Heat dissipation structure
By introducing a floating heat dissipation structure into the heat dissipation structure, the problem of damage to components under impact, vibration or drop is solved, achieving efficient heat dissipation and protection of components.
Patent Information
- Application Number
- CN202520242718.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-14
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2035-02-14
AI Technical Summary
In existing technologies, heat dissipation structures are prone to stress concentration when subjected to impact, vibration or drop, which can damage chips or solder balls and cause component failure. At the same time, the low thermal conductivity of the buffer medium affects the heat dissipation capacity.
Design a heat dissipation structure including a top cover, a PCB, and a bottom cover. The top cover is equipped with a floating heat dissipation structure that is in close contact with the heat-generating components. The floating heat dissipation structure can float in contact when subjected to pressure or drops to avoid damage to the components, and achieves efficient heat dissipation through elastic bosses or heat dissipation hoses.
It can prevent damage to components under impact or pressure, improve heat dissipation efficiency, and ensure the normal operation of components, and has broad application prospects.
Smart Images
Figure CN223810065U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a heat generating component heat dissipation technical field especially relates to a heat dissipation structure. BACKGROUND
[0002] At present, in order to meet the chip heat dissipation demand on PCB, the heat dissipation of component is filled with buffer medium by the way of shell itself directly contacting chip. When the whole structure is impacted, vibrated, dropped and the like by external force and causes instantaneous deformation, the stress concentration of heat dissipation structure easily leads to the damage of chip body or tin ball.
[0003] Therefore, although the whole structure has buffer medium, in order to meet the heat dissipation demand of component (such as chip), the thickness of heat dissipation medium needs to be controlled as small as possible, and correspondingly, the buffer capacity of medium decreases, which easily causes component failure problem. Meanwhile, the buffer medium has low thermal conductivity, which influences the heat dissipation capacity of whole system. UTILITY MODEL CONTENT
[0004] The utility model discloses a heat dissipation structure to solve the technical problem that the heat dissipation structure of prior art is easy to damage component and leads to the failure of whole product.
[0005] In order to realize the above-mentioned purpose, the utility model discloses a heat dissipation structure, including the top cover, PCB, bottom cover that are sequentially distributed from top to bottom, be equipped with floating heat dissipation structure on the top cover, be equipped with heat generating component on the PCB, the floating heat dissipation structure is closely contacted with heat generating component, to realize the heat dissipation of heat generating component, the floating heat dissipation structure can be floating contact heat generating component when the top cover is pressed or dropped, to avoid damaging heat generating component.
[0006] As a preferred implementation, the floating heat dissipation structure is an elastic boss.
[0007] Further, the elastic boss includes a first boss, an elastic medium and a second boss connected in sequence, the first boss is connected with the top cover, and the second boss is closely contacted with the heat generating component.
[0008] Further, the first boss, the elastic medium and the second boss are sequentially distributed from top to bottom.
[0009] Further, the elastic boss is embedded in the top cover.
[0010] Further, the top cover is a heat dissipation shell.
[0011] As another preferred implementation, the floating heat dissipation structure is a heat dissipation hose.
[0012] Further, the heat dissipation hose serves as a cooling liquid carrier.
[0013] Further, the heat dissipation hose is embedded in the top cover.
[0014] Further, the top cover is a liquid cooling plate, and the cooling liquid in the liquid cooling plate can flow through the heat dissipation hose to disperse the heat generated by the heat generating component.
[0015] In summary, the technical scheme of the utility model has the following beneficial effects: the utility model has reasonable structure, (1) the top cover, the PCB and the bottom cover are sequentially arranged from top to bottom, the top cover is provided with a floating heat dissipation structure, the PCB is provided with a heat generating component, and the floating heat dissipation structure is in close contact with the heat generating component to realize heat dissipation of the heat generating component; thus, under normal circumstances, the floating heat dissipation structure can be in close contact with the heat generating component to realize efficient heat dissipation (in the prior art, the buffering medium has low heat transfer rate, and the heat dissipation capacity of the whole system is limited). (2) the floating heat dissipation structure can be in floating contact with the heat generating component when the top cover is pressed or falls to avoid damage to the heat generating component; thus, when the top cover is in floating contact with the heat generating component under pressure or falling, damage to the heat generating component (such as the chip body or the solder ball) can be avoided to prevent the whole product from being invalid (in the prior art, the heat dissipation structure is prone to stress concentration and damage to the chip body or the solder ball to cause the whole product to be invalid when the structure is subjected to instantaneous deformation caused by external force such as impact, vibration and falling). Therefore, it can be seen that the utility model can maximize to ensure that the structure is not damaged under the condition of impact and pressure (such as the chip body or the solder ball), and the heat dissipation efficiency is improved, so the utility model has wide application prospect. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 is a schematic diagram of the three-dimensional structure of embodiment 1 of the utility model;
[0017] Figure 2 is a schematic diagram of the three-dimensional structure of embodiment 2 of the utility model;
[0018] The reference signs are as follows: 1-top cover, 2-floating heat dissipation structure, 3-heat generating component, 4-PCB, 5-bottom cover; 101-heat dissipation shell, 102-liquid cooling plate; 201-elastic boss, 2011-first boss, 2012-elastic medium, 2013-second boss; 202-heat dissipation hose. DETAILED DESCRIPTION
[0019] The technical scheme in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model, but does not constitute a limitation on the protection scope of the utility model.
[0020] In the utility model, in order to describe more clearly, the following is explained: the observer faces the drawingFigure 1 It should be noted that the terms "front end", "rear end", "left side", "right side", "middle", "upper", "lower" and the like in the specification indicate the orientation or positional relationship based on the drawings and are only used for the purpose of clearly describing the present application, and do not indicate or imply that the structure or component referred to must have a particular orientation or be constructed in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", "fourth" are only used for the purpose of clarity or simplification of description, and cannot be understood as indicating or implying relative importance or quantity.
[0021] Referring to Figures 1 to 2 The embodiment provides a heat dissipation structure, which comprises a top cover 1, a PCB 4 and a bottom cover 5 distributed in sequence from top to bottom, the top cover 1 is provided with a floating heat dissipation structure 2, the PCB 4 is provided with a heating component 3, the floating heat dissipation structure 2 is in close contact with the heating component 3, so as to realize heat dissipation of the heating component 3, and the floating heat dissipation structure 2 can be in floating contact with the heating component 3 when the top cover 1 is pressed or falls, so as to avoid damage to the heating component 3. Effects: (1) the top cover, the PCB and the bottom cover are distributed in sequence from top to bottom, the top cover is provided with the floating heat dissipation structure, the PCB is provided with the heating component, and the floating heat dissipation structure is in close contact with the heating component, so as to realize heat dissipation of the heating component; thereby, in a normal case, the floating heat dissipation structure can be used to realize efficient heat dissipation in the form of close contact with the heating component (and in the prior art, the heat dissipation capacity of the whole system is limited due to the low heat transfer rate of the buffer medium). (2) the floating heat dissipation structure can be in floating contact with the heating component when the top cover is pressed or falls, so as to avoid damage to the heating component; thereby, when the top cover is in floating contact with the heating component when being pressed or falling, damage to the heating component (such as a chip body or a solder ball) can be avoided, and the whole product can be prevented from being invalid (and in the prior art, the heat dissipation structure is prone to stress concentration and damage to the chip body or the solder ball to cause the whole product to be invalid when the structure is subjected to instantaneous deformation caused by external force such as impact, vibration and falling). It can be known from the analysis that the present application maximizes to ensure that the structural member will not damage the heating component (such as a chip body or a solder ball) under the condition of being impacted and pressed, and at the same time, the heat dissipation efficiency is improved, and the present application has a wide application prospect.
[0022] Embodiment 1: the floating heat dissipation structure 2 is an elastic boss 201. Effect: the elastic boss is a natural heat dissipation structure, the buffer medium is cancelled, floating contact is realized, and efficient heat dissipation is realized.
[0023] Specifically, the elastic boss 201 comprises a first boss 2011, an elastic medium 2012 and a second boss 2013 connected in sequence, the first boss 2011 is connected with the top cover 1, and the second boss 2013 is in close contact with the heat-generating component 3. Action: Through the action of the elastic medium, the second boss can realize floating contact.
[0024] Specifically, the first boss 2011, the elastic medium 2012 and the second boss 2013 are distributed in sequence from top to bottom. Action: Such distribution is more conducive to heat dissipation of the chip and other heat-generating components.
[0025] Specifically, the elastic boss 201 is embedded in the top cover 1. Action: This makes the elastic boss in closer contact with the top cover, facilitating heat dissipation.
[0026] Specifically, the top cover 1 is a heat dissipation shell 101. Action: The heat dissipation shell can be made of a shell material with good heat dissipation coefficient to realize active heat dissipation for the heat-generating component.
[0027] Embodiment 2: The floating heat dissipation structure 2 is a heat dissipation hose 202. Action: The use of the heat dissipation hose directly contacting the heat-generating component ensures that the system can work normally, avoids crushing the heat-generating component or solder balls when the top cover vibrates, and realizes efficient heat dissipation.
[0028] Specifically, the heat dissipation hose 202 serves as a cooling liquid carrier. Action: The liquid cooling heat dissipation system uses the heat dissipation hose as a cooling liquid carrier to directly contact the electronic component, realize floating contact and efficient heat dissipation. As an optimization, the heat-generating component is directly contacted by the heat dissipation hose with wear resistance and strong heat conductivity.
[0029] Specifically, the heat dissipation hose 202 is embedded in the top cover 1. Action: The entire system can realize heat dissipation of the heat-generating component in the form of embedding the heat dissipation hose in the liquid cooling plate.
[0030] Specifically, the top cover 1 is a liquid cooling plate 102, and the cooling liquid in the liquid cooling plate 102 can flow through the heat dissipation hose 202 to dissipate the heat generated by the heat-generating component 3. Action: The liquid cooling plate can be designed with a cooling liquid flow channel to dissipate heat for the heat-generating component. During the operation of the entire system, the cooling liquid in the liquid cooling plate flows through the heat dissipation hose to dissipate the heat generated by the heat-generating component during the operation of the system, thereby ensuring that the operating temperature of the heat-generating component is within the junction temperature range.
[0031] Heat-generating component: generally refers to a chip or other high-power electronic component with heat dissipation requirements.
[0032] As an optimization, the structure is sealed in the form of cooperation and assembly of the top cover, the bottom cover and the PCB.
[0033] In summary, the utility model discloses a liquid cooling heat dissipation structure and natural heat dissipation structure realize floating heat dissipation structure, and different floating heat dissipation schemes are provided for two kinds of heat dissipation structures respectively.Maximize ensure that structural member is not damaged component or solder ball under the condition of being impacted, being pressed, and improve the heat dissipation efficiency simultaneously.It has wide application prospect.
[0034] The above is the preferred embodiment of the utility model, and it should be pointed out that for ordinary skilled person in the art, without departing from the principle of the utility model, a number of improvements and refinements can be made, and these improvements and refinements are also regarded as the protection scope of the utility model.
Claims
1. A heat dissipation structure comprising a top cover (1), a PCB (4) and a bottom cover (5) arranged in sequence from top to bottom, characterized in that: The top cover (1) is provided with a floating heat dissipation structure (2), the PCB (4) is provided with a heating component (3), the floating heat dissipation structure (2) is in close contact with the heating component (3) to realize heat dissipation of the heating component (3), and the floating heat dissipation structure (2) can be in floating contact with the heating component (3) when the top cover (1) is pressed or falls to avoid crushing the heating component (3).
2. The heat dissipation structure according to claim 1, wherein: The floating heat dissipation structure (2) is an elastic boss (201).
3. The heat dissipation structure of claim 2, wherein: The elastic boss (201) comprises a first boss (2011), an elastic medium (2012) and a second boss (2013) connected in sequence, the first boss (2011) is connected with the top cover (1), and the second boss (2013) is in close contact with the heating component (3).
4. The heat dissipation structure according to claim 3, wherein: The first boss (2011), the elastic medium (2012) and the second boss (2013) are sequentially distributed from top to bottom.
5. The heat dissipation structure of claim 3, wherein: The elastic boss (201) is inlaid on the top cover (1).
6. The heat dissipating structure according to any one of claims 2 to 5, wherein: The top cover (1) is a heat dissipation shell (101).
7. The heat dissipation structure of claim 1, wherein: The floating heat dissipation structure (2) is a heat dissipation hose (202).
8. The heat dissipation structure of claim 7, wherein: The heat dissipation hose (202) serves as a cooling liquid carrier.
9. The heat dissipation structure of claim 8, wherein: The heat dissipation hose (202) is embedded on the top cover (1).
10. The heat dissipation structure according to claim 8 or 9, characterized in that: The top cover (1) is a liquid cooling plate (102), cooling liquid in the liquid cooling plate (102) can flow through the heat dissipation hose (202), so as to disperse heat generated on the heating component (3).