; 10, transparent thermal insulation pad; 11, recess cavity. DETAILED DESCRIPTION

[0020] Referring to Figs. 1-3 The utility model provides a technical scheme: a kind of PCB multilayer circuit board with scrap identification, including board 1: recessed cavity 11 is opened in the lower end of board 1, transparent baffle 7 is embedded in recessed cavity 11 inside, and accommodating cavity 6 is opened in the upper end of transparent baffle 7;The wiring box 3 is provided on the upper end of board 1, and a plurality of pins 2 are electrically connected around wiring box 3, and the electrically conductive pole that is plugged with pin 2 is electrically connected on the upper end of board 1, and pin 2 tail end is plugged with board 1 circuit electric pole;Transparent heat insulation pad 10 is bonded between the upper end of transparent baffle 7 and the inside top end of recessed cavity 11;A plurality of wiring ports are installed in wiring box 3, and wiring port is electrically connected with pin 2;Wiring box 3 has many wiring ports inside, and relies on port to concentrate the external wire to wiring box 3 inside, and wiring box 3 concentrates all ports on the surface of board 1 same area to facilitate concentrated connection wire, and pin 2 connects the port in wiring box 3 with the internal circuit of board 1, and the external wire is sequentially followed along port, pin 2, electric pole and board 1 internal conduction, and the layer number of multilayer circuit board in board 1 is stacked in upper and lower, and the connection point between any two adjacent layers of circuit board in board 1 is mutually electrically connected, so that the external wire is respectively connected with the circuit of each layer of circuit board in board 1, and external wire is connected with internal circuit of board 1 by wiring box 3, so that it is convenient to concentrate the board 1 by external wire to test, and wire is directly concentrated pulled out from wiring box 3 after testing, and it is beneficial to make the wiring port of board 1 form the layout of concentrated arrangement, and after port concentrated arrangement, it is beneficial to free up other positions and space of board 1 and arrange other components, and it is beneficial to optimize component layout of board 1;

[0021] After testing, if board 1 is determined to be scrapped, pin 2 is pulled out from the electrode inside of board 1, so that wiring box 3 is detached from the upper end of board 1, and the port in wiring box 3 and the internal circuit of board 1 are disconnected, to prevent the use of external wire after board 1 is scrapped, to avoid danger, and wiring box 3 can be obviously distinguished from the original untested circuit board product after being detached;

[0022] The accommodating cavity 6 provides accommodation space for the transparent baffle 7 at the lower end of the plate body 1, the shape of the accommodating cavity 6 is matched with the shape of the transparent baffle 7, the transparent baffle 7 is inlaid in the accommodating cavity 6, the concave cavity 11 provides accommodation space for the transparent marking card 9, the label pasted on the transparent marking card 9 is placed in the concave cavity 11 of the transparent baffle 7, the screw 4 is threadedly connected to the upper end of the plate body 1, the lower end of the screw 4 penetrates downward to the upper end of the transparent baffle 7, the lower end of the screw 4 is threadedly connected to the upper end of the transparent baffle 7, the screw 4 penetrates downward from the plate body 1 to the four corners of the transparent baffle 7, the screw 4 integrally connects the four corners of the plate body 1 and the four corners of the transparent baffle 7, the accommodating cavity 6 can stably install the transparent baffle 7 at the lower end of the plate body 1, the screw 4 can tightly fix the transparent baffle 7 at the lower end of the plate body 1, the transparent baffle 7 is arranged at the lower end of the plate body 1 to avoid the loss and damage of the transparent marking card 9, the frame 8 is arranged at the lower end of the transparent baffle 7, the plate body 1 is tightly attached to the four corners of the frame 8, the frame 8 can reinforce the edge of the lower end of the transparent baffle 7, and the frame 8 can improve the stability of the transparent baffle 7 placed in the concave cavity 11;

[0023] The upper end of the screw 4 is fixedly connected with the knob 5, the knob 5 is rotated to rotate the screw 4 out of the four corners between the plate body 1 and the transparent baffle 7, so that the plate body 1 and the transparent baffle 7 are separated, the transparent baffle 7 is taken out of the concave cavity 11, and the transparent marking card 9 can be taken out of the accommodating cavity 6, the surface of the transparent marking card 9 is written with the text description of the scrap of the circuit board, the transparent marking card 9 is used for recording the information of the plate body 1, the transparent marking card 9 can be directly observed to the line direction on the surface of the plate body 1, the transparent marking card 9 is in a transparent state, the written text can correspond to the position of the plate body 1, the transparent baffle 7, the transparent marking card 9 and the transparent thermal insulation pad 10 are also arranged to be transparent background color, so that the recorded scrap information and the corresponding part of the plate body 1 can present a visual visual effect, the transparent baffle 7 can directly observe the information content recorded by the transparent marking card 9, and the corresponding scrap position of the plate body 1 can be quickly found according to the scrap information, so that the circuit board which belongs to the scrap product can be quickly distinguished when the defective product is removed in the later period, the normal product is avoided from being confused, the work efficiency of taking out the defective product is increased, and the situation that the circuit board is taken wrong is avoided;

[0024] The transparent thermal insulation pad 10 can prevent the heat generated by the plate body 1 from being transmitted to the transparent marking card 9, so that the transparent marking card 9 is prevented from being damaged by high temperature;

[0025] If the plate body 1 belongs to a normal product after testing, the terminal box 3 does not need to be taken off from the plate body 1, the label can be pasted on the surface of the transparent marking card 9 after the transparent baffle 7 is taken off from the lower end of the plate body 1, and then the transparent baffle 7 is reassembled, so that the transparent marking card 9 can be sealed at the lower end of the plate body 1, and the pin 2 is firmly welded in the conductive pole at the upper end of the plate body 1 by using soldering flux (soldering paste), and the technical scheme can achieve two effects at one time.

[0026] Working principle:

[0027] The ports are relied on to concentrate the external wires into the terminal box 3, the terminal box 3 concentrates all the ports on the same area of the surface of the board body 1 to facilitate the concentrated connection of the wires, the pins 2 connect the ports inside the terminal box 3 with the internal circuit of the board body 1, the external wires are sequentially connected with the board body 1 through the ports, the pins 2, the conductive poles and the internal circuit of the board body 1, the layers of the multi-layer circuit board inside the board body 1 are stacked in an up-down manner, the connection points between any two adjacent layers of the circuit board inside the board body 1 have a mutual electrical connection relationship, so that the external wires are respectively connected with the circuit of each layer of the circuit board inside the board body 1, the terminal box 3 is relied on to connect the external wires with the internal circuit of the board body 1, so that the board body 1 can be conveniently tested through the external wires, and the wires can be directly pulled out from the terminal box 3 after the test is completed;

[0028] After the test, if the board body 1 is determined to be scrapped, the pins 2 are pulled out from the inside of the poles of the board body 1, so that the terminal box 3 is detached from the upper end of the board body 1, and the ports inside the terminal box 3 are disconnected with the internal circuit of the board body 1, so as to prevent the board body 1 from being used after being scrapped by connecting the external wires, and the terminal box 3 can be obviously distinguished from the original untested circuit board product after being detached;

[0029] The accommodating cavity 6 enables the transparent baffle 7 to be stably installed at the lower end of the board body 1, the screw 4 can fasten the transparent baffle 7 at the lower end of the board body 1, the transparent baffle 7 is arranged at the lower end of the board body 1 to avoid the loss and damage of the transparent marking card 9, the frame 8 is arranged at the lower end of the transparent baffle 7, the board body 1 is tightly attached to the four corners of the frame 8, the frame 8 can reinforce the edge of the lower end of the transparent baffle 7, and the frame 8 can improve the stability of the transparent baffle 7 placed in the recess cavity 11;

[0030] The transparent baffle 7 is taken out from the recess cavity 11, so that the transparent marking card 9 can be taken out from the accommodating cavity 6, the text description of the scrapped circuit board is written on the surface of the transparent marking card 9, the transparent marking card 9 is used for recording the information of the scrapped board body 1, the circuit layout on the surface of the board body 1 can be directly observed by visually observing the transparent marking card 9, the transparent marking card 9 is in a transparent state, so that the written text corresponds to the scrapped position on the surface of the board body 1, the transparent baffle 7, the transparent marking card 9 and the transparent thermal insulation pad 10 are also arranged to be transparent, so that the recorded scrapped information and the corresponding part of the board body 1 present a visual visual effect, the information content recorded by the transparent marking card 9 can be directly observed by visually observing the transparent baffle 7, the corresponding scrapped position of the board body 1 can be quickly found according to the scrapped information, so that the scrapped circuit boards can be quickly distinguished from the normal products in the later period, the scrapped circuit boards are avoided from being confused with the normal products, the work efficiency of taking out the scrapped circuit boards is increased, and the situation that the circuit boards are taken wrong is avoided;

[0031] If the board 1 is normal product after testing, the terminal box 3 need not be removed from the board 1, the transparent baffle 7 can be removed from the lower end of the board 1, the label can be pasted on the surface of the transparent mark card 9, and then the transparent baffle 7 is re-installed, so that the transparent mark card 9 is sealed at the lower end of the board 1, and the pin 2 is welded in the conductive pole at the upper end of the board 1 by using soldering flux (soldering paste).

Claims

1. A PCB multilayer circuit board with scrap identification, comprising a board body (1), characterized in that: a recessed cavity (11) is formed at the lower end of the board body (1), a transparent baffle (7) is embedded in the recessed cavity (11), and a containing cavity (6) is formed at the upper end of the transparent baffle (7); a terminal box (3) is arranged at the upper end of the board body (1), a plurality of pins (2) are electrically connected around the terminal box (3), and a conductive pole is electrically connected to the upper end of the board body (1) and is inserted into the pins (2); the tail end of the pin (2) is inserted into the circuit conductive pole of the board body (1).

2. The PCB multi-layer circuit board with a scrap mark according to claim 1, wherein: A transparent marking card (9) is embedded in the containing cavity (6).

3. The PCB multi-layer circuit board with a scrap mark according to claim 1, wherein: A transparent thermal insulation pad (10) is bonded between the upper end of the transparent baffle (7) and the inner top end of the recessed cavity (11).

4. The PCB multi-layer circuit board with a scrap mark according to claim 1, wherein: A frame (8) is arranged at the lower end of the transparent baffle (7), and the board body (1) is tightly attached to the four corners of the frame (8).

5. The PCB multi-layer circuit board with a scrap mark according to claim 1, wherein: A screw (4) is threadedly connected to the upper end of the board body (1), the lower end of the screw (4) penetrates downward to the upper end of the transparent baffle (7), the lower end of the screw (4) is threadedly connected to the upper end of the transparent baffle (7), and a knob (5) is fixed to the upper end of the screw (4).

6. The PCB multi-layer circuit board with a scrap mark according to claim 1, wherein: A plurality of terminal ports are installed in the terminal box (3), and the terminal ports are electrically connected to the pins (2).

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