Electronic device

Abstract

The utility model provides electronic equipment. The electronic equipment comprises a shell, a heat dissipation device and a printed circuit board, the shell comprises a first panel and a second panel, the heat dissipation device and the printed circuit board are arranged in the shell, and an opening area is formed between the first panel and the second panel; the heat dissipation device comprises a first heat dissipation assembly and a fan, the first heat dissipation assembly is arranged between the first panel and the printed circuit board, a heating assembly is arranged on the surface of the printed circuit board, the first heat dissipation assembly is used for absorbing heat of the heating assembly, and the fan is arranged on the surface of the printed circuit board. The first heat dissipation assembly and the printed circuit board divide the area between the first panel and the second panel into three ventilation channels, so that airflow blown out by the fan can approach the first panel and the second panel, the heat dissipation effect on the shell is enhanced, and the user experience is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment, and more particularly to an electronic equipment. BACKGROUND

[0002] With the development of electronic equipment technology, terminal devices such as notebook computers and tablet computers are developing towards thinness and high performance, and the heat power density is increasing. When the electronic equipment is thinned, the distance between the heat generating element and the shell in the thickness direction is shortened, and the heat of the heat generating element is more likely to be directly conducted to the shell, so that the temperature of the shell in some areas is relatively high, and the user's experience is poor when touching these areas. Therefore, an effective solution is needed to dissipate heat from the shell. CONTENT OF THE UTILITY MODEL

[0003] Embodiments of the present application provide an electronic equipment, and the heat dissipation device of the electronic equipment can effectively dissipate heat from the shell of the electronic equipment, thereby improving the user's experience.

[0004] In a first aspect, an electronic equipment is provided, comprising: a shell, a heat dissipation device and a printed circuit board; the shell comprises a first panel and a second panel arranged oppositely, the heat dissipation device and the printed circuit board are arranged in the shell, and the first panel and the second panel have an opening area communicating with the outside; the heat dissipation device comprises a first heat dissipation assembly and a first fan, the first fan is arranged at one end of the printed circuit board, the first heat dissipation assembly is arranged between the first panel and the printed circuit board, a surface of the printed circuit board is provided with a heat generating assembly, the first heat dissipation assembly is used for absorbing heat of the heat generating assembly, and the first fan comprises a first air outlet, which is arranged towards the printed circuit board; wherein the first panel and the first heat dissipation assembly are arranged oppositely to form a first channel communicating the first air outlet to the opening area, the first heat dissipation assembly and the printed circuit board are arranged oppositely to form a second channel communicating the first air outlet to the opening area, and the printed circuit board and the second panel are arranged oppositely to form a third channel communicating the first air outlet to the opening area; the airflow blown by the first fan passes through the first channel, the second channel and / or the third channel and flows out from the opening area.

[0005] Based on the above technical solution, the first heat dissipation assembly is arranged in the heat dissipation device, the space between the first panel, the second panel and the printed circuit board is divided into three channels, so that the airflow blown by the fan can pass through the three channels, the heat dissipation capacity of the shell is enhanced, and the user's experience when touching the shell during use of the electronic equipment can be improved.

[0006] In some implementations of the first aspect, the heat dissipation device further comprises a sealing member, the sealing member comprising a first sealing member sealingly connecting the first panel and the first heat dissipation assembly, the airflow blown by the first fan entering the first channel from the first air outlet along the first sealing member and flowing out of the air outlet.

[0007] According to the above technical solution, the first sealing member can improve the sealing performance of the first channel, so that the airflow blown by the fan is more concentrated in the first channel, thereby improving the heat dissipation capacity of the first panel.

[0008] In some implementations of the first aspect, the sealing member further comprises a second sealing member sealingly connecting the first heat dissipation assembly and the printed circuit board, the airflow blown by the first fan entering the second channel from the first air outlet along the second sealing member and flowing out of the air outlet.

[0009] According to the above technical solution, the second sealing member can improve the sealing performance of the second channel, so that the airflow blown by the fan is more concentrated in the second channel, thereby improving the heat dissipation capacity of the printed circuit board.

[0010] In some implementations of the first aspect, the sealing member further comprises a third sealing member sealingly connecting the printed circuit board and the second panel, the airflow blown by the first fan entering the third channel from the first air outlet along the third sealing member and flowing out of the air outlet.

[0011] According to the above technical solution, the third sealing member can improve the sealing performance of the third channel, so that the airflow blown by the fan is more concentrated in the third channel, thereby improving the heat dissipation capacity of the second panel.

[0012] In some implementations of the first aspect, the sealing member further comprises a fourth sealing member sealingly connecting the first panel and the first fan, and a fifth sealing member sealingly connecting the second panel and the first fan.

[0013] According to the above technical solution, the fourth sealing member and the fifth sealing member can prevent the airflow blown by the fan from being absorbed by the heat and then returning to the fan from the gap of the shell, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0014] In some implementations of the first aspect, the first fan further comprises a second air outlet, the second air outlet being in communication with the outside, the orientation of the second air outlet being the same as the orientation of the opening area; the first fan is provided with a flow guide member near the first air outlet, the flow guide member being used to change the ventilation volume through the first air outlet and the second air outlet.

[0015] Based on the above technical scheme, the flow guide piece can reduce the local flow resistance in the channel, increase the air volume, and adjust the air volume ratio of the fan passing through the first air outlet and the second air outlet, thereby improving the utilization efficiency of the cold air.

[0016] In combination with the first aspect, in some implementations of the first aspect, the heat dissipation device further includes an adjusting module connected with the flow guide piece, the adjusting module being configured to adjust an angle at which the flow guide piece rotates in a plane where the first fan is located, and the flow guide piece being configured to adjust the ventilation volume passing through the first air outlet and the second air outlet.

[0017] Based on the above technical scheme, the flow guide piece can rotate or rotate, and can flexibly adjust the air volume ratio of the fan passing through the first air outlet and the second air outlet according to different heat dissipation requirements, thereby improving the heat dissipation effect of the heat dissipation device.

[0018] In combination with the first aspect, in some implementations of the first aspect, the shape of the flow guide piece includes any one of a curved type, a cylindrical shape, an elliptical shape, or a streamline type.

[0019] Based on the above technical scheme, the flow guide piece in a streamline type can better change or adjust the flow direction of the air.

[0020] In combination with the first aspect, in some implementations of the first aspect, the first heat dissipation assembly is provided with at least one first through hole penetrating through the first heat dissipation assembly, and the second channel and the first channel are in communication through the first through hole.

[0021] Based on the above technical scheme, after the first channel and the second channel are in communication through the first through hole, the air flow blown into the second channel by the fan can enter the first channel through the first through hole, thereby reducing the flow resistance and increasing the air flow entering the first channel, and thus improving the heat dissipation capacity of the first panel.

[0022] In combination with the first aspect, in some implementations of the first aspect, the printed circuit board is provided with at least one second through hole penetrating through the printed circuit board, and the second channel and the third channel are in communication through the second through hole.

[0023] In combination with the first aspect, in some implementations of the first aspect, the number of the first through holes is a plurality.

[0024] Based on the above technical scheme, after the second channel and the third channel are in communication through the second through hole, the air flow blown into the second channel by the fan can enter the third channel through the second through hole, thereby reducing the flow resistance and increasing the air flow entering the third channel, and thus improving the heat dissipation capacity of the second panel.

[0025] In some possible implementations, the first through hole and the second through hole can be arranged at the same time, so that the air blown into the second channel by the fan can enter the first channel and the third channel through the first through hole and the second through hole respectively, thereby improving the heat dissipation capacity of the first panel and the second panel.

[0026] In combination with the first aspect, in some implementations of the first aspect, the number of the second through holes is a plurality.

[0027] In combination with the first aspect, in some implementations of the first aspect, the heat dissipation device further includes a second fan, the second fan is arranged at the other end of the printed circuit board, the second fan includes a third air outlet and a fourth air outlet, the third air outlet is arranged towards the printed circuit board, the fourth air outlet is in communication with the outside, and the orientation of the fourth air outlet is the same as that of the opening area; wherein the airflow blown by the second fan flows through the first channel, the second channel and / or the third channel and flows out of the opening area.

[0028] In combination with the first aspect, in some implementations of the first aspect, the first heat dissipation assembly includes any one of a vapor chamber heat plate or a heat pipe.

[0029] In combination with the first aspect, in some implementations of the first aspect, the sealing member is made of an elastic material.

[0030] Secondly, a heat dissipation device is provided, which is applied to an electronic device, the electronic device includes a shell and a printed circuit board; the shell includes oppositely arranged first and second panels, the heat dissipation device and the printed circuit board are arranged in the shell, and the first and second panels have an opening area in communication with the outside; the heat dissipation device includes a first heat dissipation assembly and a first fan, the first fan is arranged at one end of the printed circuit board, the first heat dissipation assembly is arranged between the first panel and the printed circuit board, a surface of the printed circuit board is provided with a heating assembly, the first heat dissipation assembly is used for absorbing heat of the heating assembly, and the first fan includes a first air outlet, the first air outlet is arranged towards the printed circuit board; wherein the first panel and the first heat dissipation assembly are oppositely arranged to form a first channel in communication with the first air outlet to the opening area, the first heat dissipation assembly and the printed circuit board are oppositely arranged to form a second channel in communication with the first air outlet to the opening area, and the printed circuit board and the second panel are oppositely arranged to form a third channel in communication with the first air outlet to the opening area; the airflow blown by the first fan flows through the first channel, the second channel and / or the third channel and flows out of the opening area.

[0031] According to the technical scheme, the first heat dissipation assembly is arranged in the heat dissipation device, the space between the first panel, the second panel and the printed circuit board is divided into three channels, so that the airflow blown by the fan can pass through the three channels, the heat dissipation capacity of the shell is enhanced, and the experience of a user when the user touches the shell while using the electronic device can be improved.

[0032] With reference to the second aspect, in some implementations of the second aspect, the heat dissipation device further includes a seal, and the seal includes a first seal that sealingly connects the first panel and the first heat dissipation assembly, and the airflow blown by the first fan enters the first channel from the first air outlet along the first seal and flows out of the air outlet.

[0033] According to the technical scheme, the first seal is arranged to improve the sealing performance of the first channel, so that the airflow blown by the fan is more concentrated in the first channel, and the heat dissipation capacity of the first panel is improved.

[0034] With reference to the second aspect, in some implementations of the second aspect, the seal further includes a second seal that sealingly connects the first heat dissipation assembly and the printed circuit board, and the airflow blown by the first fan enters the second channel from the first air outlet along the second seal and flows out of the air outlet.

[0035] According to the technical scheme, the second seal is arranged to improve the sealing performance of the second channel, so that the airflow blown by the fan is more concentrated in the second channel, and the heat dissipation capacity of the printed circuit board is improved.

[0036] With reference to the second aspect, in some implementations of the second aspect, the seal further includes a third seal that sealingly connects the printed circuit board and the second panel, and the airflow blown by the first fan enters the third channel from the first air outlet along the third seal and flows out of the air outlet.

[0037] According to the technical scheme, the third seal is arranged to improve the sealing performance of the third channel, so that the airflow blown by the fan is more concentrated in the third channel, and the heat dissipation capacity of the second panel is improved.

[0038] With reference to the second aspect, in some implementations of the second aspect, the seal further includes a fourth seal that sealingly connects the first panel and the first fan, and a fifth seal that sealingly connects the second panel and the first fan.

[0039] According to the technical scheme, the fourth seal and the fifth seal can prevent the airflow blown by the fan from being absorbed by heat and then returning to the fan from a gap of the shell again, and the heat dissipation efficiency of the heat dissipation device is improved.

[0040] In some implementations of the second aspect, the first fan further includes a second air outlet, the second air outlet being in communication with the outside, and the second air outlet has the same orientation as the opening region; and the first fan is provided with a flow guide near the first air outlet, the flow guide being configured to change the amount of air passing through the first air outlet and the second air outlet.

[0041] According to the above technical solution, the flow guide can reduce the local flow resistance in the channel, increase the air volume, and adjust the air volume ratio of the fan passing through the first air outlet and the second air outlet, thereby improving the utilization efficiency of the cold air.

[0042] In some implementations of the second aspect, the heat dissipation device further includes an adjustment module connected to the flow guide, the adjustment module being configured to adjust the angle of the flow guide rotating in the plane where the first fan is located, and the flow guide being configured to adjust the amount of air passing through the first air outlet and the second air outlet.

[0043] According to the above technical solution, the flow guide can rotate or rotate, and can flexibly adjust the air volume ratio of the fan passing through the first air outlet and the second air outlet according to different heat dissipation requirements, thereby improving the heat dissipation effect of the heat dissipation device.

[0044] In some implementations of the second aspect, the shape of the flow guide includes any one of a curved shape, a cylindrical shape, an elliptical shape, or a streamline shape.

[0045] According to the above technical solution, the flow guide with a streamline shape can better change or adjust the flow direction of the air.

[0046] In some implementations of the second aspect, the first heat dissipation assembly is provided with at least one first through hole penetrating through the first heat dissipation assembly, and the second channel is in communication with the first channel through the first through hole.

[0047] In some implementations of the second aspect, the number of the first through holes is multiple.

[0048] According to the above technical solution, after the first channel and the second channel are communicated through the first through hole, the air flow blown into the second channel by the fan can enter the first channel through the first through hole, thereby reducing the flow resistance and increasing the air flow entering the first channel, thereby improving the heat dissipation capacity of the first panel.

[0049] In some implementations of the second aspect, the printed circuit board is provided with at least one second through hole penetrating through the printed circuit board, and the second channel is in communication with the third channel through the second through hole.

[0050] Based on the above technical scheme, after the second channel and the third channel are communicated through the second through hole, the air flow blown into the second channel by the fan can enter the third channel through the second through hole, the flow resistance is reduced, the air flow entering the third channel is increased, and the heat dissipation capacity of the second panel is improved.

[0051] In some possible implementation manners, the first through hole and the second through hole can be arranged at the same time, so that the air blown into the second channel by the fan can enter the first channel and the third channel through the first through hole and the second through hole respectively, and the heat dissipation capacity of the first panel and the second panel is improved at the same time.

[0052] With reference to the second aspect, in some implementation manners of the second aspect, the number of the second through holes is multiple.

[0053] With reference to the second aspect, in some implementation manners of the second aspect, the heat dissipation device further includes a second fan, the second fan is arranged at the other end of the printed circuit board, the second fan includes a third air outlet and a fourth air outlet, the third air outlet is arranged towards the printed circuit board, the fourth air outlet is in communication with the outside, and the orientation of the fourth air outlet is the same as the orientation of the opening area; wherein the air flow blown out by the second fan flows through the first channel, the second channel and / or the third channel and flows out from the opening area.

[0054] With reference to the second aspect, in some implementation manners of the second aspect, the first heat dissipation component includes any one of a vapor chamber heat plate or a heat pipe.

[0055] With reference to the second aspect, in some implementation manners of the second aspect, the sealing member is made of an elastic material. BRIEF DESCRIPTION OF DRAWINGS

[0056] Figure 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.

[0057] Figure 2 is a schematic exploded view of the internal structure of the electronic device.

[0058] Figure 3 is a schematic exploded view of the internal structure of the electronic device provided by an embodiment of the present application.

[0059] Figure 4 is a partial cross-sectional schematic diagram of the electronic device provided by an embodiment of the present application.

[0060] Figure 5 is a schematic diagram of a heat dissipation device provided by an embodiment of the present application.

[0061] Figure 6 is a schematic exploded view of a heat dissipation device provided by an embodiment of the present application.

[0062] Figure 7 FIG. 1 is a schematic diagram of a heat dissipation device according to an embodiment of the present application.

[0063] Figure 8 FIG. 2 is a schematic diagram of a fan according to an embodiment of the present application.

[0064] Figure 9 FIG. 3 is a schematic diagram of a fan according to an embodiment of the present application.

[0065] Figure 10 FIG. 4 is a partial cross-sectional schematic diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0066] The technical solutions in the present application will be described below with reference to the drawings.

[0067] It should be noted that, in the embodiments of the present application, the terms "upper", "lower", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are merely intended to facilitate the description of the embodiments of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the embodiments of the present application. The terms "include", "contain", "have" and their variants mean "include but are not limited to", unless otherwise specifically emphasized. In addition, the terms "first", "second", "third" are only for descriptive purposes and should not be construed as indicating or implying relative importance. The size of the serial numbers of the processes below does not mean the order of execution, and the execution order of the processes should be determined by their functions and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0068] In the description of the embodiments of the present application, it should be noted that, unless otherwise specified, "a plurality of" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are merely intended to facilitate the description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the embodiments of the present application. In addition, the terms "first", "second", "third" and the like are only for descriptive purposes and should not be construed as indicating or implying relative importance. "Vertical" is not strictly vertical, but within the allowable error range. "Parallel" is not strictly parallel, but within the allowable error range.

[0069] Reference made in the description to "one embodiment" or "some embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "example" or "for example" in various places in the specification are used for the purpose of illustrating, by way of example, one or more embodiments of the application. Any embodiment or design solution described as "example" or "for example" should not be construed as being preferred or advantageous over other embodiments or design solutions. The use of the terms "example" or "for example" is intended to present concept in a particular way. The terms "comprise", "comprising", "include", "including", "contain", "containing", and any variations thereof are meant to encompass the elements listed thereafter without excluding other elements. In the description of the embodiments of the application, the terms "when", "if", "as long as" and "in the case of" are intended to describe objective conditions under which the device will perform corresponding processing, and are not intended to limit time, nor require the device to have a judgment action when implemented, nor imply other limitations.

[0070] The term "and / or" in the embodiments of the application is merely used to describe an association relationship of associated objects, and means that there can be three relationships, for example, A and / or B can mean that A exists, A and B exist, and B exists. In addition, the character " / " in the embodiments of the application generally means that the front and rear associated objects are in an "or" relationship.

[0071] In addition, it should be further noted that, in the description of the embodiments of the application, unless otherwise explicitly specified and limited, the terms "connected" and "connected" should be understood in a broad sense, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be mechanically connected, can be electrically connected; can be directly connected, can be indirectly connected through an intermediate medium, or can be connected inside two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the application can be understood according to the specific circumstances.

[0072] The electronic device provided by the embodiments of the application can be any electronic device provided with a heat dissipation device, for example, the electronic device can be a mobile phone, a tablet computer, a notebook computer, a projector, etc. For ease of description, the electronic device in the embodiments of the application is taken as a notebook computer for description.

[0073] Figure 1 FIG. 1 is a schematic diagram of an electronic device provided by the embodiments of the application.

[0074] Reference Figure 1 The electronic device includes a housing 10 and a heat dissipation device 20. The housing 10 can form an overall structure with an accommodating space inside. The housing 10 can include a first panel 101 and a second panel 102 arranged oppositely, and the heat dissipation device 20 is arranged in the accommodating space formed by the housing 10.

[0075] It should be noted that the first panel 101 can be a cover plate, and the second panel 102 can be a bottom plate.

[0076] Figure 2 For the internal schematic exploded view of the electronic device, the electronic device 1 includes a heat dissipation device 20, the heat dissipation device 20 includes a first fan 201 and a printed circuit board 30, the first fan 201 is arranged at one end of the printed circuit board 30, and the printed circuit board 30 is integrated with a heat generating component 301. When the electronic device 1 works, the heat generating component 301 will generate heat, and the electronic device 1 needs to be cooled in time to ensure the performance of the electronic device 1. The heat generating component 301 can be understood as a device that generates heat when the electronic device 1 is running. For example, the heat generating component 301 of the electronic device 1 can be a central processing unit (CPU), a graphic processing unit (GPU), or other heat generating electronic devices, and the electronic device 1 can discharge the heat generated by the heat generating component 301 through the heat dissipation device 20.

[0077] The first fan 201 can be fixed on the first panel 101 or the second panel 102, and the first fan 201 can include a fan blade 2011, a motor 2012 and a shell 2013. The motor 2012 can drive the fan blade 2011 to generate airflow. The first fan 201 includes a first air outlet 201a and a second air outlet 201b, and the first air outlet 201a and the second air outlet 201b are respectively located on two sides adjacent to the first fan 201. The first air outlet 201a is arranged towards the heat generating component 301 on the printed circuit board 30, blows the airflow to the area where the heat generating component 301 is located, and carries the heat of the heat generating component 301 to the outside of the electronic device 1. The opening area 10a in communication with the outside is formed between the first panel 101 and the second panel 102, the second air outlet 201b is in communication with the outside, and the direction of the second air outlet 201b is the same as the direction of the opening area 10a. The heated airflow is blown out of the shell 10 to the outside of the shell 10, achieving the heat dissipation effect of the electronic device 1.

[0078] With the design of thin and light electronic devices, the distance between the first panel 101 and the second panel 102 will become smaller and smaller, and the distance between the heat generating component 301 and the first panel 101 or the second panel 102 in the thickness direction will also become closer. The heat of the heat generating component 301 is more likely to be directly conducted to the first panel 101 or the second panel 102, resulting in a higher temperature at the shell corresponding to the heat generating component 301, forming a local high temperature area. When the user uses the electronic device 1 and touches these areas, he or she will feel that the temperature is too high, even scalding, causing the experience to decrease.

[0079] To solve the above problems, the embodiment of the present application provides a heat dissipation device and an electronic device, which can improve the heat dissipation effect of the electronic device shell.

[0080] Figure 3 is a schematic exploded view of an electronic device provided by the embodiment of the present application. As shown in Figure 3 , similar to the electronic device shown in Figure 2 , the electronic device 1 comprises a heat dissipation device 20, which comprises a first fan 201 and a first heat dissipation component 202; the electronic device 1 further comprises a printed circuit board 30, and the printed circuit board 30 is integrated with a heat generating component 301. The first heat dissipation component 202 is arranged between the first panel 101 and the printed circuit board 30; wherein the first heat dissipation component 202 can be a vapor chamber (VC) plate or a heat pipe, and the first heat dissipation component 202 can absorb the heat emitted by the heat generating component 301.

[0081] The vapor chamber heat dissipation plate, also known as the vacuum chamber heat dissipation plate, is a high-efficiency heat dissipation technology for heat transfer through liquid-vapor phase change. The cooling liquid in the vacuum chamber evaporates into vapor after being heated, the vapor diffuses in the chamber and condenses into liquid, and returns to the heat source through capillary action, forming a cycle, thereby effectively conducting heat from the heat source to the external environment.

[0082] In some possible implementations, the heat dissipation device 20 further comprises a second heat dissipation component 203, which is arranged at the second air outlet 201b of the first fan 201, and the second heat dissipation component 203 can be a heat dissipation fin, which can increase the contact area with air and improve the heat dissipation capacity.

[0083] The first heat dissipation component 202 can absorb the heat generated by the heat generating component 301 during operation, the first air outlet 201a of the first fan 201 is open towards the position where the first heat dissipation component 202 and the printed circuit board 30 are located, and the airflow generated by the first fan 201 is discharged towards the air outlet of the shell 10, so that the heat from the first heat dissipation component 202 and the heat generating component 301 can be conducted to the outside of the electronic device 1.

[0084] As described above, the first panel 101, the first heat dissipation component 202, the printed circuit board 30 and the second panel 102 are arranged in the thickness direction of the electronic device 1 respectively; wherein the first air outlet 201a of the first fan 201 blows the airflow to the area formed between the first panel 101 and the second panel 102, and since the first heat dissipation component 202 is arranged between the first panel 101 and the printed circuit board 30, the airflow can have multiple layers after entering the first panel 101 and the second panel 102.

[0085] Figure 4Figure 1 is a schematic diagram of a partial cross-section of an electronic device according to an embodiment of the present application. Figure 5 Figure 2 is a schematic diagram of a heat dissipation device according to an embodiment of the present application. Figure 4 Figure 3 is a schematic diagram of an electronic device according to an embodiment of the present application. Figure 5 The flow direction of the air flow in the electronic device according to an embodiment of the present application is described below. In the thickness direction, the first panel 101 is arranged opposite the first heat dissipation component 202, which can form a first channel 41 that connects the first air outlet 201a to the opening area 10a. The first heat dissipation component 202 is arranged opposite the printed circuit board 30, which can form a second channel 42 that connects the first air outlet 201a to the opening area 10a. The printed circuit board 30 is arranged opposite the second panel 102, which can form a third channel 43 that connects the first air outlet 201a to the opening area 10a. After the first air outlet 201a of the first fan 201 blows out the air flow, the air flow can flow through the first channel 41, the second channel 42, and / or the third channel 43, respectively, and flow out of the opening area 10a of the housing 10.

[0086] The first heat dissipation component 202 can absorb the heat emitted by the heat generating component 301 on the printed circuit board 30. When the air flow passes through the first channel 41, the air passes through the first heat dissipation component 202 and carries the heat absorbed by the first heat dissipation component 202 to the outside of the electronic device 1. The amount of heat that the first panel 101 can absorb is reduced, so that the user will not feel too hot when touching the first panel 101 when using the electronic device 1, and the heat dissipation effect of the housing 10 of the electronic device 1 can be improved.

[0087] When the air flow passes through the second channel 42, the air carries away the heat of the first heat dissipation component 202 and the heat generating component 301 when passing through the first heat dissipation component 202 and the printed circuit board 30, and carries the heat to the outside of the electronic device 1, thereby achieving heat dissipation of the electronic device 1.

[0088] When the air flow passes through the third channel 43, the air carries away the heat emitted by the heat generating component 301 when passing through the printed circuit board 30 and the second panel 102, and carries away the heat transmitted by the heat generating component 301 to the second panel 102, thereby reducing the temperature of the second panel 102 and achieving the heat dissipation effect of the housing 10.

[0089] Based on the above technical solution, by arranging the first heat dissipation component 202 between the first panel 101 and the printed circuit board 30, the heat dissipation efficiency of the housing 10 is improved, and the user experience when using the electronic device 1 can be improved.

[0090] In some possible implementation manners, the heat dissipation device 20 further includes a second fan 204, the second fan 204 is arranged at the other end of the printed circuit board 30, the second fan 204 can be considered to be arranged opposite to the first fan 201, the second fan 204 can include a fan blade 2041, a motor 2042 and a shell 2043, the motor 2042 can drive the fan blade 2041 to generate airflow, the second fan 204 includes a third air outlet 204a and a fourth air outlet 204b, the fourth air outlet 204b is in communication with the outside, and the fourth air outlet 204b is oriented in the same direction as the opening area 10a, the airflow blown out of the third air outlet 204a of the second fan 204 flows through the first channel 41, the second channel 42 and / or the third channel 43 respectively and flows out of the opening area 10a of the shell 10.

[0091] It should be noted that the first fan 201 and the second fan 204 can be considered to be symmetrical designs relative to the printed circuit board 30, the first fan 201 and the second fan 204 are consistent in other related characteristics except that the positions are different, therefore, in the embodiments provided in the present application, the setting method and characteristics of the first fan 201 are mainly described, and these descriptions of the first fan 201 are also applicable to the second fan 204, for the sake of brevity, the second fan 204 will not be described herein.

[0092] In some possible implementation manners, the heat dissipation device 20 further includes a sealing member, the sealing member can guide the airflow blown out of the first air outlet 201a of the first fan 201, affect the flow path of the air in the channel, so that the airflow can flow more concentratedly in each channel, and improve the heat dissipation efficiency of the heat dissipation device 20.

[0093] Still taking Figure 5 as an example, the sealing member includes a first sealing member 51 sealingly connecting the first panel 101 and the first heat dissipation assembly 202, the airflow blown out of the first fan 201 enters the first channel 41 along the first sealing member 51 and flows out of the air outlet 10a.

[0094] In some possible implementation manners, the number of the first sealing member 51 can be multiple, a first surface of the first sealing member 51 is in contact with or abuts against the first panel 101, and a second surface opposite to the first surface of the first sealing member 51 is in contact with or abuts against the first heat dissipation assembly 202.

[0095] In this embodiment, the first sealing member 51 can be a rectangular strip, a first end of the first sealing member 51 is close to a first side of the first air outlet 201a of the first fan 201, and a second end of the first sealing member 51 is close to the opening area 10a of the shell 10, wherein the first side of the first air outlet 201a is a side close to the opening area 10a of the shell 10.

[0096] In some possible implementation manners, the first sealing member 51 can be in a rectangular strip shape, a first end of the first sealing member 51 is close to a second side of the first air outlet 201a of the first fan 201, a second end of the first sealing member 51 is close to a second side of the third air outlet 204a of the second fan 204, the second side of the first air outlet 201a is a side away from the air outlet area 10a, and the second side of the third air outlet 204a is a side away from the air outlet area 10a.

[0097] In some possible implementation manners, the first sealing member 51 can be fixed on a surface of the first heat dissipation assembly 202 on a side facing the first panel 101 by adhesion, or the first sealing member 51 can be fixed on a surface of the first panel 101 on a side facing the first heat dissipation assembly 202 by adhesion. By fixing the first sealing member 51 by adhesion, the gap between the first sealing member 51 and the first heat dissipation assembly 202 and the gap between the first sealing member 51 and the first panel 101 can be further reduced, thereby improving the sealing performance of the first channel 41, so that the airflow blown by the first fan 201 can be more concentrated in the first channel 41, and the heat dissipation effect is improved.

[0098] Based on the technical scheme described above, after the first sealing member 51 is arranged, the airflow blown by the first fan 201 from the first air outlet 201a enters the first channel 41 under the flow guiding effect of the first sealing member 51 and performs heat dissipation on the first panel 101 and the first heat dissipation assembly 202, thereby improving the heat dissipation efficiency of the heat dissipation device 20.

[0099] It should be noted that the first sealing member 51 is usually made of an elastic material, and therefore the thickness of the first sealing member 51 is greater than the designed distance between the first panel 101 and the first heat dissipation assembly 202 after assembly before the electronic device 1 is assembled, so that the thickness of the first sealing member 51 can be compressed in the thickness direction after the first panel 101 and the first heat dissipation assembly 202 are assembled, the gap between the sealing member and the upper and lower two structural members is reduced, the sealing performance of the first channel 41 is improved, and the heat dissipation performance is improved.

[0100] Figure 6 is a schematic exploded view of a heat dissipation device provided by an embodiment of the present application.

[0101] As Figure 6 shown, in some possible implementation manners, the sealing member further includes a second sealing member 52 sealingly connecting the first heat dissipation assembly 202 and the printed circuit board 30, and the airflow blown by the first fan 201 enters the second channel 42 along the second sealing member 52 and flows out of the air outlet 10a.

[0102] In some possible implementation manners, the second sealing member 52 can be in a plurality of numbers, a first surface of the second sealing member 52 is in contact with or abuts against the first heat dissipation assembly 202, and a second surface opposite to the first surface of the second sealing member 52 is in contact with or abuts against the printed circuit board 30.

[0103] In some possible implementation manners, the second sealing member 52 can be in a rectangular strip shape, a first end of the second sealing member 52 is close to a first side of the first air outlet 201a of the first fan 201, and a second end of the second sealing member 52 is close to the opening area 10a of the shell 10.

[0104] In some possible implementation manners, the second sealing member 52 can be in a rectangular strip shape, a first end of the second sealing member 52 is close to a second side of the first air outlet 201a of the first fan 201, and a second end of the second sealing member 52 is close to a second side of the third air outlet 204a of the second fan 204, the second side of the first air outlet 201a is away from the opening area 10a, and the second side of the third air outlet 204a is away from the opening area 10a.

[0105] In some possible implementation manners, the second sealing member 52 can be fixed on a surface of the first heat dissipation assembly 202 facing the printed circuit board 30 by adhesion, or the second sealing member 52 can be fixed on a surface of the printed circuit board 30 facing the first heat dissipation assembly 202 by adhesion. By fixing the second sealing member 52 by adhesion, the gap between the second sealing member 52 and the first heat dissipation assembly 202 and the gap between the second sealing member 52 and the printed circuit board 30 can be further reduced, thereby improving the sealing performance of the second channel 42, so that the airflow blown by the first fan 201 can be more concentrated in the second channel 42, and the heat dissipation effect is improved.

[0106] Based on the above technical solution, after the second sealing member 52 is arranged, the airflow blown by the first fan 201 from the first air outlet 201a enters the second channel 42 under the guiding action of the second sealing member 52 and performs heat dissipation on the first heat dissipation assembly 202 and the printed circuit board 30, thereby improving the heat dissipation efficiency of the heat dissipation device 20.

[0107] It should be noted that the second sealing member 52 is usually made of elastic material, and therefore the thickness of the second sealing member 52 is greater than the designed distance between the first heat dissipation assembly 202 and the printed circuit board 30 after assembly before the electronic device 1 is assembled, so that the thickness of the second sealing member 52 can be compressed in the thickness direction after the first heat dissipation assembly 202 and the printed circuit board 30 are assembled, the gap between the sealing member and the upper and lower two structural members is reduced, the sealing performance of the second channel 42 is improved, and the heat dissipation performance is improved.

[0108] In some possible implementation manners, the first seal 51 and the second seal 52 can be integrated.

[0109] Figure 7 is a schematic view of a heat dissipation device provided by an embodiment of the present application.

[0110] As shown in Figure 7 , a surface of the heat dissipation device 20 close to the second panel 102 is shown; in some possible implementation manners, the seal further includes a third seal 53 sealingly connecting the second panel 102 and the printed circuit board 30, and the airflow blown by the first fan 201 enters the third passage 43 along the third seal 53 and flows out from the air outlet 10a.

[0111] In some possible implementation manners, the third seal 53 can be multiple in number, a first surface of the third seal 53 is in contact with or abuts against the second panel 102, and a second surface opposite to the first surface of the third seal 53 is in contact with or abuts against the printed circuit board 30.

[0112] In some possible implementation manners, the third seal 53 can be a rectangular strip, a first end of the third seal 53 is close to a first side of the first air outlet 201a of the first fan 201, and a second end of the third seal 53 is close to the opening region 10a of the shell 10.

[0113] In some possible implementation manners, the third seal 53 can be a rectangular strip, a first end of the third seal 53 is close to a second side of the first air outlet 201a of the first fan 201, a second end of the third seal 53 is close to a second side of the third air outlet 204a of the second fan 204, the second side of the first air outlet 201a is away from the opening region 10a, and the second side of the third air outlet 204a is away from the opening region 10a.

[0114] In some possible implementation manners, the third seal 53 can be fixed on a surface of the printed circuit board 30 facing the second panel 102 by means of adhesion, or the third seal 53 can be fixed on a surface of the second panel 102 facing the printed circuit board 30 by means of adhesion. By fixing the third seal 53 by means of adhesion, the gap between the third seal 53 and the second panel 102 and the gap between the third seal 53 and the printed circuit board 30 can be further reduced, thereby improving the sealing performance of the third passage 43, so that the airflow blown by the first fan 201 can be more concentrated in the third passage 43, and the heat dissipation effect is improved.

[0115] According to the technical scheme, after the third sealing member 53 is arranged, the airflow blown out from the first air outlet 201a of the first fan 201 enters the third channel 43 under the flow guiding effect of the third sealing member 53, and the printed circuit board 30 and the second panel 102 are cooled, thereby improving the cooling efficiency of the cooling device 20.

[0116] It should be noted that the third sealing member 53 is usually made of elastic material, and therefore, before the electronic device 1 is assembled, the thickness of the third sealing member 53 is greater than the designed distance between the second panel 102 and the printed circuit board 30 after assembly. In this way, after the second panel 102 and the printed circuit board 30 are assembled, the third sealing member 53 can be compressed in the thickness direction, the gap between the sealing member and the upper and lower structure members is reduced, the sealing property of the third channel 43 is improved, and the cooling performance is improved.

[0117] It should be noted that there is a gap between the first fan 201 and the shell 10, for example, there is a gap between the first fan 201 and the second fan 204 and the first panel 101 in the thickness direction, and there is also a gap between the first fan 201 and the second fan 204 and the second panel 102 in the thickness direction. Therefore, after the airflow blown out from the first air outlet 201a or the third air outlet 204a enters the first channel 41, the second channel 42 or the third channel 43, the air carrying heat may re-enter the first fan 201 or the second fan 204 from the gap, resulting in poor cooling effect.

[0118] In order to improve the above problem, the sealing member can further include a fourth sealing member 54 sealingly connecting the first panel 101 and the second fan 204, as shown in Figure 3 The fourth sealing member 54 is close to the third air outlet 204a of the second fan 204, for example, it can be arranged on the shell at the position of the third air outlet 204a.

[0119] It should be noted that the above embodiment is described by taking the second fan 204 as an example, and the first fan 201 can also be provided with the fourth sealing member 54. The fourth sealing member 54 can be close to the first air outlet 201a of the first fan 201, for example, it can be arranged on the shell at the position of the first air outlet 201a.

[0120] The sealing member can further include a fifth sealing member 55 arranged between the second panel 102 and the first fan 201, as shown in Figure 7 The fifth sealing member 55 is close to the first air outlet 201a of the first fan 201, for example, the fifth sealing member 55 is arranged on the shell at the position of the first air outlet 201a.

[0121] It should be noted that the above embodiment is described with the first fan 201, and the second fan 204 can also be provided with the fourth sealing member 54, and the fifth sealing member 55 can be close to the third air outlet 204a of the second fan 204, for example, the fifth sealing member 55 is arranged on the shell at the position of the third air outlet 204a.

[0122] The fourth sealing member 54 and the fifth sealing member 55 can block the gap between the first fan 201 and the second fan 204 and the first panel 101 or the second panel 102, avoid the air absorbing heat re-entering the first fan 201 and the second fan 204, prevent the backflow of hot air, and improve the heat dissipation capacity of the heat dissipation device 20.

[0123] It can be understood that during the assembly of the electronic device 1, when the first panel 101 and the second panel 102 form the shell 10, the components contained in the shell 10 will be squeezed, and therefore the first sealing member 51, the second sealing member 52, the third sealing member 53, the fourth sealing member 54 or the fifth sealing member 55 can be made of a material with elasticity, for example, a material such as foam, rubber, silicone or polyurethane, and when the first panel 101 and the second panel 102 are assembled, the sealing member deforms under pressure, thereby playing a sealing role and being able to better guide the airflow to the first channel 41, the second channel 42 or the third channel 43, thereby improving the heat dissipation effect of the heat dissipation device 20.

[0124] It should be noted that the fourth sealing member 54 and the fifth sealing member 55 are usually made of elastic materials, and therefore before the assembly of the electronic device 1, the thicknesses of the fourth sealing member 54 and the fifth sealing member 55 are respectively greater than the designed distance after the assembly between the first heat dissipation assembly 202 and the first fan 201, so that after the assembly of the third heat dissipation assembly 202 and the first fan 201, the fourth sealing member 54 and the fifth sealing member 55 can be compressed in the thickness direction, reducing the gap between the sealing member and the upper and lower two structural members, further improving the sealing performance of the second channel 42, and being beneficial to improving the heat dissipation performance.

[0125] Figure 8 is a schematic view of a first fan provided by an embodiment of the present application.

[0126] As shown in Figure 8 , the first fan 201 is provided with a flow guide member 2014 close to the position of the first air outlet 201a, and the flow guide member 2014 protrudes towards the side of the first panel 101.

[0127] Figure 9 is a schematic view of a first fan provided by an embodiment of the present application. As shown in Figure 9 (a), the shape of the flow guide member 2014 can be curved, or as shown in Figure 9As shown in (b) of FIG. 10, the shape of the flow guide 2014 can be oval, or as shown in (c) of FIG. 10, the shape of the flow guide 2014 can be curved, or as shown in (d) of FIG. 10, the shape of the flow guide 2014 can be streamlined. Figure 9 As shown in (b) of FIG. 10, the shape of the flow guide 2014 can be oval, or as shown in (c) of FIG. 10, the shape of the flow guide 2014 can be curved, or as shown in (d) of FIG. 10, the shape of the flow guide 2014 can be streamlined. Figure 9 As shown in (b) of FIG. 10, the shape of the flow guide 2014 can be oval, or as shown in (c) of FIG. 10, the shape of the flow guide 2014 can be curved, or as shown in (d) of FIG. 10, the shape of the flow guide 2014 can be streamlined.

[0128] It should be noted that during the working process of the first fan 201, air flows out from the first air outlet 201a and the second air outlet 201b, and after the flow guide 2014 is arranged, the air volume ratio passing through the first air outlet 201a and the second air outlet 201b can be changed to achieve a more optimal heat dissipation effect, and the vortex loss in the air flow generated by the first fan 201 can be optimized; at the same time, the flow guide 2014 can also improve the structural strength of the first fan 201 at the first air outlet 201a, and improve the reliability of the first fan 201 during installation.

[0129] In some possible implementations, the heat dissipation device further includes an adjusting module connected with the flow guide 2014, and the adjusting module is configured to adjust the angle of the flow guide rotating in the plane where the first fan 201 is located.

[0130] The adjusting module can control the flow guide 2014 to rotate at a certain angle in the plane where the first fan 201 is located, or alternatively, the angle of the flow guide 2014 rotating can be adjusted according to actual heat dissipation requirements, as shown in (a) of FIG. 11, the flow guide 2014 can rotate according to the clockwise direction arrow, or as shown in (b) of FIG. 11, the flow guide 2014 can rotate according to the counterclockwise direction arrow. Figure 8 As shown in (a) of FIG. 11, the flow guide 2014 can rotate according to the clockwise direction arrow, or as shown in (b) of FIG. 11, the flow guide 2014 can rotate according to the counterclockwise direction arrow. Figure 8 After the flow guide 2014 rotates, the air volume ratio passing through the first air outlet 201a and the second air outlet 201b can be controllably adjusted, for example, the air volume passing through the first air outlet 201a can be increased, or the air volume passing through the second air outlet 201b can be increased, to optimize the heat dissipation effect of the heat dissipation device 20.

[0131] The adjusting module can be a rotating shaft motor or a brushless motor, so that the flow guide 2014 can rotate, and the adjusting module can also be electrically connected with the printed circuit board 30, and the CPU on the printed circuit board 30 can send a control instruction to the adjusting module, so that the rotating angle of the flow guide 2014 is adjustable.

[0132] Figure 10 FIG. 12 is a partial cross-sectional schematic view of an electronic device provided by an embodiment of the present application.

[0133] FIG. 13 is a schematic view of a heat dissipation device provided by an embodiment of the present application. Figure 3 FIG. 14 is a schematic view of a heat dissipation device provided by an embodiment of the present application. Figure 10In (a) of FIG. 1, the first heat dissipation component 202 is provided with a first through hole 2021, which connects the first channel 41 and the second channel 42, so that air can flow between the first channel 41 and the second channel 42.

[0134] After the air flow enters the second channel 42, a part of the air can enter the first channel 41 through the first through hole 2021 of the first heat dissipation component 202, so as to reduce the flow resistance, increase the air flow entering the first channel 41, and enhance the heat dissipation capacity of the first panel 101.

[0135] The shape of the first through hole 2021 can be rectangular, circular, or other geometric shapes.

[0136] In some possible implementation manners, the first heat dissipation component 202 can be provided with a plurality of first through holes 2021, which can further increase the amount of air entering the first channel 41 from the second channel 42, so as to further improve the heat dissipation effect of the first panel 101.

[0137] In combination with (b) of FIG. 1, Figure 3 and (c) of FIG. 1, Figure 10 the printed circuit board 30 is provided with a second through hole 302, which connects the second channel 42 and the third channel 43, so that air can flow between the second channel 42 and the third channel 43.

[0138] The shape of the second through hole 302 can be rectangular, circular, or other geometric shapes.

[0139] After the air flow enters the second channel 42, a part of the air can enter the third channel 43 through the second through hole 302 on the printed circuit board 30, so as to reduce the flow resistance, increase the air flow entering the third channel 43, and enhance the heat dissipation capacity of the second panel 102.

[0140] In some possible implementation manners, the printed circuit board 30 can be provided with a plurality of second through holes 302, which can further increase the amount of air entering the third channel 43 from the second channel 42, so as to further improve the heat dissipation capacity of the second panel 102.

[0141] In combination with (b) of FIG. 1, Figure 3 and (c) of FIG. 1, Figure 10 the first heat dissipation component 202 and the printed circuit board 30 are respectively provided with the first through hole 2021 and the second through hole 302, so that the first through hole 2021 connects the first channel 41 and the second channel 42, and the second through hole 302 connects the second channel 42 and the third channel 43, so that air can flow between the first channel 41, the second channel 42, and the third channel 43.

[0142] After the air flow enters the second channel 42, the air can enter the first channel 41 through the first through hole 2021 of the first heat dissipation assembly 202, or enter the third channel 43 through the second through hole 302 of the printed circuit board 30, thereby further reducing the flow resistance, increasing the air flow entering the first channel 41 and the third channel 43, and enhancing the heat dissipation capacity of the first panel 101 and the second panel 102.

[0143] The above merely provides a specific implementation of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic device, comprising: The electronic device comprises a housing, a heat dissipation device and a printed circuit board. The housing comprises a first panel and a second panel arranged oppositely, the heat dissipation device and the printed circuit board are arranged in the housing, and the first panel and the second panel have an opening area communicating with the outside. The heat dissipation device comprises a first heat dissipation assembly and a first fan, the first fan is arranged at one end of the printed circuit board, the first heat dissipation assembly is arranged between the first panel and the printed circuit board, a surface of the printed circuit board is provided with a heat generating assembly, the first heat dissipation assembly is used for absorbing heat of the heat generating assembly, and the first fan comprises a first air outlet, which is arranged towards the printed circuit board. The first panel is arranged opposite to the first heat dissipation assembly to form a first channel communicating the first air outlet to the opening area, the first heat dissipation assembly is arranged opposite to the printed circuit board to form a second channel communicating the first air outlet to the opening area, and the printed circuit board is arranged opposite to the second panel to form a third channel communicating the first air outlet to the opening area. The airflow blown by the first fan passes through the first channel, the second channel and / or the third channel and flows out of the opening area. The heat dissipation device further comprises a sealing member.

2. The electronic device of claim 1, wherein, The sealing member comprises a first sealing member sealingly connecting the first panel and the first heat dissipation assembly, and the airflow blown by the first fan enters the first channel from the first air outlet along the first sealing member and flows out of the air outlet.

3. The electronic device according to claim 2, wherein The sealing member further comprises a second sealing member sealingly connecting the first heat dissipation assembly and the printed circuit board, and the airflow blown by the first fan enters the second channel from the first air outlet along the second sealing member and flows out of the air outlet.

4. The electronic device according to claim 2, wherein The sealing member further comprises a third sealing member sealingly connecting the printed circuit board and the second panel, and the airflow blown by the first fan enters the third channel from the first air outlet along the third sealing member and flows out of the air outlet.

5. The electronic device according to claim 2, wherein The sealing member further comprises a fourth sealing member sealingly connecting the first panel and the first fan, and a fifth sealing member sealingly connecting the second panel and the first fan.

6. The electronic device according to claim 1, wherein The first fan further comprises a second air outlet, which communicates with the outside, and the orientation of the second air outlet is the same as that of the opening area. The first fan is provided with a flow guide member near the first air outlet, and the flow guide member is used for changing the ventilation amount through the first air outlet and the second air outlet.

7. The electronic device according to claim 6, wherein ​ The heat dissipation device further comprises an adjusting module connected with the flow guide, the adjusting module being configured to adjust the angle of rotation of the flow guide in the plane where the first fan is located, and the flow guide being configured to adjust the ventilation volume through the first air outlet and the second air outlet. 8.The electronic device of claim 7, wherein, The shape of the flow guide comprises any one of a curved shape, a cylindrical shape, an elliptical shape, or a streamline shape. 9.The electronic device of claim 1, wherein, The first heat dissipation assembly is provided with at least one first through hole penetrating through the first heat dissipation assembly, and the second channel communicates with the first channel through the first through hole. 10.The electronic device of claim 1, wherein, The printed circuit board is provided with at least one second through hole penetrating through the printed circuit board, and the second channel communicates with the third channel through the second through hole. 11.The electronic device of any one of claims 1-10, wherein, The heat dissipation device further comprises a second fan, the second fan being arranged at the other end of the printed circuit board, the second fan comprising a third air outlet and a fourth air outlet, the third air outlet being arranged towards the printed circuit board, and the fourth air outlet being in communication with the outside, the fourth air outlet having the same orientation as the opening region. The air flow blown by the second fan flows through the first channel, the second channel, and / or the third channel and out of the opening region.

12. The electronic device of any of claims 1-10, wherein, The first heat dissipation assembly comprises any one of a vapor chamber heat plate or a heat pipe. 13.The electronic device of any one of claims 2-5, wherein, The sealing member is made of an elastic material.

Images